CN109717723A - Compound pot, electromagnetic oven and electromagnetic oven pinpoint temp measuring method - Google Patents
Compound pot, electromagnetic oven and electromagnetic oven pinpoint temp measuring method Download PDFInfo
- Publication number
- CN109717723A CN109717723A CN201811458679.3A CN201811458679A CN109717723A CN 109717723 A CN109717723 A CN 109717723A CN 201811458679 A CN201811458679 A CN 201811458679A CN 109717723 A CN109717723 A CN 109717723A
- Authority
- CN
- China
- Prior art keywords
- sensor
- compound pot
- layer
- electromagnetic oven
- outer layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Cookers (AREA)
Abstract
The present invention provides a kind of compound pot, electromagnetic oven and electromagnetic ovens to pinpoint temp measuring method.Compound pot includes internal layer, middle layer and outer layer, and internal layer is in recessed arc structure, the side wall of outer layer be globoidal structure, outer layer bottom wall be planar structure.The present invention solves the problems, such as that there are temperature measurement accuracies is poor for compound pot in the prior art.
Description
Technical field
The present invention relates to household appliance technical fields, pinpoint in particular to a kind of compound pot, electromagnetic oven and electromagnetic oven
Temp measuring method.
Background technique
The temperature of food materials in real-time monitoring cooking process is needed in intelligent cooking to adjust the duration and degree of heating of cooking equipment and precisely control
Cooking time processed, the pot with temp sensing function come into being, and difficult point is then how temperature transducer to be implanted into inside cookware at this time, protect
Temperature measurement accuracy is demonstrate,proved, guarantees sensor life-time.Contactless (such as infrared) thermometric in market, can not really measure food materials temperature, by
Between medium influence, temperature measurement inaccuracy.And single point temperature is only surveyed, for the control inaccuracy of food materials maturity, Wu Fajing
The quasi- effectively control cooking equipment duration and degree of heating, and stir-fry for convenience, pot can be generally set as the structure of circular-arc bottom face, for circular arc
Bottom compound pot is spherical pan, and temperature measuring point can be changed with influences such as placement location, direction, angles, causes the food materials temperature measured not
It is effective temperature, the duration and degree of heating control of cooking equipment, the control of cooking time just will appear deviation, so that dish cooking effect can not
Reach requirement.
That is, in the prior art there is temperature measurement accuracy difference in compound pot.
Summary of the invention
The main purpose of the present invention is to provide a kind of compound pot, electromagnetic oven and electromagnetic ovens to pinpoint temp measuring method, to solve
In the prior art there is temperature measurement accuracy difference in compound pot.
To achieve the goals above, according to an aspect of the invention, there is provided a kind of compound pot, including internal layer, centre
Layer and outer layer, internal layer be in recessed arc structure, the side wall of outer layer be globoidal structure, outer layer bottom wall be planar structure.
Further, compound pot further includes at least one sensor and protector for sensor, and middle layer is previously provided with
For accommodating the groove of sensor, protector for sensor is set in the outside of sensor and is located in groove.
Further, the length of protector for sensor is less than the total length of sensor and connecting line, so that sensor
Probe segment is exposed.
Further, protector for sensor is laminated structure, and laminated structure has the holding tank being adapted to sensor,
When laminated structure is installed on sensor, keep the probe segment of sensor exposed.
Further, laminated structure is welded on internal layer on a side surface of middle layer and/or outer layer is close to middle layer
A side surface on.
Further, protector for sensor is tubular structure, and sensor is threaded through at tubular structure, and makes sensor
Probe segment is exposed.
Further, tubular structure extends along the bottom wall and/or side wall of compound pot.
Further, at least one sensor is fitted in the bottom wall of internal layer, at least another sensor is fitted in outer layer
Bottom wall.
Further, at least one sensor is located at the center of middle layer, at least one sensor and middle layer
Interval pre-determined distance is arranged at the heart.
Further, the periphery of groove and/or groove are internally provided with location structure, and location structure is for fixed sensing
Device, sensor include at least temperature sensor and humidity sensor.
Further, internal layer, middle layer and outer layer are multiple by least one of Pressure Welding or soldering or cold Combined Welding mode
Synthesis type.
Further, after internal layer, middle layer and outer layer are fixed by electric resistance welding, reuse middle layer softening by heating
Three is combined with each other by Pressure Welding, so that the gap of middle layer deformable filler groove.
Further, compound pot further includes polishing screening glass, polishes screening glass for the connecting line of sensor and is fixed on internal layer
Side wall on, to prevent the connecting line of sensor in polishing process to be torn.
Further, internal layer is made of thermal conductive metallic material；And/or middle layer is made of aluminium or copper or combinations thereof；
And/or outer layer is made of permeability magnetic material.
According to another aspect of the present invention, a kind of electromagnetic oven is additionally provided, comprising: electromagnetic heating panel, electromagnetic heating face
The side wall of plate be globoidal structure, electromagnetic heating panel bottom wall be planar structure, to be adapted to above-mentioned compound pot；Electromagnetic heating line
Circle, electromagnetic heating coil heat electromagnetic heating panel.
Further, the cambered surface of the side wall of the outer layer of the radian and compound pot of the globoidal structure of the side wall of electromagnetic heating panel
The radian of structure is consistent.
According to another aspect of the present invention, a kind of electromagnetic oven fixed point temp measuring method is additionally provided.Electromagnetic oven pinpoints thermometric side
Method includes: step S1, compound pot is placed in electromagnetic oven, so that compound pot is located on the predeterminated position of electromagnetic oven, wherein
Compound pot is above-mentioned compound pot, and electromagnetic oven is above-mentioned electromagnetic oven；Step S2, it according to the position of oriented compound pot, obtains
Take the data of the sensor in compound pot；Step S3, according to the data of the sensor of acquisition, calculate compound pot temperature and/or
The maturity of food materials.
It applying the technical scheme of the present invention, compound pot includes internal layer, middle layer and outer layer, and internal layer is in recessed arc structure,
The side wall of outer layer be globoidal structure, outer layer bottom wall be planar structure.
By the way that internal layer, middle layer and outer layer are combined into compound pot, and the bottom wall of outer layer is arranged to planar structure, so that
Entire compound pot can be laid flat, so that temperature measuring point will not influence with placement location, direction, angle etc. and be become
Dynamic, so that thermometric is accurate, and internal layer is arranged to recessed arc structure, so that the compound pot is more suitable for the culinary art of stir-frying class, and makes
The capacity for obtaining compound pot is bigger.Composite pot tool in the present embodiment for circular bottom pot quick stir-frying the advantages of, and have pan
The advantages of being easily placed, the use for allowing the compound pot stable on electromagnetic oven can carry out accurately the compound pot
Thermometric.
Detailed description of the invention
The accompanying drawings constituting a part of this application is used to provide further understanding of the present invention, and of the invention shows
Examples and descriptions thereof are used to explain the present invention for meaning property, does not constitute improper limitations of the present invention.In the accompanying drawings:
Fig. 1 shows the compound pot of one alternative embodiment of the present invention and the explosive view of electromagnetic oven；
Fig. 2 shows the structural schematic diagrams that sensor in Fig. 1 is close to internal layer；
Fig. 3 shows the structural schematic diagram that sensor in Fig. 1 is close to outer layer；
Fig. 4 shows sensor and internal layer, middle layer, the positional diagram of outer layer in Fig. 1；
Fig. 5 shows protector for sensor and internal layer, middle layer, the positional diagram of outer layer in Fig. 1.
Wherein, the above drawings include the following reference numerals:
10, internal layer；20, middle layer；30, outer layer；40, sensor；50, screening glass is polished；60, electromagnetic heating panel；70,
Protector for sensor.
Specific embodiment
It should be noted that in the absence of conflict, the features in the embodiments and the embodiments of the present application can phase
Mutually combination.The present invention will be described in detail below with reference to the accompanying drawings and embodiments.
It should be pointed out that unless otherwise specified, all technical and scientific terms used in this application have and the application
The normally understood identical meanings of person of an ordinary skill in the technical field.
In the present invention, in the absence of explanation to the contrary, the noun of locality used such as " upper and lower, top, bottom " is usually needle
For direction shown in the drawings, or for component itself is on vertical, vertical or gravity direction；Equally
Ground for ease of understanding and describes, and " inside and outside " refers to the inside and outside of the profile relative to each component itself, but the above-mentioned noun of locality is not
For limiting the present invention.
In order to solve the problems, such as that there are temperature measurement accuracies is poor for compound pot in the prior art, the present invention provides a kind of compound
Pot, electromagnetic oven and electromagnetic oven pinpoint temp measuring method.
As shown in Figures 1 to 5, compound pot includes internal layer 10, middle layer 20 and outer layer 30, and internal layer 10 is in lower concave arc shape knot
Structure, the side wall of outer layer 30 be globoidal structure, outer layer 30 bottom wall be planar structure.
By the way that internal layer 10, middle layer 20 and outer layer 30 are combined into compound pot, and the bottom wall of outer layer 30 is arranged to plane
Structure lays flat entire compound pot, so that temperature measuring point will not be influenced with placement location, direction, angle etc.
And change, so that thermometric is accurate, and internal layer 10 is arranged to recessed arc structure, so that the compound pot is more suitable for the class that stir-fries
Culinary art, and make the capacity of compound pot bigger.Composite pot tool in the present embodiment for circular bottom pot quick stir-frying the advantages of, and have
The advantages of standby pan is easily placed, the use for allowing the compound pot stable on electromagnetic oven, can to the compound pot into
Capable accurately thermometric.
It should be noted that in the present embodiment, compound pot is compound by internal layer 10, middle layer 20 and 30 3 layers of pot of outer layer
Made of, rather than internal layer 10, middle layer 20 and the outer layer 30 of composite molding are distinguished by technique.
Specifically, compound pot further includes at least one sensor 40 and protector for sensor 70, middle layer 20 is set in advance
It is equipped with the groove for accommodating sensor 40, protector for sensor 70 is set in the outside of sensor 40 and is located in groove.
Sensor 40 is accommodated by the way that groove is arranged in middle layer 20, it is possible to prevente effectively from internal layer 10, middle layer 20 and outer layer 30 are multiple
Sensor 40 is destroyed when closing welding, protector for sensor 70 can be effectively protected sensor 40 in the welding process not
It is damaged by ambient pressure, increases the yield rate of compound pot.Preferred sensor 40 is temperature sensor, and temperature sensor can be with
It is thermocouple, thermal resistance or temperature-sensitive element.Certain sensor 40 is also possible to humidity sensor, gravity sensor etc..
Specifically, middle layer 20 is metal layer.
It should be noted that sensor corresponds to the predeterminated position of electromagnetic oven because the heating temperature of cookware difference is different,
So that cookware is preferably heated, is more favorable to obtain the corresponding cookware temperature of electromagnetic oven set point in preset food materials temperature algorithm
Degree, calculates food materials temperature according to preset position temperature conducive to preset algorithm.
Certainly in specific embodiment (not shown), compound pot can be not only combined by three layers of pot, be also possible to
Greater than three layers, such as five layers, seven layers etc..The specific number of plies determines according to the use demand of compound pot, this outer sensor 40 and recessed
Slot is also possible to multiple, but the quantity of sensor 40 and the number of plies are not necessarily intended to correspond to, specifically can be according to the use need of compound pot
It asks to determine.
Specifically, the length of protector for sensor 70 is less than the total length of sensor 40 and connecting line, so that sensor
40 probe segment is exposed.By the exposed outside in protector for sensor 70 of probe of sensor 40, so that sensor 40
Probe directly contacts the bottom of a pan of compound pot, and then keeps 40 thermometric of sensor more accurate.
In specific embodiment as shown in Figure 5, protector for sensor 70 is laminated structure, and laminated structure has and sensing
The holding tank that device 40 is adapted to, when sensor 40 is installed in laminated structure, keeps the probe of sensor 40 exposed.Due to sheet knot
Structure is covered on sensor 40, is completely cut off the surface contact of composite interlayer 20 and sensor 40, is effectively protected sensor 40
Connecting line is not pressed down.
As shown in figure 5, laminated structure is welded on internal layer 10 on a side surface of middle layer 20 and/or outer layer 30 is close
On one side surface of middle layer 20.It can make sensor 40 directly contact internal layer 10 and/or outer layer 30, so that thermometric is more quasi-
Really.
In a specific embodiment (not shown), protector for sensor 70 is tubular structure, and sensor 40 is worn
At tubular structure, and keep the probe segment of sensor 40 exposed.And the tubular structure with sensor 40 is placed into centre
In the groove of layer 20, so that sensor 40 is fixed.
Optionally, tubular structure extends along the bottom wall and/or side wall of compound pot.To protect the connecting line of sensor 40.
The length of certain tubular structure can also be designed into the edge of middle layer, and 40 connecting line of sensor along side wall can be filled with other
Set protection.
As shown in Figures 2 to 4, at least one sensor 40 is fitted in the bottom wall of internal layer 10, at least another sensor 40
It is fitted in the bottom wall of outer layer 30.Specifically, sensor 40 is fitted at the inner surface of 30 bottom wall of outer layer.Allow at least one to sense
Device 40 is fitted on the bottom wall of internal layer 10 and at least another sensor 40 is fitted on the bottom wall of outer layer 30, can make two biographies
Effective real time temperature of internal layer 10 and outer layer 30 that sensor 40 measures respectively, collects the effective temperature of internal layer 10 and outer layer 30,
The maturity for the interior food materials that take the dish out of the pot can be precisely speculated according to the effective real time temperature measured, to be precisely controlled the fire of cooking equipment
Time and cooking time.
As shown in Figures 2 and 3, at least one sensor 40 is located at the center of middle layer 20, at least one sensor 40
It is arranged with interval pre-determined distance at the center of middle layer 20.Specifically, sensor 40 is located on the inner surface of middle layer 20, respectively
In the different location of the bottom wall of middle layer 20, the temperature that sensor 40 can enable sensor 40 monitor bottom wall different location is set
Degree, to accurately control the duration and degree of heating and cooking time of cooking equipment.Two sensors 40 are staggered a certain distance, that is, two
Sensor 40 can measure the temperature at different location not on same vertical line.
Specifically, the periphery of groove and/or groove are internally provided with location structure, location structure is for fixing sensor
40.Location structure in a groove is that dot is fixed, and sensor 40 can be made to be fixed in middle layer 20, avoids and was welding
Sensor 40 walks in journey, and sensor 40 is made to work inaccuracy.Specifically, can be in the periphery of groove or groove
Portion is got ready, can also be pacified dot to groove periphery or inside by way of electric resistance welding.
Optionally, internal layer 10, middle layer 20 and outer layer 30 pass through Pressure Welding or at least one of soldering or cold Combined Welding side
Formula composite molding.It should be noted that Pressure Welding includes electric resistance welding, friction press welding or electric screw press welding etc..
It may indicate that groove and embedded sensors 40 can be adapted for a variety of Welders in the welding of internal layer 10, middle layer 20 and outer layer 30
Skill.
Optionally, after internal layer 10, middle layer 20 and outer layer 30 are fixed by electric resistance welding, soften middle layer 20 by heating
It reuses Pressure Welding three is combined with each other, so that the gap of 20 deformable filler groove of middle layer.20 deformable filler of middle layer
The gap of groove is seamlessly connected protector for sensor 70 and middle layer 20, avoids protector for sensor 70 in groove
The inaccuracy of thermometric caused by interior shaking, increases the accuracy of 40 thermometric of sensor.Internal layer 10, middle layer 20 and outer layer 30 are logical
After crossing electric resistance welding fixation, three's punching press is combined with each other by heating in medium frequency three by press machine, and the filling of middle layer 20 at this time is full
Cavity between internal layer 10 and outer layer 30, high production efficiency, high yield rate, the especially binding force of three are high, ensure that subsequent
Compound pot will not take off bottom in use.
As shown in Figure 1, compound pot further includes polishing screening glass 50, polishing screening glass 50 fixes the connecting line of sensor 40
On the side wall of internal layer 10, to prevent the connecting line of sensor 40 in polishing process to be torn.Polishing screening glass 50 can will pass
The connecting line of sensor 40 is fixed on the side wall of internal layer 10, to prevent the connecting line of sensor in polishing process to be torn, in turn
Increase the service life of package unit.The connecting line of sensor 40 can be connected to handle, and configuring chip mainboard at handle can be right
The acquisition of 40 measuring temperature of sensor is read, display, is handled, feedback control cooking equipment.
As shown in Figure 1, the side wall of outer layer 30 coats the side wall of middle layer 20 completely；Side wall and the centre of outer layer 30 and/or
The side wall of layer 20 does not coat the side wall of internal layer 10 completely.Middle layer 20 can be coated on internal layer 10 by outer layer 30 completely, be made
Middle layer 20 in welding internal layer 10 and 30 intermediate deformation of outer layer without it is exposed outside, increase the beauty of compound pot entirety
Property.
Specifically, internal layer 10 is made of thermal conductive metallic material；And/or middle layer 20 is aluminium or copper or copper or combinations thereof system
At；And/or outer layer 30 is made of permeability magnetic material.Middle layer can be multilayer, and material can be single aluminium or copper,
It can be copper and aluminium interval be laid with.Preferably, internal layer 10 is made of stainless steel material, and middle layer 20 is made of aluminum material.It is interior
Layer 10 can be got rusty in use with stainless steel material to avoid compound pot, and stainless steel material energy heated fast.Middle layer
20 with aluminum material be because aluminum material have good thermal conductivity the heat of outer layer 30 can be passed to rapidly to internal layer 10, and aluminium
Material has good ductility, can be filled into the gap of groove after heated, and the permeability magnetic material of outer layer 30 is convenient for compound pot
It is used on electromagnetic oven.Specifically, permeability magnetic material is stainless iron, naturally it is also possible to use the good other materials of magnetic property.
Internal layer 10 is made of the good material of heating conduction, so that internal layer 10 can be very good conduction heat.Middle layer 20 by material compared with
Soft material is made, and can be filled into the gap of groove after being heated so as to middle layer 20.
As shown in Figure 1, electromagnetic oven includes electromagnetic heating panel 60 and electromagnetic heating coil, the side wall of electromagnetic heating panel 60
Be globoidal structure, electromagnetic heating panel 60 bottom wall be planar structure, to be adapted to above-mentioned compound pot, electromagnetic heating coil is to electricity
Magnetic heating panel 60 heats.So that above-mentioned compound pot can guarantee the sensor 40 in compound pot when being used cooperatively with electromagnetic oven
Thermometric accuracy.
Specifically, the arc of the side wall of the outer layer 30 of the radian and compound pot of the globoidal structure of the side wall of electromagnetic heating panel 60
The radian of face structure is consistent.Guarantee that the composite structure of concave arc shape and bottom edge level positions the bottom plane of compound pot under compound pot
Guarantee accurate positioning and heating efficiency in the bottom plane position of electromagnetic oven.
The present invention also provides a kind of electromagnetic ovens to pinpoint temp measuring method.Electromagnetic oven fixed point temp measuring method includes: step S1, incites somebody to action
Compound pot is placed in electromagnetic oven, so that compound pot is located on the predeterminated position of electromagnetic oven, wherein compound pot is above-mentioned answers
Pot is closed, electromagnetic oven is above-mentioned electromagnetic oven；Step S2, according to the position of oriented compound pot, the sensing in compound pot is obtained
The data of device 40；Step S3, according to the data of the sensor of acquisition 40, the temperature of compound pot and/or the maturity of food materials are calculated.
It may include fixed electromagnetic oven location-dependent parameters and sensor temperature measuring parameter etc. in compound pot and electromagnetic oven, compound pot is put
The data such as compound pot temperature can more accurately be calculated in the correct position of electromagnetic oven by setting.
Obviously, above-mentioned the described embodiment is only a part of the embodiment of the present invention, instead of all the embodiments.
Based on the embodiments of the present invention, obtained by those of ordinary skill in the art without making creative efforts all
Other embodiments should fall within the scope of the present invention.
It should be noted that term used herein above is merely to describe specific embodiment, and be not intended to restricted root
According to the illustrative embodiments of the application.As used herein, unless the context clearly indicates otherwise, otherwise singular
Also it is intended to include plural form, additionally, it should be understood that, when in the present specification using term "comprising" and/or " packet
Include " when, indicate existing characteristics, step, work, device, component and/or their combination.
It should be noted that the description and claims of this application and term " first " in above-mentioned attached drawing, "
Two " etc. be to be used to distinguish similar objects, without being used to describe a particular order or precedence order.It should be understood that using in this way
Data be interchangeable under appropriate circumstances, so that presently filed embodiment described herein can be in addition to illustrating herein
Or the sequence other than those of description is implemented.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, made any to repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (17)
1. a kind of compound pot, which is characterized in that including internal layer (10), middle layer (20) and outer layer (30), the internal layer (10) is in
Recessed arc structure, the side wall of the outer layer (30) be globoidal structure, the outer layer (30) bottom wall be planar structure.
2. compound pot according to claim 1, which is characterized in that the compound pot further includes at least one sensor (40)
With protector for sensor (70), the middle layer (20) is previously provided with the groove for accommodating the sensor (40), institute
Protector for sensor (70) is stated to be set in the outside of the sensor (40) and be located in the groove.
3. compound pot according to claim 2, which is characterized in that the length of the protector for sensor (70) is less than institute
The total length of sensor (40) and connecting line is stated, so that the probe segment of the sensor (40) is exposed.
4. compound pot according to claim 2, which is characterized in that the protector for sensor (70) is laminated structure,
The laminated structure has the holding tank being adapted to the sensor (40), and the sheet knot is installed on the sensor (40)
When structure, keep the probe segment of the sensor (40) exposed.
5. compound pot according to claim 4, which is characterized in that it is close that the laminated structure is welded on the internal layer (10)
On one side surface of the middle layer (20) and/or the outer layer (30) is on a side surface of the middle layer (20).
6. compound pot according to claim 2, which is characterized in that the protector for sensor (70) is tubular structure,
The sensor (40) is threaded through at the tubular structure, and keeps the probe segment of the sensor (40) exposed.
7. compound pot according to claim 6, which is characterized in that the tubular structure along the compound pot bottom wall
And/or side wall extends.
8. compound pot according to claim 2, which is characterized in that at least one described sensor (40) is fitted in described
The bottom wall of layer (10), at least another sensor (40) are fitted in the bottom wall of the outer layer (30).
9. compound pot according to claim 2, which is characterized in that at least one described sensor (40) is located at the centre
At the center of layer (20), at least one described sensor (40) sets with interval pre-determined distance at the center of the middle layer (20)
It sets.
10. compound pot according to claim 2, which is characterized in that the periphery of the groove and/or the inside of the groove
It is provided with location structure, for the location structure for fixing the sensor (40), the sensor (40) includes at least temperature
Sensor and humidity sensor.
11. compound pot according to claim 2, which is characterized in that the internal layer (10), the middle layer (20) and described
Outer layer (30) passes through at least one of Pressure Welding or soldering or cold Combined Welding mode composite molding.
12. compound pot according to claim 11, which is characterized in that the internal layer (10), the middle layer (20) and institute
After outer layer (30) is stated by electric resistance welding fixation, the middle layer (20) softening is set to reuse the Pressure Welding for three by heating
It is combined with each other, so that the gap of groove described in the middle layer (20) deformable filler.
13. compound pot according to claim 2, which is characterized in that the compound pot further includes polishing screening glass (50), institute
It states polishing screening glass (50) connecting line of the sensor (40) is fixed on the side wall of the internal layer (10), to prevent from polishing
The connecting line of the sensor (40) is torn in the process.
14. compound pot according to any one of claim 1 to 13, which is characterized in that
The internal layer (10) is made of thermal conductive metallic material；And/or
The middle layer (20) is made of aluminium or copper or combinations thereof；And/or
The outer layer (30) is made of permeability magnetic material.
15. a kind of electromagnetic oven characterized by comprising
Electromagnetic heating panel (60), the side wall of the electromagnetic heating panel (60) are globoidal structure, the electromagnetic heating panel
(60) bottom wall is planar structure, to be adapted to compound pot described in any one of claims 1 to 14；
Electromagnetic heating coil, the electromagnetic heating coil heat the electromagnetic heating panel (60).
16. electromagnetic oven according to claim 15, which is characterized in that the cambered surface of the side wall of the electromagnetic heating panel (60)
The radian of structure is consistent with the radian of globoidal structure of side wall of outer layer (30) of the compound pot.
17. a kind of electromagnetic oven pinpoints temp measuring method, which is characterized in that the electromagnetic oven pinpoints temp measuring method and includes:
Step S1, compound pot is placed in electromagnetic oven, so that the compound pot is located on the predeterminated position of the electromagnetic oven,
Wherein, the compound pot is compound pot described in any one of claims 1 to 14, and the electromagnetic oven is claim 15 or 16
The electromagnetic oven；
Step S2, according to the position of the oriented compound pot, the data of the sensor (40) in the compound pot are obtained；
Step S3, according to the data of the sensor (40) of acquisition, the temperature of the compound pot and/or the maturation of food materials are calculated
Degree.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811458679.3A CN109717723B (en) | 2018-11-30 | 2018-11-30 | Composite pot, kit and induction cooker fixed-point temperature measurement method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811458679.3A CN109717723B (en) | 2018-11-30 | 2018-11-30 | Composite pot, kit and induction cooker fixed-point temperature measurement method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109717723A true CN109717723A (en) | 2019-05-07 |
| CN109717723B CN109717723B (en) | 2021-12-28 |
Family
ID=66295165
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811458679.3A Active CN109717723B (en) | 2018-11-30 | 2018-11-30 | Composite pot, kit and induction cooker fixed-point temperature measurement method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109717723B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110324919A (en) * | 2019-07-12 | 2019-10-11 | 南京年代科技有限公司 | A kind of forging metal multilayer composite sheet semiconductor heat booster part and the electric appliance using the device |
| WO2022000218A1 (en) * | 2020-06-29 | 2022-01-06 | 珠海优特智厨科技有限公司 | Manufacturing method for composite pan, composite pan, and interlayer structure of composite pan |
Citations (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1522383A (en) * | 1974-10-29 | 1978-08-23 | Mitsubishi Electric Corp | Induction heating apparatus |
| GB0115403D0 (en) * | 2001-05-10 | 2001-08-15 | Ya Horng Electronic Co Ltd | Electric frying pot |
| CN1628581A (en) * | 2003-12-17 | 2005-06-22 | 刘小勇 | Kettles with measuring apparatus and cooking system thereof |
| CN101088444A (en) * | 2006-06-15 | 2007-12-19 | 徐光启 | Energy-storing pot without oil fume and its production process |
| CN201150477Y (en) * | 2008-01-24 | 2008-11-19 | 广东凌丰集团有限公司 | Frying pan of electromagentic furnace |
| CN201683684U (en) * | 2010-03-01 | 2010-12-29 | 黄健 | Frying-pan of induction cooker |
| CN102049605A (en) * | 2010-10-18 | 2011-05-11 | 宁波卡特马克炊具科技有限公司 | Aluminum and steel combination technology of aluminum pan bottom and aluminum and steel combination pan using same |
| CN102384498A (en) * | 2011-06-21 | 2012-03-21 | 太仓南极风能源设备有限公司 | Multi-purpose electromagnetic oven |
| CN204881872U (en) * | 2015-06-23 | 2015-12-16 | 浙江爱妻电器有限公司 | Temperature acquisition device of pan |
| JP2016059468A (en) * | 2014-09-16 | 2016-04-25 | サーモス株式会社 | Heat insulation cooker |
| CN106108610A (en) * | 2016-08-24 | 2016-11-16 | 新兴县先丰不锈钢制品有限公司 | A kind of temperature control Intelligent pan |
| CN106136840A (en) * | 2015-04-03 | 2016-11-23 | 佛山市顺德区美的电热电器制造有限公司 | Cooking apparatus and electromagnetic oven |
| CN206491659U (en) * | 2016-11-29 | 2017-09-15 | 宁波爱妻智能科技有限公司 | Intelligent pan |
| CN206534507U (en) * | 2016-12-02 | 2017-10-03 | 罗淑珍 | A kind of intelligent pan |
| CN107713846A (en) * | 2017-11-28 | 2018-02-23 | 新兴县先丰不锈钢制品有限公司 | Temperature control three-in-one intelligent pan |
| CN207532286U (en) * | 2017-06-19 | 2018-06-26 | 佛山市顺德区美的电热电器制造有限公司 | Cookware and cooking equipment |
| CN108464727A (en) * | 2018-02-26 | 2018-08-31 | 珠海优特物联科技有限公司 | Cookware and its machining manufacture |
| CN108670008A (en) * | 2018-03-30 | 2018-10-19 | 珠海优特智厨科技有限公司 | Cookware |
-
2018
- 2018-11-30 CN CN201811458679.3A patent/CN109717723B/en active Active
Patent Citations (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1522383A (en) * | 1974-10-29 | 1978-08-23 | Mitsubishi Electric Corp | Induction heating apparatus |
| GB0115403D0 (en) * | 2001-05-10 | 2001-08-15 | Ya Horng Electronic Co Ltd | Electric frying pot |
| CN1628581A (en) * | 2003-12-17 | 2005-06-22 | 刘小勇 | Kettles with measuring apparatus and cooking system thereof |
| CN101088444A (en) * | 2006-06-15 | 2007-12-19 | 徐光启 | Energy-storing pot without oil fume and its production process |
| CN201150477Y (en) * | 2008-01-24 | 2008-11-19 | 广东凌丰集团有限公司 | Frying pan of electromagentic furnace |
| CN201683684U (en) * | 2010-03-01 | 2010-12-29 | 黄健 | Frying-pan of induction cooker |
| CN102049605A (en) * | 2010-10-18 | 2011-05-11 | 宁波卡特马克炊具科技有限公司 | Aluminum and steel combination technology of aluminum pan bottom and aluminum and steel combination pan using same |
| CN102384498A (en) * | 2011-06-21 | 2012-03-21 | 太仓南极风能源设备有限公司 | Multi-purpose electromagnetic oven |
| JP2016059468A (en) * | 2014-09-16 | 2016-04-25 | サーモス株式会社 | Heat insulation cooker |
| CN106136840A (en) * | 2015-04-03 | 2016-11-23 | 佛山市顺德区美的电热电器制造有限公司 | Cooking apparatus and electromagnetic oven |
| CN204881872U (en) * | 2015-06-23 | 2015-12-16 | 浙江爱妻电器有限公司 | Temperature acquisition device of pan |
| CN106108610A (en) * | 2016-08-24 | 2016-11-16 | 新兴县先丰不锈钢制品有限公司 | A kind of temperature control Intelligent pan |
| CN206491659U (en) * | 2016-11-29 | 2017-09-15 | 宁波爱妻智能科技有限公司 | Intelligent pan |
| CN206534507U (en) * | 2016-12-02 | 2017-10-03 | 罗淑珍 | A kind of intelligent pan |
| CN207532286U (en) * | 2017-06-19 | 2018-06-26 | 佛山市顺德区美的电热电器制造有限公司 | Cookware and cooking equipment |
| CN107713846A (en) * | 2017-11-28 | 2018-02-23 | 新兴县先丰不锈钢制品有限公司 | Temperature control three-in-one intelligent pan |
| CN108464727A (en) * | 2018-02-26 | 2018-08-31 | 珠海优特物联科技有限公司 | Cookware and its machining manufacture |
| CN108670008A (en) * | 2018-03-30 | 2018-10-19 | 珠海优特智厨科技有限公司 | Cookware |
Non-Patent Citations (1)
| Title |
|---|
| "中国设备工程2003年1～12期总目录", 《中国设备工程》 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110324919A (en) * | 2019-07-12 | 2019-10-11 | 南京年代科技有限公司 | A kind of forging metal multilayer composite sheet semiconductor heat booster part and the electric appliance using the device |
| WO2022000218A1 (en) * | 2020-06-29 | 2022-01-06 | 珠海优特智厨科技有限公司 | Manufacturing method for composite pan, composite pan, and interlayer structure of composite pan |
| CN115279230A (en) * | 2020-06-29 | 2022-11-01 | 珠海优特智厨科技有限公司 | Manufacturing method of composite pot, composite pot and middle layer structure of composite pot |
| CN115279230B (en) * | 2020-06-29 | 2023-12-05 | 珠海优特智厨科技有限公司 | Manufacturing method of composite pot, composite pot and intermediate layer structure of composite pot |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109717723B (en) | 2021-12-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11241113B2 (en) | Cooking vessel with a thermal sensor | |
| US11641700B2 (en) | Induction heater and dispenser | |
| CN101485231B (en) | Hob allowing the temperature of a culinary article to be detected | |
| CN109717723A (en) | Compound pot, electromagnetic oven and electromagnetic oven pinpoint temp measuring method | |
| CN101484053B (en) | Culinary article allowing its temperature to be detected by a hob | |
| WO2013134239A1 (en) | Method and apparatus for temperature measurement during induction cooking | |
| CN207253258U (en) | Temperature measuring equipment and temp measuring system | |
| JP2013529305A (en) | Temperature estimation | |
| CN109497814A (en) | The manufacturing method of compound pot | |
| EP2939497B1 (en) | Apparatus and method for determining core temperature of food | |
| CN108347796A (en) | A kind of electromagnetic induction heating cooker of low temperature culinary art | |
| WO2011132614A1 (en) | Induction cooker | |
| CN209678171U (en) | Compound pot | |
| CN104919891B (en) | For determining the device and method of the core temperature of food | |
| CN105823099B (en) | A kind of electromagnetic oven | |
| CN209661248U (en) | Compound pot | |
| JP7007360B2 (en) | Induction heaters and dispensers | |
| CN209678170U (en) | Cookware | |
| CN215424272U (en) | Cooking utensil intelligence handle and cooking utensil | |
| CN210624607U (en) | Electromagnetic oven | |
| CN207627025U (en) | Induction cooker pot | |
| CN207428961U (en) | A kind of liquid heater | |
| CN206371840U (en) | Cooking apparatus | |
| CN109419299A (en) | Cookware | |
| CN206905937U (en) | Temperature measuring device for electromagnetic oven and electromagnetic oven |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |