CN108260292A - Increase the method for underfill coverage rate after a kind of SMT - Google Patents
Increase the method for underfill coverage rate after a kind of SMT Download PDFInfo
- Publication number
- CN108260292A CN108260292A CN201711293577.6A CN201711293577A CN108260292A CN 108260292 A CN108260292 A CN 108260292A CN 201711293577 A CN201711293577 A CN 201711293577A CN 108260292 A CN108260292 A CN 108260292A
- Authority
- CN
- China
- Prior art keywords
- dispensing
- electronic device
- coverage rate
- increase
- smt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/002—Pretreatement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
- B05D3/0254—After-treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/02—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by distortion, beating, or vibration of the surface to be cleaned
- B08B7/026—Using sound waves
- B08B7/028—Using ultrasounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1147—Sealing or impregnating, e.g. of pores
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
Abstract
The method that the present invention provides increase underfill coverage rate after a kind of SMT, the method includes the steps：S1, electronic device and flexible circuit board are welded to form welding product by tin cream, cleans the welding product；S2, first time dispensing is carried out along the electronic device periphery, dispensing length is the half perimeter of the electronic device；S3, a standing duration is provided, second of dispensing is carried out along the periphery of the electronic device after standing duration is reached.Method by increasing underfill coverage rate after above-mentioned SMT, electronic device bottom can be covered completely with glue, effectively increase the coverage rate of underfill glue, and the related reliability between electronic device and flexible circuit board is further idealized.
Description
Technical field
The present invention relates to the sides for increasing underfill coverage rate after wiring board preparation field more particularly to a kind of SMT
Method.
Background technology
At present, electronic product (such as mobile phone) is higher and higher for waterproof performance requirement.And for the waterproof of electronic component, it needs
Capillary underfill is wanted to inject organic bottom packing material from device edge.But the coverage rate of underfill glue, but not to the utmost
People's will.
Invention content
The technical problem to be solved by the present invention is to, the method that increase underfill coverage rate after a kind of SMT is provided, with
Improve glue coverage rate.
The technical scheme is that：Increase the method for underfill coverage rate after a kind of SMT, the method includes
Step：
S1, electronic device and flexible circuit board are welded to form welding product by tin cream, cleans the welding product；
S2, first time dispensing is carried out along the electronic device periphery, dispensing length is the half of the electronic device
Perimeter；
S3, a standing duration is provided, second of dispensing is carried out along the periphery of the electronic device after standing duration is reached.
Preferably, when carrying out second of dispensing, dispensing, and a reserved notch, institute are carried out within one week around the electronic device
State notch be located at first time dispensing path without position.
Preferably, a length of five minutes during the standing, and after standing duration is reached, the welding product is subjected to pressure
Baking carries out second of dispensing again.
Preferably, after second of dispensing is completed, the welding product is stood until the full electronics of glue filling
Behind gap between device and the flexible circuit board, pressure baking is carried out to the welding product again.
Preferably, using automatic dispensing machine progress dispensing, a diameter of 3.0mm of striker in the automatic dispensing machine, nozzle
Size is between 0.05mm-0.2mm, and dispensing air pressure is in the range of 0.1 ± 0.05Mpa, and dispensing speed is in the range of 10-9mm/s.
Preferably, the welding product is cleaned using ultrasonic wave in step sl.
Preferably, the electronic device and the flexible PCB are welded using SMT technologies.
Above-mentioned technical proposal has the following advantages that or advantageous effect：It is covered by increasing underfill after above-mentioned SMT
The method of rate can cover electronic device bottom with glue completely, i.e., effectively increase the coverage rate of underfill glue,
And the related reliability between electronic device and flexible circuit board is further idealized.
Description of the drawings
With reference to appended attached drawing, more fully to describe the embodiment of the present invention.However, appended attached drawing be merely to illustrate and
It illustrates, and is not meant to limit the scope of the invention.
Unwashed welding product cuts open in the method for increase underfill coverage rate after Fig. 1 is a kind of SMT of the present invention
View；
After Fig. 2 is a kind of SMT of the present invention in the method for increase underfill coverage rate in unwashed welding product
The sectional view of structure A；
Fig. 3 increases after being cleaned in the method for underfill coverage rate welding product after being a kind of SMT of the present invention cuts open
View；
Fig. 4 increases after being a kind of SMT of the present invention in the welding product after being cleaned in the method for underfill coverage rate
The sectional view of structure B；
After Fig. 5 is a kind of SMT of the present invention in the method for increase underfill coverage rate after first time dispensing processing
Welding product structure diagram；
After Fig. 6 is a kind of SMT of the present invention in the method for increase underfill coverage rate after second of dispensing processing
Welding product structure diagram；
After Fig. 7 is a kind of SMT of the present invention in the method for increase underfill coverage rate after second of dispensing processing
Welding product sectional view；
In attached drawing：1st, electronic device；2nd, tin cream；3rd, glue；4th, flexible circuit board；5th, surface booty and scaling powder.
Specific embodiment
Increase the method for underfill coverage rate after SMT a kind of to the present invention in the following with reference to the drawings and specific embodiments
It is described in detail.
Increase underfill covering after a kind of SMT (Surface Mount Technology, surface installation technique)
The method of rate, including step：
S1, electronic device 1 and flexible circuit board 4 are formed into welding product by the welding of tin cream 2, cleans the welding product；
S2, first time dispensing is carried out along 1 periphery of electronic device, dispensing length is the half perimeter of electronic device 1；
S3, a standing duration is provided, second of dispensing is carried out along the periphery of electronic device 1 after standing duration is reached.
Specifically, in the above-mentioned methods, as depicted in figs. 1 and 2, first have to lead to electronic device 1 and flexible circuit board 4
It crosses the welding of tin cream 2 and forms welding product, then the welding product is cleaned as shown in Figure 3 and Figure 4, by welding product table
Remaining scaling powder removal, i.e., remove surface booty and scaling powder 5 between face booty and device and wiring board.Later, such as
Shown in Fig. 5, first time dispensing is carried out along 1 surrounding of electronic device, after standing a period of time, after standing full time of repose, such as Fig. 6 and
Shown in Fig. 7, second of dispensing is carried out along the periphery of electronic device 1, one allows glue 3 to be flowed naturally by capillary, by electronic device 1
Bottom be stuffed entirely with adhesive curing.
For further, above-mentioned cleaning way is is cleaned using ultrasonic wave.
For further, in above-mentioned steps S1, electronic device 1 and flexible PCB are welded using SMT technologies.
It is the periphery along electronic device 1 when carrying out first time dispensing to the welding product after cleaning for further
Continuous dispensing is carried out, dispensing length is the half perimeter of electronic device 1, i.e., becomes along the week of electronic device 1, in electronics device
Dispensing is carried out between part 1 and flexible circuit board 4, which is the perimeter of half electronic device 1.A period of time is stood, with
So that glue 3 is flowed naturally by capillary.
For further, when carrying out second of dispensing, dispensing is carried out along the periphery of electronic device 1, current dispensing is
Around electronic device 1 one weeks, but need to reserve a notch.By second of dispensing, 1 surrounding of electronic device is added again
Gu the place of no dispensing in place is covered.
For further, during above-mentioned second of dispensing, reserved notch cannot be located at path for dispensing glue for the first time
On.Because of the not notch on the glue path of any point, help to shut between electronic device 1 and flexible circuit board 4, with
Glue 3 can flow to the bottom of electronic device 1 by capillary phenomenon after ensureing second of dispensing, and then realize high coverage rate
Fill glue effect.
For further, dispensing is carried out using automatic dispensing machine, 3 model of glue is preferably 3808.In addition to this, it uses
The striker of a diameter of 3.0mm, the jet size in dispenser between 0.05mm-0.2mm, preferably 0.2mm or 0.1mm or
0.05mm, the dispensing air pressure of dispenser is in the range of 0.1 ± 0.05Mpa, and dispensing speed is in the range of 10-9mm/s, preferably
10mm/s, 50mm/s and 40mm/s.Using above-mentioned parameter, what can be stablized plays glue 3 on 1 periphery of electronic device, use
Stating 3 amount of mode glue will not excessively cause to accumulate, will not 3 amount of glue is very few causes between electronic device 1 and flexible circuit board 4
Glue 3 can not be flow to.
Five minutes are stood for further, after first time dispensing and carries out second of dispensing again, that is, a length of five points when standing
Clock.Based on first time, second of dispensing supplements dispensing process primarily as glue 3.It is worth noting that in first time point
Glue and stand five minutes after, need to welding product carry out pressure baking after carry out second of dispensing again, and in second of dispensing
It completes and stands after certain time is filled up completely to glue 3, pressure baking is carried out again, to complete entire dispensing process.
Method by increasing underfill coverage rate after above-mentioned SMT, can use glue completely by 1 bottom of electronic device
Water 3 covers, i.e., effectively increases the coverage rate of underfill glue 3, and will be between electronic device 1 and flexible circuit board 4
Related reliability further idealize.
For a person skilled in the art, after reading above description, various changes and modifications undoubtedly will be evident.
Therefore, appended claims should regard the whole variations and modifications of true intention and range for covering the present invention as.It is weighing
The range and content of any and all equivalence, are all considered as still belonging to the intent and scope of the invention in the range of sharp claim.
Claims (7)
1. increase the method for underfill coverage rate after a kind of SMT, which is characterized in that the method includes the steps：
S1, electronic device and flexible circuit board are welded to form welding product by tin cream, cleans the welding product；
S2, first time dispensing is carried out along the electronic device periphery, dispensing length is the half perimeter of the electronic device；
S3, a standing duration is provided, second of dispensing is carried out along the periphery of the electronic device after standing duration is reached.
2. increase the method for underfill coverage rate after SMT according to claim 1, which is characterized in that carrying out
During second of dispensing, dispensing is carried out within one week, and a reserved notch, the notch are located at first time dispensing road around the electronic device
Diameter without position.
3. increase the method for underfill coverage rate after SMT according to claim 1, which is characterized in that described quiet
A length of five minutes when putting, and after standing duration is reached, the welding product is subjected to pressure baking and carries out second of dispensing again.
4. increase the method for underfill coverage rate after SMT according to claim 3, which is characterized in that complete
After second of dispensing, stand the welding product until the full electronic device of glue filling and the flexible circuit board it
Between gap after, again to the welding product carry out pressure baking.
5. increase the method for underfill coverage rate after SMT according to claim 1, which is characterized in that using certainly
Dynamic dispenser carries out dispensing, a diameter of 3.0mm of striker in the automatic dispensing machine, jet size 0.05mm-0.2mm it
Between, dispensing air pressure is in the range of 0.1 ± 0.05Mpa, and dispensing speed is in the range of 10-9mm/s.
6. increase the method for underfill coverage rate after SMT according to claim 1, which is characterized in that in step
The welding product is cleaned using ultrasonic wave in S1.
7. increase the method for underfill coverage rate after SMT according to claim 1, which is characterized in that utilize SMT
Technology welds the electronic device and the flexible PCB.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711293577.6A CN108260292A (en) | 2017-12-08 | 2017-12-08 | Increase the method for underfill coverage rate after a kind of SMT |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711293577.6A CN108260292A (en) | 2017-12-08 | 2017-12-08 | Increase the method for underfill coverage rate after a kind of SMT |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108260292A true CN108260292A (en) | 2018-07-06 |
Family
ID=62722445
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711293577.6A Pending CN108260292A (en) | 2017-12-08 | 2017-12-08 | Increase the method for underfill coverage rate after a kind of SMT |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108260292A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109104660A (en) * | 2018-08-08 | 2018-12-28 | 深圳市中时科技有限公司 | A kind of sealing waterproof method of bluetooth headset |
| CN111479390A (en) * | 2020-04-15 | 2020-07-31 | 苏州市杰煜电子有限公司 | Automatic dispensing process for FPC (Flexible printed Circuit) |
| CN113194628A (en) * | 2021-05-19 | 2021-07-30 | 景旺电子科技(龙川)有限公司 | Dispensing process, circuit board main production process and circuit board processed by same |
| CN114918505A (en) * | 2022-04-29 | 2022-08-19 | 中国电子科技集团公司第三十八研究所 | Solder paste spot coating method of electric connector |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101150076A (en) * | 2006-09-21 | 2008-03-26 | 矽品精密工业股份有限公司 | Making method for semiconductor encapsulation component and semiconductor part location structure and method |
| WO2012136000A1 (en) * | 2011-04-06 | 2012-10-11 | 北京大学深圳研究生院 | Glue filling method and device in the semiconductor package |
| CN102738014A (en) * | 2011-04-14 | 2012-10-17 | 颀中科技（苏州）有限公司 | Flip chip packaging method |
| CN106206510A (en) * | 2015-04-27 | 2016-12-07 | 南茂科技股份有限公司 | Multi-chip packaging structure, wafer-level chip packaging structure and method thereof |
| CN106793554A (en) * | 2015-11-19 | 2017-05-31 | 重庆申叶机电设备安装有限公司 | Electronic component modular and the electronic installation using this electronic component modular |
-
2017
- 2017-12-08 CN CN201711293577.6A patent/CN108260292A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101150076A (en) * | 2006-09-21 | 2008-03-26 | 矽品精密工业股份有限公司 | Making method for semiconductor encapsulation component and semiconductor part location structure and method |
| WO2012136000A1 (en) * | 2011-04-06 | 2012-10-11 | 北京大学深圳研究生院 | Glue filling method and device in the semiconductor package |
| CN102738014A (en) * | 2011-04-14 | 2012-10-17 | 颀中科技（苏州）有限公司 | Flip chip packaging method |
| CN106206510A (en) * | 2015-04-27 | 2016-12-07 | 南茂科技股份有限公司 | Multi-chip packaging structure, wafer-level chip packaging structure and method thereof |
| CN106793554A (en) * | 2015-11-19 | 2017-05-31 | 重庆申叶机电设备安装有限公司 | Electronic component modular and the electronic installation using this electronic component modular |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109104660A (en) * | 2018-08-08 | 2018-12-28 | 深圳市中时科技有限公司 | A kind of sealing waterproof method of bluetooth headset |
| CN111479390A (en) * | 2020-04-15 | 2020-07-31 | 苏州市杰煜电子有限公司 | Automatic dispensing process for FPC (Flexible printed Circuit) |
| CN113194628A (en) * | 2021-05-19 | 2021-07-30 | 景旺电子科技(龙川)有限公司 | Dispensing process, circuit board main production process and circuit board processed by same |
| CN114918505A (en) * | 2022-04-29 | 2022-08-19 | 中国电子科技集团公司第三十八研究所 | Solder paste spot coating method of electric connector |
| CN114918505B (en) * | 2022-04-29 | 2023-07-04 | 中国电子科技集团公司第三十八研究所 | Solder paste spot coating method of electric connector |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108260292A (en) | Increase the method for underfill coverage rate after a kind of SMT | |
| JP2011119731A5 (en) | ||
| WO2011082333A3 (en) | Flavor enhancement apparatus and method | |
| JP2020524410A5 (en) | ||
| EP2390908A3 (en) | Method of manufacturing an electronic device package | |
| JP2013131669A5 (en) | ||
| ZA200709540B (en) | Apparatus for cleaning golf accessories, in particular golf clubs and golf balls | |
| WO2005017938A3 (en) | Method and apparatus for bi-planar backward wave oscillator | |
| CN105989364A (en) | Method for manufacturing sensing device | |
| WO2016188217A1 (en) | Terminal | |
| CN103596358B (en) | SMT addition high-density packages multilayer circuit board structure and preparation method thereof | |
| CN104505350A (en) | IC (Integrated Circuit) card carrier band with two conductive surfaces and processing method of IC card carrier band | |
| CN205984140U (en) | Electric kettle's three -dimensional metal sign piece mosaic structure | |
| CN102231376A (en) | Multi-cycle arrangement carrier-free double-integrated chip (IC) package and production method | |
| CN203690294U (en) | Electronic component assembly | |
| CN104363718A (en) | Production method of soft and hard combined circuit board | |
| CN205862929U (en) | A kind of waterproof inductance used in radiator fan | |
| CN108097651A (en) | A kind of 3D printing shakes cleaning machine with ripple | |
| CN103985677B (en) | Ultra-thin plastic packaging semiconductor components and devices framework, components and parts and preparation method thereof | |
| CN104249208B (en) | Wave-soldering device and its nozzle | |
| CN206384294U (en) | Fried food packing box | |
| CN204464271U (en) | Packaging body integrated circuit structure | |
| CN207639039U (en) | Electronic equipment | |
| CN204473451U (en) | A kind of volatilization prevention device | |
| CN205507840U (en) | USB flash disk with type -c3. 0 interface |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180706 |