CN201134981Y - Tin cream printed platform of minimized single-chip flexible printed circuit board - Google Patents
Tin cream printed platform of minimized single-chip flexible printed circuit board Download PDFInfo
- Publication number
- CN201134981Y CN201134981Y CNU2007200776380U CN200720077638U CN201134981Y CN 201134981 Y CN201134981 Y CN 201134981Y CN U2007200776380 U CNU2007200776380 U CN U2007200776380U CN 200720077638 U CN200720077638 U CN 200720077638U CN 201134981 Y CN201134981 Y CN 201134981Y
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- small
- solder
- circuit board
- steel wire
- spring steel
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Abstract
The utility model provides a small-sized single FPC solder-paste printing platform, which aims at saving tooling equipment investment, avoiding occupying production SMT line body, and having better guarantee on printing effects. A small-sized single flexible printing circuit board solder-paste printing platform comprises a bottom board, wherein a position block and a copper button are fixed on the bottom board, one end of a spring steel wire is locked by the position block, and the other end of the spring steel wire is locked by the copper button, the spring steel wire is used to fix a solder-paste printing net slice, two adjustable position columns are also arranged on the bottom board, and the two adjustable position columns are also used to fix the solder-paste printing net slice. The small-sized single FPC solder-paste printing platform solves the industry process problem that a small-sized single FPC can not print solder paste, which effectively applies the operation procedures such as former position and print of reflow soldering process of the small-sized single FPC, the rapid conversion of FPC with various types and the like, and the small-sized single FPC solder-paste printing platform has improvement on operating efficiency and process application precision.
Description
Technical field
The utility model relates to a kind of small-sized monolithic flexible printed circuit board paste solder printing platform.
Background technology
Flexible printed circuit board (FPC, FLEXIBLE PRINTED CIRCUITS BOARD is hereinafter to be referred as FPC) is a kind ofly to have height reliability, an excellent flexible printed circuit with what mylar or polyimides were that base material is made.This kind circuit can arbitrarily stretch, crooked, folding, in light weight, volume is little, thermal diffusivity good, is used for multiple electronic product.Small-sized monolithic FPC is meant that area is no more than single double-faced flexible printed circuit board of 6 square centimeters
In the SMT industry, mainly be to adopt to make a plurality of complexity and expensive localization tool at present, and then be installed on the automatic or semi-automatic paste solder printing equipment and print after the contraposition mounting of small-sized monolithic FPC.In this process, need several operating personnel FPC to be navigated on the tool with higher technical ability (deviation＜0.1mm), carry out the device weldment to the few small-sized monolithic FPC of quantity generally can only adopt the electric iron welding, but quality can not be guaranteed.Along with soldered miniaturization of devices, the welding method of electric iron also can't adapt to, wants the hand-printing tin cream also can't implement because of FPC is too little.
Summary of the invention
The purpose of this utility model provides a kind of small-sized monolithic FPC paste solder printing platform, to save the equipment frock input, to avoid taking volume production SMT line body, solved the industry difficult problem that small-sized monolithic FPC can't print solder paste, and better guarantees has been arranged on printing effect.
To achieve these goals, the utility model has adopted following technical scheme:
Small-sized monolithic flexible printed circuit board paste solder printing platform, comprise a base plate, an affixed fixed block and a copper button on the base plate, one end of fixed block locking spring steel wire, the other end of spring steel wire is decided by the copper padlock, described spring steel wire is used for fixing paste solder printing net sheet, also is provided with two adjustable reference columns on the base plate, and described two adjustable reference columns also are used for fixing paste solder printing net sheet.
Fix a capsule on the base plate.Two adjustable reference columns are fixed in base plate with screw.On fixed block, lock an end of spring steel wire with screw.Avris at base plate laterally has a vacuum hole, and described vacuum hole extends through the base plate front.
Vacuum hole links to each other with the external vacuum source of the gas.
The utility model has solved the industry difficult problem that small-sized monolithic FPC can't print solder paste, by simple structural adjustment, applicable to the manual paste solder printing of the monolithic FPC of different types of structure.Implemented the location, preceding road of the reflow soldering process of small-sized monolithic FPC effectively, operational sequences such as printing, the quick conversion of polymorphic type FPC are improved on operating efficiency and process implementing precision.
Description of drawings
Fig. 1 is a plan structure schematic diagram of the present utility model.
Fig. 2 is the Facad structure schematic diagram of looking squarely of the present utility model.
Fig. 3 is a side-looking structural representation of the present utility model.
Embodiment
As Fig. 1, Fig. 2, shown in Figure 3, small-sized monolithic flexible printed circuit board paste solder printing platform of the present utility model, comprise a base plate 1, an affixed fixed block 3 and a copper button 5 on the base plate 1, one end of fixed block 3 locking spring steel wires 4, the other end of spring steel wire 4 is by 5 lockings of copper button, and described spring steel wire 4 is used for fixing paste solder printing net sheet, also be provided with 2, two adjustable reference columns 2 of two adjustable reference columns on the base plate 1 and also be used for fixing paste solder printing net sheet.
On base plate 1, fix a capsule 7.Two adjustable reference columns 2 are fixed in base plate 1 with screw.On fixed block 3, lock an end of spring steel wire 4 with screw.
Avris at base plate 1 laterally has a vacuum hole 6, and described vacuum hole 6 extends through base plate 1 front.Vacuum hole 6 links to each other with the external vacuum source of the gas.
When using the utility model, insert the vacuum hole 6 of external vacuum source of the gas to the base plate 1, the net sheet of perforate is bonded on the spring steel wire 4 with double faced adhesive tape, according to the location hole distance adjustment scalable reference column 2 that is printed product, the location hole of FPC is aimed at scalable reference column 2 put into, press down spring steel wire 4 and locked by copper button 5 up to the one end, in capsule 7, get an amount of tin cream with scraper, parallel being coated on the net sheet unclamped at last by the spring steel wire 4 of copper button 5 lockings, and FPC is taken out.
Claims (6)
1, a kind of small-sized monolithic flexible printed circuit board paste solder printing platform, it is characterized in that, comprise a base plate (1), base plate (1) is gone up an affixed fixed block (3) and a copper button (5), one end of fixed block (3) locking spring steel wire (4), the other end of spring steel wire (4) is locked by copper button (5), described spring steel wire (4) is used for fixing paste solder printing net sheet, also be provided with two adjustable reference columns (2) on the base plate (1), described two adjustable reference columns (2) also are used for fixing paste solder printing net sheet.
2, small-sized monolithic flexible printed circuit board paste solder printing platform as claimed in claim 1 is characterized in that, fixes a capsule (7) on the base plate (1).
3, small-sized monolithic flexible printed circuit board paste solder printing platform as claimed in claim 1 is characterized in that, two adjustable reference columns (2) are fixed in base plate (1) with screw.
4, small-sized monolithic flexible printed circuit board paste solder printing platform as claimed in claim 1 is characterized in that, goes up an end that locks spring steel wire (4) with screw at fixed block (3).
5, small-sized monolithic flexible printed circuit board paste solder printing platform as claimed in claim 1 is characterized in that, laterally has a vacuum hole (6) at the avris of base plate (1), and described vacuum hole (6) extends through base plate (1) front.
6, small-sized monolithic flexible printed circuit board paste solder printing platform as claimed in claim 5 is characterized in that vacuum hole (6) links to each other with the external vacuum source of the gas.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200776380U CN201134981Y (en) | 2007-12-28 | 2007-12-28 | Tin cream printed platform of minimized single-chip flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200776380U CN201134981Y (en) | 2007-12-28 | 2007-12-28 | Tin cream printed platform of minimized single-chip flexible printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201134981Y true CN201134981Y (en) | 2008-10-15 |
Family
ID=40063252
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007200776380U Expired - Fee Related CN201134981Y (en) | 2007-12-28 | 2007-12-28 | Tin cream printed platform of minimized single-chip flexible printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201134981Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103369859A (en) * | 2013-05-08 | 2013-10-23 | 无锡江南计算技术研究所 | Solder paste printing jig and solder paste printing method |
| CN110267439A (en) * | 2019-07-05 | 2019-09-20 | 湖南维胜科技电路板有限公司 | A kind of rigid circuit board and its production technology with heat dissipation paster structure |
-
2007
- 2007-12-28 CN CNU2007200776380U patent/CN201134981Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103369859A (en) * | 2013-05-08 | 2013-10-23 | 无锡江南计算技术研究所 | Solder paste printing jig and solder paste printing method |
| CN103369859B (en) * | 2013-05-08 | 2016-02-10 | 无锡江南计算技术研究所 | Paste solder printing tool and paste solder printing method |
| CN110267439A (en) * | 2019-07-05 | 2019-09-20 | 湖南维胜科技电路板有限公司 | A kind of rigid circuit board and its production technology with heat dissipation paster structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: SHANGHAI CHENXING SIM TECHNOLOGY ELECTRONIC TECHNO Free format text: FORMER NAME: SHANGHAI CHENXING ELECTRONICS SCIENCE + TECHNOLOGY CO., LTD. |
|
| CP03 | Change of name, title or address |
Address after: No. 888 Shengli Road, Qingpu District, Shanghai: 201700 Patentee after: Shanghai Sunrise Simcom Electronic Technology Co., Ltd. Address before: No. 888 Shengli Road, Qingpu District, Shanghai: 201700 Patentee before: Shanghai Chenxing Electronics Science & Technology Co., Ltd. |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081015 Termination date: 20121228 |