WO2016197748A1

WO2016197748A1 - Through hole reflow soldering device for b surface socket and a surface, and socket mounting method

Info

Publication number: WO2016197748A1
Application number: PCT/CN2016/080910
Authority: WO
Inventors: 胡东东; 钱宏量; 王峰; 杨卫卫; 徐伟明; 梁志刚
Original assignee: 中兴通讯股份有限公司
Priority date: 2016-01-04
Filing date: 2016-05-03
Publication date: 2016-12-15
Also published as: CN106941764A

Abstract

Provided are a through hole reflow soldering device for a B surface socket and an A surface, and a socket mounting method. The device comprises: a feeding tray (1), a feeding tool (2), a positioning tool (3) and a reflow soldering tray (4). A socket (5) docks with the feeding tool (2) via the feeding tray (1), the feeding tool (2) docks with the positioning tool (3), and the positioning tool (3) snaps onto the reflow soldering tray (4).

Description

Device and socket mounting method for A-face through-hole reflow soldering of B-face socket

Technical field

The present application relates to, but is not limited to, the technical field of socket welding in PCBA (Printed Circuit Board+Assembly).

Background technique

At present, the socket on the B side of the RF power amplifier board is usually subjected to selective soldering or manual soldering after the reflow soldering of the entire board. There are several obvious disadvantages to the traditional process of selective welding or manual welding:

The process is cumbersome and the efficiency is low; the selection of the welding process requires that the reflowed veneer is transferred to the selected welding line for welding, which is cumbersome and cumbersome and inefficient.

The welding quality is obviously insufficient compared to the through-hole reflow soldering; the selection of welding usually has more welding defects, which is not conducive to ensuring the quality of the product.

The process cost is high; the selection of the solder sometimes requires the production of a mask, and the process cost is high.

Summary of the invention

The following is an overview of the topics detailed in this document. This Summary is not intended to limit the scope of the claims.

With the improvement of the performance and reliability requirements of communication equipment products, modern electronic assembly technology has also undergone changes, and reflow soldering technology will gradually replace wave soldering technology as the mainstream direction for future development. Reflow soldering technology has better solder quality, higher production efficiency, and lower production cost than wave soldering.

This document provides a device for inserting a socket on the B side of the PCB and performing a through-hole reflow soldering on the A side of the PCB.

The utility model relates to a device for reflow soldering of a face A through hole of a B face socket, comprising: a loading tray, a loading tool, a positioning tool and a reflow soldering tray;

The socket is arranged to be inserted into the loading tool through a loading tray;

The loading tool is inserted into the positioning tool;

The positioning tool is snapped onto the reflow soldering tray.

Optionally, the loading tray has a plurality of slots arranged side by side for the insertion of the socket pins of the socket.

Optionally, the loading tool comprises: a loading tool body and a cylindrical pin extending from the loading tool body for inserting a circular bowl base of the socket.

Optionally, the positioning tool has a first slot for inserting the loading tool body and a second slot for inserting the cylindrical pin.

Optionally, the first slot is a square slot that conforms to the shape of the loading tool body.

Optionally, the second slot is a cylindrical slot that matches the shape of the cylindrical pin of the loading tool.

Optionally, the reflow soldering tray has a card slot having the same shape as the positioning tool, and the positioning tool is snapped into the card slot.

Optionally, the card slot of the reflow soldering tray and the positioning tool are in a stepped slot, and the positioning tool is engaged with the upper edge of the stepped slot.

Optionally, the lower edge of the stepped slot extends to form a placement space of the printed circuit board PCB.

Optionally, the socket is configured to: after being unplugged from the socket circular bowl base on the loading tray, the socket pin is inserted into the component hole of the PCB to be inserted into the PCB.

A socket installation method includes:

In step S1, the socket is inserted into the slot of the loading tray, and the socket pin is facing downward;

Step S2, inserting the loading tool into the circular bowl base of the socket in the loading tray, so that the socket is fixed on the loading tool;

Step S3, the positioning tool is stuck in the reflow soldering tray;

Step S4, inserting the loading tool with the socket fixed into the positioning tool in the reflow soldering tray;

Step S5, placing the copper base and the PCB into the reflow soldering tray;

Step S6, after placing the positioning pin and the gland, the loading tool is pulled out from the bottom of the reflow soldering tray, and the B-side socket is smoothly inserted into the component hole on the PCB;

In step S7, the PCB and the copper base are passed through the furnace, and the socket is inserted in the B side.

The beneficial effects of the above embodiments of the present invention are as follows:

In the above embodiment, the socket mounting device inserts the socket into position once by the plug-in combination between each tooling, and the tooling is simple and easy to operate; the socket is inserted into one side of the PCB and once on the other side of the PCB. Through-hole reflow soldering improves the welding quality, saves man-hours, greatly improves production efficiency, and reduces production costs. The tooling design is flexible, and the tooling design can be adjusted according to different types of power amplifier boards, which is versatile.

Other aspects will be apparent upon reading and understanding the drawings and detailed description.

DRAWINGS

1 is a schematic view showing the assembly of a tool and a socket according to an embodiment of the present invention;

2 is a schematic cross-sectional view of a loading tray according to an embodiment of the present invention;

3 is a schematic structural view of a loading tray according to an embodiment of the present invention;

4 is a schematic plan view of a loading tooling according to an embodiment of the present invention;

FIG. 5 is a schematic structural view of a loading tooling according to an embodiment of the present invention; FIG.

6 is a schematic cross-sectional view showing a positioning tool according to an embodiment of the present invention;

7 is a schematic structural view of a positioning tooling according to an embodiment of the present invention;

8 is a schematic plan view of a reflow soldering tray according to an embodiment of the present invention;

9 is a schematic structural view of a reflow soldering tray according to an embodiment of the present invention;

10 is a flowchart of a socket installation method according to an embodiment of the present invention;

FIG. 11 is a schematic view showing the assembly of a tooling, a socket and a PCB board according to an embodiment of the present invention.

Description of the reference signs:

1-feeding tray; 2-feeding tooling; 3-position tooling; 4-reflow soldering tray; 5-socket; 6-PCB; 11-grooving; 21-loading tool body; 22-cylindrical pin; 31-first slot; 32-second slot; 41-card slot; 51-socket pin; 52-round bowl base; 61-component hole.

detailed description

Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be noted that, in the case of no conflict, the features in the embodiments and the embodiments in the present application may be arbitrarily combined with each other.

Assume that one side of the PCB 6 is the B side, and the other side of the PCB 6 is the A side.

As shown in FIG. 1 , an embodiment of the present invention provides a device for reflow soldering of a B-side socket A surface through hole, comprising: a loading tray 1, a loading tool 2, a positioning tool 3, and a reflow soldering tray 4; The material tray 1 is disposed to be inserted into the loading tool 2 through the socket 5; the loading tool 2 is inserted into the positioning tool 3; and the positioning tool 3 is snapped onto the reflow soldering tray 4.

In this embodiment, the socket 5 is inserted into the loading tool 2 through the loading tray 1; the loading tool 2 is inserted into the positioning tool 3; and the positioning tool 3 is stuck in the reflow soldering tray. 4, a plurality of sockets 5 can be inserted into the loading tray 1 at a time, the loading tray 1 is inserted into the loading tool 2, and after the loading tray 1 is unplugged, a plurality of sockets 5 can be inserted. Receiving the loading tooling 2, and finally inserting the plurality of sockets 5 connected to the loading tooling 2 to the PCB6 at one time, so that the plurality of sockets 5 are inserted into the position at one time, the tooling is simple and easy to operate; 5 Inserting on the B side, performing a through-hole reflow soldering on the A side, improving the welding quality, saving man-hours, greatly improving the production efficiency and reducing the production cost; the tooling design is flexible, and the tooling design can be according to different types of power amplifier boards. Make adjustments for versatility.

As shown in FIGS. 2 and 3, optionally, the loading tray 1 has a plurality of slots 11 arranged side by side for the insertion of the socket pins 51 of the socket 5.

2 is a schematic cross-sectional view of the loading tray 1 and FIG. 3 is a schematic structural view of the loading tray 1. The shape and size of the slot 11 are in one-to-one correspondence with the contour of the socket pin 51. The size of the slot 11 is set to a certain tolerance, and the effect of setting the tolerance is that the socket pin 51 can be smoothly inserted and removed in the slot 11 to improve the efficiency of the plug socket 5.

The distance, position and number between the slots 11 in the loading tray 1 correspond one-to-one with the distance, position and number between the plurality of component holes 61 on the PCB 6, and the shape and number thereof can be appropriately adjusted as needed. When used in conjunction with the loading tooling 2, a quick and precise feeding can be realized, and the sockets 5 can be placed one by one in the loading tray 1 for subsequent use.

FIG. 4 is a schematic plan view of the loading tooling 2, and FIG. 5 is a schematic structural view of the loading tooling 2. Optionally, the loading tooling 2 includes: a loading tooling body 21, and the loading tooling body 21 is preferably a frame-shaped design for facilitating the grip when loading; the loading tool 2 further includes: a cylindrical pin 22 extending from the loading bowl body 21 for inserting the circular bowl base 52 of the socket 5, The number and position of the cylindrical pins 22 correspond to the positions of the component holes 61 on the PCB 6; when loading, the tooling is held The body 21 has a cylindrical pin 22 corresponding to the circular bowl base 52 of the socket 5 on the loading tray 1 in one-to-one correspondence, and is pressed downward with appropriate force to insert the cylindrical pin 22 into the circular bowl of the socket 5. The base 52 realizes the fixing of the socket 5 on the loading tool 2.

FIG. 6 is a schematic cross-sectional view of the positioning tooling 3, and FIG. 7 is a schematic structural view of the positioning tooling 3. Optionally, the positioning tooling 3 has a first slot 31 for inserting the loading tooling body 21, first The slot width of the slot 31 matches the loading tool body 21 and is square in shape. A second slot 32 for the insertion of the cylindrical pin 22 is formed on the first slot 31. The second slot 32 is a cylindrical slot matching the shape and number of the cylindrical pins 22 of the loading tool 2. The diameter of the circular bowl base 52 of the socket 5 is larger than the square slot width of the positioning tool 3, so that the socket 5 can be placed on the cylindrical slot on the positioning tool 3, as shown in FIG. The socket 5 just falls on the cylindrical slot of the positioning tool 3. The positioning tool 3 is placed in the reflow soldering tray 4, and both ends of the positioning tool 3 are dropped on the card slot 41 of the reflow soldering tray 4.

FIG. 8 is a schematic plan view of the reflow soldering tray 4, and FIG. 9 is a schematic structural view of the reflow soldering tray 4, which is a hollow structure having an inwardly recessed portion corresponding to the shape of the PCB 6, the recess The portion of the PCB 6 is formed by the lower edge of the stepped slot; the card slot 41 of the reflow soldering tray 4 and the positioning tool 3 are in a stepped slot. The positioning tool 3 is engaged with the upper edge of the stepped slot; during the fixed assembly, both ends of the positioning tool 3 are placed on the card slot 41 of the reflow soldering tray 4, and then the loading tool for fixing the socket 5 is fixed. 2, according to the direction of the circular bowl base 52 of the socket 5, placed in the positioning tool 3, and then the component hole 61 of the PCB 6 is corresponding to the position of the socket pin 51, and then placed in the recessed portion of the reflow soldering tray 4, Then put the positioning pin and the gland, as shown in Figure 1, the assembly diagram of each tooling.

As shown in FIG. 10 and FIG. 11, the socket mounting method of this embodiment is installed as follows:

In step S1, the socket 5 is inserted into the slot 11 of the loading tray 1, and the socket pin 51 faces downward;

Step S2, the loading tooling 2 is inserted into the circular bowl base 52 of the socket 5 in the loading tray 1, so that the socket 5 is fixed on the loading tool 2;

Step S3, the positioning tool 3 is stuck into the reflow soldering tray 4;

Step S4, the loading tool 2 to which the socket 5 is fixed is inserted into the positioning tooling 3 in the reflow soldering tray 4;

Step S5, placing the copper base and the PCB 6 into the reflow soldering tray 4;

Step S6, after placing the positioning pin and the gland, the loading tool 2 is pulled out from the bottom of the reflow soldering tray 4, and the B-side socket 5 is smoothly inserted into the component hole 61 on the PCB 6.

In step S7, the PCB 6 and the copper-based furnace are placed in the socket on the B side, and a through-hole reflow soldering is performed on the A side.

In the embodiment of the present invention, the number of the slots 11 of the loading tray 1 is not limited, and the position of the slot 11 is in one-to-one correspondence with the component holes 61 on the PCB 6, so that bulk feeding can be realized (that is, the socket 5 is inserted into the component hole in batches). 61)), and can be used as different types of socket 5 loading to improve the efficiency and accuracy of loading.

The frame design of the loading tool body 21 of the loading tooling 2 facilitates the hand grip during loading, and the cylindrical pin 22 corresponds to the circular bowl base 52 of the socket 5, which can realize accurate feeding and save man-hours.

The whole method is simple and convenient to operate, the tooling design is user-friendly, and each tooling is closely connected. Through one through-hole reflow soldering process, all the sockets 5 can be soldered on the PCB6, which saves resources while ensuring product quality.

The above is a preferred embodiment of the present invention, and it should be noted that those skilled in the art can also make several improvements and retouchings without departing from the principles of the present invention. It should be considered as the scope of protection of the present invention.

Industrial applicability

In the embodiment of the invention, the device for reflow soldering of the A-side via hole of the B-face socket is realized by the loading tray, the loading tooling, the positioning tooling and the reflow soldering tray, and the plurality of sockets of the B-face of the RF power amplifier board can be connected once and with the A side. The device is reflowed together, which greatly improves the welding quality and production efficiency, and reduces the production cost; the tooling is simple and easy to operate; the tooling design is flexible, and the tooling design can be adjusted according to different types of power amplifier boards, and has versatility.

Claims

The utility model relates to a B-side socket A-face through-hole reflow soldering device, comprising: a loading tray (1), a loading tool (2), a positioning tool (3) and a reflow soldering tray (4);

The socket (5) is arranged to be inserted into the loading tool (2) through a loading tray (1);

The loading tool is inserted into the positioning tool (3);

The positioning tool (3) is snapped onto the reflow soldering tray (4).
The apparatus for reflow soldering of a B-side socket A face via according to claim 1, wherein said loading tray (1) has a plurality of socket pins (51) arranged side by side for said socket (5) Slotted (11).
The device for reflow soldering of a B-side socket A face through hole according to claim 2, wherein the loading tool (2) comprises: a loading tool body (21) and a lifting tool body (21) a cylindrical pin (22) into which the circular bowl base (52) of the socket (5) is inserted.
The apparatus for reflow soldering of a B-side socket A face through hole according to claim 3, wherein said positioning tool (3) has a first slot (31) for inserting said loading tool body (21) and a second slot (32) for insertion of the cylindrical pin (22).
The device of claim 4, wherein the first slot (31) is a square slot that conforms to the shape of the loading tool body (21).
The apparatus for reflow soldering of a B-side socket A face through hole according to claim 4, wherein said second slit (32) is in the shape of a cylindrical pin (22) of said loading tool (2) Matching cylindrical slots.
The apparatus for reflow soldering of a B-side socket A face through hole according to claim 4, wherein said reflow soldering tray (4) has a card slot (41) having the same shape as said positioning tool (3), said positioning The tooling (3) is snapped into the card slot (41).
The apparatus for reflow soldering of a B-side socket A face through hole according to claim 7, wherein a position of the card slot (41) of the reflow soldering tray (4) and the positioning tool (3) is a step The slot is formed, and the positioning tool (3) is engaged with the upper edge of the stepped slot.
The apparatus of claim 8, wherein the lower edge of the stepped slot extends to form a placement space of a printed circuit board PCB (6).
The apparatus for reflow soldering of a B-face socket A face via according to any one of claims 1 to 9, wherein the socket (5) is provided from a socket (5) on the loading tray (1) After the circular bowl base (52) is unplugged, the socket pin (51) is inserted into the component hole (61) of the PCB (6) and is inserted into the PCB (6).
A socket installation method includes:

In step S1, the socket (5) is inserted into the slot (11) of the loading tray (1), and the socket pin (51) faces downward;

In step S2, the loading tooling (2) is inserted into the circular bowl base (52) of the socket (5) in the loading tray (1), so that the socket (5) is fixed in the loading tool (2) on;

Step S3, the positioning tool (3) is stuck into the reflow soldering tray (4);

Step S4, inserting the loading tool (2) to which the socket (5) is fixed, into the positioning tool (3) in the reflow soldering tray (4);

Step S5, placing the copper base and the PCB (6) into the reflow soldering tray (4);

Step S6, after placing the positioning pin and the gland, pull out the loading tool (2) from the bottom of the reflow soldering tray (4), and the B-side socket (5) is smoothly inserted into the component hole (61) on the PCB 6.

In step S7, the PCB (6) and the copper-based oven are placed in the socket on the B side.