CN111148377B - Horizontal continuous low-pressure vacuum pressing method - Google Patents
Horizontal continuous low-pressure vacuum pressing method Download PDFInfo
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- CN111148377B CN111148377B CN201911410933.7A CN201911410933A CN111148377B CN 111148377 B CN111148377 B CN 111148377B CN 201911410933 A CN201911410933 A CN 201911410933A CN 111148377 B CN111148377 B CN 111148377B
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- prepreg
- resin
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- pressure vacuum
- resin layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a horizontal continuous low-pressure vacuum pressing method, which comprises the following steps: coating resin on the surface of the supporting layer to form a uniform liquid resin layer; sticking a prepreg on the resin layer, and automatically and tightly attaching the prepreg and the resin layer; sending the support layer with the surface covered with the resin layer and the prepreg into a continuous oven for primary baking, and controlling baking time and temperature to cure the resin layer to a certain extent but not completely; after the preliminary baking is finished, a copper foil is pasted on the surface of the prepreg, and the copper foil is automatically and tightly attached to the prepreg; then horizontally conveying the support layer with the surface covered with the resin layer, the prepreg and the copper foil into a low-pressure vacuum press for pressing; and after the pressing is finished, baking in a continuous oven until the resin is completely cured. The horizontal continuous low-pressure vacuum pressing method provided by the invention solves the problems of circuit board warpage, thick copper plate resin holes and the like in a pressing process, and realizes horizontal continuity of the whole pressing process.
Description
Technical Field
The invention relates to a horizontal continuous low-pressure vacuum pressing method, and belongs to the technical field of circuit board manufacturing.
Background
The pressing procedure in the existing circuit board manufacturing process is vertical and discontinuous, before pressing, copper foils, prepregs and copper-clad plates are riveted into a circuit board to be pressed according to a set stacking method, a plurality of circuit boards to be pressed are stacked to the same opening, and then the circuit boards are sent to a press for pressing. In a press, to undergo: three steps of prepreg melting, circuit and hole filling and resin curing; the consumed time is long, and the yield of the key equipment in the unit time of the press is low.
The glue on the prepreg flows to have certain locality due to the constraint of glass cloth, and the phenomenon of uneven thickness of the dielectric layer occurs in a filling area and a non-filling area after pressing. Because a plurality of circuit boards in the same opening are overlapped according to the same direction, the copper-free area and the copper-containing area are accumulated, so that the phenomenon of uneven pressure/temperature rise occurs on different positions of the same circuit board and among different circuit boards in the pressing process, and the phenomenon of uneven thickness of the whole circuit board occurs after the pressing is completed. This problem is particularly pronounced with non-uniform pattern distribution and with thick copper and buried via hole designs.
In any glass fiber prepreg, the glass fiber may be broken or separated from the resin after drilling, and the inner layer circuit is in direct contact with the glass fiber in the prepreg, which provides a path for copper ion migration, thereby risking short circuit due to the conductive anode wire.
The larger the general pressure is during pressing, the more easily the circuit board is warped; and the pressing pressure is too large, so that the resin generates great stress in the curing process, and the heat resistance and the long-term reliability of the circuit board are not facilitated.
Compared with a common circuit board, the thick copper plate has large line-to-line side corrosion and needs more glue for filling, and when the glue on the prepreg corresponding to the glue-needed area is insufficient, the problems of incomplete resin filling or cavities are easy to occur after pressing. The existing buried-hole plugging circuit board manufacturing process has the risks of outer-layer copper foil depression and buried-hole orifice crack, or has the defects of more process flows and large plugging resin consumption.
Disclosure of Invention
The purpose is as follows: in order to overcome the defects in the prior art, the invention provides a horizontal continuous low-pressure vacuum pressing method, which solves the problems of circuit board warpage, thick copper plate resin holes and the like in a pressing procedure and realizes the horizontal continuity of the whole pressing process.
The technical scheme is as follows: in order to solve the technical problems, the technical scheme adopted by the invention is as follows:
a horizontal continuous low-pressure vacuum pressing method comprises the following steps:
coating resin on the surface of the supporting layer to form a uniform liquid resin layer; sticking a prepreg on the resin layer, and automatically and tightly attaching the prepreg and the resin layer; then sending the support layer with the surface covered with the resin layer and the prepreg into a continuous oven for primary baking, and controlling baking time and temperature to ensure that the resin layer is cured to a certain degree but not completely cured;
after the preliminary baking is finished, a copper foil is pasted on the surface of the prepreg, and the copper foil is automatically and tightly attached to the prepreg; then horizontally conveying the support layer with the surface covered with the resin layer, the prepreg and the copper foil into a low-pressure vacuum press for pressing; and after the pressing is finished, baking in a continuous oven until the resin is completely cured.
Furthermore, the supporting layer is a copper-clad plate, or a high-density printed circuit board, or a thick copper plate, or a buried hole and plugged circuit board.
Furthermore, before the resin is coated on the surface of the supporting layer, the copper foil on the surface of the supporting layer is subjected to oxidation treatment.
Further, the method for coating the resin is one of roller coating, wet pad coating and spraying.
Further, the low-pressure vacuum press comprises a cabin body, a supporting plate, a plate thickness control rod and a die, wherein the cabin body is in a vacuum environment, and the supporting plate is arranged in the cabin body; the periphery of die sets up the connecting hole, and the plate thickness control pole passes the connecting hole downwards and fixes on the layer board, and the die can reciprocate along the plate thickness control pole, height sensor is installed to the die downside.
Furthermore, zero calibration is carried out on the height sensor, and when the height sensor is located on the upper surface of the supporting plate, the measured height value is zero.
Furthermore, a resin layer, a prepreg and a copper foil which are sequentially attached from inside to outside are arranged on one surface of the supporting layer.
Furthermore, the two sides of the supporting layer are provided with a resin layer, a prepreg and a copper foil which are sequentially attached from inside to outside.
Has the advantages that: the invention provides a horizontal continuous low-pressure vacuum pressing method, which is used for pressing a single circuit board in a low-pressure vacuum printing mode, can ensure the whole board thickness uniformity and reliability of the circuit board through an adjustable printing die and a board thickness control rod in a vacuum press, and specifically comprises the following steps: 1) the resin is directly coated on the surface of the supporting layer, so that the thickness uniformity of the dielectric layer is greatly improved, the prepreg is prevented from being in direct contact with the copper foil and the inner-layer copper conductor, and the risk of short circuit of the circuit board due to the conductive anode wire is greatly reduced. 2) The resin is semi-cured by an oven and then is pressed in a low-pressure vacuum manner, and the stress generated in the curing process of the resin under the low pressure is extremely small, so that the heat resistance and the long-term reliability of the circuit board are improved; the adjustable die and the plate thickness control rod in the vacuum press can ensure the whole plate thickness uniformity of the circuit board. 3) The continuous oven ensures the horizontal continuity of the whole process, effectively solves the problem of thick copper plate resin cavities, simplifies the manufacturing process of the buried hole plugging circuit board and reduces the risk of resin cracks at the buried hole orifice.
Drawings
FIG. 1 is a schematic flow chart of a pressing method according to the present invention;
FIG. 2 is a schematic top view of the low pressure vacuum press;
FIG. 3 is a schematic front view of a low pressure vacuum press;
FIG. 4 is a schematic diagram of a circuit board formed by disposing resin layers, prepregs and copper foils on both sides of a support layer;
fig. 5 is a schematic structural view of a continuous oven.
Detailed Description
The present invention will be further described with reference to the accompanying drawings.
As shown in fig. 1, a horizontal continuous low-pressure vacuum pressing method comprises the following processes:
coating resin on the surface of the support layer 404 to form a uniform liquid resin layer 403; the support layer 404 is a copper-clad plate, or a high-density printed circuit board, or a thick copper plate, or a buried via plug circuit board. Before the surface of the support layer 404 is coated with the resin, the copper foil on the surface of the support layer is subjected to oxidation treatment, namely browning or blackening treatment, so that the bonding force between the support layer and the resin is increased.
The method for coating the resin is one of roller coating, wet pad coating and spraying.
Adhering a prepreg 402 on the resin layer 403, wherein the prepreg 402 and the resin layer 403 are automatically and tightly attached; then, the support layer 404 covered with the resin layer 403 and the prepreg 402 is sent to a continuous oven for primary baking, and the resin layer is cured to some extent without being completely cured by controlling the baking time and temperature. The time and temperature for the complete curing of the resin can be obtained according to the existing literature data or limited experiments, and on the basis, the oven temperature and the baking time are set to control the curing degree of the resin.
After the preliminary baking is finished, a copper foil 401 is pasted on the surface of the prepreg 402, and the copper foil 401 is automatically and tightly attached to the prepreg 402; then horizontally conveying the support layer 404 with the surface covered with the resin layer 403, the prepreg 402 and the copper foil 401 to a low-pressure vacuum press for pressing; and after the pressing is finished, baking in a continuous oven until the resin is completely cured. The continuous oven shown in fig. 5 is adopted to separate the heat curing process in the traditional press and perform the heat curing operation independently; compared with the traditional press which needs to be stopped to disassemble the plate, the continuous oven can operate uninterruptedly, the efficiency is improved, and the output of the key equipment press in unit time is improved.
As shown in fig. 2 and 3, the low-pressure vacuum press comprises a cabin body 1, a supporting plate 5, a plate thickness control rod 3 and a die 2, wherein the cabin body 1 is in a vacuum environment, and the supporting plate 5 is arranged in the cabin body; the periphery of die 2 sets up the connecting hole, and the plate thickness control pole 3 passes the connecting hole downwards and fixes on layer board 5, and die 2 can reciprocate along plate thickness control pole 3, height sensor 6 is installed to die 2 downside. Before pressing, according to the thickness of the circuit board 4xThe height of the die 2 is accurately set to X by the height sensor 6 and the plate thickness control rod 3, and X is slightly larger than XxAnd the circuit board 4 is horizontally conveyed to the supporting plate 5 in the cabin by the conveying belt during pressing, so that the integral board thickness uniformity of the circuit board can be ensured.
The height sensor 6 may employ a laser distance sensor. And (4) zero calibration is carried out on the height sensor, and when the height sensor is positioned on the upper surface of the supporting plate, the measured height value is zero.
The low-pressure vacuum pressing mode has low pressure and uniform distribution, and can effectively reduce the warpage of the board; the resin generates less stress during the curing process, thereby improving the heat resistance and long-term reliability of the circuit board.
The support layer may be provided with a resin layer, a prepreg and a copper foil sequentially laminated from inside to outside on a single surface, or may be provided with a resin layer, a prepreg and a copper foil sequentially laminated from inside to outside on a double surface, as shown in fig. 4.
The above description is only of the preferred embodiments of the present invention, and it should be noted that: it will be apparent to those skilled in the art that various modifications and adaptations can be made without departing from the principles of the invention and these are intended to be within the scope of the invention.
Claims (7)
1. A horizontal continuous low-pressure vacuum pressing method is characterized in that: the method comprises the following steps:
coating resin on the surface of the supporting layer to form a uniform liquid resin layer; sticking a prepreg on the resin layer, and automatically and tightly attaching the prepreg and the resin layer; then sending the support layer with the surface covered with the resin layer and the prepreg into a continuous oven for primary baking, and controlling baking time and temperature to ensure that the resin layer is cured to a certain degree but not completely cured;
after the preliminary baking is finished, a copper foil is pasted on the surface of the prepreg, and the copper foil is automatically and tightly attached to the prepreg; then horizontally conveying the support layer with the surface covered with the resin layer, the prepreg and the copper foil into a low-pressure vacuum press for pressing; after the pressing is finished, the resin enters a continuous oven to be baked until the resin is completely cured;
the low-pressure vacuum press comprises a cabin body, a supporting plate, a plate thickness control rod and a die, wherein the cabin body is in a vacuum environment, and the supporting plate is arranged in the cabin body; the periphery of die sets up the connecting hole, and the plate thickness control rod passes the connecting hole downwards and fixes on the layer board, and the die can reciprocate along the plate thickness control rod, height sensor is installed to the die downside.
2. The horizontally continuable low pressure vacuum press-fitting method of claim 1, wherein: the supporting layer is a copper-clad plate, or a high-density printed circuit board, or a thick copper plate, or a buried hole and plugged circuit board.
3. A horizontally continuous low pressure vacuum press-fitting method according to claim 1, wherein: before the surface of the supporting layer is coated with resin, the copper foil on the surface of the supporting layer is subjected to oxidation treatment.
4. A horizontally continuous low pressure vacuum press-fitting method according to claim 1, wherein: the method for coating the resin is one of roller coating, wet pad coating and spraying.
5. A horizontally continuous low pressure vacuum press-fitting method according to claim 1, wherein: and (4) zero calibration is carried out on the height sensor, and the measured height value is zero when the height sensor is positioned on the upper surface of the supporting plate.
6. A horizontally continuous low pressure vacuum press-fitting method according to claim 1, wherein: and a resin layer, a prepreg and a copper foil which are sequentially attached from inside to outside are arranged on one surface of the supporting layer.
7. A horizontally continuous low pressure vacuum press-fitting method according to claim 1, wherein: the two sides of the supporting layer are provided with a resin layer, a prepreg and a copper foil which are sequentially attached from inside to outside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911410933.7A CN111148377B (en) | 2019-12-31 | 2019-12-31 | Horizontal continuous low-pressure vacuum pressing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911410933.7A CN111148377B (en) | 2019-12-31 | 2019-12-31 | Horizontal continuous low-pressure vacuum pressing method |
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| Publication Number | Publication Date |
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| CN111148377A CN111148377A (en) | 2020-05-12 |
| CN111148377B true CN111148377B (en) | 2022-07-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201911410933.7A Active CN111148377B (en) | 2019-12-31 | 2019-12-31 | Horizontal continuous low-pressure vacuum pressing method |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115519850A (en) * | 2022-09-20 | 2022-12-27 | 宁波甬强科技有限公司 | Copper-clad plate manufacturing method |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102056425A (en) * | 2010-12-23 | 2011-05-11 | 北大方正集团有限公司 | Method for manufacturing multilayer printed circuit board (PCB) |
| CN102186306A (en) * | 2011-04-29 | 2011-09-14 | 惠州中京电子科技股份有限公司 | Metal base circuit board and manufacturing method thereof |
| CN102514353A (en) * | 2011-12-13 | 2012-06-27 | 广东生益科技股份有限公司 | Production method of copper-clad plate and copper-clad plate |
| CN104149471A (en) * | 2014-07-10 | 2014-11-19 | 腾辉电子（苏州）有限公司 | Preparation method of resin coated copper foil and copper foil coated laminated board manufactured by resin coated copper foil |
| CN105451472A (en) * | 2014-08-26 | 2016-03-30 | 深南电路有限公司 | Laminated circuit board processing method and laminated circuit board |
| CN110113898A (en) * | 2019-04-09 | 2019-08-09 | 沪士电子股份有限公司 | A kind of PCB plate production method based on liquid resin |
| CN110572948A (en) * | 2019-09-26 | 2019-12-13 | 深圳明阳电路科技股份有限公司 | laser-engraved circuit board and manufacturing method thereof |
-
2019
- 2019-12-31 CN CN201911410933.7A patent/CN111148377B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102056425A (en) * | 2010-12-23 | 2011-05-11 | 北大方正集团有限公司 | Method for manufacturing multilayer printed circuit board (PCB) |
| CN102186306A (en) * | 2011-04-29 | 2011-09-14 | 惠州中京电子科技股份有限公司 | Metal base circuit board and manufacturing method thereof |
| CN102514353A (en) * | 2011-12-13 | 2012-06-27 | 广东生益科技股份有限公司 | Production method of copper-clad plate and copper-clad plate |
| CN104149471A (en) * | 2014-07-10 | 2014-11-19 | 腾辉电子（苏州）有限公司 | Preparation method of resin coated copper foil and copper foil coated laminated board manufactured by resin coated copper foil |
| CN105451472A (en) * | 2014-08-26 | 2016-03-30 | 深南电路有限公司 | Laminated circuit board processing method and laminated circuit board |
| CN110113898A (en) * | 2019-04-09 | 2019-08-09 | 沪士电子股份有限公司 | A kind of PCB plate production method based on liquid resin |
| CN110572948A (en) * | 2019-09-26 | 2019-12-13 | 深圳明阳电路科技股份有限公司 | laser-engraved circuit board and manufacturing method thereof |
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| CN111148377A (en) | 2020-05-12 |
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