CN110379744A - Baking suppressor suitable for LGA molding product - Google Patents
Baking suppressor suitable for LGA molding product Download PDFInfo
- Publication number
- CN110379744A CN110379744A CN201910698960.2A CN201910698960A CN110379744A CN 110379744 A CN110379744 A CN 110379744A CN 201910698960 A CN201910698960 A CN 201910698960A CN 110379744 A CN110379744 A CN 110379744A
- Authority
- CN
- China
- Prior art keywords
- baking
- product
- molding product
- lga
- tempered glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C53/00—Shaping by bending, folding, twisting, straightening or flattening; Apparatus therefor
- B29C53/16—Straightening or flattening
- B29C53/18—Straightening or flattening of plates or sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C53/00—Shaping by bending, folding, twisting, straightening or flattening; Apparatus therefor
- B29C53/80—Component parts, details or accessories; Auxiliary operations
- B29C53/84—Heating or cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Baking, Grill, Roasting (AREA)
Abstract
The invention discloses the baking suppressors for being suitable for LGA molding product, the magazine used will be toasted after molding is substituted for the jig with glass, big plate and tempered glass are orderly put into jig before baking, spring iron block is pushed using the pressure of cylinder, the jackscrew cap at both ends is locked again, is put into baking in oven；Wherein, for the product of molding, substrate under, put in the mode of upper stacking by resin material；In scheme baking process of the present invention, the resin arrangement in big plate will not generate variation, keep the warpage of big plate constant.
Description
Technical field
The present invention relates to the baking suppressors for being suitable for LGA molding product.
Background technique
For LGA product, client requires big slab warping especially high (3 millimeters of the shape of face of crying state or less and cannot have Smiling-face-shaped
State occurs), the warpage of product meets customer requirement after molding, but is put into magazine after molding and toasts seven in 175 DEG C of stove
A hour, big slab warping can become smiling face's form, cannot be readily accepted by customers, and the warpage of product is unsatisfactory for customer requirement after molding,
But it is put into after molding in magazine and toasts seven hours in 175 DEG C of stove, big slab warping can change, 3 millimeters of the shape of face of crying state, then
Can be readily accepted by customers, the variation of warpage after the warpage and baking after molding be because resin is in baking, under the action of by gravity,
Internal strand arrangement changes and causes.
In the new product development stage: selecting the substrate of different shrinking percentages and different shrinking percentage resin next life maternity leave pieces, then
Seven hours of baking in magazine are put into after completing molding, measure warpage, choose optimal one group of warpage combination, it is final to determine selection
Which kind of substrate and resin, process expend the time.
When volume production, the product measurement warpage after molding is meaningless, can only be to the big board monitoring warpage after baking, if mould
Technological parameter has exception to cause warpage after baking exceeded when envelope, cannot find in time after molding, and it is super to will cause large-tonnage product warpage
Mark is abnormal.
Summary of the invention
Aiming at the problem that background technique is previously mentioned, the technical problem to be solved in the present invention is to provide be suitable for LGA molding to produce
The baking suppressor of product finds map match mistake by the error correction of to map, to reduce the generation of bad chip, improves brilliant
Circle encapsulation yields.
Baking suppressor suitable for LGA molding product of the invention, it is described to control including being suitable for toasting the jig used
Tool includes tool frame, jackscrew cap, spring iron block, cylinder and tempered glass composition；The cylinder is mounted on above jig；It is described
Tempered glass is placed in tool frame；The spring iron block is activity installation, and jackscrew cap is mounted on spring iron block two sides, and is socketed
In tool frame；The baking suppressor includes a kind of baking drawing method, it is characterized in that:
LGA molding product is placed on tempered glass, arrangement architecture is product-tempered glass-after tempered glass-LGA molding
Product after LGA molding, circulation stacks in this order；Spring iron block is pushed by the pressure of cylinder, then by the jackscrew cap at both ends
Locking is put into baking in oven, and setting baking temperature is 175 degree, and baking time is 7 hours, and the product after final baking is stuck up
It is bent identical with the warpage of LGA molding product.
Wherein, the LGA molding product is the false piece that substrate and resin are constituted.
Preferably, the tool frame is stainless steel material.
Advantages of the present invention:
1. Optimizing Flow, big slab warping is big slab warping after toasting after molding, need to only determine the warpage of big plate after molding
Determine used material；
2. big slab warping can be monitored after molding, there is exception that can find in time, not will cause batch exception；
3. toasting jig, at low cost, long service life, the service life of every set was at 5 years or more.
Detailed description of the invention
Detailed description will be given by the following detailed implementation and drawings by the present invention for ease of explanation,.
Fig. 1 is jig structure figure.
Fig. 2 is the excessive false piece schematic diagram of warpage.
Fig. 3 is warpage normally false piece schematic diagram.
Specific embodiment
As shown in Figure 1, it is suitable for the baking suppressor of LGA molding product, it is described including being suitable for toasting the jig used
Jig includes that tool frame 4, jackscrew cap 6, spring iron block 5, cylinder 7 and tempered glass 3 form；The cylinder 7 is mounted on jig
Top；The tempered glass 3 is placed in tool frame 4；The spring iron block 5 is activity installation, and jackscrew cap 6 is mounted on iron spring
5 two sides of block, and be socketed in tool frame 4；The baking suppressor includes a kind of baking drawing method, it is characterized in that:
LGA molding product is placed on tempered glass 3, arrangement architecture is product-tempered glass after tempered glass 3-LGA molding
Product after 3- LGA molding, circulation stacks in this order；Spring iron block 5 is pushed by the pressure of cylinder 7, then by the top at both ends
Silk cap 6 is locked, and baking in oven is put into, and setting baking temperature is 175 degree, and baking time is 7 hours, the production after final baking
Product warpage is identical with the warpage of LGA molding product.
Wherein, the LGA molding product is the false piece that substrate 1 and resin 2 are constituted.
Such as Fig. 2 and shown, the warpage of LGA molding product is excessive, forms " face of crying " form, illustrates the substrate and Choice of Resin
Scheme is undesirable；As shown in figure 3, being the normal warpage form of LGA molding, illustrates the substrate and Choice of Resin scheme is ideal side
Case.
The warpage of LGA molding product after being toasted by the above method is identical with the warpage of LGA molding product, in jig
Interior resin arrangement will not generate variation, so that warpage is constant, it is not in existing method, due to the LGA mould of baking generation
The warpage variation for sealing product, provides foundation for the basic and resin type selecting of false piece, need to only be selected according to the warpage of LGA molding product
Optimal resin and substrate in combination mode are selected, without greatly improving efficiency by the result selection after finally toasting.
The above-described embodiments are merely illustrative of preferred embodiments of the present invention, not to structure of the invention
Think and range is defined.Without departing from the design concept of the invention, ordinary people in the field is to technology of the invention
The all variations and modifications that scheme is made, should all drop into protection scope of the present invention, the claimed technology contents of the present invention,
It is all described in the claims.
Claims (3)
1. being suitable for the baking suppressor of LGA molding product, it is characterised in that: described including being suitable for toasting the jig used
Jig includes tool frame, jackscrew cap, spring iron block, cylinder and tempered glass composition；The cylinder is mounted on above jig；Institute
Tempered glass is stated to be placed in tool frame；The spring iron block is activity installation, and jackscrew cap is mounted on spring iron block two sides, and covers
It connects in tool frame；The baking suppressor includes a kind of baking drawing method, it is characterized in that:
LGA molding product is placed on tempered glass, arrangement architecture is product-tempered glass-after tempered glass-LGA molding
Product after LGA molding, circulation stacks in this order；Spring iron block is pushed by the pressure of cylinder, then by the jackscrew cap at both ends
Locking is put into baking in oven, and setting baking temperature is 175 degree, and baking time is 7 hours, and the product after final baking is stuck up
It is bent identical with the warpage of LGA molding product.
2. the baking suppressor according to claim 1 suitable for LGA molding product, it is characterised in that: the LGA molding
Product is the false piece that substrate and resin are constituted.
3. the baking suppressor according to claim 1 suitable for LGA molding product, it is characterised in that: the tool frame
For stainless steel material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910698960.2A CN110379744A (en) | 2019-07-31 | 2019-07-31 | Baking suppressor suitable for LGA molding product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910698960.2A CN110379744A (en) | 2019-07-31 | 2019-07-31 | Baking suppressor suitable for LGA molding product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110379744A true CN110379744A (en) | 2019-10-25 |
Family
ID=68257245
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910698960.2A Pending CN110379744A (en) | 2019-07-31 | 2019-07-31 | Baking suppressor suitable for LGA molding product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110379744A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111900094A (en) * | 2020-07-15 | 2020-11-06 | 中国电子科技集团公司第五十八研究所 | High-transmission-rate wafer-level fan-out type packaging method and structure thereof |
| CN112454873A (en) * | 2020-11-03 | 2021-03-09 | 重庆翰博光电有限公司 | Heavy-pressure high-temperature baking process and device for light guide plate |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101166396A (en) * | 2006-10-17 | 2008-04-23 | 比亚迪股份有限公司 | Joint tool and method for flexible printed circuit board |
| CN201781692U (en) * | 2010-05-27 | 2011-03-30 | 深南电路有限公司 | Clamp fixture for printed circuit board (PCB) |
| CN105636368A (en) * | 2016-03-18 | 2016-06-01 | 奥士康科技股份有限公司 | Control method for uniformly laminating multi-layered PCB |
| CN105682381A (en) * | 2016-03-03 | 2016-06-15 | 深圳市景旺电子股份有限公司 | High multi-layer PCB and laminating method thereof |
| CN205510213U (en) * | 2016-03-09 | 2016-08-24 | 深圳市赋兴光电有限公司 | Toast tool |
| CN106211581A (en) * | 2016-07-11 | 2016-12-07 | 深圳天珑无线科技有限公司 | The device and method of printed circuit board (PCB) levelling warpage |
| CN209170754U (en) * | 2018-09-30 | 2019-07-26 | 深圳市恒荣晟电子有限公司 | A kind of three-dimensional PCB resin roasting plant |
-
2019
- 2019-07-31 CN CN201910698960.2A patent/CN110379744A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101166396A (en) * | 2006-10-17 | 2008-04-23 | 比亚迪股份有限公司 | Joint tool and method for flexible printed circuit board |
| CN201781692U (en) * | 2010-05-27 | 2011-03-30 | 深南电路有限公司 | Clamp fixture for printed circuit board (PCB) |
| CN105682381A (en) * | 2016-03-03 | 2016-06-15 | 深圳市景旺电子股份有限公司 | High multi-layer PCB and laminating method thereof |
| CN205510213U (en) * | 2016-03-09 | 2016-08-24 | 深圳市赋兴光电有限公司 | Toast tool |
| CN105636368A (en) * | 2016-03-18 | 2016-06-01 | 奥士康科技股份有限公司 | Control method for uniformly laminating multi-layered PCB |
| CN106211581A (en) * | 2016-07-11 | 2016-12-07 | 深圳天珑无线科技有限公司 | The device and method of printed circuit board (PCB) levelling warpage |
| CN209170754U (en) * | 2018-09-30 | 2019-07-26 | 深圳市恒荣晟电子有限公司 | A kind of three-dimensional PCB resin roasting plant |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111900094A (en) * | 2020-07-15 | 2020-11-06 | 中国电子科技集团公司第五十八研究所 | High-transmission-rate wafer-level fan-out type packaging method and structure thereof |
| CN112454873A (en) * | 2020-11-03 | 2021-03-09 | 重庆翰博光电有限公司 | Heavy-pressure high-temperature baking process and device for light guide plate |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20191025 |
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| RJ01 | Rejection of invention patent application after publication |