CN105873367A - Method for reducing warping degree of multilayer board - Google Patents
Method for reducing warping degree of multilayer board Download PDFInfo
- Publication number
- CN105873367A CN105873367A CN201610362502.8A CN201610362502A CN105873367A CN 105873367 A CN105873367 A CN 105873367A CN 201610362502 A CN201610362502 A CN 201610362502A CN 105873367 A CN105873367 A CN 105873367A
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- pressure
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- 400kpa
- 140kpa
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
The invention discloses a method for reducing the warping degree of a multilayer board. The method comprises a hot-pressing procedure, press-fitting is performed in a high and low pressure pulse type pressurization manner during hot-pressing, and high and low pressure pulse type pressurization includes a starting step-wise pressure increasing section, a first pressure reducing section and at least three pulse type pressurization processes. A traditional continuous high pressure press-fitting manner is changed into the high and low pressure pulse type pressurization press-fitting manner, internal stress release windows of a high-layer board can be increased in the manner, most internal stress is released in a high-temperature environment, the warping degree of the board is reduced, and warpage of the press-fit board is effectively controlled to be lower than or equal to 0.75%, so that product quality problems of difficulty in attachment, difficulty in tin soldering, breakage of joints and the like caused by warping of a circuit board are significantly solved.
Description
Technical field
The invention belongs to printed circuit board production technical field, relate to a kind of Multi-layer force fit plate, specifically
Relate to a kind of method reducing multi-layer sheet angularity.
Background technology
Printed circuit board carries out curing molding by High Temperature High Pressure to resin during pressing, completes height
Multiple-plate laminat molding technique.Process for pressing of the prior art uses the pressing mode of continuous high-pressure,
As it is shown in figure 1, resin reduces to the stage of glassy transition, resin flow from molten state, viscosity increases
Adding, internal stress is concentrated such as accumulation in the process and is easily caused force fit plate prying, after common High Temperature High Pressure
Force fit plate cannot discharge completely due to each interior ply stress, on the impact of production board seesaw song substantially, beyond
The acceptance criteria of 0.75%.Wiring board warpage will make electronic component plug-in mounting can not enter smoothly with mounting operation
OK, part solder joint also can be made not reach solder side and cause not welding stannum, wiring board warpage is except making
Integrated package contact can not closely sealed with PCB pad outside, because of warpage produce stress also can result in contact break
Split and make product rejection.
Summary of the invention
To this end, the technical problem to be solved is in prior art to deposit in multi-layer sheet bonding processes
Getting a profit at internal layer, production board warpage is obvious, thus proposes a kind of method reducing multi-layer sheet angularity.
For solving above-mentioned technical problem, the technical scheme is that
The present invention provides a kind of method reducing multi-layer sheet angularity, including the operation of hot pressing, described hot pressing
The mode using the pressurization of high-low pressure pulsed carries out pressing, and the pressurization of described high-low pressure pulsed includes continuous print
Initial staged boosting section, the first blood pressure lowering section, at least three pulsed pressure process, described initial ladder
Formula boosting section pressure is risen to 300-400Kpa by 100-140KPa, and pressure rising time is 100-160min；Described
First blood pressure lowering section is down to 100-140KPa by 300-400KPa, and dip time is 3-6min；Described pulsed
Pressure process mesolow is 100-140Kpa, and high pressure is 300-400KPa.
As preferably, described staged boosting section include kiss pressure section, the first boosting section, the first pressure-stabilizing section,
Second boosting section and the second pressure-stabilizing section.
As preferably, each described pulsed pressure process is by low pressure kiss pressure section, boosting section, high voltage stabilizing
Section, the second blood pressure lowering section composition.
As preferably, in described staged boosting section, the pressure of kiss pressure section is 100-140KPa, pressing time
For 5-10min, described first boosting section pressure is risen to 200-300Ka by 100-140KPa, and pressure rising time is
5-10min, the pressure of described pressure-stabilizing section is 200-300KPa, and pressing time is 15-25min, described second
Boosting section pressure is risen to 300-400Ka by 200-300KPa, and pressure rising time is 15-25min, described second steady
The pressure of pressure section is 300-400KPa, and pressing time is 60-90min.
As preferably, the low pressure kiss pressure section pressure in described pulsed pressure process is 100-140KPa, surely
The pressure time is 3-6min, and boosting section is risen to 300-400KPa by 100-140KPa, and pressure rising time is 3-6min,
Described high voltage stabilizing section pressure is 300-400KPa, and voltage stabling control is 3-6min, described second blood pressure lowering section by
300-400Kpa is down to 100-140KPa, and dip time is 3-6min.
As preferably, last pulsed pressure process blood pressure lowering section is down to 200KPa by 300-400KPa.
As preferably, last pulsed pressure process also includes constant voltage pressurized segment, described perseverance after terminating
The pressure of pressure pressurized segment is 200KPa, and constant voltage time is 30-50min.
As preferably, the temperature of described hot pressing is 140-220 DEG C.
The technique scheme of the present invention has the following advantages compared to existing technology, reduction of the present invention
The method of multi-layer sheet angularity, including the operation of hot pressing, described hot pressing uses the pressurization of high-low pressure pulsed
Mode carries out pressing, the pressurization of described high-low pressure pulsed include initial staged boosting section, the first blood pressure lowering section,
At least three pulsed pressure process.Change traditional continuous high-pressure pressing mode into high-low pressure pulsed to add
Pressure pressing, this mode can increase high-rise Stress of plate interior release window, discharge major part in high temperature environments
Internal stress reduces plate prying degree, effectively controls force fit plate prying≤0.75%, thus significantly improves because of line
The attachment that road slab warping causes is difficult, be difficult to the product quality problem such as scolding tin, contact fracture.
Accompanying drawing explanation
In order to make present disclosure be more likely to be clearly understood, being embodied as below according to the present invention
Example also combines accompanying drawing, and the present invention is further detailed explanation, wherein
Fig. 1 is the pressure and temperature curve of hot pressing in prior art；
Fig. 2 is the pressure of hot pressing in the method reducing multi-layer sheet angularity described in the embodiment of the present invention 1
And temperature curve.
Detailed description of the invention
Embodiment 1
Core material, outer copper foil and prepreg are cut according to preliminary dimension, then with conventional means
Carry out hot pressing after cleaning, brown, lamination, in hot pressing, control hot pressing temperature at 140-220 DEG C.
As in figure 2 it is shown, in the present embodiment, described hot pressing uses the mode of high-low pressure pulsed pressurization to carry out
Pressing, described high-low pressure pulsed pressurization include continuous print initiate staged boosting section, the first blood pressure lowering section,
At least three pulsed pressure process, described initial staged boosting section pressure is risen to by 100-140KPa
300-400Kpa, pressure rising time is 100-160min；Described first blood pressure lowering section is down to by 300-400KPa
100-140KPa, dip time is 3-6min；Described pulsed pressure process mesolow is
100-140Kpa, high pressure is 300-400KPa.
Wherein, kiss pressure section (Kiss pressure) when described staged boosting section includes initial, first liter
Pressure section, the first pressure-stabilizing section, the second boosting section and the second pressure-stabilizing section.Wherein, in the present embodiment, described kiss
The pressure of pressure section is 100KPa, and pressing time is 10min, and described first boosting section pressure is by 100KPa
Rising to 200KPa, pressure rising time is 5min, and the pressure of described pressure-stabilizing section is 200Kpa, voltage stabling control
For 15min, described second boosting section pressure is risen to 300KPa by 200KPa, and pressure rising time is 15min,
The pressure of described second pressure-stabilizing section is 300KPa, and pressing time is 60min.
After staged boost phase terminates, entering the first blood pressure lowering section, described first blood pressure lowering section is by 300KPa
Being down to 100KPa, dip time is 3min.
Entering continuous 7 subpulse formula pressure processes after first blood pressure lowering section, wherein, each pulsed is pressurizeed
Process is all made up of low pressure kiss pressure section, boosting section, high voltage stabilizing section, the second blood pressure lowering section.
In the present embodiment, the low pressure kiss pressure section pressure of first three pulsed pressure process is 100KPa, pressure
The conjunction time is 3min, and boosting section is risen to 350KPa by 100KPa, and pressure rising time is 6min, described
High voltage stabilizing section pressure is 350KPa, and pressing time is 3min, and the second blood pressure lowering section is down to by 350KPa
100KPa, dip time is 3min.Ensuing three subpulse formula pressure process mesolow kiss pressure section pressures
Strong is 100KPa, and pressing time is 3min, and boosting section is risen to 300KPa by 100KPa, during boosting
Between be 3min, described high voltage stabilizing section pressure is 300KPa, and pressing time is 3min, the second blood pressure lowering
Section is down to 100KPa by 300KPa, and dip time is 3min.In last pulsed pressure process
Low pressure kiss pressure section pressure is 100KPa, and pressing time is 3min, and boosting section is risen to 300 by 100KPa
KPa, pressure rising time is 3min, and described high voltage stabilizing section pressure is 300KPa, and pressing time is 3min,
Second blood pressure lowering section is down to 200KPa by 300KPa, and dip time is 3min, after the second blood pressure lowering section terminates
Entering constant voltage pressurized segment, described constant voltage pressurized segment pressure is 200Kpa, and constant voltage time is 30min.
Embodiment 2
Core material, outer copper foil and prepreg are cut according to preliminary dimension, then with conventional means
Carry out hot pressing after cleaning, brown, lamination, in hot pressing, control hot pressing temperature at 140-220 DEG C.
In the present embodiment, described hot pressing uses the mode of high-low pressure pulsed pressurization to carry out pressing, described height
The pressurization of action of low-voltage pulse formula includes that continuous print initiates staged boosting section, the first blood pressure lowering section, at least three pulse
Formula pressure process, described initial staged boosting section pressure is risen to 300-400Kpa by 100-140KPa,
Pressure rising time is 100-160min；Described first blood pressure lowering section is down to 100-140KPa by 300-400KPa,
Dip time is 3-6min；Described pulsed pressure process mesolow is 100-140Kpa, and high pressure is
300-400KPa。
Wherein, kiss pressure section (Kiss pressure) when described staged boosting section includes initial, first liter
Pressure section, the first pressure-stabilizing section, the second boosting section and the second pressure-stabilizing section.Wherein, in the present embodiment, described kiss
The pressure of pressure section is 140KPa, and pressing time is 5min, and described first boosting section pressure is by 140KPa
Rising to 300KPa, pressure rising time is 10min, and the pressure of described pressure-stabilizing section is 300Kpa, voltage stabling control
For 25min, described second boosting section pressure is risen to 400KPa by 300KPa, and pressure rising time is 25min,
The pressure of described second pressure-stabilizing section is 400KPa, and pressing time is 90min.
After staged boost phase terminates, entering the first blood pressure lowering section, described first blood pressure lowering section is by 400KPa
Being down to 140KPa, dip time is 6min.
Entering continuous 6 subpulse formula pressure processes after first blood pressure lowering section, wherein, each pulsed is pressurizeed
Process is all made up of low pressure kiss pressure section, boosting section, high voltage stabilizing section, the second blood pressure lowering section.
In the present embodiment, the low pressure kiss pressure section pressure of first five pulsed pressure process is 140KPa, pressure
The conjunction time is 6min, and boosting section is risen to 400KPa by 140KPa, and pressure rising time is 6min, described
High voltage stabilizing section pressure is 400KPa, and pressing time is 6min, and the second blood pressure lowering section is down to by 400KPa
140KPa, dip time is 6min.Last pulsed pressure process mesolow kiss pressure section pressure is
140KPa, pressing time is 6min, and boosting section is risen to 400KPa by 140KPa, and pressure rising time is
6min, described high voltage stabilizing section pressure is 400KPa, and pressing time is 6min, the second blood pressure lowering section by
400KPa is down to 200KPa, and dip time is 6min.Second blood pressure lowering section enters constant voltage pressurization after terminating
Section, described constant voltage pressurized segment pressure is 200Kpa, and constant voltage time is 50min.
Embodiment 3
Core material, outer copper foil and prepreg are cut according to preliminary dimension, then with conventional means
Carry out hot pressing after cleaning, brown, lamination, in hot pressing, control hot pressing temperature at 140-220 DEG C.
In the present embodiment, described hot pressing uses the mode of high-low pressure pulsed pressurization to carry out pressing, described height
The pressurization of action of low-voltage pulse formula includes that continuous print initiates staged boosting section, the first blood pressure lowering section, at least three pulse
Formula pressure process, described initial staged boosting section pressure is risen to 300-400Kpa by 100-140KPa,
Pressure rising time is 100-160min；Described first blood pressure lowering section is down to 100-140KPa by 300-400KPa,
Dip time is 3-6min；Described pulsed pressure process mesolow is 100-140Kpa, and high pressure is
300-400KPa。
Wherein, kiss pressure section (Kiss pressure) when described staged boosting section includes initial, first liter
Pressure section, the first pressure-stabilizing section, the second boosting section and the second pressure-stabilizing section.Wherein, in the present embodiment, described kiss
The pressure of pressure section is 120KPa, and pressing time is 8min, and described first boosting section pressure is by 120KPa
Rising to 250KPa, pressure rising time is 8min, and the pressure of described pressure-stabilizing section is 250Kpa, voltage stabling control
For 20min, described second boosting section pressure is risen to 360KPa by 250KPa, and pressure rising time is 20min,
The pressure of described second pressure-stabilizing section is 360KPa, and pressing time is 80min.
After staged boost phase terminates, entering the first blood pressure lowering section, described first blood pressure lowering section is by 360KPa
Being down to 120KPa, dip time is 5min.
Entering continuous 8 subpulse formula pressure processes after first blood pressure lowering section, wherein, each pulsed is pressurizeed
Process is all made up of low pressure kiss pressure section, boosting section, high voltage stabilizing section, the second blood pressure lowering section.
In the present embodiment, the low pressure kiss pressure section pressure of the first seven pulsed pressure process is 120KPa, pressure
The conjunction time is 5min, and boosting section is risen to 350KPa by 120KPa, and pressure rising time is 5min, described
High voltage stabilizing section pressure is 350KPa, and pressing time is 5min, and the second blood pressure lowering section is down to by 350KPa
120KPa, dip time is 5min.Last pulsed pressure process mesolow kiss pressure section pressure is
120KPa, pressing time is 5min, and boosting section is risen to 350KPa by 120KPa, and pressure rising time is
5min, described high voltage stabilizing section pressure is 350KPa, and pressing time is 5min, the second blood pressure lowering section by
350KPa is down to 200KPa, and dip time is 5min.Second blood pressure lowering section enters constant voltage pressurization after terminating
Section, described constant voltage pressurized segment pressure is 200Kpa, and constant voltage time is 40min.
Obviously, above-described embodiment is only for clearly demonstrating example, and not to embodiment
Restriction.For those of ordinary skill in the field, can also do on the basis of the above description
Go out change or the variation of other multi-form.Here without also all of embodiment being given thoroughly
Lift.And the obvious change thus extended out or variation are still in the protection domain of the invention
Among.
Claims (8)
1. the method reducing multi-layer sheet angularity, it is characterised in that include the operation of hot pressing, described
Hot pressing uses the mode of high-low pressure pulsed pressurization to carry out pressing, and the pressurization of described high-low pressure pulsed includes even
Continuous initial staged boosting section, the first blood pressure lowering section, at least three pulsed pressure process, described initial
Staged boosting section pressure is risen to 300-400Kpa by 100-140KPa, and pressure rising time is 100-160min；
Described first blood pressure lowering section is down to 100-140KPa by 300-400KPa, and dip time is 3-6min；Described arteries and veins
Rushing formula pressure process mesolow is 100-140Kpa, and high pressure is 300-400KPa.
The method of reduction multi-layer sheet angularity the most according to claim 1, it is characterised in that described
Staged boosting section includes that kiss pressure section, the first boosting section, the first pressure-stabilizing section, the second boosting section and second are steady
Pressure section.
The method of reduction multi-layer sheet angularity the most according to claim 2, it is characterised in that each
Described pulsed pressure process is made up of low pressure kiss pressure section, boosting section, high voltage stabilizing section, the second blood pressure lowering section.
The method of reduction multi-layer sheet angularity the most according to claim 3, it is characterised in that described
In staged boosting section, the pressure of kiss pressure section is 100-140KPa, and pressing time is 5-10min, described first
Boosting section pressure is risen to 200-300KPa by 100-140KPa, and pressure rising time is 5-10min, described pressure-stabilizing section
Pressure be 200-300KPa, pressing time is 15-25min, described second boosting section pressure by 200-300
KPa rises to 300-400KPa, and pressure rising time is 15-25min, and the pressure of described second pressure-stabilizing section is
300-400KPa, pressing time is 60-90min.
The method of reduction multi-layer sheet angularity the most according to claim 4, it is characterised in that described
Low pressure kiss pressure section pressure in pulsed pressure process is 100-140KPa, and pressing time is 3-6min, rises
Pressure section is risen to 300-400KPa by 100-140KPa, and pressure rising time is 3-6min, described high voltage stabilizing section pressure
Strong is 300-400KPa, and pressing time is 3-6min, and described second blood pressure lowering section is down to by 300-400KPa
100-140KPa, dip time is 3-6min.
The method of reduction multi-layer sheet angularity the most according to claim 5, it is characterised in that last
One pulsed pressure process blood pressure lowering section is down to 200KPa by 300-400KPa.
The method of reduction multi-layer sheet angularity the most according to claim 6, it is characterised in that last
One pulsed pressure process also includes constant voltage pressurized segment after terminating, the pressure of described constant voltage pressurized segment is
200KPa, constant voltage time is 30-50min.
The method of reduction multi-layer sheet angularity the most according to claim 7, it is characterised in that described
The temperature of hot pressing is 140-220 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610362502.8A CN105873367B (en) | 2016-05-27 | 2016-05-27 | A method of reducing multi-layer board angularity |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610362502.8A CN105873367B (en) | 2016-05-27 | 2016-05-27 | A method of reducing multi-layer board angularity |
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| CN105873367B CN105873367B (en) | 2019-03-05 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106476405A (en) * | 2016-09-30 | 2017-03-08 | 生益电子股份有限公司 | The lamination sheeting process of PCB and PCB |
| CN110557899A (en) * | 2019-08-28 | 2019-12-10 | 广合科技（广州）有限公司 | method for processing expansion and shrinkage of PCB finished board |
| CN111479390A (en) * | 2020-04-15 | 2020-07-31 | 苏州市杰煜电子有限公司 | Automatic dispensing process for FPC (Flexible printed Circuit) |
| CN114245617A (en) * | 2021-12-15 | 2022-03-25 | 生益电子股份有限公司 | Pressing method for improving poor filling |
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| CN101212867A (en) * | 2006-12-25 | 2008-07-02 | 比亚迪股份有限公司 | Flexible circuit board press bonding method |
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| CN114245617A (en) * | 2021-12-15 | 2022-03-25 | 生益电子股份有限公司 | Pressing method for improving poor filling |
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| Publication number | Publication date |
|---|---|
| CN105873367B (en) | 2019-03-05 |
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