CN108464727A - Cookware and its machining manufacture - Google Patents
Cookware and its machining manufacture Download PDFInfo
- Publication number
- CN108464727A CN108464727A CN201810162872.6A CN201810162872A CN108464727A CN 108464727 A CN108464727 A CN 108464727A CN 201810162872 A CN201810162872 A CN 201810162872A CN 108464727 A CN108464727 A CN 108464727A
- Authority
- CN
- China
- Prior art keywords
- pot base
- cookware
- middle level
- pot
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
- A47J27/00—Cooking-vessels
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- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
- A47J27/00—Cooking-vessels
- A47J27/002—Construction of cooking-vessels; Methods or processes of manufacturing specially adapted for cooking-vessels
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
- A47J36/00—Parts, details or accessories of cooking-vessels
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
- A47J36/00—Parts, details or accessories of cooking-vessels
- A47J36/02—Selection of specific materials, e.g. heavy bottoms with copper inlay or with insulating inlay
- A47J36/04—Selection of specific materials, e.g. heavy bottoms with copper inlay or with insulating inlay the materials being non-metallic
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
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- Engineering & Computer Science (AREA)
- Food Science & Technology (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cookers (AREA)
Abstract
The present invention provides a kind of cookware and its machining manufactures, wherein the machining manufacture of cookware, including：Step S1 installs temperature transducer to the implantation slot of the middle level pot base of cookware, and the cabling channel by the connection line being connect with temperature transducer along middle level pot base is arranged, then one end of the separate temperature transducer of connection line is stretched out by middle level pot base；Step S2 fills heat-conducting glue into implantation slot and cabling channel, and heats pot body so that heat conduction adhesive curing；The top layer pot base of cookware, middle level pot base and bottom pot base are stacked and are assembled together by step S3.The present invention solves the temperature transducer in groove structure of cookware in the prior art and connection line is easy to be damaged because of compression, cause intelligent cookware that can not stablize effectively cooking temp to cookware to measure, the problem of performance to influence intelligent cookware.
Description
Technical field
The present invention relates to cooking appliances to fabricate field, in particular to a kind of cookware and its machining manufacture.
Background technology
Intelligent cookware can measure the cooking temp of cookware, and the temperature value to measuring carries out analyzing processing,
According to the size of the output control firepower of analyzing processing, cookware is made to be in suitable cooking temp, to make cookware realize Baoshang,
It the different cooking functions such as cooks.
In the prior art, in order to which temperature transducer to be implanted into the pot base of cookware, groove is usually opened up in advance on pot base
Temperature transducer and the connection line being attached thereto are directly installed in groove structure by structure later.But the pot of cookware
Base is easy to happen deformation in compaction process or welding procedure, when the pot base of cookware deforms upon, is mounted in groove structure
Temperature transducer and connection line be damaged because of compression, cause intelligent cookware that can not be carried out to the cooking temp of cookware effective
It measures, to influence the cooking function of intelligent cookware.
Invention content
The main purpose of the present invention is to provide a kind of cookware, groove knot is mounted on solve cookware in the prior art
Temperature transducer and connection line in structure are easy to be damaged because of compression, cause intelligent cookware that can not stablize effectively to cookware
Cooking temp measure, the problem of performance to influence intelligent cookware.
To achieve the goals above, according to an aspect of the invention, there is provided a kind of machining manufacture of cookware, packet
It includes：Step S1 installs temperature transducer to the implantation slot of the middle level pot base of cookware, and the company that will be connect with temperature transducer
Link is arranged along the cabling channel of middle level pot base, then one end of the separate temperature transducer of connection line is stretched by middle level pot base
Go out；Step S2 fills heat-conducting glue into implantation slot and cabling channel, and heats cookware so that heat conduction adhesive curing；Step S3, by pot
Top layer pot base, middle level pot base and the bottom pot base of tool are stacked and are assembled together.
Further, cookware includes with cambered surface pan bottom structure, step S3：Step S31, by the pot edge of top layer pot base, in
The pot edge of layer pot base and the pot edge of bottom pot base are welded using soldering processes.
Further, cookware includes with plane pan bottom structure, step S3：Step S31, by the pot edge of top layer pot base, in
The pot edge of layer pot base and the pot edge of bottom pot base are welded using soldering processes；Step S32, by the bottom of a pan of top layer pot base, middle level pot
The bottom of a pan of base and the bottom of a pan of bottom pot base are welded using soldering processes.
Further, cookware has plane pan bottom structure, and top layer pot base is coating, and bottom pot base is answered as cookware
Bottom；Step S3 includes：Bottom pot base is soldered to by soldering processes at the bottom of a pan of middle level pot base by step S31；Step S32,
The surface spraying coating away from bottom pot base of middle level pot base is to form top layer pot base.
Further, it is more than or equal to 5mm using the thickness of the brazing layer formed at soldering processes and is less than or equal to 8mm.
Further, top layer pot base is made of 304 stainless steels, and middle level pot base is made of aluminum, and bottom pot base is by 430 stainless steels
It is made.
Further, further include before step S1：Step S01, die casting forms implantation slot and cabling on pot base in middle level
Slot, and be stamped and formed out first on pot base in middle level and go out line three-way hole；It is logical to be stamped and formed out the second outlet on bottom pot base by step S02
Hole.
Further, in step sl, by one end of the separate temperature transducer of connection line by first go out line three-way hole and
Second goes out line three-way hole stretches out successively.
Further, further include before step S1：Step S0 processes to form top layer pot using punching press or die-casting process
Base, middle level pot base and bottom pot base.
Further, heat-conducting glue is the refractory metal adhesive glue made of alumino-silicate.
Further, in step s 2, to middle level pot base heat so that the cured duration of heat-conducting glue be more than or equal to 2 hours and
Less than or equal to 3 hours.
Further, in step s 2, make the slot of heat-conducting glue filling temperature transducer and implantation slot being located in implantation slot
Space between wall；Make the space between the heat-conducting glue being located in cabling channel filling connection line and the cell wall of cabling channel.
Further, further include after step s 3：Step S4 carries out punching and flange to the pot edge of cookware；Step S5,
Cookware is pressed, the air between top layer pot base, middle level pot base and bottom pot base is discharged；Step S6, to the pot of cookware
Along progress grinding and buffing, the burr or defective material at pot edge to remove cookware.
According to another aspect of the present invention, a kind of cookware is provided, cookware uses above-mentioned machining manufacture processing system
It includes the top layer pot base being sequentially stacked, middle level pot base and bottom pot base to cause type, cookware, wherein offers phase on the pot base of middle level
Implantation slot and the cabling channel cookware of connection further include the temperature transducer being connected and connection line, and temperature transducer setting is being planted
Enter in slot, connection line is arranged along cabling channel, and is extended to the side of bottom pot base, is implanted into slot and cabling channel and is filled with heat conduction
Glue.
Further, heat-conducting glue is the refractory metal adhesive glue made of alumino-silicate.
Apply the technical scheme of the present invention, by implantation slot and cabling channel in fill heat-conducting glue, make temperature transducer with
The installation gap between installation gap, connection line and cabling channel between implantation slot is occupied and then centering by heat-conducting glue
Layer pot base heating makes heat conduction adhesive curing, and the heat-conducting glue after solidification has good heat conductivility and the cushion performance to external force, energy
Enough be effectively prevented heat gathered at temperature transducer and so that temperature transducer is damaged by high temperature, it is further possible to anti-
The temperature transducer and the connection line in cabling channel being only mounted in implantation slot are damaged because of compression, improve survey
The service life of temperature sensor and connection line, to which the cooking temp for enabling cookware to stablize effectively to cookware is surveyed
Amount, and then ensure that cookware has good performance, while conveniently cookware is produced in batches.
Description of the drawings
The accompanying drawings which form a part of this application are used to provide further understanding of the present invention, and of the invention shows
Meaning property embodiment and its explanation are not constituted improper limitations of the present invention for explaining the present invention.In the accompanying drawings：
Fig. 1 shows the structural schematic diagram of one cookware according to an embodiment of the invention；
Fig. 2 shows the decomposition texture schematic diagrams of the cookware in Fig. 1；
Fig. 3 shows the enlarged diagram at A in Fig. 2；
Fig. 4 shows the schematic cross-sectional view of the cookware in Fig. 1；
Fig. 5 shows the enlarged diagram at B in Fig. 4；
Fig. 6 shows the enlarged diagram at C in Fig. 4；
Fig. 7 shows the structural schematic diagram of two cookware according to an embodiment of the invention；
Fig. 8 shows the enlarged diagram at D in Fig. 7；
Fig. 9 shows the enlarged diagram at E in Fig. 7；
Figure 10 shows the structural schematic diagram of three cookware according to an embodiment of the invention；
Figure 11 shows the enlarged diagram at F in Figure 10；
Figure 12 shows the enlarged diagram at G in Figure 10；
Figure 13 shows the structural schematic diagram of four cookware according to an embodiment of the invention；
Figure 14 shows the enlarged diagram at H in Figure 13.
Wherein, above-mentioned attached drawing includes the following drawings label：
10, top layer pot base；20, middle level pot base；30, bottom pot base；21, it is implanted into slot；22, cabling channel；23, first goes out line three-way hole；
31, second goes out line three-way hole；40, temperature transducer；41, connection line.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Below
Description only actually at least one exemplary embodiment is illustrative, is never used as to the present invention and its application or makes
Any restrictions.Based on the embodiments of the present invention, those of ordinary skill in the art are not making creative work premise
Lower obtained every other embodiment, shall fall within the protection scope of the present invention.
In order to which the temperature transducer being mounted in groove structure and connection line that solve cookware in the prior art are easy
It is damaged because of compression, causes intelligent cookware that can not stablize the effectively cooking temp to cookware and measure, to influence Intelligent pan
The problem of performance of tool, the present invention provides a kind of cookware and its machining manufactures.
It should be noted that the diagram embodiment one of the application to example IV is the cookware of four kinds of different structures, four kinds
The cookware of different structure can be such that the machining manufacture of the cookware in the application is processed to be manufactured, explain in turn below
State the concrete structure of four kinds of cookwares.
Embodiment one
As shown in Figures 1 to 6, cookware includes the top layer pot base 10 being sequentially stacked, middle level pot base 20 and bottom pot base 30, wherein
Middle level pot base 20 on offer the implantation slot 21 being connected, cabling channel 22 and first goes out line three-way hole 23, opened up on bottom pot base 30
Have with first go out line three-way hole 23 it is opposite second go out line three-way hole 31, cookware further includes the temperature transducer 40 and connecting line being connected
Road 41, the setting of temperature transducer 40 in implantation slot 21, along cabling channel 22 arrange, and goes out line three-way hole by first by connection line 41
23 extend to the side of bottom pot base 30, are implanted into slot 21 and cabling channel 22 and are filled with heat-conducting glue.And in this embodiment, cookware
With cambered surface pan bottom structure.
Embodiment two
As shown in Figure 7 to 9, the difference between this embodiment and the first embodiment lies in, cookware has plane pan bottom structure, and cookware
Flange processing is carried out at pot edge.
Embodiment three
As shown in Figure 10 to Figure 12, the difference between the present embodiment and the second embodiment lies in that, multiple bottom of the bottom pot base 30 as cookware.
Example IV
As shown in Figure 13 and Figure 14, difference lies in top layer pot base 10 is pot base 20 in middle level to the present embodiment with embodiment three
The coating sprayed on the surface of bottom pot base 30.
Present invention also provides a kind of machining manufactures of cookware, including step S1：Extremely by the installation of temperature transducer 40
In the implantation slot 21 of the middle level pot base 20 of cookware, and by the connection line 41 being connect with temperature transducer 40 along middle level pot base 20
Cabling channel 22 is arranged, then one end of the separate temperature transducer 40 of connection line 41 is gone out line three-way hole by the first of middle level pot base 20
23 and bottom pot base 30 second go out line three-way hole 31 stretching；Step S2：It is implanted into slot 21 and cabling channel 22 and fills heat-conducting glue, and is right
The middle level pot heating of base 20 is so that heat conduction adhesive curing；And step S3, by the top layer pot base 10 of cookware, middle level pot base 20 and bottom pot
Base 30 is stacked to be assembled together.
By filling heat-conducting glue into implantation slot 21 and cabling channel 22, the peace for making temperature transducer 40 and being implanted between slot 21
Installation gap between dress gap, connection line 41 and cabling channel 22 is occupied by heat-conducting glue, and then is added to middle level pot base 20
Heat makes heat conduction adhesive curing, and the heat-conducting glue after solidification has good heat conductivility and the cushion performance to external force, can be effectively
Prevent that heat from gathering at temperature transducer 40 and so that temperature transducer 40 is damaged by high temperature, it is further possible to prevent from pacifying
Temperature transducer in implantation slot 21 and the connection line 41 in cabling channel 22 are damaged because of compression, are improved
The service life of temperature transducer 40 and connection line 41, to enable cookware stablize effectively the cooking temp to cookware into
Row measures, and then ensures that cookware has good performance.
For the cookware of the structure in embodiment one, i.e. cookware has cambered surface pan bottom structure, and step S3 includes step S31,
The pot edge of the pot edge of top layer pot base 10, the pot edge of middle level pot base 20 and bottom pot base 30 is welded using soldering processes.
And for the cookware of the structure in embodiment two, i.e. cookware has plane pan bottom structure, and step S3 includes step
S31 welds the pot edge of the pot edge of top layer pot base 10, the pot edge of middle level pot base 20 and bottom pot base 30 using soldering processes；With
And step S32, the bottom of a pan in the bottom of a pan of top layer pot base 10, the bottom of a pan of middle level pot base 20 and bottom pot base 30 is welded using soldering processes
It connects.For the cookware of different structure, the welding position of soldering processes welding is different, can ensure the integrally-built stabilization of cookware
Property.
And for the cookware of the structure in example IV, i.e. cookware has plane pan bottom structure, and top layer pot base 10 is to apply
Layer, multiple bottom of the bottom pot base 30 as cookware；Step S3 includes step S31, and bottom pot base 30 is soldered to by soldering processes
At the bottom of a pan of middle level pot base 20；And step S32, the surface spraying coating away from bottom pot base 30 of pot base 20 is with shape in middle level
At top layer pot base 10.
Optionally, it is more than or equal to 5mm using the thickness of the brazing layer formed at soldering processes and is less than or equal to 8mm.In this way,
Ensure the connective stability to the Each part of cookware using soldering processes.
In a kind of alternative embodiment of the application, top layer pot base 10 is made of 304 stainless steels, and middle level pot base 20 is by aluminum
At bottom pot base 30 is made of 430 stainless steels.
In addition, further including step S01 before step S1, die casting forms implantation slot 21 and cabling channel on pot base 20 in middle level
22, and be stamped and formed out first and go out line three-way hole 23；And step S02, on bottom pot base 30 being stamped and formed out second goes out line three-way hole 31.
For the cookware in embodiment one and embodiment two, further includes step S0 before step S1, use punching press or pressure
Casting process is processed to form top layer pot base 10, middle level pot base 20 and bottom pot base 30.
Optionally, heat-conducting glue is made of the heat-conducting glue with high temperature resistance, it is preferable to use alumino-silicate refractory metal
Adhesive glue is capable of the application scenario of well suited cookware.
Optionally, for, it is ensured that the effect that heat-conducting glue is heat cured for, in step s 2, to middle level pot base 20 heating with
The cured duration of heat-conducting glue is set to be more than or equal to 2 hours and be less than or equal to 3 hours.
Furthermore, it is necessary to which explanation is needed into implantation slot 21 with the effect of the filling heat-conducting glue of cabling channel 22 in step s 2
Reach, makes the space between the heat-conducting glue filling temperature transducer 40 being located in implantation slot 21 and the cell wall of implantation slot 21；Make
Heat-conducting glue filling connection line 41 in cabling channel 22 and the space between the cell wall of cabling channel 22.
In order to complete the overall processing manufacture to cookware, further include after step s 3：Step S4, to the pot edge of cookware into
Row punching and flange；Step S5, presses cookware, be discharged top layer pot base 10, middle level pot base 20 and bottom pot base 30 it
Between air；Step S6 carries out grinding and buffing, the burr or defective material at pot edge to remove cookware to the pot edge of cookware.
It should be noted that term used herein above is merely to describe specific implementation mode, and be not intended to restricted root
According to the illustrative embodiments of the application.As used herein, unless the context clearly indicates otherwise, otherwise singulative
It is also intended to include plural form, additionally, it should be understood that, when in the present specification using term "comprising" and/or " packet
Include " when, indicate existing characteristics, step, operation, device, component and/or combination thereof.
Unless specifically stated otherwise, positioned opposite, the digital table of the component and step that otherwise illustrate in these embodiments
It is not limited the scope of the invention up to formula and numerical value.Simultaneously, it should be appreciated that for ease of description, attached each portion shown in the drawings
The size divided not is to be drawn according to actual proportionate relationship.For technology, side known to person of ordinary skill in the relevant
Method and equipment may be not discussed in detail, but in the appropriate case, and the technology, method and apparatus should be considered as authorizing explanation
A part for book.In shown here and discussion all examples, any occurrence should be construed as merely illustrative, and
Not by way of limitation.Therefore, the other examples of exemplary embodiment can have different values.It should be noted that：Similar label
Similar terms are indicated in following attached drawing with letter, therefore, once it is defined in a certain Xiang Yi attached drawing, then subsequent attached
It need not be further discussed in figure.
In the description of the present invention, it is to be understood that, the noun of locality such as " front, rear, top, and bottom, left and right ", " it is laterally, vertical,
Vertically, the orientation or positional relationship indicated by level " and " top, bottom " etc. is normally based on orientation or position shown in the drawings and closes
System, is merely for convenience of description of the present invention and simplification of the description, in the absence of explanation to the contrary, these nouns of locality do not indicate that
Signified device or element must have a particular orientation or with specific azimuth configuration and operations with hint, therefore cannot manage
Solution is limiting the scope of the invention；The noun of locality " inside and outside " refers to inside and outside the profile relative to each component itself.
For ease of description, herein can with use space relative terms, as " ... on ", " in ... top ",
" ... upper surface ", " above " etc., for describing such as a device shown in the figure or feature and other devices or spy
The spatial relation of sign.It should be understood that spatially relative term is intended to comprising the orientation in addition to device described in figure
Except different direction in use or operation.For example, if the device in attached drawing is squeezed, it is described as " in other devices
It will be positioned as " under other devices or construction after part or construction top " or the device of " on other devices or construction "
Side " or " under other devices or construction ".Thus, exemplary term " ... top " may include " ... top " and
" in ... lower section " two kinds of orientation.The device can also the positioning of other different modes（It is rotated by 90 ° or is in other orientation）, and
And respective explanations are made to the opposite description in space used herein above.
Furthermore, it is necessary to which explanation, limits parts, it is only for be convenient for using the words such as " first ", " second "
Corresponding parts are distinguished, do not have Stated otherwise such as, there is no particular meanings for above-mentioned word, therefore should not be understood as to this
The limitation of invention protection domain.
It should be noted that term used herein above is merely to describe specific implementation mode, and be not intended to restricted root
According to the illustrative embodiments of the application.As used herein, unless the context clearly indicates otherwise, otherwise singulative
It is also intended to include plural form, additionally, it should be understood that, when in the present specification using term "comprising" and/or " packet
Include " when, indicate existing characteristics, step, work, device, component and/or combination thereof.
It should be noted that term " first " in the description and claims of this application and above-mentioned attached drawing, "
Two " etc. be for distinguishing similar object, without being used to describe specific sequence or precedence.It should be appreciated that using in this way
Data can be interchanged in the appropriate case, so that presently filed embodiment described herein can be in addition to illustrating herein
Or the sequence other than those of description is implemented.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, any made by repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (15)
1. a kind of machining manufacture of cookware, which is characterized in that including：
Step S1, by temperature transducer（40）It installs to the middle level pot base of the cookware（20）Implantation slot（21）It is interior, and will be with
The temperature transducer（40）The connection line of connection（41）Along middle level pot base（20）Cabling channel（22）Arrangement, then by institute
State connection line（41）Far from the temperature transducer（40）One end by the middle level pot base（20）It stretches out；
Step S2, to the implantation slot（21）With the cabling channel（22）Interior filling heat-conducting glue, and to the cookware heat so that
The heat conduction adhesive curing；
Step S3, by the top layer pot base of the cookware（10）, middle level pot base（20）With bottom pot base（30）It is stacked to be assembled together.
2. machining manufacture according to claim 1, which is characterized in that the cookware has cambered surface pan bottom structure, institute
Stating step S3 includes：
Step S31, by the top layer pot base（10）Pot edge, the middle level pot base（20）Pot edge and the bottom pot base（30）
Pot edge welded using soldering processes.
3. machining manufacture according to claim 1, which is characterized in that the cookware has plane pan bottom structure, institute
Stating step S3 includes：
Step S31, by the top layer pot base（10）Pot edge, the middle level pot base（20）Pot edge and the bottom pot base（30）
Pot edge welded using soldering processes；
Step S32, by the top layer pot base（10）The bottom of a pan, the middle level pot base（20）The bottom of a pan and the bottom pot base（30）
The bottom of a pan welded using soldering processes.
4. machining manufacture according to claim 1, which is characterized in that the cookware has plane pan bottom structure, and
The top layer pot base（10）For coating, the bottom pot base（30）Multiple bottom as the cookware；The step S3 includes：
Step S31, by the bottom pot base（30）It is soldered to the middle level pot base by soldering processes（20）The bottom of a pan at；
Step S32, in middle level pot base（20）Deviate from the bottom pot base（30）Surface spraying coating it is described to be formed
Top layer pot base（10）.
5. machining manufacture according to any one of claim 2 to 4, which is characterized in that use shape at soldering processes
At brazing layer thickness be more than or equal to 5mm and be less than or equal to 8mm.
6. machining manufacture according to claim 1, which is characterized in that the top layer pot base（10）By 304 stainless steels
It is made, the middle level pot base（20）It is made of aluminum, the bottom pot base（30）It is made of 430 stainless steels.
7. machining manufacture according to claim 1, which is characterized in that further include before the step S1：
Step S01, in middle level pot base（20）Upper die casting forms the implantation slot（21）With the cabling channel（22）, and institute
State middle level pot base（20）On be stamped and formed out first and go out line three-way hole（23）；
Step S02, in the bottom pot base（30）On be stamped and formed out second and go out line three-way hole（31）.
8. machining manufacture according to claim 7, which is characterized in that in the step S1, by the connecting line
Road（41）Far from the temperature transducer（40）One end go out line three-way hole by described first（23）Go out line three-way hole with described second
（31）It stretches out successively.
9. machining manufacture according to claim 2 or 3, which is characterized in that further include before the step S1：
Step S0 processes to form the top layer pot base using punching press or die-casting process（10）, middle level pot base（20）With it is described
Bottom pot base（30）.
10. machining manufacture according to claim 1, which is characterized in that the heat-conducting glue of alumino-silicate by being made
Refractory metal adhesive glue.
11. machining manufacture according to claim 1, which is characterized in that in the step S2, to middle level pot
Base（20）It heats so that the cured duration of the heat-conducting glue is more than or equal to 2 hours and is less than or equal to 3 hours.
12. machining manufacture according to claim 1, which is characterized in that in the step S2, make to be located at the plant
Enter slot（21）The interior heat-conducting glue fills the temperature transducer（40）With the implantation slot（21）Cell wall between space；
Make to be located at the cabling channel（22）The interior heat-conducting glue fills the connection line（41）With the cabling channel（22）Cell wall
Between space.
13. machining manufacture according to claim 1, which is characterized in that further include after the step S3：
Step S4 carries out punching and flange to the pot edge of the cookware；
Step S5 presses the cookware, the top layer pot base is discharged（10）, middle level pot base（20）With the bottom
Layer pot base（30）Between air；
Step S6 carries out grinding and buffing, the burr or defective material at pot edge to remove the cookware to the pot edge of the cookware.
14. a kind of cookware, which is characterized in that the cookware uses the processing and manufacturing side described in any one of claim 1 to 13
Method processing and manufacturing molding, the cookware includes the top layer pot base being sequentially stacked（10）, middle level pot base（20）With bottom pot base（30）,
Wherein, the middle level pot base（20）On offer the implantation slot being connected（21）And cabling channel（22）, the cookware further includes phase
The temperature transducer of connection（40）And connection line（41）, wherein the temperature transducer（40）It is arranged in the implantation slot
（21）It is interior, the connection line（41）Along the cabling channel（22）Arrangement, and to the bottom pot base（30）Side extend, institute
State implantation slot（21）With the cabling channel（22）It is filled with heat-conducting glue.
15. cookware according to claim 14, which is characterized in that the heat-conducting glue is the high temperature resistant made of alumino-silicate
Metal adhesive glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810162872.6A CN108464727A (en) | 2018-02-26 | 2018-02-26 | Cookware and its machining manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810162872.6A CN108464727A (en) | 2018-02-26 | 2018-02-26 | Cookware and its machining manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108464727A true CN108464727A (en) | 2018-08-31 |
Family
ID=63264082
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810162872.6A Pending CN108464727A (en) | 2018-02-26 | 2018-02-26 | Cookware and its machining manufacture |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108464727A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109349931A (en) * | 2018-10-31 | 2019-02-19 | 珠海优特智厨科技有限公司 | Cover opening-closing mechanism, cooker and cooker folding lid control method |
| CN109497814A (en) * | 2018-11-30 | 2019-03-22 | 珠海优特智厨科技有限公司 | The manufacturing method of compound pot |
| CN109717723A (en) * | 2018-11-30 | 2019-05-07 | 珠海优特智厨科技有限公司 | Compound pot, electromagnetic oven and electromagnetic oven pinpoint temp measuring method |
| CN115279230A (en) * | 2020-06-29 | 2022-11-01 | 珠海优特智厨科技有限公司 | Manufacturing method of composite pot, composite pot and middle layer structure of composite pot |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109349931A (en) * | 2018-10-31 | 2019-02-19 | 珠海优特智厨科技有限公司 | Cover opening-closing mechanism, cooker and cooker folding lid control method |
| CN109497814A (en) * | 2018-11-30 | 2019-03-22 | 珠海优特智厨科技有限公司 | The manufacturing method of compound pot |
| CN109717723A (en) * | 2018-11-30 | 2019-05-07 | 珠海优特智厨科技有限公司 | Compound pot, electromagnetic oven and electromagnetic oven pinpoint temp measuring method |
| CN109717723B (en) * | 2018-11-30 | 2021-12-28 | 珠海优特智厨科技有限公司 | Composite pot, kit and induction cooker fixed-point temperature measurement method |
| CN115279230A (en) * | 2020-06-29 | 2022-11-01 | 珠海优特智厨科技有限公司 | Manufacturing method of composite pot, composite pot and middle layer structure of composite pot |
| CN115279230B (en) * | 2020-06-29 | 2023-12-05 | 珠海优特智厨科技有限公司 | Manufacturing method of composite pot, composite pot and intermediate layer structure of composite pot |
| WO2023280532A1 (en) * | 2021-07-05 | 2023-01-12 | Miele & Cie. Kg | Cookware for a hob, and method for producing cookware |
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