CN203434130U - Packaging device - Google Patents
Packaging device Download PDFInfo
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- CN203434130U CN203434130U CN201320441960.2U CN201320441960U CN203434130U CN 203434130 U CN203434130 U CN 203434130U CN 201320441960 U CN201320441960 U CN 201320441960U CN 203434130 U CN203434130 U CN 203434130U
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Abstract
The utility model relates to a packaging device used for packaging an LED chip on a substrate in a flip chip type. The packaging device includes a machine table on which the substrate is placed; a die bonder for fixedly connecting the LED chip on the substrate on the machine table and making the positive electrode and the negative electrode of the LED chip electrically contact with a conductive pattern on the substrate; a fluorescent layer forming device used for forming a fluorescent layer on the surface of the LED chip, wherein the LED chip is fixedly connected on the substrate on the machine table; a heating unit for heating the substrate. All the working procedures of the flip-chip packaging of the LED chip can be performed on one machine table, so as to effectively prevent semi-products in the working-procedure transfer process from being polluted, and furthermore improve the yield rate of the flip chip packaged LED chip.
Description
Technical field
The utility model relates to LED(Light Emitting Diode, light-emitting diode), relate in particular to the sealed in unit of a kind of crystal covering type packaging LED chips special use.
Background technology
Growing along with LED technology, the application of LED in people's daily life is also more and more extensive.Crystalline substance (Flip Chip) mode packaged LED is covered in employing, and the die bond mode of more general solid type LED encapsulation is simply many, has higher reliability, and can keep away mixed and disorderly technique, and volume production feasibility is significantly promoted.Because chip package LED chip has advantages such as shortening processing procedure time, high yield, the heat-conducting effect of high-temperature baking is good, high amount of light concurrently, then in market, show one's talent, be the technology that industry does one's utmost to carry out.
In general, the processing procedure of chip package LED chip comprises die bond, some glue, grows the operations such as roasting.Die bond operation also comprises the steps such as coating, paster, heating.The steps such as some glue process also comprises gluing, mold pressing, solidify.And, in prior art, conventionally adopt different equipment to carry out each step of each operation and each operation inside.For example, utilize die bond machine to carry out die bond operation, utilize fluorescent layer forming apparatus to carry out execution point glue process, and utilize drying box to come executive chairman to bake operation.Like this, in the processing procedure of whole chip package LED chip, intermediate (semi-finished product) need to be transferred to equipment or the station of carrying out subsequent processing or step from carrying out equipment or the station of current operation or step.Yet, in such transfer process, easily cause intermediate contaminated, thereby reduced the yields of chip package LED chip.Such as: due to tin cream is oxidized or tin cream in sneaked into impurity etc., make solder joint loose contact in follow-up LED chip and substrate welding process, thereby reduced the yields of chip package LED chip.
Utility model content
In view of this, the technical problems to be solved in the utility model is how to improve the yields of chip package LED chip.
In order to solve the problems of the technologies described above, according to an embodiment of the present utility model, provide a kind of sealed in unit, for LED chip crystal covering type is encapsulated in to substrate, comprising:
Board, can be placed with described substrate on it;
Die bond machine, for described LED chip being fixed in to the described substrate being placed on described board, and make the positive electrode of described LED chip and negative electrode can with described substrate on conductive pattern in electrical contact;
Fluorescent layer forming apparatus, forms fluorescence coating for the surface at described LED chip, and wherein said LED chip is fixed on the described substrate being placed on described board; And
Heating unit, for heating described substrate.
For above-mentioned sealed in unit, in the possible implementation of the first, described LED chip comprises positive electrode, negative electrode and the isolated area that along continuous straight runs is arranged in order, and wherein said horizontal direction is the direction parallel with described substrate,
The upright projection of described isolated area on described substrate be at described positive electrode and negative electrode between the upright projection on described substrate,
Center line and the described LED chip axis on described horizontal direction of described isolated area in described horizontal direction is overlapping, and
Described isolated area is no more than described LED chip at 1/3rd of the width of described horizontal direction at the width of described horizontal direction.
In conjunction with the possible implementation of the first, in the possible implementation of the second, described board is divided into low-temperature space and high-temperature region.
In conjunction with the possible implementation of the second, in the third possible implementation, described fluorescent layer forming apparatus comprises point gum machine, wherein
Described point gum machine is for the surface-coated fluorescence solution at described LED chip, and to form described fluorescence coating, wherein said LED chip is fixed on the described substrate of the low-temperature space that is placed in described board; And
Described heating unit is for heating to solidify described fluorescence coating to described substrate, and the surface that wherein said substrate is placed in the high-temperature region of described board and is fixed in the described LED chip on described substrate is formed with described fluorescence coating.
In conjunction with the third possible implementation, in the 4th kind of possible implementation, described point gum machine comprises for stirring the blender of described fluorescence solution.
In conjunction with the possible implementation of the first, in the 5th kind of possible implementation, described fluorescent layer forming apparatus comprises mold pressing device, wherein
Described mold pressing device is for being pressed together on fluorescent glue cake on the surface of described LED chip, and to form described fluorescence coating, wherein said LED chip is fixed on the described substrate of the low-temperature space that is placed in described board; And
Described heating unit is for heating to solidify described fluorescence coating to described substrate, and the surface that wherein said substrate is placed in the high-temperature region of described board and is fixed in the described LED chip on described substrate is formed with described fluorescence coating.
In conjunction with five kinds of possible implementations of the second to the, in the 5th kind of possible implementation, described die bond machine comprises coating unit and chip unit, wherein
Described coating unit is for being coated in tin cream the conductive pattern of the described substrate on the low-temperature space that is placed in described board;
Described chip unit is used for the described substrate that described LED chip is covered on the low-temperature space that is placed in described board and be coated with described tin cream, so that the positive electrode of described LED chip and negative electrode can be electrically connected via the conductive pattern of described tin cream and described substrate; And
Described heating unit heats for the described substrate that is opposite on described workbench and be coated with described LED chip, so that the fusing of described tin cream, thus make the positive electrode of described LED chip and negative electrode in electrical contact via the conductive pattern of described tin cream and described substrate.
In conjunction with the 6th kind of possible implementation, in the 7th kind of possible implementation, described coating unit comprises a tin cream swing arm, and described some tin cream swing arm is for taking out described tin cream from tin cream load plate.
In conjunction with the 6th kind of possible implementation, in the 8th kind of possible implementation, described chip unit comprises gets core swing arm, described in get core swing arm for take out described LED chip from wafer central.
By making die bond machine, fluorescent layer forming apparatus and heating unit be opposite to whole operations of the substrate execution chip package LED chip on same board, according to the sealed in unit of the utility model above-described embodiment, can effectively avoid the contaminated problem of semi-finished product in operation transfer process, thereby improve the yields of chip package LED chip.
According to below with reference to accompanying drawing to detailed description of illustrative embodiments, it is clear that further feature of the present utility model and aspect will become.
Accompanying drawing explanation
The accompanying drawing that is included in specification and forms a part for specification shows exemplary embodiment of the present utility model, feature and aspect together with specification, and for explaining principle of the present utility model.
Fig. 1 illustrates according to the block diagram of the sealed in unit of the utility model one embodiment;
Fig. 2 illustrates according to the schematic diagram of the LED chip of the sealed in unit encapsulation of the utility model one embodiment;
Fig. 3 illustrates according to the schematic diagram of the substrate of the sealed in unit encapsulation of the utility model one embodiment;
Fig. 4 illustrates according to the schematic diagram of the board in the sealed in unit of the utility model one embodiment;
Fig. 5 illustrates according to the schematic diagram of the die bond machine in the sealed in unit of the utility model one embodiment;
Fig. 6 illustrates according to the die bond machine in the sealed in unit of the utility model one embodiment and LED chip is fixed in to the schematic diagram on the substrate being placed on board;
Fig. 7 illustrates according to the schematic diagram of the point gum machine as fluorescent layer forming apparatus in the sealed in unit of the utility model one embodiment;
Fig. 8 illustrates according to the mold pressing device as fluorescent layer forming apparatus in the sealed in unit of the utility model one embodiment and fluorescent glue cake is pressed together on to the surperficial schematic diagram of LED chip; And
Fig. 9 illustrates and according to the sealed in unit of the another embodiment of the utility model, on the surface of LED chip, forms the schematic diagram of fluorescence coating.
Description of reference numerals:
10: sealed in unit; 11: board; 12: die bond machine; 13: fluorescent layer forming apparatus; 14: heating unit; 30: substrate; 31: conductive pattern; 20:LED chip; 21: positive electrode; 22: negative electrode; 23: isolated area; 41: low-temperature space; 42: high-temperature region; 51: coating unit; 52: chip unit; 53: point gum machine; 54: mold pressing device; 61: the swing arm of some tin cream; 62: tin cream load plate; 63: get core swing arm; 64: wafer central; 70: tin cream; 81: blender; 90: patrix; 91: die cavity; 92: fluorescent glue cake; 93: fluorescence coating; L0:LED chip 20 width in the horizontal direction; L1: positive electrode 21 and negative electrode 22 width in the horizontal direction; L2: isolated area 23 width in the horizontal direction.
Embodiment
Below with reference to accompanying drawing, describe various exemplary embodiments of the present utility model, feature and aspect in detail.The identical same or analogous element of Reference numeral presentation function in accompanying drawing.Although the various aspects of embodiment shown in the drawings, unless otherwise indicated, needn't draw accompanying drawing in proportion.
Here special-purpose word " exemplary " means " as example, embodiment or illustrative ".Here as " exemplary " illustrated any embodiment, needn't be interpreted as being better than or being better than other embodiment.
In addition, in order better to illustrate, in embodiment below, provided numerous details by the utility model.It will be appreciated by those skilled in the art that and there is no these details, the utility model can be implemented equally.In other example, the method for knowing for everybody, means, element and circuit are not described in detail, so that highlight purport of the present utility model.
Fig. 1 illustrates according to the block diagram of the sealed in unit of the utility model one embodiment, this sealed in unit 10 be mainly used in by example as shown in Figure 2 LED chip 20 crystal covering types be encapsulated in example as shown in Figure 3 on substrate 30.As shown in Figure 1, sealed in unit 10 mainly comprises board 11, die bond machine 12, fluorescent layer forming apparatus 13 and heating unit 14.Wherein, board 11 is for being placed with substrate 30 thereon.Die bond machine 12 is for LED chip 20 being fixed in to the substrate 30 being placed on board 11, and make the positive electrode 21 of LED chip 20 and negative electrode 22 can with substrate 30 on conductive pattern 31 in electrical contact.Fluorescent layer forming apparatus 13, forms fluorescence coating 93 for the surface at LED chip 20, and wherein LED chip 20 is fixed on the substrate 30 being placed on board 11.Heating unit 14 is for heating substrate 30.
Owing to being integrated with die bond machine 12, fluorescent layer forming apparatus 13 and heating unit 14, this sealed in unit 10 can complete die bond in chip package LED chip, some glue, long each operation such as roasting successively.First, carry out die bond operation, by die bond machine 12, use for example tin cream 70 of conducting metals, LED chip 20 be fixed on the substrate 30 being placed on board 11, and make the positive electrode 21 of LED chip 20 and negative electrode 22 can with substrate 30 on conductive pattern 31 in electrical contact.Secondly, after LED chip 20 is fixed on the described substrate 30 being placed on board 11, execution point glue process, forms fluorescence coating 93 by fluorescent layer forming apparatus 13 on the surface of LED chip 20.Finally, carry out curing process, by 14 pairs of substrates 30 of heating unit, heat, so that fluorescence coating 93 further solidifies.Like this, on this sealed in unit 10, completed successively whole operations of chip package LED chip, and without carrying out operation transfer, thereby effectively avoided owing to semi-finished product being shifted between distinct device to the pollution causing.
In a kind of possible implementation, as shown in Figure 2, described LED chip 20 comprises the positive electrode 21 that along continuous straight runs is arranged in order, negative electrode 22 and isolated area 23, wherein said horizontal direction is the direction parallel with described substrate 30, the upright projection of described isolated area 23 on described substrate 30 is at described positive electrode 21 and negative electrode 22 between the upright projection on described substrate 30, center line and described LED chip 20 axis on described horizontal direction of described isolated area 23 in described horizontal direction is overlapping, and described isolated area 23 is no more than described LED chip 20 at 1/3rd of the width L0 of described horizontal direction at the width L2 of described horizontal direction.
Particularly, as shown in Figures 2 and 3, the isolated area 23 of LED chip 20 is positioned at the centre of LED chip 20, is equivalent to the both sides, axis that positive electrode 21 and negative electrode 22 are symmetrically distributed in LED chip 20, and positive electrode 21 and negative electrode 22 width L1 in the horizontal direction roughly the same.For example: if LED chip 20 width L0 is in the horizontal direction 1mm, positive electrode 21 and negative electrode 22 width L1 in the horizontal direction, to be 0.3mm, isolated area 23 width L2 be in the horizontal direction 0.3mm, on substrate 30 during chip package LED chip 20, because positive electrode 21 and negative electrode 22 are symmetrically distributed in the both sides, axis of LED chip 20, therefore conducting metal can be coated in to the surperficial central area of positive electrode 21 and negative electrode 22 just as tin cream or elargol, and coated weight is moderate.In the die bond operation of chip package LED chip, when being heated to high temperature so that conducting metal when fusing, can not cause the surface of conducting metal any one in conductive pattern 31 from positive electrode 21, negative electrode 22 and substrate 30 to be overflowed, thereby avoided short circuit between positive electrode 21 and negative electrode 22, effectively improved the yields of chip package LED chip.
Like this, by making die bond machine, fluorescent layer forming apparatus and heating unit can be opposite to whole operations that substrate on same board completes chip package LED chip, according to the sealed in unit of the utility model above-described embodiment, can effectively avoid causing the contaminated situation of semi-finished product because operation shifts, thereby improve the yields of chip package LED chip.
In a kind of possible implementation, as shown in Figure 4, board 11 can be divided into 41He high-temperature region, low-temperature space 42, to adapt to the temperature requirements of different operations and/or step.
For example, coating or pressing step in the coating in die bond operation, paster step and some glue process need to operate under normal temperature or low temperature environment, therefore can in the situation that substrate 30 is placed in the low-temperature space 41 of board 11, carry out these steps accordingly.In addition, the curing schedule in the heating steps in die bond operation, some glue process and long roasting operation need to operate under hot environment, therefore can carry out these steps or operation in the situation that substrate is placed in the high-temperature region 42 of board 11.
In a kind of possible specific implementation, high-temperature region 42 can further be divided into a plurality of high-temperature regions that heating-up temperature is different, to adapt to the heating steps in die bond operation, curing schedule and the required mutual different demand of temperature possibility of long roasting operation in some glue process.For example, in high-temperature region 42, can be provided with the first high-temperature region for the heating steps in die bond operation, to carry out die bond heating operation at the first temperature; Also can be provided with the second high-temperature region for the curing schedule in a glue process, to carry out this adhesive curing operation at the second temperature; Third high warm area for long roasting operation also can be set, to carry out the operation of further solidifying fluorescence coating at the 3rd temperature.In addition, the first high-temperature region can further be divided into a plurality of high-temperature regions that heating-up temperature is different, to adapt to the different heating-up temperature demand causing due to the electric conducting material difference on tin cream 70 materials variancess and LED chip 20 and/or substrate 30 in die bond operation.For example, in high-temperature region 42, a plurality of sub-high-temperature region in 35～100 ℃ of temperature ranges can be set, to adapt to various materials demands.
In a kind of possible specific implementation, can use push pedal, conveyer belt or chain etc. between low-temperature space 41 and at least one high-temperature region 42, to carry out the transmission of substrate 30.
Like this, by board being divided into low-temperature space and at least one high-temperature region, and each operation and/or step complete respectively chip package LED chip in low-temperature space and at least one high-temperature region in, according to the sealed in unit of the utility model above-described embodiment, can on same board, provide different operations and step to operate required different temperatures, avoided causing the contaminated situation of semi-finished product because operation and/or step shift, thereby improved the yields of chip package LED chip.
In a kind of possible implementation, as shown in Figure 5, die bond machine 12 comprises coating unit 51 and chip unit 52.Wherein, coating unit 51 is for being coated in tin cream 70 conductive pattern 31 of the substrate 30 on the low-temperature space 41 that is placed in board 11.Chip unit 52 in the situation that substrate 30 be placed on the low-temperature space 31 of board 11 and be coated with tin cream 70, the positive electrode 21 of LED chip 20 and negative electrode 22 LED chip 20 covered on substrate 30, so that can be electrically connected via tin cream 70 and the conductive pattern 31 of substrate 30.In this implementation, heating unit 14 is also in the situation that be coated with the high-temperature region 42 that the substrate 30 of LED chip 20 is placed in board 11, this substrate 30 and/or LED chip 20 are heated, so that tin cream 70 fusing, thus make the positive electrode 21 of LED chip 20 and negative electrode 22 in electrical contact with the conductive pattern 31 of substrate 30 via tin cream 70.
In a kind of possible specific implementation, as shown in Figure 5, coating unit 51 can comprise a tin cream swing arm 61, and the swing arm 61 of some tin cream is for taking out tin cream 70 from tin cream load plate 62.
Particularly, tin cream load plate 62 is for placing in advance tin cream 70.As shown in Fig. 5～6, first, some tin cream swing arm 61 can be used suction nozzle, takes out appropriate tin cream 70 from tin cream load plate 62.Secondly, some tin cream swing arm 61 can be used a pin, tin cream 70 is coated in to the surface of the conductive pattern 31 of the substrate 30 being placed on board 11.In order tin cream 70 to be coated on the arbitrary conductive pattern 31 in substrate 30, point tin cream swing arm 61 can be set to, in allowed operating space, can arrive on the arbitrary position in substrate 30, thereby improve flexibility and the convenience of the operation of some tin cream.In order to guarantee that tin cream 70 can be coated on the interior desired position of substrate 30 exactly, can control more accurately to a concrete operations for tin cream swing arm 61.By similar procedure, tin cream 70 can be coated on a plurality of conductive patterns 31 of substrate 30 successively.
In a kind of possible implementation, chip unit 52 can comprise gets core swing arm 63, gets core swing arm 63 for taking out LED chip 20 from wafer central 64.
Particularly, wafer central 64 is for placing LED chip 20.As shown in Fig. 5～6, first, get core swing arm 63 and can use suction nozzle, from wafer central 64, take out a LED chip 20.Then, get core swing arm 63 and can use a pin, LED chip 20 is placed on the interior required relevant position of substrate 30, so that LED chip 20 can be stained with on substrate 30 via tin cream 70, thereby the positive electrode 21 of LED chip 20 and negative electrode 22 are realized and being electrically connected with the conductive pattern 31 of substrate 30.For LED chip 20 being placed on the arbitrary position in substrate 30, getting core swing arm 63 can be set to, and in allowed operating space, can arrive on the arbitrary position in substrate 30, thereby improve flexibility and the convenience of getting core operation.In order to guarantee that LED chip 20 can be placed on the interior desired position of substrate 30 exactly, can control more accurately to getting the concrete operations of core swing arm 62.By similar procedure, can successively a plurality of LED chips 20 be placed on a plurality of positions of substrate 30.
In a kind of possible implementation, as shown in Figure 7, fluorescent layer forming apparatus 13 can comprise point gum machine 53.Wherein, point gum machine 53 in the situation that substrate 30 be placed in the low-temperature space 41 of board 11 and be connected with LED chip 20, at the surface-coated fluorescence solution of LED chip 20, to form fluorescence coating 93.In this implementation, heating unit 14 also, in the situation that substrate 30 is placed in the high-temperature region 42 of board 11 and the surface of the LED chip 20 on substrate 30 is formed with fluorescence coating 93, heats to solidify fluorescence coating 93 to substrate 30 and/or LED chip.In addition, point gum machine 53 can be used screw point colloid system.
Particularly, the light of the different colours that will launch according to LED chip, for example the light of white light, gold-tinted or other colors applies corresponding fluorescence solution on LED chip surface and side.Fluorescence solution is generally by many raw materials such as fluorescent material, resin glue mixed solution formulated according to certain proportion.As shown in Fig. 7 and Fig. 9, after requiring to have configured fluorescence solution according to the luminous color of LED chip 20, point gum machine 53 can in the situation that substrate be placed in the low-temperature space 41 of board 11 and be connected with LED chip 20, use some plastic pin evenly to apply fluorescence solution on the surface of LED chip 20 and side, to form fluorescence coating 93 as shown in Figure 9.In this implementation, heating unit 14 also, in the situation that substrate 30 is placed in the high-temperature region 42 of board 11 and the surface of the LED chip 20 on substrate 30 is formed with fluorescence coating, heats to solidify fluorescence coating 93 to substrate 30 and/or LED chip.Thereby can within the shortest time, complete coating and curing schedule in a glue process.
In a kind of possible specific implementation, as shown in Figure 7, point gum machine 53 can comprise for stirring the blender 81 of fluorescence solution.Particularly, in the process for preparation of fluorescence solution, in order to guarantee that each raw material can remain on even admixture and prevent fluorescent material precipitation, can use 81 pairs of fluorescence solution of blender constantly to stir, to avoid because each of the inhomogeneous LED of causing of fluorescence solution applying is inconsistent to luminosity, thereby improved the yields of some glue process.
In the possible implementation of another kind, as shown in Figure 8, fluorescent layer forming apparatus 13 comprises mold pressing device 54.Wherein, described mold pressing device 54, in the situation that substrate 30 is placed in the low-temperature space 41 of board 11 and is connected with LED chip 20, is pressed together on fluorescent glue cake 92 on the surface of LED chip 20, to form fluorescence coating 93.In this implementation, heating unit 14 also, in the situation that substrate 30 is placed in the high-temperature region 42 of board 11 and the surface of the LED chip 20 on substrate 30 is formed with fluorescence coating, heats to solidify fluorescence coating 93 to substrate 30 and/or LED chip.
Particularly, as shown in Figure 8, can utilize the surperficial evenness of LED chip 20, for example the evenness of Sapphire Substrate, the mode that makes 90 pairs of fluorescent glue cakes of patrix 92 carry out downward mold pressing by mold pressing device 54, is pressed together on fluorescent glue cake 92 on the surface and side of LED chip 20.Wherein, the material of fluorescent glue cake 92, the color of the light that will launch according to this LED chip 20 is definite, and the shape of the die cavity 91 of patrix 90 inner sides can be determined according to LED chip 20 and the profile of substrate 30.
The above; it is only embodiment example of the present utility model; but protection range of the present utility model is not limited to this; anyly be familiar with those skilled in the art in the technical scope that the utility model discloses; can expect easily changing or replacing, within all should being encompassed in protection range of the present utility model.Therefore, protection range of the present utility model should be as the criterion by the described protection range with claim.
Claims (9)
1. a sealed in unit, for LED chip crystal covering type is encapsulated in to substrate, is characterized in that, comprising:
Board, can be placed with described substrate on it;
Die bond machine, for described LED chip being fixed in to the described substrate being placed on described board, and make the positive electrode of described LED chip and negative electrode can with described substrate on conductive pattern in electrical contact;
Fluorescent layer forming apparatus, forms fluorescence coating for the surface at described LED chip, and wherein said LED chip is fixed on the described substrate being placed on described board; And
Heating unit, for heating described substrate.
2. sealed in unit according to claim 1, is characterized in that, described LED chip comprises positive electrode, negative electrode and the isolated area that along continuous straight runs is arranged in order, and wherein said horizontal direction is the direction parallel with described substrate,
The upright projection of described isolated area on described substrate be at described positive electrode and negative electrode between the upright projection on described substrate,
Center line and the described LED chip axis on described horizontal direction of described isolated area in described horizontal direction is overlapping, and
Described isolated area is no more than described LED chip at 1/3rd of the width of described horizontal direction at the width of described horizontal direction.
3. sealed in unit according to claim 2, is characterized in that, described board is divided into low-temperature space and high-temperature region.
4. sealed in unit according to claim 3, is characterized in that, described fluorescent layer forming apparatus comprises point gum machine, wherein
Described point gum machine is for the surface-coated fluorescence solution at described LED chip, and to form described fluorescence coating, wherein said LED chip is fixed on the described substrate of the low-temperature space that is placed in described board; And
Described heating unit is for heating to solidify described fluorescence coating to described substrate, and the surface that wherein said substrate is placed in the high-temperature region of described board and is fixed in the described LED chip on described substrate is formed with described fluorescence coating.
5. sealed in unit according to claim 4, is characterized in that, described point gum machine comprises for stirring the blender of described fluorescence solution.
6. sealed in unit according to claim 3, is characterized in that, described fluorescent layer forming apparatus comprises mold pressing device, wherein
Described mold pressing device is for being pressed together on fluorescent glue cake on the surface of described LED chip, and to form described fluorescence coating, wherein said LED chip is fixed on the described substrate of the low-temperature space that is placed in described board; And
Described heating unit is for heating to solidify described fluorescence coating to described substrate, and the surface that wherein said substrate is placed in the high-temperature region of described board and is fixed in the described LED chip on described substrate is formed with described fluorescence coating.
7. according to the sealed in unit described in any one in claim 2 to 6, it is characterized in that, described die bond machine comprises coating unit and chip unit, wherein
Described coating unit is for being coated in tin cream the conductive pattern of the described substrate on the low-temperature space that is placed in described board;
Described chip unit is used for the described substrate that described LED chip is covered on the low-temperature space that is placed in described board and be coated with described tin cream, so that the positive electrode of described LED chip and negative electrode can be electrically connected via the conductive pattern of described tin cream and described substrate; And
Described heating unit heats for the described substrate that is opposite on described workbench and be coated with described LED chip, so that the fusing of described tin cream, thus make the positive electrode of described LED chip and negative electrode in electrical contact via the conductive pattern of described tin cream and described substrate.
8. sealed in unit according to claim 7, is characterized in that, described coating unit comprises a tin cream swing arm, and described some tin cream swing arm is for taking out described tin cream from tin cream load plate.
9. sealed in unit according to claim 7, is characterized in that, described chip unit comprises gets core swing arm, described in get core swing arm for take out described LED chip from wafer central.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201320441960.2U CN203434130U (en) | 2013-07-23 | 2013-07-23 | Packaging device |
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| CN201320441960.2U CN203434130U (en) | 2013-07-23 | 2013-07-23 | Packaging device |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104091877A (en) * | 2014-07-01 | 2014-10-08 | 东莞市万丰纳米材料有限公司 | LED production process |
| CN104934506A (en) * | 2014-03-19 | 2015-09-23 | 弘凯光电(深圳)有限公司 | White light crystal grain manufacturing method |
| CN106159061A (en) * | 2016-08-03 | 2016-11-23 | 常州市武进区半导体照明应用技术研究院 | A kind of flip chip integration packaging device and technique |
-
2013
- 2013-07-23 CN CN201320441960.2U patent/CN203434130U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104934506A (en) * | 2014-03-19 | 2015-09-23 | 弘凯光电(深圳)有限公司 | White light crystal grain manufacturing method |
| CN104091877A (en) * | 2014-07-01 | 2014-10-08 | 东莞市万丰纳米材料有限公司 | LED production process |
| CN106159061A (en) * | 2016-08-03 | 2016-11-23 | 常州市武进区半导体照明应用技术研究院 | A kind of flip chip integration packaging device and technique |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: SHENZHEN SHUNYU AUTOMATION EQUIPMENT CO., LTD. Free format text: FORMER NAME: SHENZHEN CHUANGWEIXING AUTOMATION EQUIPMENT CO., LTD. Owner name: SHENZHEN CHUANGWEIXING AUTOMATION EQUIPMENT CO., L Free format text: FORMER NAME: SHENZHEN CREASTAR AUTOMATIC EQUIPMENT CO., LTD. |
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| CP01 | Change in the name or title of a patent holder |
Address after: 518055 Guangdong city of Shenzhen province Nanshan District Xili Street sunshine District Songbai Road No. 1026 Weihao Industrial Park 2 building, A block 501 Patentee after: SHENZHEN SHUNYU AUTOMATION EQUIPMENT CO.,LTD. Address before: 518055 Guangdong city of Shenzhen province Nanshan District Xili Street sunshine District Songbai Road No. 1026 Weihao Industrial Park 2 building, A block 501 Patentee before: Shenzhen Chuangwei star Automation Equipment Co.,Ltd. Address after: 518055 Guangdong city of Shenzhen province Nanshan District Xili Street sunshine District Songbai Road No. 1026 Weihao Industrial Park 2 building, A block 501 Patentee after: Shenzhen Chuangwei star Automation Equipment Co.,Ltd. Address before: 518055 Guangdong city of Shenzhen province Nanshan District Xili Street sunshine District Songbai Road No. 1026 Weihao Industrial Park 2 building, A block 501 Patentee before: Shenzhen Chuangweixing Automation Equipment Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140212 Termination date: 20150723 |
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| EXPY | Termination of patent right or utility model |