CN111479390A - Automatic dispensing process for FPC (Flexible printed Circuit) - Google Patents

Automatic dispensing process for FPC (Flexible printed Circuit) Download PDF

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Publication number
CN111479390A
CN111479390A CN202010292887.1A CN202010292887A CN111479390A CN 111479390 A CN111479390 A CN 111479390A CN 202010292887 A CN202010292887 A CN 202010292887A CN 111479390 A CN111479390 A CN 111479390A
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China
Prior art keywords
tunnel
fpc
jig
temperature
dispensing
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Granted
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CN202010292887.1A
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CN111479390B (en
Inventor
奚杰
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Suzhou Jieyu Electronic Co ltd
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Suzhou Jieyu Electronic Co ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/002—Pretreatement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/007—After-treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • B05D3/0218—Pretreatment, e.g. heating the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/04—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
    • B05D3/0486—Operating the coating or treatment in a controlled atmosphere
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
    • B05D3/061—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation using U.V.
    • B05D3/065—After-treatment
    • B05D3/067—Curing or cross-linking the coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Abstract

The invention discloses an automatic dispensing process for an FPC (flexible printed circuit), which comprises the following steps of: s1, preheating the FPC and the jig simultaneously, and releasing the acting force between the FPC and the jig; s2, dispensing under the constant temperature condition; s3, after the gap is filled by vibration, carrying out constant-temperature primary curing; s4, further reducing the temperature to solidify the glue; s5, ultraviolet ray irradiation is performed to denature and solidify at room temperature. The dispensing is accurately completed, the acting force between the FPC and the electronic components on the FPC is low, and the reliability is high.

Description

Automatic dispensing process for FPC (Flexible printed Circuit)
Technical Field
The invention relates to a dispensing process, in particular to an automatic dispensing process for an FPC (flexible printed circuit).
Background
Flexible Printed Circuit (FPC) has the advantages of high wiring density, light weight, thin thickness, good flexibility, etc., and is increasingly applied to electronic products. Before the FPC is put into use, glue is usually dispensed at the pins of electronic components attached to the FPC, so that the connection strength of the pins can be increased, and the pins can be protected from being corroded by the outside. However, since the FPC is easily bent, it is usually deformed due to fixing and the like during dispensing, so that the glue cannot uniformly enter the pins, the gaps between the pins and the FPC during dispensing. After the external force is relieved, the FPC can gradually restore to the original shape, but the partially solidified glue can prevent the FPC from restoring, so that the force can be generated between the FPC and the component, when the glue is completely solidified, the force can continuously act between the FPC and the component, and the reliability of the FPC and the component can be greatly reduced.
Disclosure of Invention
The invention aims to provide an automatic dispensing process for an FPC (flexible printed circuit), which can accurately complete dispensing, and has low acting force between the FPC and electronic components thereon and strong reliability.
In order to solve the technical problem, the invention provides an automatic dispensing process for an FPC (flexible printed circuit) board, which comprises the following steps of:
s1, preheating:
a. providing a jig with a shallow groove, wherein the shape of the shallow groove is consistent with the bottom surface of the FPC, the size of the shallow groove is expanded by 1.05-1.1 times, and the jig is placed in a tunnel I with the temperature of 60-80 ℃ and baked for 15 min;
b. then placing the FPC into a shallow groove, and continuously roasting for 5 min;
c. finally, conveying the jig to a vibration table positioned in the first tunnel to release stress between the FPC and the jig, wherein the vibration frequency of the vibration table is 10-20 Hz, the amplitude is not more than 1mm, and the vibration time is 3-5 min;
s2, constant-temperature dispensing:
d. after the vibration is finished, the jig is sent into a second tunnel at the temperature of 30-45 ℃, wherein the cooling speed from the first tunnel to the second tunnel is not more than 3 ℃/min;
e. dispensing in the second tunnel to enable the glue to completely cover the dispensing position, wherein the temperature of the glue is 3-5 ℃ higher than that in the second tunnel, and the environmental pressure during dispensing is 0.13-0.15 MPa;
s3, primary curing at constant temperature:
f. after dispensing is finished, vibrating on a vibrating table in the tunnel II, wherein the vibration frequency is 5-8 Hz, the amplitude is not more than 1mm, and the vibration time is 1-2 min;
g. gradually reducing the temperature in the tunnel II to 25-30 ℃, standing for 15-20 min, and performing primary curing;
s4, cooling and curing:
h. gradually reducing the temperature to 20 ℃, standing for 5-7 min, and cooling and solidifying;
s5, ultraviolet curing:
i. and placing the jig at normal temperature, irradiating the dispensing position by using ultraviolet rays to modify and solidify the glue, and taking the FPC out of the jig to finish dispensing.
Preferably, step S1 includes:
a. providing a jig with a shallow groove, wherein the shape of the shallow groove is consistent with the bottom surface of the FPC, and the size of the shallow groove is expanded by 1.075 times, and placing the jig into a tunnel I with the temperature of 70 ℃ for baking for 15 min;
b. then placing the FPC into a shallow groove, and continuously roasting for 5 min;
c. and finally, conveying the jig to a vibration table positioned in the first tunnel to release stress between the FPC and the jig, wherein the vibration frequency of the vibration table is 15Hz, the amplitude is not more than 1mm, and the vibration time is 4 min.
Preferably, step S2 includes:
d. after the vibration is finished, the jig is sent into a second tunnel with the temperature of 37.5 ℃, wherein the cooling speed from the first tunnel to the second tunnel is not more than 3 ℃/min;
e. and dispensing in the second tunnel to enable the glue to completely cover the dispensing position, wherein the temperature of the glue is 4 ℃ higher than that in the second tunnel, and the environmental pressure during dispensing is 0.14 MPa.
Preferably, the step S3 includes:
f. after dispensing is finished, vibrating on a vibrating table in the tunnel II, wherein the vibration frequency is 6.5Hz, the amplitude is not more than 1mm, and the vibration time is 1.5 min;
g. and gradually reducing the temperature in the tunnel II to 27.5 ℃, standing for 17.5min, and performing primary curing.
Preferably, step S4 includes:
h. gradually cooling to 20 deg.C, standing for 6min, cooling and solidifying.
Compared with the prior art, the invention has the beneficial effects that:
1. the invention can stably fix the FPC, release the stress between the FPC and the outside and avoid the mutual acting force between the FPC and the electronic components on the FPC after the glue is solidified, thereby influencing the reliability of the FPC and the electronic components.
2. The invention can accurately fix the FPC and ensure that the dispensing position is more accurate.
3. The invention can ensure that the glue enters the gaps among the pins, the pins and the FPC, so that the protection is more sufficient and the reliability is improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments of the present invention will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to be able to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic flow chart of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
Referring to fig. 1, the embodiment discloses an automatic dispensing process for an FPC flexible circuit board, comprising the following steps:
s1, preheating:
a. providing a jig with a shallow groove, wherein the shape of the shallow groove is consistent with the bottom surface of the FPC, the size of the shallow groove is expanded by 1.05-1.1 times, and the jig is placed in a tunnel I with the temperature of 60-80 ℃ and baked for 15 min;
b. then placing the FPC into a shallow groove, and continuously roasting for 5 min;
c. finally, conveying the jig to a vibration table positioned in the first tunnel to release stress between the FPC and the jig, wherein the vibration frequency of the vibration table is 10-20 Hz, the amplitude is not more than 1mm, and the vibration time is 3-5 min;
s2, constant-temperature dispensing:
d. after the vibration is finished, the jig is sent into a second tunnel at the temperature of 30-45 ℃, wherein the cooling speed from the first tunnel to the second tunnel is not more than 3 ℃/min;
e. dispensing in the second tunnel to enable the glue to completely cover the dispensing position, wherein the temperature of the glue is 3-5 ℃ higher than that in the second tunnel, and the environmental pressure during dispensing is 0.13-0.15 MPa;
s3, primary curing at constant temperature:
f. after dispensing is finished, vibrating on a vibrating table in the tunnel II, wherein the vibration frequency is 5-8 Hz, the amplitude is not more than 1mm, and the vibration time is 1-2 min;
g. gradually reducing the temperature in the tunnel II to 25-30 ℃, standing for 15-20 min, and performing primary curing;
s4, cooling and curing:
h. gradually reducing the temperature to 20 ℃, standing for 5-7 min, and cooling and solidifying;
s5, ultraviolet curing:
i. and placing the jig at normal temperature, irradiating the dispensing position by using ultraviolet rays to modify and solidify the glue, and taking the FPC out of the jig to finish dispensing.
Example 2
The embodiment discloses an automatic dispensing process of an FPC (flexible printed circuit), which comprises the following steps of:
s1, preheating:
a. providing a jig with a shallow groove, wherein the shape of the shallow groove is consistent with the bottom surface of the FPC, and the size of the shallow groove is expanded by 1.075 times, and placing the jig into a tunnel I with the temperature of 70 ℃ for baking for 15 min;
b. then placing the FPC into a shallow groove, and continuously roasting for 5 min;
c. finally, the jig is conveyed to a vibration table in the first tunnel to release stress between the FPC and the jig, the vibration frequency of the vibration table is 15Hz, the amplitude is not more than 1mm, and the vibration time is 4 min;
s2, constant-temperature dispensing:
d. after the vibration is finished, the jig is sent into a second tunnel at the temperature of 30-45 ℃, wherein the cooling speed from the first tunnel to the second tunnel is not more than 3 ℃/min;
e. dispensing in the second tunnel to enable the glue to completely cover the dispensing position, wherein the temperature of the glue is 3-5 ℃ higher than that in the second tunnel, and the environmental pressure during dispensing is 0.13-0.15 MPa;
s3, primary curing at constant temperature:
f. after dispensing is finished, vibrating on a vibrating table in the tunnel II, wherein the vibration frequency is 5-8 Hz, the amplitude is not more than 1mm, and the vibration time is 1-2 min;
g. gradually reducing the temperature in the tunnel II to 25-30 ℃, standing for 15-20 min, and performing primary curing;
s4, cooling and curing:
h. gradually reducing the temperature to 20 ℃, standing for 5-7 min, and cooling and solidifying;
s5, ultraviolet curing:
i. and placing the jig at normal temperature, irradiating the dispensing position by using ultraviolet rays to modify and solidify the glue, and taking the FPC out of the jig to finish dispensing.
Example 3
The embodiment discloses an automatic dispensing process of an FPC (flexible printed circuit), which comprises the following steps of:
s1, preheating:
a. providing a jig with a shallow groove, wherein the shape of the shallow groove is consistent with the bottom surface of the FPC, the size of the shallow groove is expanded by 1.05-1.1 times, and the jig is placed in a tunnel I with the temperature of 60-80 ℃ and baked for 15 min;
b. then placing the FPC into a shallow groove, and continuously roasting for 5 min;
c. finally, conveying the jig to a vibration table positioned in the first tunnel to release stress between the FPC and the jig, wherein the vibration frequency of the vibration table is 10-20 Hz, the amplitude is not more than 1mm, and the vibration time is 3-5 min;
s2, constant-temperature dispensing:
d. after the vibration is finished, the jig is sent into a second tunnel with the temperature of 37.5 ℃, wherein the cooling speed from the first tunnel to the second tunnel is not more than 3 ℃/min;
e. dispensing in the second tunnel to enable the glue to completely cover the dispensing position, wherein the temperature of the glue is 4 ℃ higher than that in the second tunnel, and the environmental pressure during dispensing is 0.14 MPa;
s3, primary curing at constant temperature:
f. after dispensing is finished, vibrating on a vibrating table in the tunnel II, wherein the vibration frequency is 5-8 Hz, the amplitude is not more than 1mm, and the vibration time is 1-2 min;
g. gradually reducing the temperature in the tunnel II to 25-30 ℃, standing for 15-20 min, and performing primary curing;
s4, cooling and curing:
h. gradually reducing the temperature to 20 ℃, standing for 5-7 min, and cooling and solidifying;
s5, ultraviolet curing:
i. and placing the jig at normal temperature, irradiating the dispensing position by using ultraviolet rays to modify and solidify the glue, and taking the FPC out of the jig to finish dispensing.
Example 4
The embodiment discloses an automatic dispensing process of an FPC (flexible printed circuit), which comprises the following steps of:
s1, preheating:
a. providing a jig with a shallow groove, wherein the shape of the shallow groove is consistent with the bottom surface of the FPC, the size of the shallow groove is expanded by 1.05-1.1 times, and the jig is placed in a tunnel I with the temperature of 60-80 ℃ and baked for 15 min;
b. then placing the FPC into a shallow groove, and continuously roasting for 5 min;
c. finally, conveying the jig to a vibration table positioned in the first tunnel to release stress between the FPC and the jig, wherein the vibration frequency of the vibration table is 10-20 Hz, the amplitude is not more than 1mm, and the vibration time is 3-5 min;
s2, constant-temperature dispensing:
d. after the vibration is finished, the jig is sent into a second tunnel at the temperature of 30-45 ℃, wherein the cooling speed from the first tunnel to the second tunnel is not more than 3 ℃/min;
e. dispensing in the second tunnel to enable the glue to completely cover the dispensing position, wherein the temperature of the glue is 3-5 ℃ higher than that in the second tunnel, and the environmental pressure during dispensing is 0.13-0.15 MPa;
s3, primary curing at constant temperature:
f. after dispensing is finished, vibrating on a vibrating table in the tunnel II, wherein the vibration frequency is 6.5Hz, the amplitude is not more than 1mm, and the vibration time is 1.5 min;
g. gradually reducing the temperature in the tunnel II to 27.5 ℃, standing for 17.5min, and performing primary curing;
s4, cooling and curing:
h. gradually reducing the temperature to 20 ℃, standing for 5-7 min, and cooling and solidifying;
s5, ultraviolet curing:
i. and placing the jig at normal temperature, irradiating the dispensing position by using ultraviolet rays to modify and solidify the glue, and taking the FPC out of the jig to finish dispensing.
Example 5
The embodiment discloses an automatic dispensing process of an FPC (flexible printed circuit), which comprises the following steps of:
s1, preheating:
a. providing a jig with a shallow groove, wherein the shape of the shallow groove is consistent with the bottom surface of the FPC, the size of the shallow groove is expanded by 1.05-1.1 times, and the jig is placed in a tunnel I with the temperature of 60-80 ℃ and baked for 15 min;
b. then placing the FPC into a shallow groove, and continuously roasting for 5 min;
c. finally, conveying the jig to a vibration table positioned in the first tunnel to release stress between the FPC and the jig, wherein the vibration frequency of the vibration table is 10-20 Hz, the amplitude is not more than 1mm, and the vibration time is 3-5 min;
s2, constant-temperature dispensing:
d. after the vibration is finished, the jig is sent into a second tunnel at the temperature of 30-45 ℃, wherein the cooling speed from the first tunnel to the second tunnel is not more than 3 ℃/min;
e. dispensing in the second tunnel to enable the glue to completely cover the dispensing position, wherein the temperature of the glue is 3-5 ℃ higher than that in the second tunnel, and the environmental pressure during dispensing is 0.13-0.15 MPa;
s3, primary curing at constant temperature:
f. after dispensing is finished, vibrating on a vibrating table in the tunnel II, wherein the vibration frequency is 5-8 Hz, the amplitude is not more than 1mm, and the vibration time is 1-2 min;
g. gradually reducing the temperature in the tunnel II to 25-30 ℃, standing for 15-20 min, and performing primary curing;
s4, cooling and curing:
h. gradually cooling to 20 deg.C, standing for 6min, cooling and solidifying;
s5, ultraviolet curing:
i. and placing the jig at normal temperature, irradiating the dispensing position by using ultraviolet rays to modify and solidify the glue, and taking the FPC out of the jig to finish dispensing.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (5)

1. An automatic dispensing process for an FPC (flexible printed circuit) is characterized by comprising the following steps of:
s1, preheating:
a. providing a jig with a shallow groove, wherein the shape of the shallow groove is consistent with the bottom surface of the FPC, the size of the shallow groove is expanded by 1.05-1.1 times, and the jig is placed in a tunnel I with the temperature of 60-80 ℃ and baked for 15 min;
b. then placing the FPC into a shallow groove, and continuously roasting for 5 min;
c. finally, conveying the jig to a vibration table positioned in the first tunnel to release stress between the FPC and the jig, wherein the vibration frequency of the vibration table is 10-20 Hz, the amplitude is not more than 1mm, and the vibration time is 3-5 min;
s2, constant-temperature dispensing:
d. after the vibration is finished, the jig is sent into a second tunnel at the temperature of 30-45 ℃, wherein the cooling speed from the first tunnel to the second tunnel is not more than 3 ℃/min;
e. dispensing in the second tunnel to enable the glue to completely cover the dispensing position, wherein the temperature of the glue is 3-5 ℃ higher than that in the second tunnel, and the environmental pressure during dispensing is 0.13-0.15 MPa;
s3, primary curing at constant temperature:
f. after dispensing is finished, vibrating on a vibrating table in the tunnel II, wherein the vibration frequency is 5-8 Hz, the amplitude is not more than 1mm, and the vibration time is 1-2 min;
g. gradually reducing the temperature in the tunnel II to 25-30 ℃, standing for 15-20 min, and performing primary curing;
s4, cooling and curing:
h. gradually reducing the temperature to 20 ℃, standing for 5-7 min, and cooling and solidifying;
s5, ultraviolet curing:
i. and placing the jig at normal temperature, irradiating the dispensing position by using ultraviolet rays to modify and solidify the glue, and taking the FPC out of the jig to finish dispensing.
2. The automatic dispensing process of the FPC flexible circuit board according to claim 1, wherein step S1 includes:
a. providing a jig with a shallow groove, wherein the shape of the shallow groove is consistent with the bottom surface of the FPC, and the size of the shallow groove is expanded by 1.075 times, and placing the jig into a tunnel I with the temperature of 70 ℃ for baking for 15 min;
b. then placing the FPC into a shallow groove, and continuously roasting for 5 min;
c. and finally, conveying the jig to a vibration table positioned in the first tunnel to release stress between the FPC and the jig, wherein the vibration frequency of the vibration table is 15Hz, the amplitude is not more than 1mm, and the vibration time is 4 min.
3. The automatic dispensing process of the FPC flexible circuit board according to claim 1, wherein step S2 includes:
d. after the vibration is finished, the jig is sent into a second tunnel with the temperature of 37.5 ℃, wherein the cooling speed from the first tunnel to the second tunnel is not more than 3 ℃/min;
e. and dispensing in the second tunnel to enable the glue to completely cover the dispensing position, wherein the temperature of the glue is 4 ℃ higher than that in the second tunnel, and the environmental pressure during dispensing is 0.14 MPa.
4. The automatic dispensing process of the FPC flexible circuit board according to claim 1, wherein the step S3 includes:
f. after dispensing is finished, vibrating on a vibrating table in the tunnel II, wherein the vibration frequency is 6.5Hz, the amplitude is not more than 1mm, and the vibration time is 1.5 min;
g. and gradually reducing the temperature in the tunnel II to 27.5 ℃, standing for 17.5min, and performing primary curing.
5. The automatic dispensing process of the FPC flexible circuit board according to claim 1, wherein step S4 includes:
h. gradually cooling to 20 deg.C, standing for 6min, cooling and solidifying.
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113194628A (en) * 2021-05-19 2021-07-30 景旺电子科技(龙川)有限公司 Dispensing process, circuit board main production process and circuit board processed by same
CN113245164A (en) * 2021-04-02 2021-08-13 深圳市世宗自动化设备有限公司 Rapid pressure maintaining heating method and system

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