CN111479390B - Automatic dispensing process for FPC flexible circuit board - Google Patents

Automatic dispensing process for FPC flexible circuit board Download PDF

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Publication number
CN111479390B
CN111479390B CN202010292887.1A CN202010292887A CN111479390B CN 111479390 B CN111479390 B CN 111479390B CN 202010292887 A CN202010292887 A CN 202010292887A CN 111479390 B CN111479390 B CN 111479390B
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tunnel
fpc
jig
dispensing
temperature
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CN111479390A (en
Inventor
奚杰
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Suzhou Jieyu Electronic Co ltd
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Suzhou Jieyu Electronic Co ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/002—Pretreatement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/007—After-treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • B05D3/0218—Pretreatment, e.g. heating the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/04—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
    • B05D3/0486—Operating the coating or treatment in a controlled atmosphere
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
    • B05D3/061—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation using U.V.
    • B05D3/065—After-treatment
    • B05D3/067—Curing or cross-linking the coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

The invention discloses an automatic dispensing process of an FPC flexible circuit board, which comprises the following steps: s1, preheating the FPC and the jig simultaneously, and releasing acting force between the FPC and the jig; s2, dispensing under the constant temperature condition; s3, after the gaps are filled by vibration, performing constant-temperature primary curing; s4, further reducing the temperature to solidify the glue; s5, performing ultraviolet irradiation denaturation and solidification at room temperature. The dispensing is accurately completed, the acting force between the FPC and the electronic components on the FPC is low, and the reliability is high.

Description

Automatic dispensing process for FPC flexible circuit board
Technical Field
The invention relates to a dispensing process, in particular to an automatic dispensing process for an FPC (flexible printed circuit).
Background
Flexible circuit boards (FPCs) have advantages of high wiring density, light weight, thin thickness, good flexibility, etc., and are increasingly used in electronic products. Before the FPC is put into use, the pins of the electronic components attached to the FPC are usually glued, so that the connection strength of the pins can be increased, and the pins can be protected from being corroded by the outside. However, because the FPC is easy to bend, the FPC will generally deform due to fixation and other reasons during dispensing, which makes the glue unable to uniformly enter the pins, the gaps between the pins and the FPC during dispensing. After the external force is relieved, the FPC will gradually recover to the original shape, but the partially solidified glue can prevent the FPC from recovering, so that force can be generated between the FPC and the components, and after the glue is completely solidified, the force can continuously act between the FPC and the components, so that the reliability of the FPC and the components can be greatly reduced.
Disclosure of Invention
The invention aims to solve the technical problem of providing an automatic dispensing process for an FPC flexible circuit board, which can accurately finish dispensing, and has low acting force between the FPC and electronic components on the FPC and high reliability.
In order to solve the technical problems, the invention provides an automatic dispensing process of an FPC flexible circuit board, which comprises the following steps:
s1, preheating:
a. providing a jig with a shallow groove, wherein the shape of the shallow groove is consistent with the bottom surface of the FPC and the size of the shallow groove expands by 1.05-1.1 times, and placing the jig into a tunnel I with the temperature of 60-80 ℃ for baking for 15min;
b. then placing the FPC in a shallow groove, and continuously roasting for 5min;
c. finally, conveying the jig to a vibrating table positioned in the tunnel I to release stress between the FPC and the jig, wherein the vibrating frequency of the vibrating table is 10-20 Hz, the amplitude is not more than 1mm, and the vibrating time is 3-5 min;
s2, constant-temperature dispensing:
d. after vibration is finished, the jig is sent into a second tunnel with the temperature of 30-45 ℃, wherein the cooling speed from the first tunnel to the second tunnel is not more than 3 ℃/min;
e. dispensing is carried out in the second tunnel, so that the glue completely covers the dispensing position, wherein the temperature of the glue is 3-5 ℃ higher than that in the second tunnel, and the ambient pressure during dispensing is 0.13-0.15 MPa;
s3, primary solidification at constant temperature:
f. after dispensing, vibrating on a vibrating table in a second tunnel, wherein the vibration frequency is 5-8 Hz, the vibration amplitude is not more than 1mm, and the vibration time is 1-2 min;
g. gradually reducing the temperature in the second tunnel to 25-30 ℃, standing for 15-20 min, and performing primary curing;
s4, cooling and solidifying:
h. gradually cooling to 20 ℃, standing for 5-7 min, and cooling and solidifying;
s5, ultraviolet curing:
i. and placing the jig at normal temperature, irradiating the dispensing position by using ultraviolet rays to modify and solidify the glue, and taking out the FPC from the jig to finish dispensing.
Preferably, step S1 includes:
a. providing a jig with a shallow groove, wherein the shape of the shallow groove is consistent with the bottom surface of the FPC and the size of the shallow groove expands by 1.075 times, and placing the jig into a tunnel I with the temperature of 70 ℃ for baking for 15min;
b. then placing the FPC in a shallow groove, and continuously roasting for 5min;
c. and finally, conveying the jig to a vibrating table positioned in the tunnel I to release stress between the FPC and the jig, wherein the vibration frequency of the vibrating table is 15Hz, the vibration amplitude is not more than 1mm, and the vibration time is 4min.
Preferably, step S2 includes:
d. after vibration is finished, the jig is sent into a second tunnel with the temperature of 37.5 ℃, wherein the cooling speed from the first tunnel to the second tunnel is not more than 3 ℃/min;
e. dispensing is carried out in the second tunnel, so that the glue completely covers the dispensing position, wherein the temperature of the glue is 4 ℃ higher than that in the second tunnel, and the ambient pressure during dispensing is 0.14MPa.
Preferably, the step S3 includes:
f. after dispensing, vibrating on a vibrating table in a second tunnel, wherein the vibration frequency is 6.5Hz, the vibration amplitude is not more than 1mm, and the vibration time is 1.5min;
g. gradually reducing the temperature in the second tunnel to 27.5 ℃, and standing for 17.5min for primary curing.
Preferably, step S4 includes:
h. gradually cooling to 20deg.C, standing for 6min, and cooling and solidifying.
Compared with the prior art, the invention has the beneficial effects that:
1. the invention can stably fix the FPC, release the stress between the FPC and the outside, and avoid the interaction force between the FPC and the electronic components on the FPC after the glue is solidified, thereby influencing the reliability of the FPC and the electronic components.
2. The invention can accurately fix the FPC, so that the dispensing position is more accurate.
3. The invention can enable the glue to enter the pin, the pin and the gap of the FPC, so that the protection is more sufficient, and the reliability is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the description of the embodiments of the present invention will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained according to these drawings without inventive effort for a person of ordinary skill in the art.
FIG. 1 is a schematic flow chart of the present invention.
Detailed Description
The following will clearly and completely describe the technical solutions in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1
Referring to fig. 1, the embodiment discloses an automatic dispensing process for an FPC flexible circuit board, which comprises the following steps:
s1, preheating:
a. providing a jig with a shallow groove, wherein the shape of the shallow groove is consistent with the bottom surface of the FPC and the size of the shallow groove expands by 1.05-1.1 times, and placing the jig into a tunnel I with the temperature of 60-80 ℃ for baking for 15min;
b. then placing the FPC in a shallow groove, and continuously roasting for 5min;
c. finally, conveying the jig to a vibrating table positioned in the tunnel I to release stress between the FPC and the jig, wherein the vibrating frequency of the vibrating table is 10-20 Hz, the amplitude is not more than 1mm, and the vibrating time is 3-5 min;
s2, constant-temperature dispensing:
d. after vibration is finished, the jig is sent into a second tunnel with the temperature of 30-45 ℃, wherein the cooling speed from the first tunnel to the second tunnel is not more than 3 ℃/min;
e. dispensing is carried out in the second tunnel, so that the glue completely covers the dispensing position, wherein the temperature of the glue is 3-5 ℃ higher than that in the second tunnel, and the ambient pressure during dispensing is 0.13-0.15 MPa;
s3, primary solidification at constant temperature:
f. after dispensing, vibrating on a vibrating table in a second tunnel, wherein the vibration frequency is 5-8 Hz, the vibration amplitude is not more than 1mm, and the vibration time is 1-2 min;
g. gradually reducing the temperature in the second tunnel to 25-30 ℃, standing for 15-20 min, and performing primary curing;
s4, cooling and solidifying:
h. gradually cooling to 20 ℃, standing for 5-7 min, and cooling and solidifying;
s5, ultraviolet curing:
i. and placing the jig at normal temperature, irradiating the dispensing position by using ultraviolet rays to modify and solidify the glue, and taking out the FPC from the jig to finish dispensing.
Example 2
The embodiment discloses an automatic dispensing process of an FPC flexible circuit board, which comprises the following steps:
s1, preheating:
a. providing a jig with a shallow groove, wherein the shape of the shallow groove is consistent with the bottom surface of the FPC and the size of the shallow groove expands by 1.075 times, and placing the jig into a tunnel I with the temperature of 70 ℃ for baking for 15min;
b. then placing the FPC in a shallow groove, and continuously roasting for 5min;
c. finally, conveying the jig to a vibration table positioned in the tunnel I to release stress between the FPC and the jig, wherein the vibration frequency of the vibration table is 15Hz, the vibration amplitude is not more than 1mm, and the vibration time is 4min;
s2, constant-temperature dispensing:
d. after vibration is finished, the jig is sent into a second tunnel with the temperature of 30-45 ℃, wherein the cooling speed from the first tunnel to the second tunnel is not more than 3 ℃/min;
e. dispensing is carried out in the second tunnel, so that the glue completely covers the dispensing position, wherein the temperature of the glue is 3-5 ℃ higher than that in the second tunnel, and the ambient pressure during dispensing is 0.13-0.15 MPa;
s3, primary solidification at constant temperature:
f. after dispensing, vibrating on a vibrating table in a second tunnel, wherein the vibration frequency is 5-8 Hz, the vibration amplitude is not more than 1mm, and the vibration time is 1-2 min;
g. gradually reducing the temperature in the second tunnel to 25-30 ℃, standing for 15-20 min, and performing primary curing;
s4, cooling and solidifying:
h. gradually cooling to 20 ℃, standing for 5-7 min, and cooling and solidifying;
s5, ultraviolet curing:
i. and placing the jig at normal temperature, irradiating the dispensing position by using ultraviolet rays to modify and solidify the glue, and taking out the FPC from the jig to finish dispensing.
Example 3
The embodiment discloses an automatic dispensing process of an FPC flexible circuit board, which comprises the following steps:
s1, preheating:
a. providing a jig with a shallow groove, wherein the shape of the shallow groove is consistent with the bottom surface of the FPC and the size of the shallow groove expands by 1.05-1.1 times, and placing the jig into a tunnel I with the temperature of 60-80 ℃ for baking for 15min;
b. then placing the FPC in a shallow groove, and continuously roasting for 5min;
c. finally, conveying the jig to a vibrating table positioned in the tunnel I to release stress between the FPC and the jig, wherein the vibrating frequency of the vibrating table is 10-20 Hz, the amplitude is not more than 1mm, and the vibrating time is 3-5 min;
s2, constant-temperature dispensing:
d. after vibration is finished, the jig is sent into a second tunnel with the temperature of 37.5 ℃, wherein the cooling speed from the first tunnel to the second tunnel is not more than 3 ℃/min;
e. dispensing in the second tunnel to enable the glue to completely cover the dispensing position, wherein the temperature of the glue is 4 ℃ higher than that in the second tunnel, and the ambient pressure during dispensing is 0.14MPa;
s3, primary solidification at constant temperature:
f. after dispensing, vibrating on a vibrating table in a second tunnel, wherein the vibration frequency is 5-8 Hz, the vibration amplitude is not more than 1mm, and the vibration time is 1-2 min;
g. gradually reducing the temperature in the second tunnel to 25-30 ℃, standing for 15-20 min, and performing primary curing;
s4, cooling and solidifying:
h. gradually cooling to 20 ℃, standing for 5-7 min, and cooling and solidifying;
s5, ultraviolet curing:
i. and placing the jig at normal temperature, irradiating the dispensing position by using ultraviolet rays to modify and solidify the glue, and taking out the FPC from the jig to finish dispensing.
Example 4
The embodiment discloses an automatic dispensing process of an FPC flexible circuit board, which comprises the following steps:
s1, preheating:
a. providing a jig with a shallow groove, wherein the shape of the shallow groove is consistent with the bottom surface of the FPC and the size of the shallow groove expands by 1.05-1.1 times, and placing the jig into a tunnel I with the temperature of 60-80 ℃ for baking for 15min;
b. then placing the FPC in a shallow groove, and continuously roasting for 5min;
c. finally, conveying the jig to a vibrating table positioned in the tunnel I to release stress between the FPC and the jig, wherein the vibrating frequency of the vibrating table is 10-20 Hz, the amplitude is not more than 1mm, and the vibrating time is 3-5 min;
s2, constant-temperature dispensing:
d. after vibration is finished, the jig is sent into a second tunnel with the temperature of 30-45 ℃, wherein the cooling speed from the first tunnel to the second tunnel is not more than 3 ℃/min;
e. dispensing is carried out in the second tunnel, so that the glue completely covers the dispensing position, wherein the temperature of the glue is 3-5 ℃ higher than that in the second tunnel, and the ambient pressure during dispensing is 0.13-0.15 MPa;
s3, primary solidification at constant temperature:
f. after dispensing, vibrating on a vibrating table in a second tunnel, wherein the vibration frequency is 6.5Hz, the vibration amplitude is not more than 1mm, and the vibration time is 1.5min;
g. gradually reducing the temperature in the second tunnel to 27.5 ℃, standing for 17.5min, and performing primary curing;
s4, cooling and solidifying:
h. gradually cooling to 20 ℃, standing for 5-7 min, and cooling and solidifying;
s5, ultraviolet curing:
i. and placing the jig at normal temperature, irradiating the dispensing position by using ultraviolet rays to modify and solidify the glue, and taking out the FPC from the jig to finish dispensing.
Example 5
The embodiment discloses an automatic dispensing process of an FPC flexible circuit board, which comprises the following steps:
s1, preheating:
a. providing a jig with a shallow groove, wherein the shape of the shallow groove is consistent with the bottom surface of the FPC and the size of the shallow groove expands by 1.05-1.1 times, and placing the jig into a tunnel I with the temperature of 60-80 ℃ for baking for 15min;
b. then placing the FPC in a shallow groove, and continuously roasting for 5min;
c. finally, conveying the jig to a vibrating table positioned in the tunnel I to release stress between the FPC and the jig, wherein the vibrating frequency of the vibrating table is 10-20 Hz, the amplitude is not more than 1mm, and the vibrating time is 3-5 min;
s2, constant-temperature dispensing:
d. after vibration is finished, the jig is sent into a second tunnel with the temperature of 30-45 ℃, wherein the cooling speed from the first tunnel to the second tunnel is not more than 3 ℃/min;
e. dispensing is carried out in the second tunnel, so that the glue completely covers the dispensing position, wherein the temperature of the glue is 3-5 ℃ higher than that in the second tunnel, and the ambient pressure during dispensing is 0.13-0.15 MPa;
s3, primary solidification at constant temperature:
f. after dispensing, vibrating on a vibrating table in a second tunnel, wherein the vibration frequency is 5-8 Hz, the vibration amplitude is not more than 1mm, and the vibration time is 1-2 min;
g. gradually reducing the temperature in the second tunnel to 25-30 ℃, standing for 15-20 min, and performing primary curing;
s4, cooling and solidifying:
h. gradually cooling to 20deg.C, standing for 6min, and cooling and solidifying;
s5, ultraviolet curing:
i. and placing the jig at normal temperature, irradiating the dispensing position by using ultraviolet rays to modify and solidify the glue, and taking out the FPC from the jig to finish dispensing.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (5)

1. The automatic dispensing process for the FPC is characterized by comprising the following steps of:
s1, preheating:
a. providing a jig with a shallow groove, wherein the shape of the shallow groove is consistent with the bottom surface of the FPC and the size of the shallow groove expands by 1.05-1.1 times, and placing the jig into a tunnel I with the temperature of 60-80 ℃ for baking for 15min;
b. then placing the FPC in a shallow groove, and continuously roasting for 5min;
c. finally, conveying the jig to a vibrating table positioned in the tunnel I to release stress between the FPC and the jig, wherein the vibrating frequency of the vibrating table is 10-20 Hz, the amplitude is not more than 1mm, and the vibrating time is 3-5 min;
s2, constant-temperature dispensing:
d. after vibration is finished, the jig is sent into a second tunnel with the temperature of 30-45 ℃, wherein the cooling speed from the first tunnel to the second tunnel is not more than 3 ℃/min;
e. dispensing is carried out in the second tunnel, so that the glue completely covers the dispensing position, wherein the temperature of the glue is 3-5 ℃ higher than that in the second tunnel, and the ambient pressure during dispensing is 0.13-0.15 MPa;
s3, primary solidification at constant temperature:
f. after dispensing, vibrating on a vibrating table in a second tunnel, wherein the vibration frequency is 5-8 Hz, the vibration amplitude is not more than 1mm, and the vibration time is 1-2 min;
g. gradually reducing the temperature in the second tunnel to 25-30 ℃, standing for 15-20 min, and performing primary curing;
s4, cooling and solidifying:
h. gradually cooling to 20 ℃, standing for 5-7 min, and cooling and solidifying;
s5, ultraviolet curing:
i. and placing the jig at normal temperature, irradiating the dispensing position by using ultraviolet rays to modify and solidify the glue, and taking out the FPC from the jig to finish dispensing.
2. The automated dispensing process of FPC flexible circuit board according to claim 1, wherein step S1 comprises:
a. providing a jig with a shallow groove, wherein the shape of the shallow groove is consistent with the bottom surface of the FPC and the size of the shallow groove expands by 1.075 times, and placing the jig into a tunnel I with the temperature of 70 ℃ for baking for 15min;
b. then placing the FPC in a shallow groove, and continuously roasting for 5min;
c. and finally, conveying the jig to a vibrating table positioned in the tunnel I to release stress between the FPC and the jig, wherein the vibration frequency of the vibrating table is 15Hz, the vibration amplitude is not more than 1mm, and the vibration time is 4min.
3. The automatic dispensing process of FPC flexible circuit board according to claim 1, wherein step S2 comprises:
d. after vibration is finished, the jig is sent into a second tunnel with the temperature of 37.5 ℃, wherein the cooling speed from the first tunnel to the second tunnel is not more than 3 ℃/min;
e. dispensing is carried out in the second tunnel, so that the glue completely covers the dispensing position, wherein the temperature of the glue is 4 ℃ higher than that in the second tunnel, and the ambient pressure during dispensing is 0.14MPa.
4. The automatic dispensing process of FPC flexible circuit board according to claim 1, wherein said step S3 comprises:
f. after dispensing, vibrating on a vibrating table in a second tunnel, wherein the vibration frequency is 6.5Hz, the vibration amplitude is not more than 1mm, and the vibration time is 1.5min;
g. gradually reducing the temperature in the second tunnel to 27.5 ℃, and standing for 17.5min for primary curing.
5. The automatic dispensing process of FPC flexible circuit board according to claim 1, wherein step S4 comprises:
h. gradually cooling to 20deg.C, standing for 6min, and cooling and solidifying.
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CN113245164A (en) * 2021-04-02 2021-08-13 深圳市世宗自动化设备有限公司 Rapid pressure maintaining heating method and system
CN113194628A (en) * 2021-05-19 2021-07-30 景旺电子科技(龙川)有限公司 Dispensing process, circuit board main production process and circuit board processed by same

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