CN104470217A - False sticking equipment - Google Patents
False sticking equipment Download PDFInfo
- Publication number
- CN104470217A CN104470217A CN201410708852.6A CN201410708852A CN104470217A CN 104470217 A CN104470217 A CN 104470217A CN 201410708852 A CN201410708852 A CN 201410708852A CN 104470217 A CN104470217 A CN 104470217A
- Authority
- CN
- China
- Prior art keywords
- hot
- hot pressing
- pressing groove
- vacation
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007731 hot pressing Methods 0.000 claims abstract description 28
- 230000003014 reinforcing effect Effects 0.000 claims description 13
- 230000007423 decrease Effects 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004801 process automation Methods 0.000 description 2
- 229910001294 Reinforcing steel Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses false sticking equipment, and relates to the technical field of flexible circuit board processing. The false sticking equipment comprises a rotary table and a base, hot-pressing blocks are arranged on the rotary table, hot-pressing grooves are formed in the base, and spring ejector pins are arranged at the bottoms of the hot-pressing grooves. The rotary table can rotate, ascend and descend, and the hot-pressing blocks are made to be aligned with the hot-pressing grooves.
Description
Technical field
The present invention relates to flexible PCB processing technique field, particularly a kind of vacation is sticked standby.
Background technology
Often use in reinforcing chip is produced and false paste technique, by hot-setting adhesive mired thermal-adhering on reinforcement steel disc, by client in use the more permanent thermal-adhering that adds fix.The mode that the many employings of technique are manually fitted is pasted in current vacation, enhancing productivity and ensureing to be difficult in production quality improve, can effectively reduce cost, and alleviate the flurried pressure of enterprises using the labor, needs to provide a kind of and automatically can realize the false equipment pasted.
Summary of the invention
The technical problem to be solved in the present invention is: during existing artificial false reinforcing sheet, the problem that production efficiency is not high.
For solving the problems of the technologies described above, the invention provides a kind of vacation and be sticked standby, comprising: rotating platform and base, described rotating platform is provided with hot wafering, and described base is provided with hot pressing groove, and described hot pressing trench bottom is provided with spring thimble; Described rotating platform is rotatable, rise and decline, and described hot wafering is aimed at described hot pressing groove.
Preferably, described hot pressing groove is provided with reinforcing chip fixed jig, for placing reinforcing chip.
Preferably, the hot pressing groove on described base has two, and the hot wafering corresponding with described hot pressing groove is also two.
This vacation is sticked for artificial hot pressing can be replaced to operate, and realize process automation, production efficiency is higher, reduces production cost.
Accompanying drawing explanation
Fig. 1 is that vacation of the present invention is sticked standby structural representation.
Fig. 2 is that vacation of the present invention is sticked standby vertical view.
Embodiment
Below in conjunction with drawings and Examples, the specific embodiment of the present invention is described in further detail.Following examples for illustration of the present invention, but are not used for limiting the scope of the invention.
Vacation is as depicted in figs. 1 and 2 sticked standby, comprising: rotating platform 1 and base 2.Rotating platform 1 is provided with hot wafering 3.Base 2 is provided with hot pressing groove 4, is provided with spring thimble 5 bottom hot pressing groove 4, and the effect of spring thimble 5 is: when one, keeping laminating, reinforcing chip and hot wafering are adjacent to, and two, prevent reinforcing chip pressurized excessive.Rotating platform 1 is rotatable, rise and decline, and hot wafering 3 is aimed at hot pressing groove 4.
In order to energy lamination reinforcement sheet in enormous quantities, hot pressing groove 4 is provided with reinforcing chip fixed jig 6, and reinforcing chip fixed jig 6 is provided with multiple reinforcing chip mounting groove.
In order to make full use of the device space, the hot pressing groove 4 on base 2 has two, and the hot wafering 3 corresponding with hot pressing groove 4 is also two.
During use, rotating platform 1 drives hot wafering 3 to rise, and the position of hot wafering 3 and the position of hot pressing groove 4 interlock; Then the fixed jig 6 being booked reinforcing chip and hot-setting adhesive is put into hot pressing groove 4; Then, rotating platform 1 drives hot wafering 3 rotary alignment hot pressing groove 4, and press down, thermal-adhering; Finally, rotating platform 1 rises, rotates, and takes the reinforcing chip posted away.
This vacation is sticked for artificial hot pressing can be replaced to operate, and realize process automation, production efficiency is higher, reduces production cost.
Above execution mode is only for illustration of the present invention; and be not limitation of the present invention; the those of ordinary skill of relevant technical field; without departing from the spirit and scope of the present invention; can also make a variety of changes and modification; therefore all equivalent technical schemes also belong to category of the present invention, and scope of patent protection of the present invention should be defined by the claims.
Claims (3)
1. a vacation is sticked standby, and it is characterized in that, comprising: rotating platform and base, described rotating platform is provided with hot wafering, and described base is provided with hot pressing groove, and described hot pressing trench bottom is provided with spring thimble; Described rotating platform is rotatable, rise and decline, and described hot wafering is aimed at described hot pressing groove.
2. vacation as claimed in claim 1 is sticked standby, and it is characterized in that, described hot pressing groove is provided with reinforcing chip fixed jig, for placing reinforcing chip.
3. vacation as claimed in claim 1 is sticked standby, and it is characterized in that, the hot pressing groove on described base has two, and the hot wafering corresponding with described hot pressing groove is also two.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410708852.6A CN104470217A (en) | 2014-11-28 | 2014-11-28 | False sticking equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410708852.6A CN104470217A (en) | 2014-11-28 | 2014-11-28 | False sticking equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104470217A true CN104470217A (en) | 2015-03-25 |
Family
ID=52915357
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410708852.6A Pending CN104470217A (en) | 2014-11-28 | 2014-11-28 | False sticking equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104470217A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105415436A (en) * | 2015-12-11 | 2016-03-23 | 苏州米达思精密电子有限公司 | Production process of glue retraction reinforced sheet |
| CN105491801A (en) * | 2015-12-31 | 2016-04-13 | 深圳市鑫美威自动化设备有限公司 | Multifunctional FPC reinforcement rotating platform |
| CN108323018A (en) * | 2018-03-23 | 2018-07-24 | 芜湖致新信息科技有限公司 | A clamping device for circuit board processing |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2513761Y (en) * | 2001-12-14 | 2002-10-02 | 罗锦华 | Normal temperature floating hot head of hot press |
| CN101262744A (en) * | 2007-03-08 | 2008-09-10 | 奈电软性科技电子(珠海)有限公司 | False pasting machine and film pasting method |
| CN202551505U (en) * | 2012-03-26 | 2012-11-21 | 宁波赛特信息科技发展有限公司 | Semi-automatic FPCB (Flexible Printed Circuit Board) reinforcing sheet aligning, gluing and laminating machine |
| CN203680632U (en) * | 2014-01-09 | 2014-07-02 | 东莞市鑫华仪器有限公司 | Hot press |
| CN104062793A (en) * | 2014-05-29 | 2014-09-24 | 深圳市中欣科技有限公司 | CCD vision aligning vacuum fitting machine |
| CN204272503U (en) * | 2014-11-28 | 2015-04-15 | 苏州米达思精密电子有限公司 | A kind of vacation is sticked standby |
-
2014
- 2014-11-28 CN CN201410708852.6A patent/CN104470217A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2513761Y (en) * | 2001-12-14 | 2002-10-02 | 罗锦华 | Normal temperature floating hot head of hot press |
| CN101262744A (en) * | 2007-03-08 | 2008-09-10 | 奈电软性科技电子(珠海)有限公司 | False pasting machine and film pasting method |
| CN202551505U (en) * | 2012-03-26 | 2012-11-21 | 宁波赛特信息科技发展有限公司 | Semi-automatic FPCB (Flexible Printed Circuit Board) reinforcing sheet aligning, gluing and laminating machine |
| CN203680632U (en) * | 2014-01-09 | 2014-07-02 | 东莞市鑫华仪器有限公司 | Hot press |
| CN104062793A (en) * | 2014-05-29 | 2014-09-24 | 深圳市中欣科技有限公司 | CCD vision aligning vacuum fitting machine |
| CN204272503U (en) * | 2014-11-28 | 2015-04-15 | 苏州米达思精密电子有限公司 | A kind of vacation is sticked standby |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105415436A (en) * | 2015-12-11 | 2016-03-23 | 苏州米达思精密电子有限公司 | Production process of glue retraction reinforced sheet |
| CN105491801A (en) * | 2015-12-31 | 2016-04-13 | 深圳市鑫美威自动化设备有限公司 | Multifunctional FPC reinforcement rotating platform |
| CN108323018A (en) * | 2018-03-23 | 2018-07-24 | 芜湖致新信息科技有限公司 | A clamping device for circuit board processing |
| CN108323018B (en) * | 2018-03-23 | 2020-09-01 | 温州曼昔维服饰有限公司 | A clamping device for circuit board processing |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150325 |
|
| RJ01 | Rejection of invention patent application after publication |