CN205789876U - A kind of chip repairing batch plants ball chuck tool - Google Patents

A kind of chip repairing batch plants ball chuck tool Download PDF

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Publication number
CN205789876U
CN205789876U CN201620644478.2U CN201620644478U CN205789876U CN 205789876 U CN205789876 U CN 205789876U CN 201620644478 U CN201620644478 U CN 201620644478U CN 205789876 U CN205789876 U CN 205789876U
Authority
CN
China
Prior art keywords
chip
main body
ball
chuck tool
ball chuck
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201620644478.2U
Other languages
Chinese (zh)
Inventor
戴建权
苏红
王海东
张先年
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mobiwire Mobiles Ningbo Co Ltd
Original Assignee
Mobiwire Mobiles Ningbo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mobiwire Mobiles Ningbo Co Ltd filed Critical Mobiwire Mobiles Ningbo Co Ltd
Priority to CN201620644478.2U priority Critical patent/CN205789876U/en
Application granted granted Critical
Publication of CN205789876U publication Critical patent/CN205789876U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

This utility model provides a kind of chip repairing batch to plant ball chuck tool, including supporting region and main body, described supporting region is located at the surrounding of described main body, and the middle part of described main body is provided with chip rest area, corner is arranged with setting base, and described main body is additionally provided with some lightening holes.This utility model combines the equipment such as existing stencil printer, tin cream somascope (SPI), reflow soldering, bga chip can be realized and plant the mass of ball, reduce manual operation simultaneously, make to plant ball and cross process automation, plant ball quality judging equipment, thus improve bga chip and plant the efficiency of ball, success rate, reduce maintenance cost low.

Description

A kind of chip repairing batch plants ball chuck tool
Technical field
This utility model relates to electronic product maintenance technique field, is specifically related to a kind of chip repairing batch and plants ball chuck tool.
Background technology
In surface mounting technology (SMT) process of manufacture, because of factors such as printing are bad, paster is bad, cause chip Weld defect occurs, each factory of this phenomenon generally exists.Welded ball array encapsulation (BGA) class chip is substantially CPU (CPU), the valuable chip such as flash memory (FLASH), power management, price tens, hundreds of to thousands of, be electron product circuit On plate indispensable.Because of expensive, the bad chip that welding reason causes, it is necessary to carry out reprocessing reuse.Bga chip at present Ball of planting reprocess, basic use the most single ball of planting, use tin sweat(ing) or tin cream two schemes, operation device is essentially identical.
BGA class chip increasingly miniaturization, fine and closely wovenization at present, soldered ball quantity gets more and more, and current current techique uses By hand plant ball mode, make to reprocess that to plant ball more and more difficult, but also exist following not enough: 1, efficiency is low: once can only plant a piece of Bga chip;2, success rate is low: whole process all uses manual operations, after chip miniaturization, fine and closely wovenization, and location difficulty, exist simultaneously It is easily generated skew during brush stannum or brush tin cream, causes and plant ball failure;3, chip is fragile: chip is in the manual process planting ball In, touch repeatedly easily causes electrostatic breakdown and damages;Plant ball unsuccessful, repeatedly cause solder ball pad to destroy damage etc. except stannum.
The deficiency existed in view of prior art, thus it is necessary that researching and developing a kind of novel B GA chip batch plants ball chuck tool, improve Production efficiency, meet reality need.
Utility model content
The purpose of this utility model is to provide a kind of chip repairing batch and plants ball chuck tool, in conjunction with existing stencil printer, The equipment such as tin cream somascope (SPI), reflow soldering, can realize bga chip plants the mass of ball, reduces manual operation simultaneously, makes Plant ball and cross process automation, plant ball quality judging equipment, thus improve bga chip and plant the efficiency of ball, success rate, reduce and keep in repair into This is low.
To achieve these goals, the technical solution adopted in the utility model is as follows:
A kind of chip repairing batch plants ball chuck tool, and including supporting region and main body, described supporting region is located at the four of described main body In week, the middle part of described main body is provided with chip rest area, corner is arranged with setting base.
According to above scheme, described main body is additionally provided with some lightening holes, to alleviate the weight of fixture.
According to above scheme, described chip rest area is provided with some chips and places position, hole, location and handle hole.
According to above scheme, described chip is placed position and is provided with high temperature resistant double faced adhesive tape, is used for pasting core sheet to be planted.
According to above scheme, described handle hole is symmetrically set in described chip and places the corner of position.
According to above scheme, a length of 250mm, a width of 202mm, the thickness of described main body is 4mm, the thickness of described supporting region For 2mm.
According to above scheme, a diameter of 1mm of described setting base, a diameter of 20mm of described lightening hole, described operation A diameter of 5mm in hole.
Chip of the present utility model places bit quantity can carry out spirit according to the quantity of chip to be reprocessed and size with size The adjustment lived.
The beneficial effects of the utility model are:
1) batch of the present utility model plants the chip rest area being provided with in the middle of ball chuck tool, the setting base that corner is provided with, core Sheet rest area is provided with multiple chip and places position, and is provided with high temperature resistant double faced adhesive tape and is used for fixing core sheet to be planted, in conjunction with existing stannum The equipment such as cream printer, tin cream somascope, reflow soldering, can realize mass plants ball, automation mechanized operation, substantially increases and plants ball Success rate and efficiency, reduce operating cost low;
2) this utility model uses aluminum alloy materials to make, and material source is extensive, and simple in construction is easy to process, is fabricated to This is cheap.
Accompanying drawing explanation
Fig. 1 is main TV structure schematic diagram of the present utility model;
Fig. 2 is plan structure schematic diagram of the present utility model.
In figure: 1, supporting region;2, chip rest area;3, setting base;4, lightening hole;5, main body;21, chip places position; 22, hole, location;23, handle hole.
Detailed description of the invention
With embodiment, the technical solution of the utility model is illustrated below in conjunction with the accompanying drawings.
As shown in Figure 1 to Figure 2, this utility model offer a kind of chip repairing batch is planted ball chuck and is had, supporting region 1 and main body 5, Described supporting region 1 is located at the surrounding of described main body 5, and the middle part of described main body 5 is provided with chip rest area 2, corner symmetry sets There is setting base 3, be additionally provided with some lightening holes 4,
Further, described chip rest area 2 is provided with 25 chips and places hole 22, location, 21,25, position and 100 operations Hole 23, described chip placement position 21 is provided with high temperature resistant double faced adhesive tape, and described handle hole 23 is symmetrically set in described chip and places position 21 Corner.
Further, a length of 250mm, a width of 202mm, the thickness of described main body 5 is 4mm, and the thickness of described supporting region 1 is 2mm, a diameter of 1mm of described setting base 3, a diameter of 20mm of described lightening hole 4, a diameter of 5mm of described handle hole 23.
Above example is only in order to illustrative not limiting the technical solution of the utility model, although above-described embodiment is to this reality Be described in detail with novel, the person skilled of this area it is understood that this utility model can be modified or Person replaces on an equal basis, but any amendment and local without departing from this utility model spirit and scope is replaced and all should be contained in this practicality newly In the right of type.

Claims (7)

1. a chip repairing batch plants ball chuck tool, it is characterised in that include supporting region (1) and main body (5), described supporting region (1) being located at the surrounding of described main body (5), the middle part of described main body (5) is provided with chip rest area (2), corner is arranged with Setting base (3).
Chip repairing the most according to claim 1 batch plants ball chuck tool, it is characterised in that described main body is additionally provided with on (5) Some lightening holes (4).
Chip repairing the most according to claim 1 batch plants ball chuck tool, it is characterised in that described chip rest area (2) sets Some chips are had to place position (21), hole, location (22) and handle hole (23).
Chip repairing the most according to claim 3 batch plants ball chuck tool, it is characterised in that described chip is placed on position (21) It is provided with high temperature resistant double faced adhesive tape.
Chip repairing the most according to claim 3 batch plants ball chuck tool, it is characterised in that described handle hole (23) symmetry sets The corner of position (21) is placed in described chip.
Chip repairing the most according to claim 1 batch plants ball chuck tool, it is characterised in that a length of 250mm, a width of 202mm, The thickness of described main body (5) is 4mm, and the thickness of described supporting region (1) is 2mm.
Chip repairing the most according to claim 1 and 2 batch plants ball chuck tool, it is characterised in that described setting base (3) A diameter of 1mm, a diameter of 20mm of described lightening hole (4), a diameter of 5mm of described handle hole (23).
CN201620644478.2U 2016-06-23 2016-06-23 A kind of chip repairing batch plants ball chuck tool Expired - Fee Related CN205789876U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201620644478.2U CN205789876U (en) 2016-06-23 2016-06-23 A kind of chip repairing batch plants ball chuck tool

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201620644478.2U CN205789876U (en) 2016-06-23 2016-06-23 A kind of chip repairing batch plants ball chuck tool

Publications (1)

Publication Number Publication Date
CN205789876U true CN205789876U (en) 2016-12-07

Family

ID=58130815

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201620644478.2U Expired - Fee Related CN205789876U (en) 2016-06-23 2016-06-23 A kind of chip repairing batch plants ball chuck tool

Country Status (1)

Country Link
CN (1) CN205789876U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111823028A (en) * 2019-04-22 2020-10-27 上海上飞飞机装备制造有限公司 Standard supporting plate for positioning and clamping parts

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111823028A (en) * 2019-04-22 2020-10-27 上海上飞飞机装备制造有限公司 Standard supporting plate for positioning and clamping parts

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20161207

Termination date: 20200623