CN106136840A - Cooking apparatus and electromagnetic oven - Google Patents
Cooking apparatus and electromagnetic oven Download PDFInfo
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- CN106136840A CN106136840A CN201510159525.4A CN201510159525A CN106136840A CN 106136840 A CN106136840 A CN 106136840A CN 201510159525 A CN201510159525 A CN 201510159525A CN 106136840 A CN106136840 A CN 106136840A
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- cooking apparatus
- conductive structure
- temperature sensor
- pot
- insulation layer
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Abstract
The invention provides a kind of cooking apparatus and electromagnetic oven, wherein, cooking apparatus, including: cooking apparatus pot；Composite coating, is arranged on the sidepiece lateral wall of described cooking apparatus pot, and described composite coating includes the first thermal insulation layer, the first conductive structure and the second thermal insulation layer being combined；Second conductive structure, it is arranged on the bottom outside wall of described cooking apparatus pot, the marginal area of described second conductive structure is seamless with the side of described first conductive structure to be contacted, and described second conductive structure is for obtaining the bottom temp of described cooking apparatus pot and being transmitted to described first conductive structure；Temperature sensor, is arranged on the opposite side of described first conductive structure, is transmitted to the bottom temp value of described first conductive structure for detection.By technique scheme, change the warming method of cooking apparatus, while improving the accuracy of thermometric, simplify the structure of the temperature module.
Description
Technical field
The present invention relates to field of household appliances, more specifically, relate to a kind of cooking apparatus and a kind of electromagnetic oven.
Background technology
Existing cooking apparatus uses the mode temperature-sensitive of external contact mostly, but the sense of this warming method
Temperature postpones height, and temperature-sensitive error is the biggest.For improving temperature-sensitive precision, temperature is passed by some cooking apparatus
Sensor is implanted in exothermic material, or uses pot in composite base, and temperature sensor is arranged on composite base
Centre, but the structure that this mode makes the temperature module is the most complicated, lead-in wire difficulty, and thermometric
Effect is the most undesirable.
Therefore, how to change the warming method of cooking apparatus, improve the accuracy of thermometric, simplify simultaneously
The structure of the temperature module becomes current problem demanding prompt solution.
Summary of the invention
It is contemplated that at least solve one of technical problem present in prior art.
To this end, it is an advantage of the invention to provide a kind of can the cooking apparatus of accurate thermometric.
Further object is that, it is proposed that a kind of electromagnetic oven.
For achieving the above object, embodiment according to the first aspect of the invention provides a kind of cooking pot
Tool, including: cooking apparatus pot；Composite coating, is arranged on the sidepiece lateral wall of described cooking apparatus pot,
Described composite coating includes the first thermal insulation layer, the first conductive structure and the second thermal insulation layer being combined；Second heat conduction
Structure, is arranged on the bottom outside wall of described cooking apparatus pot, the marginal area of described second conductive structure
Seamless with the side of described first conductive structure contacting, described second conductive structure is used for obtaining described cooking pot
Have the bottom temp of pot and be transmitted to described first conductive structure；Temperature sensor, is arranged on described first
The opposite side of conductive structure, is transmitted to the bottom temp value of described first conductive structure for detection.
Cooking apparatus according to an embodiment of the invention, the second conductive structure is arranged on cooking apparatus pot
Bottom outside wall on, the edge seamless link of first conductive structure one end and the second conductive structure, separately
One end is connected with temperature sensor, and the temperature of cooking apparatus bottom of pot body is conducted extremely by the second conductive structure
First conductive structure, then conducted to temperature sensor by the first conductive structure.First conductive structure and
Two conductive structures are made up of super heat conduction material, can transition temperature exactly.First conductive structure upper,
Lower surface is provided with the first thermal insulation layer and the second thermal insulation layer, it is to avoid the first conductive structure during temperature transfer
The thermal loss on surface so that the deviation of temperature sensor thermometric is bigger.The design changes cooking pot
The warming method of tool, while improving the accuracy of thermometric, simplifies the structure of the temperature module, enters
And can be by the temperature applications more accurately that records in temperature prompt, the control of heat driven circuit and report
The aspects such as alert prompting, more can guarantee that reliability and the precise control of above-mentioned control system.
According to an embodiment of the invention it addition, according to the above embodiment of the present invention provide cooking apparatus
Also there is following additional technical feature:
According to one embodiment of present invention, the other end of described first conductive structure is provided with mounting groove, institute
State mounting groove for placing described temperature sensor.
Cooking apparatus according to an embodiment of the invention, the other end of the first conductive structure is provided with mounting groove,
Temperature sensor is arranged in mounting groove, it is ensured that it is firm that temperature sensor is connected with the first conductive structure
Property so that the temperature-sensitive end of temperature sensor is fitted with the first conductive structure all the time, thus ensures temperature sensor
The accuracy of thermometric.
According to one embodiment of present invention, the area of described first guide structure is less than or equal to described first
The area of thermal insulation layer, and the area of described first conductive structure is less than or equal to the face of described second thermal insulation layer
Long-pending.
Cooking apparatus according to an embodiment of the invention, the area of the first conductive structure is less than or equal to first
Thermal insulation layer and the area of the second thermal insulation layer so that the upper and lower surface of the first conductive structure is completely heat insulation by first
Layer and the second thermal insulation layer cover, and are run off by the first conductive structure surface so that temperature when keeping away surface temperature transmission
The deviation of sensor thermometric is bigger.The design ensure that the accuracy of temperature sensor thermometric.
According to one embodiment of present invention, described first conductive structure includes the first thermal conductive material layer.
Cooking apparatus according to an embodiment of the invention, the first thermal conductive material layer is made up of super heat conduction material,
Can transition temperature exactly, thus ensure the accuracy of temperature sensor thermometric.
According to one embodiment of present invention, described first conductive structure includes at least one first cavity knot
Structure, at least one first cavity structure described is used for accommodating high thermal conductivity air and/or high thermal conductivity liquid.
Cooking apparatus according to an embodiment of the invention, the first conductive structure includes at least one first cavity
Structure, fills high thermal conductivity air and/or high thermal conductivity liquid, cooking apparatus pot in the first cavity structure
The temperature of bottom is conducted to the first conductive structure exactly by the second conductive structure, then by the first cavity knot
High thermal conductivity air and/or the high thermal conductivity liquid filled in structure conduct exactly to temperature sensor, it is ensured that
The accuracy of temperature sensor thermometric.
According to one embodiment of present invention, described second conductive structure includes the second thermal conductive material layer.
Cooking apparatus according to an embodiment of the invention, the second thermal conductive material layer is made up of super heat conduction material,
Can transition temperature exactly, thus ensure the accuracy of temperature sensor thermometric.
According to one embodiment of present invention, described second conductive structure includes at least one second cavity knot
Structure, at least one second cavity structure described is used for accommodating high thermal conductivity air and/or high thermal conductivity liquid.
Cooking apparatus according to an embodiment of the invention, the second conductive structure includes at least one second cavity
Structure, fills high thermal conductivity air and/or high thermal conductivity liquid, cooking apparatus pot in the second cavity structure
Bottom temperature by the second cavity structure fill high thermal conductivity air and/or high thermal conductivity liquid exactly
Conduction is to the first conductive structure, then is conducted exactly to temperature sensor by the first conductive structure, it is ensured that
The accuracy of temperature sensor thermometric.
According to one embodiment of present invention, described cooking apparatus also includes: control circuit, with described temperature
Degree sensor connects, and described control circuit is entered for the described bottom temp value obtaining described temperature sensor
Row processes, the heating instructions corresponding to create described bottom temp value.
Cooking apparatus according to an embodiment of the invention, cooking apparatus also includes control circuit, control circuit
Being connected with temperature sensor, the temperature signal detected is transferred to control circuit by temperature sensor, controls
Temperature signal is processed by circuit, produces corresponding control signal, controls the heating of cooking apparatus.
According to one embodiment of present invention, described cooking apparatus also includes: heat driven module, connects
To described control circuit, described heat driven module is used for according to described heating instructions described cooking apparatus pot
Body heats.
Cooking apparatus according to an embodiment of the invention, cooking apparatus also includes heat driven module, heating
Driving module to be connected with control circuit, the temperature signal detected is transferred to control electricity by temperature sensor
Road, temperature signal is processed by control circuit, produces corresponding control signal, and by control signal
Being transferred to heat driven module, cooking apparatus is heated by heat driven module according to control signal.
The thermometric accuracy of temperature sensor improves, and the control effect of control circuit also the most and then improves, from
And the heats of product is improved.
Embodiment according to the second aspect of the invention, it is proposed that a kind of electromagnetic oven, has any of the above
Item cooking apparatus described in embodiment.
Additional aspect and the advantage of the present invention will become obvious in following description part, or pass through the present invention
Practice recognize.
Accompanying drawing explanation
Above-mentioned and/or the additional aspect of the present invention and advantage are from combining the accompanying drawings below description to embodiment
Will be apparent from easy to understand, wherein:
Fig. 1 is the structural representation of cooking apparatus described according to one embodiment of present invention；
Fig. 2 is the amplification structure schematic diagram in the A portion shown in Fig. 1.
Detailed description of the invention
In order to be more clearly understood that the above-mentioned purpose of the present invention, feature and advantage, below in conjunction with attached
The present invention is further described in detail by figure and detailed description of the invention.It should be noted that not
In the case of conflict, the feature in embodiments herein and embodiment can be mutually combined.
Elaborate a lot of detail in the following description so that fully understanding the present invention, but,
The present invention can implement to use other to be different from mode described here, therefore, and the guarantor of the present invention
Scope of protecting is not limited by following public specific embodiment.
As depicted in figs. 1 and 2, embodiment according to the first aspect of the invention provides a kind of cooking pot
Tool, including: cooking apparatus pot 1；Composite coating, is arranged on outside the sidepiece of described cooking apparatus pot 1
Sidewall, described composite coating includes that first thermal insulation layer the 21, first conductive structure 22 and second being combined is heat insulation
Layer 23；Second conductive structure 3, is arranged on the bottom outside wall of described cooking apparatus pot 1, and described second
The marginal area of conductive structure 3 is seamless with the side of described first conductive structure 22 to be contacted, and described second leads
Heat structure 3 is for obtaining the bottom temp of described cooking apparatus pot 1 and being transmitted to described first conductive structure
22；Temperature sensor 4, is arranged on the opposite side of described first conductive structure 22, is transmitted to for detection
The bottom temp value of described first conductive structure 22.
Cooking apparatus according to an embodiment of the invention, the second conductive structure 3 is arranged on cooking apparatus pot
On the bottom outside wall of body 1, first conductive structure 22 one end is seamless with the edge of the second conductive structure 3
Connecting, the other end is connected with temperature sensor 4, and the temperature bottom cooking apparatus pot 1 is led by second
Heat structure 3 conducts to the first conductive structure 22, then is conducted to temperature sensing by the first conductive structure 22
Device 4.First conductive structure 22 and the second conductive structure 3 are made up of super heat conduction material, can pass exactly
Lead temperature.The upper and lower surface configuration of the first conductive structure 22 has the first thermal insulation layer 21 and second heat insulation
Layer 23, it is to avoid the thermal loss on first conductive structure 22 surface during temperature transfer so that temperature passes
The deviation of sensor 4 thermometric is bigger.The design changes the warming method of cooking apparatus, is improving thermometric
Accuracy while, simplify the structure of the temperature module, and then the temperature more accurately that can record
Degree is applied to the aspects such as temperature prompt, the control of heat driven circuit and alarm, more can guarantee that
State reliability and the precise control of control system.
According to an embodiment of the invention it addition, according to the above embodiment of the present invention provide cooking apparatus
Also there is following additional technical feature:
As in figure 2 it is shown, according to one embodiment of present invention, the other end of described first conductive structure 22
Being provided with mounting groove 221, described mounting groove 221 is used for placing described temperature sensor 4.
Cooking apparatus according to an embodiment of the invention, the other end of the first conductive structure 22 is provided with installation
Groove 221, temperature sensor 4 is arranged in mounting groove 221, it is ensured that temperature sensor 4 and the first heat conduction
Structure 22 connect steadiness so that the temperature-sensitive end of temperature sensor 4 all the time with the first conductive structure 22
Laminating, thus ensure the accuracy of temperature sensor 4 thermometric.
According to one embodiment of present invention, the area of described first guide structure is less than or equal to described first
The area of thermal insulation layer 21, and the area of described first conductive structure 22 is less than or equal to described second thermal insulation layer
The area of 23.
Cooking apparatus according to an embodiment of the invention, the area of the first conductive structure 22 is less than or equal to
First thermal insulation layer 21 and the area of the second thermal insulation layer 23 so that the upper and lower surface of the first conductive structure 22
Covered by the first thermal insulation layer 21 and the second thermal insulation layer 23 completely, tied by the first heat conduction when keeping away surface temperature transmission
Run off in structure 22 surface so that the deviation of temperature sensor 4 thermometric is bigger.The design ensure that temperature passes
The accuracy of sensor 4 thermometric.
According to one embodiment of present invention, described first conductive structure 22 includes the first thermal conductive material layer.
Cooking apparatus according to an embodiment of the invention, the first thermal conductive material layer is made up of super heat conduction material,
Can transition temperature exactly, thus ensure the accuracy of temperature sensor 4 thermometric.
According to one embodiment of present invention, described first conductive structure 22 includes at least one first cavity
Structure, at least one first cavity structure described is used for accommodating high thermal conductivity air and/or high thermal conductivity liquid.
Cooking apparatus according to an embodiment of the invention, the first conductive structure 22 include at least one first
Cavity structure, fills high thermal conductivity air and/or high thermal conductivity liquid, cooking apparatus in the first cavity structure
Temperature bottom pot 1 is conducted to the first conductive structure 22 exactly by the second conductive structure 3, then by
The high thermal conductivity air filled in first cavity structure and/or high thermal conductivity liquid conduct exactly to temperature biography
Sensor 4, it is ensured that the accuracy of temperature sensor 4 thermometric.
According to one embodiment of present invention, described second conductive structure 3 includes the second thermal conductive material layer.
Cooking apparatus according to an embodiment of the invention, the second thermal conductive material layer is made up of super heat conduction material,
Can transition temperature exactly, thus ensure the accuracy of temperature sensor 4 thermometric.
According to one embodiment of present invention, described second conductive structure 3 includes at least one second cavity
Structure, at least one second cavity structure described is used for accommodating high thermal conductivity air and/or high thermal conductivity liquid.
Cooking apparatus according to an embodiment of the invention, the second conductive structure 3 includes at least one second sky
Cavity configuration, fills high thermal conductivity air and/or high thermal conductivity liquid, cooking apparatus pot in the second cavity structure
Temperature bottom body 1 is accurate by the high thermal conductivity air filled in the second cavity structure and/or high thermal conductivity liquid
Really conduct to the first conductive structure 22, then conducted exactly to temperature sensing by the first conductive structure 22
Device 4, it is ensured that the accuracy of temperature sensor 4 thermometric.
According to one embodiment of present invention, described cooking apparatus also includes: control circuit, with described temperature
Degree sensor 4 connects, and described control circuit is for the described bottom temp obtaining described temperature sensor 4
Value processes, the heating instructions corresponding to create described bottom temp value.
Cooking apparatus according to an embodiment of the invention, cooking apparatus also includes control circuit, control circuit
Being connected with temperature sensor 4, the temperature signal detected is transferred to control circuit by temperature sensor 4,
Temperature signal is processed by control circuit, produces corresponding control signal, controls adding of cooking apparatus
Heat.
According to one embodiment of present invention, described cooking apparatus also includes: heat driven module, connects
To described control circuit, described heat driven module is used for according to described heating instructions described cooking apparatus pot
Body 1 heats.
Cooking apparatus according to an embodiment of the invention, cooking apparatus also includes heat driven module, heating
Driving module to be connected with control circuit, the temperature signal detected is transferred to control electricity by temperature sensor 4
Road, temperature signal is processed by control circuit, produces corresponding control signal, and by control signal
Being transferred to heat driven module, cooking apparatus is heated by heat driven module according to control signal.
The thermometric accuracy of temperature sensor 4 improves, and the control effect of control circuit also the most and then improves,
So that the heats of product improves.
Embodiment according to the second aspect of the invention, it is proposed that a kind of electromagnetic oven, has any of the above
Item cooking apparatus described in embodiment.
In describing the invention, term " is installed ", " connection " etc. all should be interpreted broadly, such as,
" connecting " can be fixing connection, it is also possible to is to removably connect, or is integrally connected；Can be straight
Connect connected, it is also possible to be indirectly connected to by intermediary.For the ordinary skill in the art,
Above-mentioned term concrete meaning in the present invention can be understood as the case may be.
In the description of this specification, term " embodiment ", " some embodiments ", " be embodied as
Example " etc. description means to combine this embodiment or example describes specific features, structure, material or feature
It is contained at least one embodiment or the example of the present invention.In this manual, to above-mentioned term
Schematic representation is not necessarily referring to identical embodiment or example.And, the specific features of description,
Structure, material or feature can in any one or more embodiments or example in an appropriate manner
In conjunction with.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, for
For those skilled in the art, the present invention can have various modifications and variations.All essences in the present invention
Within god and principle, any modification, equivalent substitution and improvement etc. made, should be included in the present invention
Protection domain within.
Claims (10)
1. a cooking apparatus, it is characterised in that including:
Cooking apparatus pot；
Composite coating, is arranged on the sidepiece lateral wall of described cooking apparatus pot, and described composite coating includes multiple
The first thermal insulation layer, the first conductive structure and the second thermal insulation layer closed；
Second conductive structure, is arranged on the bottom outside wall of described cooking apparatus pot, described second heat conduction knot
The marginal area of structure is seamless with the side of described first conductive structure to be contacted, and described second conductive structure is used for obtaining
Take the bottom temp of described cooking apparatus pot and be transmitted to described first conductive structure；
Temperature sensor, is arranged on the opposite side of described first conductive structure, is transmitted to described for detection
The bottom temp value of one conductive structure.
Cooking apparatus the most according to claim 1, it is characterised in that described first conductive structure
The other end is provided with mounting groove, and described mounting groove is used for placing described temperature sensor.
Cooking apparatus the most according to claim 1, it is characterised in that the face of described first guide structure
Amass the area less than or equal to described first thermal insulation layer, and the area of described first conductive structure is less than or equal to
The area of described second thermal insulation layer.
Cooking apparatus the most according to claim 1, it is characterised in that described first conductive structure bag
Include the first thermal conductive material layer.
Cooking apparatus the most according to claim 1, it is characterised in that described first conductive structure bag
Including at least one first cavity structure, at least one first cavity structure described is used for accommodating high thermal conductivity air
And/or high thermal conductivity liquid.
Cooking apparatus the most according to claim 1, it is characterised in that described second conductive structure bag
Include the second thermal conductive material layer.
Cooking apparatus the most according to claim 1, it is characterised in that described second conductive structure bag
Including at least one second cavity structure, at least one second cavity structure described is used for accommodating high thermal conductivity air
And/or high thermal conductivity liquid.
Cooking apparatus the most according to any one of claim 1 to 7, it is characterised in that also include:
Control circuit, is connected with described temperature sensor, and described control circuit is for described temperature sensor
The described bottom temp value obtained processes, the heating instructions corresponding to create described bottom temp value.
Cooking apparatus the most according to claim 8, it is characterised in that also include:
Heat driven module, is connected to described control circuit, and described heat driven module is for adding described in basis
Described cooking apparatus pot is heated by heat instruction.
10. an electromagnetic oven, it is characterised in that include the culinary art according to any one of claim 1 to 9
Utensil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510159525.4A CN106136840B (en) | 2015-04-03 | 2015-04-03 | Cooking apparatus and electromagnetic oven |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510159525.4A CN106136840B (en) | 2015-04-03 | 2015-04-03 | Cooking apparatus and electromagnetic oven |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106136840A true CN106136840A (en) | 2016-11-23 |
| CN106136840B CN106136840B (en) | 2018-07-27 |
Family
ID=57337642
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510159525.4A Active CN106136840B (en) | 2015-04-03 | 2015-04-03 | Cooking apparatus and electromagnetic oven |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106136840B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109717723A (en) * | 2018-11-30 | 2019-05-07 | 珠海优特智厨科技有限公司 | Compound pot, electromagnetic oven and electromagnetic oven pinpoint temp measuring method |
| WO2022000218A1 (en) * | 2020-06-29 | 2022-01-06 | 珠海优特智厨科技有限公司 | Manufacturing method for composite pan, composite pan, and interlayer structure of composite pan |
| WO2023078181A1 (en) * | 2021-11-05 | 2023-05-11 | 添可智能科技有限公司 | Heating device |
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| CN201515962U (en) * | 2009-05-19 | 2010-06-30 | 富可 | Intelligent temperature-controlled fry pan |
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| WO2022000218A1 (en) * | 2020-06-29 | 2022-01-06 | 珠海优特智厨科技有限公司 | Manufacturing method for composite pan, composite pan, and interlayer structure of composite pan |
| WO2023078181A1 (en) * | 2021-11-05 | 2023-05-11 | 添可智能科技有限公司 | Heating device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106136840B (en) | 2018-07-27 |
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