CN201922612U - Press - Google Patents

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Publication number
CN201922612U
CN201922612U CN2010206949347U CN201020694934U CN201922612U CN 201922612 U CN201922612 U CN 201922612U CN 2010206949347 U CN2010206949347 U CN 2010206949347U CN 201020694934 U CN201020694934 U CN 201020694934U CN 201922612 U CN201922612 U CN 201922612U
Authority
CN
China
Prior art keywords
plate
press
utility
base plate
buffer plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2010206949347U
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Chinese (zh)
Inventor
段一侦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HUIZHOU GREEN LABEL OPTO TECHNOLOGY Co Ltd
Original Assignee
HUIZHOU GREEN LABEL OPTO TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HUIZHOU GREEN LABEL OPTO TECHNOLOGY Co Ltd filed Critical HUIZHOU GREEN LABEL OPTO TECHNOLOGY Co Ltd
Priority to CN2010206949347U priority Critical patent/CN201922612U/en
Application granted granted Critical
Publication of CN201922612U publication Critical patent/CN201922612U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model belongs to the technical field of circuit boards, and particularly relates to a press, which comprises an upper heating plate, a lower heating plate, an upper cover plate, a lower cover plate, an upper base plate, a lower base plate and a tray. The lower heating plate, the lower cover plate, the lower base plate, the upper base plate, the upper cover plate and the upper heating plate are sequentially laminated on the tray from bottom to top, and the upper base plate and the lower base plate are buffering base plates. The buffering base plates are adopted to replace kraft paper in traditional copper-clad plate lamination process, and cost of lamination process is greatly lowered.

Description

Press
Technical field
The utility model belongs to the wiring board technical field, relates in particular to a kind of press.
Background technology
The copper-clad plate lamination process need carries out lamination under high-temperature and high-pressure conditions, make the substrate resin curing molding.In lamination process,, need to use the padded coaming uniform pressure to distribute in order to guarantee base material quality and plate surface planarization.The traditional general use of copper-clad plate production brown paper etc. are as padded coaming.
In recent years, rare along with the forest reserves in the world wide, pulp price is more and more expensive, and therefore the cost of laminating technology increases.And the characteristic reason of brown paper owing to itself used in copper-clad plate, uses one will variable color to become fragile after twice, can't continue to use, and so also aggravated the production cost of laminating technology.
Summary of the invention
The purpose of the utility model embodiment is to provide a kind of press, to solve traditional high problem of laminating technology production cost.
The technical solution of the utility model is as follows:
A kind of press, comprise heat dish, following hot dish, upper cover plate, lower cover, upper padding plate, lower bolster, pallet, wherein, following hot dish, lower cover, lower bolster, upper padding plate, upper cover plate, last heat dish are arranged on the pallet according to sequential cascade from top to bottom, and upper padding plate and lower bolster are buffer plate.
Described press, wherein, described buffer plate is the rubber buffer plate.
Described press, wherein, described buffer plate is the fiber buffer plate.
The beneficial effects of the utility model are:
The utility model employing buffer plate has replaced the brown paper in traditional copper-clad plate lamination technology, and the cost of laminating technology is reduced greatly.
Description of drawings
Fig. 1 is the schematic diagram of the utility model press.
The specific embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer,, the utility model is further elaborated below in conjunction with drawings and Examples.Should be appreciated that specific embodiment described herein only in order to explanation the utility model, and be not used in qualification the utility model.
Fig. 1 shows the schematic diagram of the utility model press, press mainly comprises heat dish 11, following heat dish 12, upper cover plate 21, lower cover 22, upper padding plate 31, lower bolster 32, pallet 40, wherein, following heat dish 12, lower cover 22, lower bolster 32, upper padding plate 31, upper cover plate 21, go up heat dish 11 and be arranged on the pallet 40 according to from top to bottom sequential cascade, upper padding plate 31 and lower bolster 32 are buffer plate.In use, copper-clad plate is placed between upper padding plate 31 and the lower bolster 32.
Buffer plate is formed by the pressing of elevated temperature heat compression technology, and common have two kinds of rubber buffer plate and fiber buffer plates, and they have shown good serviceability in the copper-clad plate lamination process, have good matching.
Adopt the heat resistance fiber pressing to make buffer plate, can bear the laminating temperature that is up to more than 250 ℃, and have advantage such as use repeatedly that the back quality is aging, nondiscolouring, superficial layer are not destroyed, shock-absorbing capacity etc. also can keep.As the pressing material, its body of material can be because of the long term high temperature pressing and not destroyed, and along with the increase of access times, the influence that its heat transfer temperature is subjected to is very little.What such advantage can guarantee buffer plate effectively recycles number of times, reduces because its heating rate changes the technology that occurs and adjusts cost.
The most important functions of padded coaming in copper-clad plate lamination technology is exactly that compensator or trimmer pressure distributes, and makes the pressure of laminating machine can be evenly distributed in the whole plate face of copper-clad plate.If padded coaming pressure transmission ability is inhomogeneous, the comparatively significantly not controlled situation of thickness can appear during copper-clad plate was produced so, show as plate face thickness skewness, local thickness overproof (blocked up or thin excessively) etc.Therefore thickness of copper-clad plate control level can fully characterize the quality of the buffer capacity of padded coaming.
We use buffer plate to test, suppressing slab and thin plate (FR-4 1.5 and FR-4 0.20) respectively experimentizes, it is more even to see that sheet metal thickness distributes, compare as padded coaming with brown paper, THICKNESS CONTROL is on close level, can satisfy the level of three grades of tolerances of industry, be suitable as the padded coaming that copper-clad plate is produced.
The quality of padded coaming has certain influence to inside base material quality (insulating barrier) of copper-clad plate.If resiliency does not reach requirement, be easy to bring out local under-voltage, bubble, the white angle of white edge.Or even weavy grain defective such as appears and occurs.Show by trial state, buffer plate has good self-recovery, the buffering stability that therefore can keep its material of main part for a long time, according to the tracking to the base material quality, buffer plate also can guarantee copper-clad plate base material quality of stability through maximum recycling more than 400 times.
Brown paper has the situation of paper scrap to take place under HTHP, the paper scrap that falls down can pollute the frock (going into mirror steel plate etc.) of lamination, then can have influence on follow-up production, form visual defects such as plate face pit easily, this defective can cause situations such as short circuit in the PCB procedure for processing, be that PCB client is never acceptable.Therefore, to fall the paper scrap problem also be a puzzlement copper-clad plate manufacturing industry difficult problem for many years to brown paper.And the lamination buffer plate that uses new material to make can greatly improve this difficult problem, through overtesting, use the type backing plate to be used for copper-clad plate lamination at present, can effectively reduce the plate planar defect really, significantly promote A level product rate, this is the big advantage of buffer plate than brown paper.
The above only is preferred embodiment of the present utility model; not in order to restriction the utility model; all any modifications of within spirit of the present utility model and principle, being done, be equal to and replace and improvement etc., all should be included within the protection domain of the present utility model.

Claims (3)

1. press, comprise heat dish, following hot dish, upper cover plate, lower cover, upper padding plate, lower bolster, pallet, wherein, descend hot dish, lower cover, lower bolster, upper padding plate, upper cover plate, last heat dish to be arranged on the pallet according to sequential cascade from top to bottom, it is characterized in that: upper padding plate and lower bolster are buffer plate.
2. press as claimed in claim 1 is characterized in that, described buffer plate is the rubber buffer plate.
3. press as claimed in claim 1 is characterized in that, described buffer plate is the fiber buffer plate.
CN2010206949347U 2010-12-31 2010-12-31 Press Expired - Fee Related CN201922612U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010206949347U CN201922612U (en) 2010-12-31 2010-12-31 Press

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010206949347U CN201922612U (en) 2010-12-31 2010-12-31 Press

Publications (1)

Publication Number Publication Date
CN201922612U true CN201922612U (en) 2011-08-10

Family

ID=44426481

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010206949347U Expired - Fee Related CN201922612U (en) 2010-12-31 2010-12-31 Press

Country Status (1)

Country Link
CN (1) CN201922612U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106211581A (en) * 2016-07-11 2016-12-07 深圳天珑无线科技有限公司 The device and method of printed circuit board (PCB) levelling warpage
CN110315608A (en) * 2019-07-09 2019-10-11 广西大学 Face artificial board manufacturing process
CN110996562A (en) * 2019-12-27 2020-04-10 广州兴森快捷电路科技有限公司 Automated bonding apparatus and method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106211581A (en) * 2016-07-11 2016-12-07 深圳天珑无线科技有限公司 The device and method of printed circuit board (PCB) levelling warpage
CN110315608A (en) * 2019-07-09 2019-10-11 广西大学 Face artificial board manufacturing process
CN110315608B (en) * 2019-07-09 2021-10-01 广西大学 Facing artificial board manufacturing process
CN110996562A (en) * 2019-12-27 2020-04-10 广州兴森快捷电路科技有限公司 Automated bonding apparatus and method

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110810

Termination date: 20181231

CF01 Termination of patent right due to non-payment of annual fee