CN106136840B - Cooking apparatus and electromagnetic oven - Google Patents
Cooking apparatus and electromagnetic oven Download PDFInfo
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- CN106136840B CN106136840B CN201510159525.4A CN201510159525A CN106136840B CN 106136840 B CN106136840 B CN 106136840B CN 201510159525 A CN201510159525 A CN 201510159525A CN 106136840 B CN106136840 B CN 106136840B
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- conductive structure
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Abstract
The present invention provides a kind of cooking apparatus and electromagnetic ovens, wherein cooking apparatus, including:Cooking apparatus pot body;Composite coating, is arranged the side lateral wall in the cooking apparatus pot body, and the composite coating includes compound first thermal insulation layer, the first conductive structure and second thermal insulation layer;Second conductive structure, bottom outside wall in the cooking apparatus pot body is set, the seamless contact in side of the fringe region of second conductive structure and first conductive structure, second conductive structure are used to obtain the bottom temp of the cooking apparatus pot body and are transmitted to first conductive structure;Temperature sensor is arranged in the other side of first conductive structure, for detecting the bottom temp value for being transmitted to first conductive structure.Through the above technical solutions, changing the warming method of cooking apparatus, while improving the accuracy of thermometric, the structure of the temperature module is simplified.
Description
Technical field
The present invention relates to field of household appliances, more specifically, are related to a kind of cooking apparatus and a kind of electromagnetic oven.
Background technology
Existing cooking apparatus mostly uses greatly the mode temperature-sensitive of external contact, but the temperature-sensitive delay of this warming method is high,
Temperature-sensitive error is also bigger.To improve temperature-sensitive precision, temperature sensor is implanted into exothermic material by some cooking apparatus, or is adopted
With pot in composite base, temperature sensor is mounted among composite base, but this mode makes the structure of the temperature module excessively
Complexity, lead is difficult, and thermometric effect is also undesirable.
Therefore, the warming method for how changing cooking apparatus, improves the accuracy of thermometric, while simplifying the temperature module
Structure becomes current urgent problem to be solved.
Invention content
The present invention is directed at least solve one of the technical problems existing in the prior art.
For this purpose, it is an advantage of the invention to provide it is a kind of can accurate thermometric cooking apparatus.
It is another object of the present invention to, it is proposed that a kind of electromagnetic oven.
To achieve the above object, embodiment according to the first aspect of the invention provides a kind of cooking apparatus, including:It cooks
It prepares food utensil pot body;Composite coating, is arranged the side lateral wall in the cooking apparatus pot body, and the composite coating includes compound
First thermal insulation layer, the first conductive structure and second thermal insulation layer;Second conductive structure is arranged in the bottom of the cooking apparatus pot body
The seamless contact in side of lateral wall, the fringe region of second conductive structure and first conductive structure, described second leads
Heat structure is used to obtain the bottom temp of the cooking apparatus pot body and is transmitted to first conductive structure;Temperature sensor,
It is arranged in the other side of first conductive structure, for detecting the bottom temp value for being transmitted to first conductive structure.
The bottom outside in cooking apparatus pot body is arranged in cooking apparatus according to an embodiment of the invention, the second conductive structure
On wall, the first conductive structure side and the edge of the second conductive structure are seamlessly connected, and the other side is connect with temperature sensor, is cooked
The temperature of utensil bottom of pot body is conducted by the second conductive structure to the first conductive structure, then is conducted to temperature by the first conductive structure
Sensor.First conductive structure and the second conductive structure are made of super heat conduction material, can accurately transition temperature.First heat conduction knot
The upper and lower surface of structure is provided with first thermal insulation layer and second thermal insulation layer, avoids the first conductive structure surface when temperature is transmitted
Thermal loss so that the deviation of temperature sensor thermometric is larger.The design changes the warming method of cooking apparatus, is surveyed improving
While the accuracy of temperature, the structure of the temperature module is simplified, and then can be by the more accurate temperature applications measured in temperature
Prompt, the control of heat driven circuit and alarm etc. more can guarantee that the reliability of above-mentioned control system and control are accurate
True property.
It is according to an embodiment of the invention in addition, according to the above embodiment of the present invention provide cooking apparatus also have it is as follows
Additional technical feature:
According to one embodiment of present invention, the other side of first conductive structure is provided with mounting groove, the installation
Slot is for placing the temperature sensor.
The other side of cooking apparatus according to an embodiment of the invention, the first conductive structure is provided with mounting groove, and temperature passes
Sensor is mounted in mounting groove, ensure that the stability that temperature sensor is connect with the first conductive structure so that temperature sensor
Temperature-sensitive end be bonded always with the first conductive structure, to ensure the accuracy of temperature sensor thermometric.
According to one embodiment of present invention, the area of first conductive structure is less than or equal to the first thermal insulation layer
Area, and the area of first conductive structure be less than or equal to the second thermal insulation layer area.
Cooking apparatus according to an embodiment of the invention, the area of the first conductive structure be less than or equal to first thermal insulation layer and
The area of second thermal insulation layer so that the upper and lower surface of the first conductive structure is covered by first thermal insulation layer and second thermal insulation layer completely,
It keeps away when face temperature is transmitted and is lost in by the first conductive structure surface so that the deviation of temperature sensor thermometric is larger.The design ensures
The accuracy of temperature sensor thermometric.
According to one embodiment of present invention, first conductive structure includes the first thermal conductive material layer.
Cooking apparatus according to an embodiment of the invention, the first thermal conductive material layer are made of super heat conduction material, can be accurately
Transition temperature, to ensure the accuracy of temperature sensor thermometric.
According to one embodiment of present invention, first conductive structure includes at least one first cavity structure, described
At least one first cavity structure is for accommodating high thermal conductivity air and/or high thermal conductivity liquid.
Cooking apparatus according to an embodiment of the invention, the first conductive structure include at least one first cavity structure, the
Filling high thermal conductivity air and/or high thermal conductivity liquid, the temperature of cooking apparatus bottom of pot body are led by second in one cavity structure
Heat structure is accurately conducted to the first conductive structure, then the high thermal conductivity air by being filled in the first cavity structure and/or height are led
Heating rate liquid accurately conducts the accuracy that ensure that temperature sensor thermometric to temperature sensor.
According to one embodiment of present invention, second conductive structure includes the second thermal conductive material layer.
Cooking apparatus according to an embodiment of the invention, the second thermal conductive material layer are made of super heat conduction material, can be accurately
Transition temperature, to ensure the accuracy of temperature sensor thermometric.
According to one embodiment of present invention, second conductive structure includes at least one second cavity structure, described
At least one second cavity structure is for accommodating high thermal conductivity air and/or high thermal conductivity liquid.
Cooking apparatus according to an embodiment of the invention, the second conductive structure include at least one second cavity structure, the
Filling high thermal conductivity air and/or high thermal conductivity liquid in two cavity structures, the temperature of cooking apparatus bottom of pot body is by the second sky
The high thermal conductivity air and/or high thermal conductivity liquid filled in cavity configuration are accurately conducted to the first conductive structure, then by first
Conductive structure accurately conducts the accuracy that ensure that temperature sensor thermometric to temperature sensor.
According to one embodiment of present invention, the cooking apparatus further includes:Control circuit connects with the temperature sensor
It connects, the control circuit is for handling the bottom temp value that the temperature sensor obtains, to create the bottom
The corresponding heating instructions of portion's temperature value.
Cooking apparatus according to an embodiment of the invention, cooking apparatus further include control circuit, and control circuit is passed with temperature
Sensor connects, and the temperature signal detected is transferred to control circuit by temperature sensor, control circuit to temperature signal at
Reason generates corresponding control signal, controls the heating of cooking apparatus.
According to one embodiment of present invention, the cooking apparatus further includes:Heat driven module is connected to the control
Circuit, the heat driven module is for heating the cooking apparatus pot body according to the heating instructions.
Cooking apparatus according to an embodiment of the invention, cooking apparatus further include heat driven module, heat driven module
It is connect with control circuit, the temperature signal detected is transferred to control circuit by temperature sensor, and control circuit is to temperature signal
It is handled, generates corresponding control signal, and give control signal transmission to heat driven module, heat driven module is according to control
Signal processed heats cooking apparatus.The thermometric accuracy of temperature sensor improves, and the control effect of control circuit is also
And then it improves, so that the heating effect of product improves.
Embodiment according to the second aspect of the invention, it is proposed that a kind of electromagnetic oven has any of the above item embodiment institute
The cooking apparatus stated.
The additional aspect and advantage of the present invention will become apparent in following description section, or practice through the invention
Recognize.
Description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention will become in the description from combination following accompanying drawings to embodiment
Obviously and it is readily appreciated that, wherein:
Fig. 1 is the structural schematic diagram of the cooking apparatus described according to one embodiment of present invention;
Fig. 2 is the amplification structure schematic diagram in the portions A shown in Fig. 1.
Specific implementation mode
To better understand the objects, features and advantages of the present invention, below in conjunction with the accompanying drawings and specific real
Mode is applied the present invention is further described in detail.It should be noted that in the absence of conflict, the implementation of the application
Feature in example and embodiment can be combined with each other.
Many details are elaborated in the following description to facilitate a thorough understanding of the present invention, still, the present invention may be used also
By using other, different from implementing in a manner of described here, therefore, protection scope of the present invention is not by following public tool
The limitation of body embodiment.
As depicted in figs. 1 and 2, embodiment according to the first aspect of the invention provides a kind of cooking apparatus, including:It cooks
It prepares food utensil pot body 1;Composite coating, is arranged the side lateral wall in the cooking apparatus pot body 1, and the composite coating includes compound
First thermal insulation layer 21, the first conductive structure 22 and second thermal insulation layer 23;Second conductive structure 3 is arranged in the cooking apparatus
The side of the bottom outside wall of pot body 1, the fringe region of second conductive structure 3 and first conductive structure 22 is without sewing up
It touches, second conductive structure 3 is used to obtain the bottom temp of the cooking apparatus pot body 1 and is transmitted to the first heat conduction knot
Structure 22;Temperature sensor 4, is arranged in the other side of first conductive structure 22, and first heat conduction is transmitted to for detecting
The bottom temp value of structure 22.
Cooking apparatus according to an embodiment of the invention, the second conductive structure 3 are arranged outside the bottom of cooking apparatus pot body 1
On side wall, 22 side of the first conductive structure and the edge of the second conductive structure 3 are seamlessly connected, and the other side connects with temperature sensor 4
It connects, the temperature of 1 bottom of cooking apparatus pot body is conducted by the second conductive structure 3 to the first conductive structure 22, then by the first heat conduction knot
Structure 22 is conducted to temperature sensor 4.First conductive structure 22 and the second conductive structure 3 are made of super heat conduction material, can be accurately
Transition temperature.The upper and lower surface of first conductive structure 22 is provided with first thermal insulation layer 21 and second thermal insulation layer 23, avoids temperature
The thermal loss on 22 surface of the first conductive structure when transmission so that the deviation of 4 thermometric of temperature sensor is larger.The design changes
The warming method of cooking apparatus simplifies the structure of the temperature module, and then can will survey while improving the accuracy of thermometric
In temperature prompt, the control of heat driven circuit and alarm etc. more can guarantee the more accurate temperature applications obtained
State reliability and the precise control of control system.
It is according to an embodiment of the invention in addition, according to the above embodiment of the present invention provide cooking apparatus also have it is as follows
Additional technical feature:
As shown in Fig. 2, according to one embodiment of present invention, the other side of first conductive structure 22 is provided with installation
Slot 221, the mounting groove 221 is for placing the temperature sensor 4.
The other side of cooking apparatus according to an embodiment of the invention, the first conductive structure 22 is provided with mounting groove 221, temperature
It spends sensor 4 to be mounted in mounting groove 221, ensure that the stability that temperature sensor 4 is connect with the first conductive structure 22 so that
The temperature-sensitive end of temperature sensor 4 is bonded with the first conductive structure 22 always, to ensure the accuracy of 4 thermometric of temperature sensor.
According to one embodiment of present invention, the area of first conductive structure is less than or equal to the first thermal insulation layer
21 area, and the area of first conductive structure 22 is less than or equal to the area of the second thermal insulation layer 23.
The area of cooking apparatus according to an embodiment of the invention, the first conductive structure 22 is less than or equal to first thermal insulation layer
21 and second thermal insulation layer 23 area so that the upper and lower surface of the first conductive structure 22 is completely by first thermal insulation layer 21 and second
Thermal insulation layer 23 covers, and keeps away when face temperature is transmitted and is lost in by 22 surface of the first conductive structure so that the deviation of 4 thermometric of temperature sensor
It is larger.The design ensure that the accuracy of 4 thermometric of temperature sensor.
According to one embodiment of present invention, first conductive structure 22 includes the first thermal conductive material layer.
Cooking apparatus according to an embodiment of the invention, the first thermal conductive material layer are made of super heat conduction material, can be accurately
Transition temperature, to ensure the accuracy of 4 thermometric of temperature sensor.
According to one embodiment of present invention, first conductive structure 22 includes at least one first cavity structure, institute
At least one first cavity structure is stated for accommodating high thermal conductivity air and/or high thermal conductivity liquid.
Cooking apparatus according to an embodiment of the invention, the first conductive structure 22 include at least one first cavity structure,
Filling high thermal conductivity air and/or high thermal conductivity liquid in first cavity structure, the temperature of 1 bottom of cooking apparatus pot body is by second
Conductive structure 3 is accurately conducted to the first conductive structure 22, then the high thermal conductivity air by being filled in the first cavity structure and/or
High thermal conductivity liquid accurately conducts the accuracy that ensure that 4 thermometric of temperature sensor to temperature sensor 4.
According to one embodiment of present invention, second conductive structure 3 includes the second thermal conductive material layer.
Cooking apparatus according to an embodiment of the invention, the second thermal conductive material layer are made of super heat conduction material, can be accurately
Transition temperature, to ensure the accuracy of 4 thermometric of temperature sensor.
According to one embodiment of present invention, second conductive structure 3 includes at least one second cavity structure, described
At least one second cavity structure is for accommodating high thermal conductivity air and/or high thermal conductivity liquid.
Cooking apparatus according to an embodiment of the invention, the second conductive structure 3 include at least one second cavity structure, the
Filling high thermal conductivity air and/or high thermal conductivity liquid in two cavity structures, the temperature of 1 bottom of cooking apparatus pot body is by the second sky
The high thermal conductivity air and/or high thermal conductivity liquid filled in cavity configuration are accurately conducted to the first conductive structure 22, then by the
One conductive structure 22 accurately conducts the accuracy that ensure that 4 thermometric of temperature sensor to temperature sensor 4.
According to one embodiment of present invention, the cooking apparatus further includes:Control circuit, with the temperature sensor 4
Connection, the control circuit is for handling the bottom temp value that the temperature sensor 4 obtains, described in establishment
The corresponding heating instructions of bottom temp value.
Cooking apparatus according to an embodiment of the invention, cooking apparatus further include control circuit, and control circuit is passed with temperature
Sensor 4 connects, and the temperature signal detected is transferred to control circuit by temperature sensor 4, and control circuit carries out temperature signal
Processing generates corresponding control signal, controls the heating of cooking apparatus.
According to one embodiment of present invention, the cooking apparatus further includes:Heat driven module is connected to the control
Circuit, the heat driven module is for heating the cooking apparatus pot body 1 according to the heating instructions.
Cooking apparatus according to an embodiment of the invention, cooking apparatus further include heat driven module, heat driven module
It is connect with control circuit, the temperature signal detected is transferred to control circuit by temperature sensor 4, and control circuit is to temperature signal
It is handled, generates corresponding control signal, and give control signal transmission to heat driven module, heat driven module is according to control
Signal processed heats cooking apparatus.The thermometric accuracy of temperature sensor 4 improves, and the control effect of control circuit is also
And then it improves, so that the heating effect of product improves.
Embodiment according to the second aspect of the invention, it is proposed that a kind of electromagnetic oven has any of the above item embodiment institute
The cooking apparatus stated.
In the description of the present invention, term " installation ", " connection " etc. shall be understood in a broad sense, for example, " connection " can be
It is fixedly connected, may be a detachable connection, or be integrally connected;It can be directly connected, it can also be by between intermediary
It connects connected.For the ordinary skill in the art, it can understand above-mentioned term in the present invention as the case may be
Concrete meaning.
In the description of this specification, the description of term " one embodiment ", " some embodiments ", " specific embodiment " etc.
Mean that particular features, structures, materials, or characteristics described in conjunction with this embodiment or example are contained at least one reality of the present invention
It applies in example or example.In the present specification, schematic expression of the above terms are not necessarily referring to identical embodiment or reality
Example.Moreover, description particular features, structures, materials, or characteristics can in any one or more of the embodiments or examples with
Suitable mode combines.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, any made by repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (9)
1. a kind of cooking apparatus, which is characterized in that including:
Cooking apparatus pot body;
Composite coating, is arranged the side lateral wall in the cooking apparatus pot body, the composite coating include compound first every
Thermosphere, the first conductive structure and second thermal insulation layer;
The bottom outside wall in the cooking apparatus pot body, the marginal zone of second conductive structure is arranged in second conductive structure
The seamless contact in side in domain and first conductive structure, second conductive structure is for obtaining the cooking apparatus pot body
Bottom temp is simultaneously transmitted to first conductive structure;
Temperature sensor, is arranged in the other side of first conductive structure, and first conductive structure is transmitted to for detecting
Bottom temp value;
The other side of first conductive structure is provided with mounting groove, and the mounting groove is for placing the temperature sensor.
2. cooking apparatus according to claim 1, which is characterized in that the area of first conductive structure is less than or equal to
The area of the first thermal insulation layer, and the area of first conductive structure is less than or equal to the area of the second thermal insulation layer.
3. cooking apparatus according to claim 1, which is characterized in that first conductive structure includes the first Heat Conduction Material
Layer.
4. cooking apparatus according to claim 1, which is characterized in that first conductive structure includes at least one first
Cavity structure, at least one first cavity structure is for accommodating high thermal conductivity air and/or high thermal conductivity liquid.
5. cooking apparatus according to claim 1, which is characterized in that second conductive structure includes the second Heat Conduction Material
Layer.
6. cooking apparatus according to claim 1, which is characterized in that second conductive structure includes at least one second
Cavity structure, at least one second cavity structure is for accommodating high thermal conductivity air and/or high thermal conductivity liquid.
7. cooking apparatus according to any one of claim 1 to 6, which is characterized in that further include:
Control circuit is connect with the temperature sensor, and the control circuit is used for described in temperature sensor acquisition
Bottom temp value is handled, to create the corresponding heating instructions of the bottom temp value.
8. cooking apparatus according to claim 7, which is characterized in that further include:
Heat driven module, is connected to the control circuit, and the heat driven module is used for according to the heating instructions to institute
Cooking apparatus pot body is stated to be heated.
9. a kind of electromagnetic oven, which is characterized in that including cooking apparatus described in any item of the claim 1 to 8.
Priority Applications (1)
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CN201510159525.4A CN106136840B (en) | 2015-04-03 | 2015-04-03 | Cooking apparatus and electromagnetic oven |
Applications Claiming Priority (1)
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CN201510159525.4A CN106136840B (en) | 2015-04-03 | 2015-04-03 | Cooking apparatus and electromagnetic oven |
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CN106136840A CN106136840A (en) | 2016-11-23 |
CN106136840B true CN106136840B (en) | 2018-07-27 |
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CN201510159525.4A Active CN106136840B (en) | 2015-04-03 | 2015-04-03 | Cooking apparatus and electromagnetic oven |
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Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN109717723B (en) * | 2018-11-30 | 2021-12-28 | 珠海优特智厨科技有限公司 | Composite pot, kit and induction cooker fixed-point temperature measurement method |
CN115279230B (en) * | 2020-06-29 | 2023-12-05 | 珠海优特智厨科技有限公司 | Manufacturing method of composite pot, composite pot and intermediate layer structure of composite pot |
CN113974455A (en) * | 2021-11-05 | 2022-01-28 | 添可智能科技有限公司 | Heating device |
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CN202151310U (en) * | 2011-07-15 | 2012-02-29 | 王晓东 | Pot provided with high-precision electronic temperature display device |
CN202386471U (en) * | 2011-12-07 | 2012-08-22 | 周和平 | Cooking pot with temperature prompt and alarm functions |
CN203399971U (en) * | 2013-07-29 | 2014-01-22 | 美的集团股份有限公司 | Pot and electromagnetic cooker with pot |
CN204520272U (en) * | 2015-04-03 | 2015-08-05 | 佛山市顺德区美的电热电器制造有限公司 | Cooking apparatus and electromagnetic oven |
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2015
- 2015-04-03 CN CN201510159525.4A patent/CN106136840B/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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CN201515962U (en) * | 2009-05-19 | 2010-06-30 | 富可 | Intelligent temperature-controlled fry pan |
DE202011100641U1 (en) * | 2011-02-10 | 2011-11-16 | GSW GäNS STAHLWAREN GMBH | Cookware with temperature indicator |
CN202151310U (en) * | 2011-07-15 | 2012-02-29 | 王晓东 | Pot provided with high-precision electronic temperature display device |
CN202386471U (en) * | 2011-12-07 | 2012-08-22 | 周和平 | Cooking pot with temperature prompt and alarm functions |
CN203399971U (en) * | 2013-07-29 | 2014-01-22 | 美的集团股份有限公司 | Pot and electromagnetic cooker with pot |
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