CN105873367B - A method of reducing multi-layer board angularity - Google Patents
A method of reducing multi-layer board angularity Download PDFInfo
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- CN105873367B CN105873367B CN201610362502.8A CN201610362502A CN105873367B CN 105873367 B CN105873367 B CN 105873367B CN 201610362502 A CN201610362502 A CN 201610362502A CN 105873367 B CN105873367 B CN 105873367B
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- pressure
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- 400kpa
- 140kpa
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
The invention discloses a kind of methods for reducing multi-layer board angularity, process including hot pressing, the hot pressing is pressed by the way of the pressurization of high-low pressure pulsed, and the high-low pressure pulsed pressurization includes starting staged boosting section, the first decompression section, at least three pulsed pressure processes.Traditional continuous high-pressure pressing mode is changed to the pressurization pressing of high-low pressure pulsed, this mode can increase high-rise Stress of plate interior release window, most of internal stress is discharged under high temperature environment reduces plate prying degree, effectively control force fit plate prying≤0.75%, to mount difficulty caused by significantly improving because of route slab warping, be not easy the product quality problems such as upper scolding tin, contact fracture.
Description
Technical field
The invention belongs to printed circuit board production technical fields, are related to a kind of Multi-layer force fit plate, relate in particular to one kind
The method for reducing multi-layer board angularity.
Background technique
Printed circuit board carries out curing molding to resin by high temperature and pressure during pressing, completes high multiple-plate
Laminat molding technique.Process for pressing in the prior art uses the pressing mode of continuous high-pressure, as shown in Figure 1, resin is from melting
Stage of the state to glassy transition, resin flow reduction, viscosity increase, and internal stress is in the process as accumulation is concentrated easily
Force fit plate prying is caused, the force fit plate after common high temperature and pressure can not be discharged due to each interior ply stress completely, to production board wraping plate
Song influences obviously, to have exceeded 0.75% acceptance criteria.Route slab warping will prevent electronic component inserting with mounting operation from
It goes on smoothly, so that part solder joint is not reached solder side causes not weld tin, and route slab warping is in addition to that may make integrated package
Contact cannot with PCB pad it is closely sealed except, make scrap of the product due to the stress that warpage generates is also possible to cause contact to be broken.
Summary of the invention
For this purpose, technical problem to be solved by the present invention lies in there are internal layers to be full of in multi-layer board bonding processes in the prior art
Benefit, finished product slab warping is obvious, to propose a kind of method for reducing multi-layer board angularity.
In order to solve the above technical problems, the technical solution of the present invention is as follows:
The present invention provides a kind of method for reducing multi-layer board angularity, and the process including hot pressing, the hot pressing is using height
The mode of pressure pulsed pressurization is pressed, and high-low pressure pulsed pressurization includes continuous starting staged boosting section, the
One decompression section, at least three pulsed pressure processes, the starting staged boosting section pressure rise to 300- by 100-140KPa
400Kpa, pressure rising time 100-160min；The first decompression section is down to 100-140KPa, dip time by 300-400KPa
For 3-6min；The pulsed pressure process mesolow is 100-140Kpa, high pressure 300-400KPa.
Preferably, the staged boosting section includes kiss pressure section, the first boosting section, the first pressure-stabilizing section, the second boosting section
With the second pressure-stabilizing section.
Preferably, each pulsed pressure process kisses pressure section, boosting section, high voltage stabilizing section, the second drop by low pressure
Press section composition.
Preferably, the pressure of kiss pressure section is 100-140KPa, pressing time 5- in the staged boosting section
10min, the first boosting section pressure rise to 200-300Ka, pressure rising time 5-10min, the pressure stabilizing by 100-140KPa
The pressure of section is 200-300KPa, pressing time 15-25min, and the second boosting section pressure is risen to by 200-300KPa
300-400Ka, pressure rising time 15-25min, the pressure of second pressure-stabilizing section are 300-400KPa, pressing time 60-
90min。
Preferably, the low pressure kiss pressure section pressure in the pulsed pressure process is 100-140KPa, voltage stabling control is
3-6min, section of boosting rise to 300-400KPa, pressure rising time 3-6min by 100-140KPa, and the high voltage stabilizing section pressure is
300-400KPa, voltage stabling control 3-6min, the second decompression section are down to 100-140KPa, dip time by 300-400Kpa
For 3-6min.
Preferably, the last one pulsed pressure process, which is depressured section, is down to 200KPa by 300-400KPa.
Preferably, further include constant pressure pressurized segment after the last one pulsed pressure process, the constant pressure pressurized segment
Pressure be 200KPa, constant voltage time 30-50min.
Preferably, the temperature of the hot pressing is 140-220 DEG C.
The above technical solution of the present invention has the following advantages over the prior art, and reduction multi-layer board of the present invention is stuck up
The method of curvature, the process including hot pressing, the hot pressing are pressed by the way of the pressurization of high-low pressure pulsed, the height
Pressing pulsed pressurization includes starting staged boosting section, the first decompression section, at least three pulsed pressure processes.Traditional is held
Continuous high pressure pressing mode is changed to the pressurization pressing of high-low pressure pulsed, and this mode can increase high-rise Stress of plate interior release window,
Most of internal stress is discharged under hot environment and reduces plate prying degree, force fit plate prying≤0.75% is effectively controlled, thus significantly
Difficulty is mounted caused by improving because of route slab warping, is not easy the product quality problems such as upper scolding tin, contact fracture.
Detailed description of the invention
In order to make the content of the present invention more clearly understood, it below according to specific embodiments of the present invention and combines
Attached drawing, the present invention is described in further detail, wherein
Fig. 1 is the pressure and temperature curve of hot pressing in the prior art；
Fig. 2 is the pressure and temperature curve of hot pressing in the method for reduce described in the embodiment of the present invention 1 multi-layer board angularity.
Specific embodiment
Embodiment 1
Core material, outer copper foil and prepreg are cut according to predetermined size, then with conventional means cleaning, palm fibre
Change, carry out hot pressing after lamination, in hot pressing, controls hot pressing temperature at 140-220 DEG C.
As shown in Fig. 2, the hot pressing is pressed by the way of the pressurization of high-low pressure pulsed, described in the present embodiment
The pressurization of high-low pressure pulsed includes continuously originating staged boosting section, the first decompression section, at least three pulsed pressure processes,
The starting staged boosting section pressure rises to 300-400Kpa, pressure rising time 100-160min by 100-140KPa；It is described
First decompression section is down to 100-140KPa, dip time 3-6min by 300-400KPa；It is low in the pulsed pressure process
Pressure is 100-140Kpa, high pressure 300-400KPa.
Wherein, kiss pressure section (Kiss pressure), the first boosting section when staged boosting section includes starting, the
One pressure-stabilizing section, the second boosting section and the second pressure-stabilizing section.Wherein, in the present embodiment, the pressure of the kiss pressure section is 100KPa, pressing
Time is 10min, and the first boosting section pressure rises to 200KPa, pressure rising time 5min by 100KPa, the pressure-stabilizing section
Pressure is 200Kpa, and voltage stabling control 15min, the second boosting section pressure rises to 300KPa by 200KPa, and pressure rising time is
15min, the pressure of second pressure-stabilizing section are 300KPa, pressing time 60min.
After staged boost phase, into the first decompression section, the first decompression section is down to 100KPa by 300KPa,
Dip time is 3min.
Enter continuous 7 subpulse formula pressure process after first decompression section, wherein each pulsed pressure process is by low
Pressure kiss pressure section, boosting section, high voltage stabilizing section, the second decompression section composition.
In the present embodiment, the low pressure kiss pressure section pressure of first three pulsed pressure process is 100KPa, and pressing time is
3min, boosting section rise to 350KPa, pressure rising time 6min by 100KPa, and the high voltage stabilizing section pressure is 350KPa, pressing
Time is 3min, and the second decompression section is down to 100KPa, dip time 3min by 350KPa.The next pressurization of pulsed three times
Process mesolow kiss pressure section pressure is 100KPa, pressing time 3min, and section of boosting rises to 300KPa, pressure rising time by 100KPa
For 3min, the high voltage stabilizing section pressure is 300KPa, and pressing time 3min, second is depressured section is down to by 300KPa
100KPa, dip time 3min.Last time pulsed pressure process mesolow kiss pressure section pressure is 100KPa, pressing time
For 3min, section of boosting rises to 300KPa, pressure rising time 3min by 100KPa, and the high voltage stabilizing section pressure is 300KPa, pressure
The conjunction time is 3min, and the second decompression section is down to 200KPa by 300KPa, dip time 3min, is entered after the second decompression section
Constant pressure pressurized segment, the constant pressure pressurized segment pressure are 200Kpa, constant voltage time 30min.
Embodiment 2
Core material, outer copper foil and prepreg are cut according to predetermined size, then with conventional means cleaning, palm fibre
Change, carry out hot pressing after lamination, in hot pressing, controls hot pressing temperature at 140-220 DEG C.
In the present embodiment, the hot pressing is pressed by the way of the pressurization of high-low pressure pulsed, the high-low pressure pulse
Formula pressurization includes continuous starting staged boosting section, the first decompression section, at least three pulsed pressure processes, the starting rank
Ladder type boosting section pressure rises to 300-400Kpa, pressure rising time 100-160min by 100-140KPa；The first decompression section
100-140KPa, dip time 3-6min are down to by 300-400KPa；The pulsed pressure process mesolow is 100-
140Kpa, high pressure 300-400KPa.
Wherein, kiss pressure section (Kiss pressure), the first boosting section when staged boosting section includes starting, the
One pressure-stabilizing section, the second boosting section and the second pressure-stabilizing section.Wherein, in the present embodiment, the pressure of the kiss pressure section is 140KPa, pressing
Time is 5min, and the first boosting section pressure rises to 300KPa, pressure rising time 10min by 140KPa, the pressure-stabilizing section
Pressure is 300Kpa, and voltage stabling control 25min, the second boosting section pressure rises to 400KPa by 300KPa, and pressure rising time is
25min, the pressure of second pressure-stabilizing section are 400KPa, pressing time 90min.
After staged boost phase, into the first decompression section, the first decompression section is down to 140KPa by 400KPa,
Dip time is 6min.
Enter continuous 6 subpulse formula pressure process after first decompression section, wherein each pulsed pressure process is by low
Pressure kiss pressure section, boosting section, high voltage stabilizing section, the second decompression section composition.
In the present embodiment, the low pressure kiss pressure section pressure of first five pulsed pressure process is 140KPa, and pressing time is
6min, boosting section rise to 400KPa, pressure rising time 6min by 140KPa, and the high voltage stabilizing section pressure is 400KPa, pressing
Time is 6min, and the second decompression section is down to 140KPa, dip time 6min by 400KPa.Last time pulsed pressure process
Mesolow kiss pressure section pressure is 140KPa, pressing time 6min, and section of boosting by 140KPa rises to 400KPa, and pressure rising time is
6min, the high voltage stabilizing section pressure are 400KPa, and pressing time 6min, second, which is depressured section, is down to 200KPa by 400KPa,
Dip time is 6min.Enter constant pressure pressurized segment after second decompression section, the constant pressure pressurized segment pressure is 200Kpa, constant pressure
Time is 50min.
Embodiment 3
Core material, outer copper foil and prepreg are cut according to predetermined size, then with conventional means cleaning, palm fibre
Change, carry out hot pressing after lamination, in hot pressing, controls hot pressing temperature at 140-220 DEG C.
In the present embodiment, the hot pressing is pressed by the way of the pressurization of high-low pressure pulsed, the high-low pressure pulse
Formula pressurization includes continuous starting staged boosting section, the first decompression section, at least three pulsed pressure processes, the starting rank
Ladder type boosting section pressure rises to 300-400Kpa, pressure rising time 100-160min by 100-140KPa；The first decompression section
100-140KPa, dip time 3-6min are down to by 300-400KPa；The pulsed pressure process mesolow is 100-
140Kpa, high pressure 300-400KPa.
Wherein, kiss pressure section (Kiss pressure), the first boosting section when staged boosting section includes starting, the
One pressure-stabilizing section, the second boosting section and the second pressure-stabilizing section.Wherein, in the present embodiment, the pressure of the kiss pressure section is 120KPa, pressing
Time is 8min, and the first boosting section pressure rises to 250KPa, pressure rising time 8min, the pressure of the pressure-stabilizing section by 120KPa
It is by force 250Kpa, voltage stabling control 20min, the second boosting section pressure rises to 360KPa by 250KPa, and pressure rising time is
20min, the pressure of second pressure-stabilizing section are 360KPa, pressing time 80min.
After staged boost phase, into the first decompression section, the first decompression section is down to 120KPa by 360KPa,
Dip time is 5min.
Enter continuous 8 subpulse formula pressure process after first decompression section, wherein each pulsed pressure process is by low
Pressure kiss pressure section, boosting section, high voltage stabilizing section, the second decompression section composition.
In the present embodiment, the low pressure kiss pressure section pressure of the first seven pulsed pressure process is 120KPa, and pressing time is
5min, boosting section rise to 350KPa, pressure rising time 5min by 120KPa, and the high voltage stabilizing section pressure is 350KPa, pressing
Time is 5min, and the second decompression section is down to 120KPa, dip time 5min by 350KPa.Last time pulsed pressure process
Mesolow kiss pressure section pressure is 120KPa, pressing time 5min, and section of boosting by 120KPa rises to 350KPa, and pressure rising time is
5min, the high voltage stabilizing section pressure are 350KPa, and pressing time 5min, second, which is depressured section, is down to 200KPa by 350KPa,
Dip time is 5min.Enter constant pressure pressurized segment after second decompression section, the constant pressure pressurized segment pressure is 200Kpa, constant pressure
Time is 40min.
Obviously, the above embodiments are merely examples for clarifying the description, and does not limit the embodiments.It is right
For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of variation or
It changes.There is no necessity and possibility to exhaust all the enbodiments.And it is extended from this it is obvious variation or
It changes still within the protection scope of the invention.
Claims (4)
1. a kind of method for reducing multi-layer board angularity, which is characterized in that the process including hot pressing, the hot pressing use high-low pressure
The mode that pulsed is pressurizeed is pressed, and the high-low pressure pulsed pressurization includes continuous starting staged boosting section, first
It is depressured section, at least three pulsed pressure processes, the starting staged boosting section pressure rises to 300- by 100-140KPa
400Kpa, pressure rising time 100-160min；The first decompression section is down to 100-140KPa, dip time by 300-400KPa
For 3-6min；The pulsed pressure process mesolow is 100-140Kpa, high pressure 300-400KPa；
The starting staged boosting section includes kiss pressure section, the first boosting section, the first pressure-stabilizing section, the second boosting section and the second pressure stabilizing
Section；The pressure of kiss pressure section is 100-140KPa, pressing time 5-10min, described first in the starting staged boosting section
The section pressure that boosts rises to 200-300KPa, pressure rising time 5-10min by 100-140KPa, and the pressure of first pressure-stabilizing section is
200-300KPa, pressing time 15-25min, the second boosting section pressure rise to 300-400KPa by 200-300KPa, rise
The pressure time is 15-25min, and the pressure of second pressure-stabilizing section is 300-400KPa, pressing time 60-90min；
Each pulsed pressure process is kissed pressure section, boosting section, high voltage stabilizing section, the second decompression section by low pressure and is formed；It is described
Low pressure kiss pressure section pressure in pulsed pressure process is 100-140KPa, pressing time 3-6min, the pulsed pressurization
Boosting section in the process rises to 300-400KPa, pressure rising time 3-6min, the high voltage stabilizing section pressure by 100-140KPa
For 300-400KPa, pressing time 3-6min, the second decompression section is down to 100-140KPa by 300-400KPa, when decompression
Between be 3-6min.
2. the method according to claim 1 for reducing multi-layer board angularity, which is characterized in that the pressurization of the last one pulsed
Process is depressured section and is down to 200KPa by 300-400KPa.
3. the method according to claim 2 for reducing multi-layer board angularity, which is characterized in that the pressurization of the last one pulsed
It further include constant pressure pressurized segment after process, the pressure of the constant pressure pressurized segment is 200KPa, constant voltage time 30-50min.
4. the method according to claim 3 for reducing multi-layer board angularity, which is characterized in that the temperature of the hot pressing is
140-220℃。
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| CN201610362502.8A CN105873367B (en) | 2016-05-27 | 2016-05-27 | A method of reducing multi-layer board angularity |
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| CN105873367B true CN105873367B (en) | 2019-03-05 |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106476405B (en) * | 2016-09-30 | 2019-04-16 | 生益电子股份有限公司 | The lamination sheeting process and PCB of PCB |
| CN110557899B (en) * | 2019-08-28 | 2020-12-29 | 广州广合科技股份有限公司 | Method for processing expansion and shrinkage of PCB finished board |
| CN111479390B (en) * | 2020-04-15 | 2023-06-30 | 苏州市杰煜电子有限公司 | Automatic dispensing process for FPC flexible circuit board |
| CN114245617A (en) * | 2021-12-15 | 2022-03-25 | 生益电子股份有限公司 | Pressing method for improving poor filling |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101212867A (en) * | 2006-12-25 | 2008-07-02 | 比亚迪股份有限公司 | Flexible circuit board press bonding method |
| CN102244982A (en) * | 2011-04-06 | 2011-11-16 | 深南电路有限公司 | Method for controlling warp of local high-frequency mixed-laminated circuit board |
| CN102310616A (en) * | 2011-08-05 | 2012-01-11 | 金安国纪科技（珠海）有限公司 | Weight and pressure reducing compacting method of copper-clad plate |
| CN104080281A (en) * | 2014-07-04 | 2014-10-01 | 华进半导体封装先导技术研发中心有限公司 | Laminating method of printed circuit board |
| CN105472912A (en) * | 2015-11-23 | 2016-04-06 | 深圳崇达多层线路板有限公司 | Press fit method for high-voltage-resistant PCB with thick copper plate |
-
2016
- 2016-05-27 CN CN201610362502.8A patent/CN105873367B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101212867A (en) * | 2006-12-25 | 2008-07-02 | 比亚迪股份有限公司 | Flexible circuit board press bonding method |
| CN102244982A (en) * | 2011-04-06 | 2011-11-16 | 深南电路有限公司 | Method for controlling warp of local high-frequency mixed-laminated circuit board |
| CN102310616A (en) * | 2011-08-05 | 2012-01-11 | 金安国纪科技（珠海）有限公司 | Weight and pressure reducing compacting method of copper-clad plate |
| CN104080281A (en) * | 2014-07-04 | 2014-10-01 | 华进半导体封装先导技术研发中心有限公司 | Laminating method of printed circuit board |
| CN105472912A (en) * | 2015-11-23 | 2016-04-06 | 深圳崇达多层线路板有限公司 | Press fit method for high-voltage-resistant PCB with thick copper plate |
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