JPH02272793A - Manufacture of metallic base printed wiring board - Google Patents
Manufacture of metallic base printed wiring boardInfo
- Publication number
- JPH02272793A JPH02272793A JP9296489A JP9296489A JPH02272793A JP H02272793 A JPH02272793 A JP H02272793A JP 9296489 A JP9296489 A JP 9296489A JP 9296489 A JP9296489 A JP 9296489A JP H02272793 A JPH02272793 A JP H02272793A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- flexible printed
- semi
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- 238000000034 method Methods 0.000 claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000011889 copper foil Substances 0.000 claims abstract description 10
- 239000003822 epoxy resin Substances 0.000 claims abstract description 7
- 239000004744 fabric Substances 0.000 claims abstract description 7
- 239000011521 glass Substances 0.000 claims abstract description 7
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 7
- 238000005530 etching Methods 0.000 claims abstract description 6
- 238000000465 moulding Methods 0.000 claims abstract description 5
- 229910052751 metal Inorganic materials 0.000 claims description 60
- 239000002184 metal Substances 0.000 claims description 60
- 239000000463 material Substances 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 239000004745 nonwoven fabric Substances 0.000 claims 1
- 238000005452 bending Methods 0.000 abstract description 6
- 239000004020 conductor Substances 0.000 abstract description 6
- 238000003825 pressing Methods 0.000 abstract description 4
- 230000009291 secondary effect Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 6
- 238000012217 deletion Methods 0.000 description 5
- 230000037430 deletion Effects 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 238000007602 hot air drying Methods 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、金属ベース印刷配線板の製造方法に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method of manufacturing a metal-based printed wiring board.
近年、金属ベース印刷配線板には、たとえば、電卓のよ
うに金属ケースと印刷配線板とを一体化したもの、印刷
配線板上にモータ等の重量物を載置する場合のよ、うに
物理的強度が必要なもの、モータまたはパワートランジ
スタのように熱を発生する部品を載置する印刷配線板で
、基板に放熱板を兼ねさせたもの、あるいは金属ベース
を電波シ−ルドとして使用するもの等があり、このよう
な金属ベース印刷配線板の用途は、増加する一方である
。In recent years, metal-based printed wiring boards have been used for physical purposes, such as when a metal case and printed wiring board are integrated, such as a calculator, or when heavy objects such as motors are placed on a printed wiring board. Items that require strength, printed wiring boards on which heat-generating parts such as motors or power transistors are placed, and items where the board also serves as a heat sink, items where a metal base is used as a radio wave shield, etc. The applications of such metal-based printed wiring boards are increasing.
また、電子機器の軽薄短小化が進み、狭い場所に印刷配
線板を設置する場合には、゛平板状の印刷配線板のまま
ではなく、湾曲あるいは立体的にする必要が多くなって
きた。Furthermore, as electronic devices become lighter, thinner, shorter, and smaller, when installing printed wiring boards in narrow spaces, it has become increasingly necessary to use curved or three-dimensional printed wiring boards instead of just using flat printed wiring boards.
第３図は従来例における金属ベース印刷配線板の説明図
である。FIG. 3 is an explanatory diagram of a conventional metal-based printed wiring board.
図において、１０は金属ベース印刷配線板、１１は金属
ベース印刷配線板１０の配線回路となる銅箔で、鉄また
はアルミニウム等からなる金属ベース１２上に、接着部
１３によって接着されている。In the figure, reference numeral 10 denotes a metal-based printed wiring board, and 11 denotes a copper foil serving as a wiring circuit of the metal-based printed wiring board 10, which is bonded by an adhesive portion 13 onto a metal base 12 made of iron, aluminum, or the like.
そして、公知の印刷配線技術で金属ベース印刷配線板１
０を作る。このようにして作られた金属ベース印刷配線
板１０を金型により成形して、たと又は、電卓等のケー
スまたは蓋にすることができる。Then, the metal-based printed wiring board 1 is manufactured using known printed wiring technology.
Make 0. The metal-based printed wiring board 10 produced in this manner can be molded into a case or lid for a calculator or the like.
また、金属ベース印刷配線板１０には、重量物たとえば
、モータ等を載置する場合、あるいは放熱板または電波
シールド板を兼用する場合がある。Further, the metal base printed wiring board 10 may be used to place a heavy object, such as a motor, or to serve as a heat sink or a radio wave shield plate.
このような場合には、金属ベース印刷配線板１０に載置
する物の重量、あるいは放熱量を考慮して金属ベース１
２の厚さあるいは形状を決める。In such a case, the metal base 1 may be
Decide the thickness or shape of 2.
次に、金属ベース印刷配線板１０を成形する場合を説明
する。Next, the case of molding the metal base printed wiring board 10 will be explained.
第４図は従来例における金属ベース印刷配線板の成形説
明図である。FIG. 4 is an explanatory diagram of forming a metal-based printed wiring board in a conventional example.
図において、符号１０ないし１３は前記第３図図示の従
来例と対応する。１４はオス金型、１５はメス金型、１
６は金属ベース印刷配線板１０の伸長部、１７は金属ベ
ース印刷配線板１０の圧縮部を示す。In the figure, numerals 10 to 13 correspond to the conventional example shown in FIG. 14 is a male mold, 15 is a female mold, 1
Reference numeral 6 indicates an extended portion of the metal-based printed wiring board 10, and 17 indicates a compressed portion of the metal-based printed wiring board 10.
金属ベース印刷配線技術線板電子機器の狭い場所に設置
する場合には、電子機器の構造あるいは形状に合わして
金属ベース印刷配線板１０を成形しな（ではならない。Metal-based printed wiring board technology When installing an electronic device in a narrow space, the metal-based printed wiring board 10 must not be shaped to match the structure or shape of the electronic device.
そのため、第４図図示のごとくオス金型１４とメスの金
型１５とを使用して、所望の形状に絞りあるいは曲げ加
工を行う。Therefore, as shown in FIG. 4, a male mold 14 and a female mold 15 are used to perform drawing or bending into a desired shape.
しかし、金属ベース印刷配線板１０は、標準の樹脂基板
と比較して約１０倍の重量があるため、製造工程におい
て、金属基板同士の接触、あるいは耐酸のため塩化ビニ
ール製のコンベアラインまたは製造装置の何処かに接触
または衝突した場合には、製造装置を大きく傷付けるこ
とになる。特に、熱工程の後において、絶縁部は軟化し
ているため、重量のある金属ベースが絶縁部に接触する
と、その部分に傷が生じて絶縁破壊を起こすという問題
があった。However, since the metal-based printed wiring board 10 is about 10 times heavier than a standard resin substrate, during the manufacturing process, vinyl chloride conveyor lines or manufacturing equipment are used to prevent metal substrates from coming into contact with each other or to resist acid. If it touches or collides with any part of the equipment, it will seriously damage the manufacturing equipment. In particular, since the insulating part is softened after the heat process, there is a problem in that when a heavy metal base comes into contact with the insulating part, the part is scratched and dielectric breakdown occurs.
また、金型１４．１５により絞りあるいは曲げ加工を行
う場合には、必ず伸長部と圧縮部（第４図１６および１
７参照）とが生ずる。特に、伸長部１６では、銅箔１１
と金属ベース１２との伸び強度が相違するため、いずれ
か一方が切断される。In addition, when performing drawing or bending using the mold 14.15, be sure to include the elongated portion and the compressed portion (Fig. 4 16 and 1).
7) occurs. In particular, in the extension portion 16, the copper foil 11
Since the elongation strengths of the metal base 12 and the metal base 12 are different, one of them is cut.
また、伸長１１１６が熱により軟化している場合には、
僅かの力によっても簡単に絶縁破壊を起こすという間ｊ
があった。In addition, if the extension 1116 is softened by heat,
While dielectric breakdown can easily occur even with a small amount of force.
was there.
さらに、金属ベース印刷配線板１０は、放熱板、電波シ
ールド、あるいは重量物載置台を兼用することができる
が、上記理由により複雑な形状とすることが困難であっ
た。Furthermore, although the metal-based printed wiring board 10 can also be used as a heat sink, a radio wave shield, or a heavy object mounting table, it has been difficult to form it into a complicated shape for the above-mentioned reasons.
以上のような問題を解決するために、本発明は、未・半
硬化フレキシブル印刷配線板と金属ベースとを別々に製
造して、その後両者を熱圧着する金属ベース印刷配線板
の製造方法を提供することを目的とする。In order to solve the above-mentioned problems, the present invention provides a method for manufacturing a metal-based printed wiring board, in which an uncured/semi-cured flexible printed wiring board and a metal base are manufactured separately, and then both are bonded by thermocompression. The purpose is to
また、本発明は、如何なる複雑な形状の金属ベースにも
取り付けられる金属ベース印刷配線板の製造方法を提供
することを目的とする。Another object of the present invention is to provide a method for manufacturing a metal-based printed wiring board that can be attached to a metal base of any complicated shape.
さらに、硬化したフレキシブル印刷配線板と金属ベース
とを接着剤で接着する金属ベース印刷配線板の製造方法
、を提供することを目的とする。Another object of the present invention is to provide a method for manufacturing a metal-based printed wiring board, in which a cured flexible printed wiring board and a metal base are bonded together with an adhesive.
以上のような問題を解決するために、本発明の金属ベー
ス印刷配線板の製造方法は、ガラス布基材とエポキシ樹
脂とから構成する未・半硬化フレキシブル基板に銅箔を
接着する第１工程と、所望の回路を形成するために第１
工程で得られた未・半硬化フレキシブル基板をエツチン
グする第２工程と、金属ベースを所望の形状に成形する
第３工程と、第２工程で作られた未・半硬化フレキシブ
ル印刷配線板と第３工程で成形加工された金属ベースと
を熱圧着すると同時に、前記回路部分をフレキシブル基
板に埋め込む第４工程と、から構成する。In order to solve the above problems, the method for manufacturing a metal-based printed wiring board of the present invention includes a first step of bonding copper foil to an uncured/semi-cured flexible substrate made of a glass cloth base material and an epoxy resin. and the first step to form the desired circuit.
A second step of etching the uncured and semi-cured flexible printed wiring board obtained in the process, a third step of molding the metal base into a desired shape, and a second step of etching the uncured and semi-cured flexible printed wiring board produced in the second step. It consists of a fourth step of thermocompressing the metal base formed in the three steps and embedding the circuit portion in the flexible substrate at the same time.
また、本発明金属ベース印刷配線板の製造方法は、前記
フレキシブル印刷配線板に切込みあるいは削除部を設け
ることにより、多面体からなる金属ベースの内外面に熱
圧着できることを特徴とする。Further, the method for manufacturing a metal-based printed wiring board of the present invention is characterized in that by providing the flexible printed wiring board with a cut or a deleted portion, the flexible printed wiring board can be thermocompression bonded to the inner and outer surfaces of a metal base made of a polyhedron.
さらに、本発明の金属ベース印刷配線板の製造方法は、
前記床・半硬化フレキシブル基板の代わりに硬化フレキ
シブル基板を用いて前記金属ベースに接着することを特
徴とする。Furthermore, the method for manufacturing a metal-based printed wiring board of the present invention includes:
The present invention is characterized in that a hardened flexible substrate is used instead of the floor/semi-hardened flexible substrate and is bonded to the metal base.
本発明は、フレキシブル印刷配線板を未・半硬化の状態
で製作し、一方、金属ベースを、印刷配線板の製造とは
関係なく、絞りあるいは曲げ加工を行った後、前記床・
半硬化フレキシブル印刷配線板と金属ベースとを熱圧着
する。In the present invention, a flexible printed wiring board is produced in an uncured and semi-cured state, and the metal base is drawn or bent, independently of the production of the printed wiring board, and then the floor
The semi-hardened flexible printed wiring board and the metal base are bonded together by thermocompression.
本発明は、未・半硬化フレキシブル印刷配線板が変形し
易いように、切込みあるいは削除部を設けたので、フレ
キシブル印刷配線板を複雑な多面体あるいは曲面を有す
る金属ベースの内外に熱圧着することができる。In the present invention, a notch or deletion portion is provided so that the uncured/semi-cured flexible printed wiring board can be easily deformed, so that the flexible printed wiring board can be thermocompression bonded to the inside and outside of a metal base having a complex polyhedron or curved surface. can.
本発明は、未・半硬化フレキシブル印刷配線板の代わり
に硬化したフレキシブル印刷配線板を用いて接着剤で金
属ベースの内外に接着することもできる。In the present invention, a cured flexible printed wiring board can be used instead of an uncured/semi-cured flexible printed wiring board and can be bonded to the inside and outside of the metal base with an adhesive.
第１図および第２図にしたがって本発明の一実施例を説
明する。An embodiment of the present invention will be described with reference to FIGS. 1 and 2.
第１図（イ）は、本発明におけるフレキシブル印刷配線
板概略上面図、第１図（ロ）は、フレキシブル印刷配線
板の一部断面図、第２図（イ）は、本発明の方法により
作られた印刷配線板を有する多面体概略図、第２図（ロ
）は、第２図（イ）の一部所面図を示す。FIG. 1(a) is a schematic top view of the flexible printed wiring board according to the present invention, FIG. 1(b) is a partial sectional view of the flexible printed wiring board, and FIG. 2(a) is a schematic top view of the flexible printed wiring board according to the present invention. A schematic diagram of a polyhedron with a printed wiring board produced, FIG. 2(B) shows a partial view of FIG. 2(A).
図において、１はフレキシブル印刷配線板、２は銅箔か
らなる回路導体、３はたとえば、ガラス布基材とエポキ
シ樹脂基材とからなるフレキシブル基板で、製造時に未
硬化または半硬化状態にする。ここで、未硬化状態とは
、たとえば、ガラス布基材にエポキシ樹脂を含浸させ、
自然乾燥または熱風乾燥させた状態をいう。したがって
、未硬化フレキシブル印刷配線板１に適当な熱を加え、
たとえば、金属ベース等に押圧すると両者は熱圧着した
後、前記未硬化フレキシブル印刷配線板は硬化する。ま
た、半硬化状態とは、上記樹脂を硬化させる加熱および
加圧工程を途中で停止した状態のものをいう。したがっ
て、半硬化フレキシブル印刷配線板１に適当の熱を加え
、たとえば、金属ベース等に押圧すると両者は熱圧着し
た後、前記未硬化フレキシブル印刷配線板は硬化する。In the figure, 1 is a flexible printed wiring board, 2 is a circuit conductor made of copper foil, and 3 is a flexible board made of, for example, a glass cloth base material and an epoxy resin base material, which is kept in an uncured or semi-cured state at the time of manufacture. Here, the uncured state means, for example, when a glass cloth base material is impregnated with an epoxy resin,
This refers to the state of natural drying or hot air drying. Therefore, by applying appropriate heat to the uncured flexible printed wiring board 1,
For example, when pressed against a metal base or the like, the uncured flexible printed wiring board is cured after the two are bonded by thermocompression. Moreover, the semi-cured state refers to a state in which the heating and pressurizing steps for curing the resin are stopped midway. Therefore, by applying appropriate heat to the semi-cured flexible printed wiring board 1 and pressing it against, for example, a metal base, the two are bonded by thermocompression, and then the uncured flexible printed wiring board is cured.
この時、前記両者間に未硬化の基材を挟むことによって
接着性は向上する。At this time, adhesion is improved by sandwiching an uncured base material between the two.
本明細書における未・半硬化とは、上記状態をいう。In this specification, "uncured/semi-cured" refers to the above state.
４はアルミニウムあるいは鉄からなる金属ベース、５は
フレキシブル印刷配線板１を折曲げあるいは湾曲させる
ための切込みまたは削除部、６は成形された印刷配線板
を示す。Reference numeral 4 indicates a metal base made of aluminum or iron, 5 indicates a cut or deletion portion for bending or curving the flexible printed wiring board 1, and 6 indicates a molded printed wiring board.
次に、本発明の製造方法を工程順に説明する。Next, the manufacturing method of the present invention will be explained step by step.
第１工程では、ガラス布基材とエポキシ樹脂基材とから
なる未・半硬化フレキシブル基板３の上に回路導体とな
るべき銅箔を接着する。また、ポリエステルあるいはポ
リイミド樹脂からなるフレキシブル基板とすることもで
きる。In the first step, a copper foil to become a circuit conductor is bonded onto an uncured/semi-cured flexible substrate 3 made of a glass cloth base material and an epoxy resin base material. Further, a flexible substrate made of polyester or polyimide resin can also be used.
第２工程では、公知の印刷配線技術によりフレキシブル
印刷配線板１に所望の回路を設ける。In the second step, a desired circuit is provided on the flexible printed wiring board 1 using a known printed wiring technique.
印刷配線技術に使用されるエツチング等の工程において
、フレキシブル印刷配線板１は軽いため、たとえ、印刷
配線板同士が衝突し、あるいは製造装置の何処かに接触
しても回路の切断あるいは絶縁不良を起こさないだけで
なく、製造装置を傷付けることもない。In processes such as etching used in printed wiring technology, the flexible printed wiring board 1 is lightweight, so even if the printed wiring boards collide with each other or come into contact with any part of the manufacturing equipment, there will be no risk of circuit breakage or insulation failure. Not only does it not cause any problems, it also does not damage the manufacturing equipment.
このようにして作られたフレキシブル印刷配線板１と所
望の形状に成形された金属ベース４との取りつけを容易
にするため、第１図（イ）図示のごとく、切込みまたは
削除部５が設けられる。In order to facilitate the attachment of the flexible printed wiring board 1 made in this manner to the metal base 4 formed into a desired shape, a notch or deletion portion 5 is provided as shown in FIG. 1(a). .
第３工程では、金属ベース４を所望の形状に金型で絞り
あるいは曲げ加工を行う。また、第３工程の成形加工は
、金型を使用した絞りあるいは曲げ加工だけでなく、た
とえば放熱フィンを多数設けた鋳造による冷却装置、ま
たは前記金型で成形加工されたものと鋳造により作られ
たものとを組み合わしたもの等複雑な形状のものにも適
用できる。In the third step, the metal base 4 is drawn or bent into a desired shape using a die. In addition, the forming process in the third step includes not only drawing or bending using a mold, but also a cooling device by casting with a large number of heat dissipating fins, or a molded product formed by the mold and a mold made by casting. It can also be applied to objects with complex shapes, such as those that are a combination of objects.
第４工程では、第３工程で成形加工された金属ベース４
の内側あるいは外側に、第２工程で作られたフレキシブ
ル印刷配線板１をたとえば、金型等の使用により熱圧着
する。この時ガラス布基材とエポキシ樹脂とからなる未
・半硬化フレキシブル基板３は硬化するが、前記基材の
厚さが薄いので、フレキシブル性は失われない。In the fourth step, the metal base 4 formed in the third step is
The flexible printed wiring board 1 made in the second step is bonded to the inside or outside of the board by thermocompression using, for example, a mold. At this time, the uncured/semi-cured flexible substrate 3 made of the glass cloth base material and the epoxy resin is cured, but since the base material is thin, its flexibility is not lost.
また、未・半硬化フレキシブル印刷配線板１と金属ベー
ス４との熱圧着において、副次的効果として、フレキシ
ブル印刷配線板１の銅箔２からなる導体部が基板３に埋
め込まれる。このようにすると、狭い場所において、他
の電子部品との接触が防止される。特に、電子部品が動
くような場合に、電子部品と印刷配線板の導体部との接
触がなく有利である。Further, in the thermocompression bonding of the uncured/semi-cured flexible printed wiring board 1 and the metal base 4, the conductor portion made of the copper foil 2 of the flexible printed wiring board 1 is embedded in the substrate 3 as a secondary effect. In this way, contact with other electronic components is prevented in a narrow space. Particularly when the electronic component moves, there is no contact between the electronic component and the conductor portion of the printed wiring board, which is advantageous.
これまでの実施例は、未・半硬化フレキシブル印刷配線
板について説明したが、接着剤を使用して硬化したフレ
キシブル印刷配線板を金属ベースに接着することも可能
である。Although the above embodiments have been described with respect to uncured/semi-cured flexible printed wiring boards, it is also possible to bond a cured flexible printed wiring board to a metal base using an adhesive.
さらに、実施例におけるフレキシブル印刷配線板はフィ
ルム状ｐ印刷配線板も含むことは言うまでもないことで
ある。Furthermore, it goes without saying that the flexible printed wiring boards in the examples also include film-like p printed wiring boards.
以上、本発明の実施例を詳述したが、本発明は、前記実
施例に限定されるものではない。そして、特許請求の範
囲に記載された本発明を逸脱することがなければ、種々
の設計変更を行うことが可能である。Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above embodiments. Various design changes can be made without departing from the scope of the invention as set forth in the claims.
たとえば、電子機器の中の狭い特殊形状の場所に印刷配
線板を組み込むことができる。For example, printed wiring boards can be incorporated into narrow, specially shaped locations within electronic equipment.
また、金属ベースが球形あるいは円筒形等いかなる形状
のものにも適用できることは言うまでも無いことである
。It goes without saying that the metal base can be of any shape, such as spherical or cylindrical.
本発明によれば、フレキシブル印刷配線板の製造工程と
、金属ベースの成形工程とを別々に行ったので、製造工
程中に起こる接触事故、あるいは絞りまたは自げ加工に
ふける回路の断線、絶縁部の傷または剥離による絶縁不
良がなくなる。According to the present invention, since the manufacturing process of the flexible printed wiring board and the metal base molding process are performed separately, contact accidents that occur during the manufacturing process, disconnection of circuits due to drawing or self-processing, and insulation parts Insulation defects due to scratches or peeling are eliminated.
本発明によれば、印刷配線板に予め切込みまたは削除部
を設けておくため、多面体あるいは球面からなる複雑な
形状のものに、印刷配線板を設けることができる。According to the present invention, since the printed wiring board is provided with a notch or a deletion portion in advance, the printed wiring board can be provided in a complex shape consisting of a polyhedron or a spherical surface.
第１図（イ）は、本発明におけるフレキシブル印刷配線
板概略上面図、第１図（ロ）は、フレキシブル印刷配線
板の一部断面図、第２図（イ）は、本発明の方法により
作られた印刷配線板を有する多面体概略図、第２図（ロ
）は、第２図（イ）の一部所面図、第３図は従来例にお
ける金属ベース印刷配線板の説明図、第４図は従来例に
おける金属ベース印刷配線板の成形説明図である。
１・・・フレキシブル印刷配線板
２・・・銅箔
３・・・フレキシブル基板
４・・・金属ベース
５・・・切込みまたは削除部
６・・・成形された印刷配線板
（イ）
（ロ）
第
図
（イ）
（ロ）
本発明の方法により作られた印刷配線板を有する多面体
概略図１０金属ベース印刷配線板
１２金属ベース
第
図
１６伸長部 １７FIG. 1(a) is a schematic top view of the flexible printed wiring board according to the present invention, FIG. 1(b) is a partial sectional view of the flexible printed wiring board, and FIG. 2(a) is a schematic top view of the flexible printed wiring board according to the present invention. FIG. 2 (B) is a schematic diagram of a polyhedron having a printed wiring board made, and FIG. 3 is a partial partial view of FIG. FIG. 4 is an explanatory diagram of forming a metal-based printed wiring board in a conventional example. 1... Flexible printed wiring board 2... Copper foil 3... Flexible substrate 4... Metal base 5... Notch or deletion part 6... Molded printed wiring board (a) (b) Figures (A) and (B) Schematic diagram of a polyhedron having a printed wiring board made by the method of the present invention 10 Metal base printed wiring board 12 Metal base Figure 16 Extension part 17
Claims (3)
半硬化フレキシブル基板に銅箔を接着する第１工程と、 所望の回路を形成するために第１工程で得られた未・半
硬化フレキシブル基板をエッチングする第２工程と、 金属ベースを所望の形状に成形する第３工程と、第２工
程で作られた未・半硬化フレキシブル印刷配線板と第３
工程で成形加工された金属ベースとを熱圧着すると同時
に、前記回路部分をフレキシブル基板に埋め込む第４工
程と、 からなることを特徴とする金属ベース印刷配線板の製造
方法。(1) Non-woven fabric made of glass cloth base material and epoxy resin
A first step of bonding copper foil to a semi-cured flexible board; a second step of etching the uncured semi-cured flexible board obtained in the first step to form the desired circuit; and a second step of etching the metal base into the desired shape. a third step of molding the uncured and semi-cured flexible printed wiring board made in the second step;
A method for manufacturing a metal-based printed wiring board, comprising: a fourth step of thermocompression-bonding the metal base formed in the step and embedding the circuit portion in a flexible substrate at the same time.
あるいは削除部を設けることにより、多面体からなる金
属ベースの内外面に熱圧着できるようにしたことを特徴
とする請求項１記載のフレキシブル印刷配線板の製造方
法。(2) The flexible printed wiring board according to claim 1, wherein the uncured/semi-cured flexible printed wiring board is provided with a cut or a deleted portion so that it can be thermocompression bonded to the inner and outer surfaces of a metal base made of a polyhedron. Method of manufacturing the board.
フレキシブル基板を用いて前記金属ベースに接着剤で接
着することを特徴とする請求項１または２記載のフレキ
シブル印刷配線板の製造方法。(3) The method for manufacturing a flexible printed wiring board according to claim 1 or 2, characterized in that a cured flexible substrate is used instead of the uncured/semi-cured flexible substrate and is bonded to the metal base with an adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9296489A JPH069313B2 (en) | 1989-04-14 | 1989-04-14 | Method for manufacturing metal-based printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9296489A JPH069313B2 (en) | 1989-04-14 | 1989-04-14 | Method for manufacturing metal-based printed wiring board |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18216493A Division JPH0722721A (en) | 1993-06-29 | 1993-06-29 | Metal based printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02272793A true JPH02272793A (en) | 1990-11-07 |
| JPH069313B2 JPH069313B2 (en) | 1994-02-02 |
Family
ID=14069114
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9296489A Expired - Lifetime JPH069313B2 (en) | 1989-04-14 | 1989-04-14 | Method for manufacturing metal-based printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH069313B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0713229A1 (en) * | 1994-11-17 | 1996-05-22 | International Business Machines Corporation | Planar transformer and method of manufacture |
| JP2016523445A (en) * | 2014-01-02 | 2016-08-08 | フィリップス ライティング ホールディング ビー ヴィ | Method for manufacturing a non-planar printed circuit board assembly |
| US10212810B2 (en) | 2014-12-12 | 2019-02-19 | Toppan Printing Co., Ltd. | Printed wiring board and method of producing the same |
-
1989
- 1989-04-14 JP JP9296489A patent/JPH069313B2/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0713229A1 (en) * | 1994-11-17 | 1996-05-22 | International Business Machines Corporation | Planar transformer and method of manufacture |
| JP2016523445A (en) * | 2014-01-02 | 2016-08-08 | フィリップス ライティング ホールディング ビー ヴィ | Method for manufacturing a non-planar printed circuit board assembly |
| US10212810B2 (en) | 2014-12-12 | 2019-02-19 | Toppan Printing Co., Ltd. | Printed wiring board and method of producing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH069313B2 (en) | 1994-02-02 |
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