CN105764263A - BGA carrier plate - Google Patents
BGA carrier plate Download PDFInfo
- Publication number
- CN105764263A CN105764263A CN201610193679.XA CN201610193679A CN105764263A CN 105764263 A CN105764263 A CN 105764263A CN 201610193679 A CN201610193679 A CN 201610193679A CN 105764263 A CN105764263 A CN 105764263A
- Authority
- CN
- China
- Prior art keywords
- bga
- plate
- slide block
- support plate
- spacing slide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000969 carrier Substances 0.000 title abstract description 7
- 230000002093 peripheral Effects 0.000 claims description 19
- 239000000463 material Substances 0.000 description 11
- ATJFFYVFTNAWJD-UHFFFAOYSA-N tin hydride Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
- 238000007791 dehumidification Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 230000000875 corresponding Effects 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000011435 rock Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000009376 nuclear reprocessing Methods 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 230000001737 promoting Effects 0.000 description 1
- 230000001105 regulatory Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
Abstract
The invention discloses a BGA carrier plate. The BGA carrier plate includes a BGA placing groove and a clamping part matched with a clamping device, and the groove depth and length and width dimensions of the BGA placing groove can be adjusted; the BGA carrier plate includes an enclosure frame, a bottom plate, a transverse limiting sliding block and a vertical limiting sliding block; the enclosure frame and the bottom plate are combined to form the BGA placing groove; the transverse limiting sliding block and the vertical limiting sliding block are arranged on the BGA placing groove, the transverse limiting sliding block can slide in a Y direction, and the vertical limiting sliding block can slide in an X direction; the bottom plate includes a base plate, a counterforce bearing plate and a pressurizing air bag; and the base plate is fixedly arranged at the bottom of the enclosure frame, the counterforce bearing plate is arranged right above the base plate and can slide vertically along an inner side wall face of the enclosure frame, the pressurizing air bag is fixedly arranged between the base plate and the counterforce bearing plate, and a pressure sensor is arranged in the pressurizing air bag. After adoption of the abovementioned structure, the abovementioned BGA carrier plate can be matched with and fixed to an SMT chip mounter, can adapt to placement of various kinds of BGAs, is strong in universality, and can facilitate BGA ball mounting and chip mounting operation.
Description
Technical field
The present invention relates to a kind of BGA manufacture field, particularly a kind of BGA support plate.
Background technology
In SMT mounting technology, it is numerous and be hidden in the feature under encapsulation that BGA Package element (BGA) has number of welds, causes and is difficult to mounting quality is controlled, thus being difficult to realize the good welds of BGA.When the bad BGA of attachment is reprocessed, need to be dismantled, just necessarily cause stannum ball bottom BGA to damage.Reinstalling BGA, be necessary for being replied completely by soldered ball, method is exactly again plant ball.And any ball mode first step of planting all needs to clean out bottom BGA pad, but how to plant, the method for ball exists larger difference.
The ball-establishing method that at home and abroad each SMT production line is taked at present mainly has two kinds:
Plant ball by hand: utilize tweezers and filter screen to be placed in one by one by stannum ball in the BGA bottom land that need to plant ball, carry out Reflow Soldering afterwards.The shortcoming of this mode is that efficiency is low, not easily operates during soldered ball large number of, and stannum spherical pendulum puts slightly deviation, and just to easily cause tin welding in subsequent reflow weldering bad, operator requires height, underaction, it is impossible to plant ball suitable in multiple BGA.
Plant ball device and plant ball: common ball device of planting generally is made up of one block of web plate and a sleeve clamp, web plate position of opening mates with BGA bottom land, aperture is generally larger than sphere diameter, fixture is used for fixing BGA and web plate, make it closely cooperate will not rock, then soldered ball is spread out on web plate equably, rock and plant ball device, then soldered ball is rolled in the perforate of web plate, after each Kong Jun making web plate position of opening has rolled a soldered ball, finally unnecessary soldered ball is rolled into web edge, poured out by reserved opening, finally will plant ball device entirety and carry out Reflow Soldering, afterwards by BGA from planting taking-up ball device.The method is higher than manual ball success rate of planting, and speed is fast；Shortcoming is to be required for every kind different BGA buy or make corresponding web plate, and the conventional encapsulation of BGA just has hundreds of, and constantly has and newly encapsulate generation, and with high costs and web plate makes and at least needs 2-3 days, produces response speed slow.It addition, the mesh of web plate is more than Diameter of Solder Ball, when carrying out the soldered ball web plate demoulding, it is easily caused soldered ball position and does not fix, still need to after the demoulding manually adjust, otherwise may result in planting ball failure when Reflow Soldering.
8 months years 201310168536.X patent application on the 7th in 2013, disclose a kind of BGA and plant ball single-point repair method, comprising: first step: remove oxide layer and the pollutant of the bond pad surface of losing on bga chip bottom surface: second step: take paste soldering flux, and it is coated in and is lost on pad;Third step: be coated with in the second step to have helped and place the stannum ball matched with pad diameter on the pad of paste soldering flux;4th step: utilize heat gun by the air outlet vertical of heat gun in the way of bga chip bottom surface, the position that placed stannum ball at third step being heated: the 5th step: close heat gun after stannum ball melts, and whether detection reprocesses successful after closing heat gun.
Above-mentioned patent application, once can only plant ball to a single-point and reprocess, and work efficiency is low, additionally Hot-blast Heating welding, easily causes bga chip on the one hand and moves, and causes thermal loss relatively big on the other hand, and work efficiency is relatively slow, is not suitable for vigorously promoting the use.
No. 201210346219.8 Chinese invention patent, disclosed a kind of BGA and planted ball technique, utilize printer, carrier, steel mesh, tin cream, carry out batch and plant ball on January 16th, 2013.It is very fast that this invention produces corresponding speed, less costly, but carry out planting ball because have employed tin cream, owing to steel mesh thickness and pad opening diameter limit solder paste amounts, can cause that the BGA difference in height with untouched dress of the BGA after reprocessing is from bigger, the height of soldered ball cannot reduce, for need element height coordinate technique cannot use.
Summary of the invention
The technical problem to be solved in the present invention is for above-mentioned the deficiencies in the prior art, and a kind of BGA support plate is provided, this BGA support plate can match with SMT chip mounter rail to merge and fix, and adapts to the placement of all kinds BGA, highly versatile, can facilitate BGA to plant ball and paster operation.
For solving above-mentioned technical problem, the technical solution used in the present invention is:
A kind of BGA support plate, is fixed on chip mounter rail by the clamping device in SMT chip mounter, and can slide along chip mounter rail；BGA support plate includes BGA placing trough and the retaining part matched with clamping device, and groove depth and the length and width size of BGA placing trough all can regulate；BGA support plate includes peripheral frame, base plate, cross spacing slide block and vertical spacing slide block；Peripheral frame and floor combination form BGA placing trough；Cross spacing slide block and vertical spacing slide block are arranged on the top of BGA placing trough, cross spacing slide block energy Y-direction sliding, and vertical spacing slide block energy X is to sliding；Base plate includes backing plate, counter-force bearing plate and pressurised airbag；Backing plate is fixedly installed on the bottom of peripheral frame, and counter-force bearing plate is arranged on the surface of backing plate, and can along the upper and lower sliding of the interior sidewall surface of peripheral frame, and pressurised airbag is fixedly installed between backing plate and counter-force bearing plate, is provided with pressure transducer in pressurised airbag.
The outer surface of described pressurised airbag is bonding with backing plate and counter-force bearing plate respectively.
The groove depth of described BGA placing trough can be adjusted between 1-4mm.
The height dimension of described cross spacing slide block and vertical spacing slide block is 1mm.
The medial wall of described peripheral frame is provided with groove depth scale.
Being provided with the height sensor that can detect BGA placing trough groove depth size in described peripheral frame or backing plate, this height sensor is connected with pressure transducer.
After the present invention adopts said structure, above-mentioned BGA support plate can match with SMT chip mounter rail to merge and fix, and adapts to the placement of all kinds BGA, highly versatile, and BGA can be facilitated to plant ball and paster operation.
Accompanying drawing explanation
Fig. 1 shows the structural representation of a kind of BGA ball-planting device based on SMT chip mounter of the present invention.
Fig. 2 shows the structural representation of soldered ball feedway of the present invention.
Fig. 3 shows the top view of BGA support plate.
Fig. 4 shows the sectional view of BGA support plate.
Detailed description of the invention
Below in conjunction with accompanying drawing and concrete better embodiment, the present invention is further detailed explanation.
As shown in Figures 1 to 4, a kind of BGA ball-planting device based on SMT chip mounter, including SMT chip mounter 1, chip mounter suction nozzle 11, chip mounter rail 12, clamping device 13, infrared sensor 14, soldered ball feedway 2, shake charging basket 21, tilt transporting rail 22, translucent cover 221, for material level 222, telescopic baffle 23, heating and dehumidification machine 24, photoelectric sensor 25, BGA support plate 3, peripheral frame 31, retaining part 32, base plate 33, counter-force bearing plate 34, pressurised airbag 35, pressure transducer 351, height sensor 36, cross spacing slide block 37, vertical spacing slide block 38, backing plate 39, the technical characteristics such as soldered ball 4 and BGA5.
As it is shown in figure 1, a kind of BGA ball-planting device based on SMT chip mounter, including SMT chip mounter, soldered ball feedway and some pieces of BGA support plates.
SMT chip mounter includes chip mounter suction nozzle, chip mounter rail, clamping device and the chip mounter being built in SMT chip mounter plants ball program；Clamping device is slidably connected on chip mounter rail.
Every piece of BGA support plate is fixed on chip mounter rail each through clamping device, and can slide along chip mounter rail.
Every piece of BGA support plate all includes BGA placing trough and the retaining part matched with clamping device, and groove depth and the length and width size of each BGA placing trough all can regulate.
Soldered ball feedway is arranged on the side of chip mounter rail.
As in figure 2 it is shown, soldered ball feedway includes shake charging basket, tilts transporting rail, heating and dehumidification machine, photoelectric sensor, humidity sensor and PLC.
The vibrations of shake charging basket are preferably driven by interval motor.
The one end tilting transporting rail is connected with shake charging basket, and the other end tilting transporting rail is provided for material level.
It is positioned on the inclination transporting rail for material level upstream and is provided with telescopic baffle；Tilting and be provided with the arc groove for placing soldered ball on transporting rail, the degree of depth of arc groove is not less than 1/2nd of Diameter of Solder Ball, it is preferred to 2/3rds of Diameter of Solder Ball.
What tilt transporting rail is provided above translucent cover, and the ultimate range between translucent cover and arc groove is less than twice Diameter of Solder Ball.
Tilt the transporting rail angle with horizontal direction less than 30 °, it is preferred to 15 ~ 20 °.
Heating and dehumidification machine is arranged on the surface for material level, and photoelectric sensor and humidity sensor are arranged on heating and dehumidification machine.
Shake charging basket, heating and dehumidification machine, photoelectric sensor, humidity sensor are all connected with PLC with telescopic baffle；Whether photoelectric sensor has soldered ball for detecting on material level；Humidity sensor is for detecting for the wetness of soldered ball on material level.
Further, it is the twice of chip mounter suction nozzle diameter in SMT chip mounter for the vertical dimension between material level and telescopic baffle.
Further, above-mentioned SMT chip mounter is additionally provided with can detect whether BGA support plate transmits the infrared sensor put in place.
Further, the twice that vertical dimension is chip mounter suction nozzle diameter between confession material level and the telescopic baffle of above-mentioned soldered ball feedway.
Above-mentioned BGA support plate groove depth and length and width size all can regulate, and its regulative mode is as follows.
BGA support plate includes BGA placing trough and the retaining part matched with clamping device, and groove depth and the length and width size of BGA placing trough all can regulate；BGA support plate includes peripheral frame, base plate, cross spacing slide block and vertical spacing slide block；Peripheral frame and floor combination form BGA placing trough；Cross spacing slide block and vertical spacing slide block are arranged on the top of BGA placing trough, cross spacing slide block energy Y-direction sliding, and vertical spacing slide block energy X is to sliding；Base plate includes backing plate, counter-force bearing plate and pressurised airbag；Backing plate is fixedly installed on the bottom of peripheral frame, and counter-force bearing plate is arranged on the surface of backing plate, and can along the upper and lower sliding of the interior sidewall surface of peripheral frame, and pressurised airbag is fixedly installed between backing plate and counter-force bearing plate, is provided with pressure transducer in pressurised airbag.
The outer surface of pressurised airbag is bonding with backing plate and counter-force bearing plate respectively.
The groove depth of BGA placing trough can be adjusted between 1-4mm, can cover current all types of BGA size.
The height dimension of cross spacing slide block and vertical spacing slide block is both preferably 1mm.
The medial wall of peripheral frame is preferably provided with groove depth scale.
Further, peripheral frame or be provided with the height sensor that can detect BGA placing trough groove depth size on backing plate, this height sensor is connected with pressure transducer.
A kind of BGA ball-establishing method based on SMT chip mounter, comprises the following steps.
Step 1, BGA support plate size regulates: be consistent with the groove depth of ball BGA to be planted and length and width size by the groove depth of BGA placing trough in BGA support plate and length and width size adjusting.
Step 2, BGA support plate is fixed: is placed on by BGA in the BGA placing trough after step 1 size has regulated, and is fixed on chip mounter rail by BGA support plate by the clamping device in SMT chip mounter.
Step 3, soldered ball feedway installation and debugging: soldered ball feedway is arranged on the side of chip mounter rail, soldered ball feedway includes shake charging basket and tilts transporting rail；The one end tilting transporting rail is connected with shake charging basket, and the other end tilting transporting rail is provided for material level；It is positioned on the inclination transporting rail for material level upstream and is provided with telescopic baffle；Tilting and be provided with the arc groove for placing soldered ball on transporting rail, what tilt transporting rail is provided above translucent cover, and the degree of depth of arc groove is not less than 1/2nd of Diameter of Solder Ball, and the ultimate range between translucent cover and arc groove is less than twice Diameter of Solder Ball；Tilt the transporting rail angle with horizontal direction less than 30 °.
Step 4, soldered ball feed: poured into by soldered ball in the shake charging basket in step 3, and start shake charging basket, soldered ball will along tilting transporting rail roller to for material level.
Step 5, plants ball: start chip mounter, and the BGA calling correspondence plants ball paster program, and chip mounter suction nozzle, by the BGA pad in step 2 of the mounting solder ball in step 4, carries out planting ball；
In above-mentioned steps 5, after chip mounter starts, whether the infrared sensor on SMT chip mounter can automatically detect BGA support plate and transmit and put in place；After BGA carrier plate transmission puts in place, chip mounter suction nozzle just starts action.
Step 6, after having mounted, checks that the soldered ball on each BGA pad has intact ball, skew and bridge even.
Step 7, after confirming that attachment is qualified, puts to Reflow Soldering baking.
Step 8, plants ball and completes.
The preferred embodiment of the present invention described in detail above; but, the present invention is not limited to the detail in above-mentioned embodiment, in the technology concept of the present invention; technical scheme can being carried out multiple equivalents, these equivalents belong to protection scope of the present invention.
Claims (6)
1. a BGA support plate, is fixed on chip mounter rail by the clamping device in SMT chip mounter, and can slide along chip mounter rail；It is characterized in that: BGA support plate includes BGA placing trough and the retaining part matched with clamping device, groove depth and the length and width size of BGA placing trough all can regulate；BGA support plate includes peripheral frame, base plate, cross spacing slide block and vertical spacing slide block；Peripheral frame and floor combination form BGA placing trough；Cross spacing slide block and vertical spacing slide block are arranged on the top of BGA placing trough, cross spacing slide block energy Y-direction sliding, and vertical spacing slide block energy X is to sliding；Base plate includes backing plate, counter-force bearing plate and pressurised airbag；Backing plate is fixedly installed on the bottom of peripheral frame, and counter-force bearing plate is arranged on the surface of backing plate, and can along the upper and lower sliding of the interior sidewall surface of peripheral frame, and pressurised airbag is fixedly installed between backing plate and counter-force bearing plate, is provided with pressure transducer in pressurised airbag.
2. BGA support plate according to claim 1, it is characterised in that: the outer surface of described pressurised airbag is bonding with backing plate and counter-force bearing plate respectively.
3. BGA support plate according to claim 1, it is characterised in that: the groove depth of described BGA placing trough can be adjusted between 1-4mm.
4. BGA support plate according to claim 2, it is characterised in that: the height dimension of described cross spacing slide block and vertical spacing slide block is 1mm.
5. BGA support plate according to claim 1, it is characterised in that: the medial wall of described peripheral frame is provided with groove depth scale.
6. BGA support plate according to claim 1, it is characterised in that: being provided with the height sensor that can detect BGA placing trough groove depth size in described peripheral frame or backing plate, this height sensor is connected with pressure transducer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610193679.XA CN105764263A (en) | 2016-03-31 | 2016-03-31 | BGA carrier plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610193679.XA CN105764263A (en) | 2016-03-31 | 2016-03-31 | BGA carrier plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105764263A true CN105764263A (en) | 2016-07-13 |
Family
ID=56345485
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610193679.XA Pending CN105764263A (en) | 2016-03-31 | 2016-03-31 | BGA carrier plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105764263A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108513532A (en) * | 2018-05-22 | 2018-09-07 | 江苏腾世机电有限公司 | The clamping device of the special chip mounter of double-direction control LED display |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5921458A (en) * | 1997-06-25 | 1999-07-13 | Fan; Kuang-Shu | Integrated circuit solder ball implant machine |
| CN103429006A (en) * | 2013-08-20 | 2013-12-04 | 中国电子科技集团公司第十四研究所 | BGA (Ball Grid Array) ball embedding method using SMT (Surface Mounting Technology) chip mounter |
| CN204067308U (en) * | 2014-08-25 | 2014-12-31 | 烽火通信科技股份有限公司 | Bga chip plant ball instrument |
| CN205069597U (en) * | 2015-11-14 | 2016-03-02 | 苏州光韵达光电科技有限公司 | A plant ball instrument for BGA chip |
-
2016
- 2016-03-31 CN CN201610193679.XA patent/CN105764263A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5921458A (en) * | 1997-06-25 | 1999-07-13 | Fan; Kuang-Shu | Integrated circuit solder ball implant machine |
| CN103429006A (en) * | 2013-08-20 | 2013-12-04 | 中国电子科技集团公司第十四研究所 | BGA (Ball Grid Array) ball embedding method using SMT (Surface Mounting Technology) chip mounter |
| CN204067308U (en) * | 2014-08-25 | 2014-12-31 | 烽火通信科技股份有限公司 | Bga chip plant ball instrument |
| CN205069597U (en) * | 2015-11-14 | 2016-03-02 | 苏州光韵达光电科技有限公司 | A plant ball instrument for BGA chip |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108513532A (en) * | 2018-05-22 | 2018-09-07 | 江苏腾世机电有限公司 | The clamping device of the special chip mounter of double-direction control LED display |
| CN108513532B (en) * | 2018-05-22 | 2020-06-02 | 江苏腾世机电有限公司 | Clamping mechanism of chip mounter special for bidirectional control LED display screen |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160713 |