CN104540339A - Core-less board manufacturing component, core-less board and manufacturing method for core-less board - Google Patents
Core-less board manufacturing component, core-less board and manufacturing method for core-less board Download PDFInfo
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- CN104540339A CN104540339A CN201410857699.3A CN201410857699A CN104540339A CN 104540339 A CN104540339 A CN 104540339A CN 201410857699 A CN201410857699 A CN 201410857699A CN 104540339 A CN104540339 A CN 104540339A
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- copper foil
- internal layer
- central layer
- prepreg
- frame
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
A core-less board manufacturing component comprises a supporting carrier and core-less boards arranged on the two sides of the supporting carrier. The core-less boards comprise inner prepregs, outer prepregs, inner copper foil layers and outer copper foil layers. The inner prepregs are arranged on the two sides of the inner copper foil layers. The outer prepregs are arranged on the outermost inner copper foil layers, and the outer coil foil layers are arranged on the outer prepregs. Gaps are formed in frames of the inner copper foil layers. According to the core-less board manufacturing component, the core-less board and a manufacturing method for the core-less board, the supporting carrier is arranged ingeniously, the warping problem of the core-less boards can be overcome effectively, and the yield of the core-less boards is improved.
Description
Technical field
The present invention relates to centreless plate technique field, particularly relate to a kind of without central layer manufacture component, without central layer and centreless board manufacturing method.
Background technology
Along with semiconductor package product is towards high-performance, slimming and low cost future development, expedite the emergence of the thin matrix technique of centreless; Due to too thin without central layer, more serious warpage issues can be run into, in manufacturing process, easily cause the problem that plate damages, clamp is scrapped.
Summary of the invention
Based on this, be necessary for warpage issues, provide a kind of and manufacture component without central layer.In addition, there is a need to provide a kind of without central layer and a kind of centreless board manufacturing method.
A kind of to comprise: prop carrier without central layer manufacture component, and be arranged on described prop carrier both sides without central layer; Describedly to comprise without central layer: interior prepreg, outer prepreg, internal layer Copper Foil and outer copper foil; Described internal layer Copper Foil both sides arrange described interior prepreg, arrange described outer prepreg, arrange outer copper foil in described outer cured sheets at described outermost internal layer Copper Foil; The frame of described internal layer Copper Foil offers gap.
In an embodiment wherein, the inside of described internal layer Copper Foil arranges round pad, and described round pad is laid around the frame of described internal layer Copper Foil.
In an embodiment wherein, the frame of described outer copper foil offers gap.
In an embodiment wherein, the frame that the frame of described internal layer Copper Foil offers gap and described outer copper foil is offered gap and is in same vertical face.
In an embodiment wherein, the thickness of the frame of described internal layer Copper Foil and described outer copper foil is greater than the thickness in the middle part of it.
In an embodiment wherein, described prop carrier comprises: insulating trip, divides the carrier copper foil being located at described insulating trip both sides.
In an embodiment wherein, the surface coarsening process of described carrier copper foil.
A kind of without central layer, comprising: interior prepreg, outer prepreg, internal layer Copper Foil and outer copper foil; Described internal layer Copper Foil both sides arrange described interior prepreg, arrange described outer prepreg, arrange outer copper foil in described outer cured sheets at described outermost internal layer Copper Foil; The frame of described internal layer Copper Foil offers gap.
In an embodiment wherein, the inside of described internal layer Copper Foil arranges round pad, and described round pad is laid around the frame of described internal layer Copper Foil.
A kind of centreless board manufacturing method, comprising: S100: provide support carrier; S200: lamination pressing internal layer Copper Foil on prop carrier, interior prepreg is provided with between each internal layer copper foil layer, at the outer prepreg of the arranged outside of internal layer Copper Foil, then make without central layer at prepreg arranged outside outer copper foil, the frame of described internal layer Copper Foil offers gap; S300: be separated from prop carrier without central layer.
Adopt the manufacturing component without central layer, without central layer and a kind of centreless board manufacturing method, be provided with prop carrier cleverly of the application, effectively can overcome the problem of centreless slab warping, improve the yields of producing without central layer.
Accompanying drawing explanation
Fig. 1 be the present invention propose manufacture element structure schematic diagram without central layer;
Fig. 2 is the prop carrier structural representation in a kind of embodiment;
Fig. 3 is without core plate structure figure in Fig. 1;
Fig. 4 is the pattern schematic diagram of Fig. 1 ectomesoderm Copper Foil;
Fig. 5 is the pattern schematic diagram of internal layer Copper Foil in Fig. 1;
Fig. 6 is glass structural representation in Fig. 1;
Fig. 7 is the double-deck glass structural representation in a kind of embodiment;
Fig. 8 is the manufacture method flow chart that the present invention proposes;
Fig. 9 is the manufacture method flow chart in a kind of embodiment;
Figure 10 is the manufacture method flow chart in another kind of embodiment;
Figure 11 is location hole design diagram.
Embodiment
For enabling object of the present invention, feature and advantage become apparent more, are described in detail the specific embodiment of the present invention below in conjunction with accompanying drawing.Set forth a lot of detail in the following description so that fully understand the present invention.But the present invention can be much different from alternate manner described here to implement, those skilled in the art can when without prejudice to doing similar improvement when intension of the present invention, therefore the present invention is by the restriction of following public concrete enforcement.
The present embodiment without central layer manufacture component, comprise prop carrier, and be arranged on prop carrier both sides without central layer.Particularly:
Prop carrier is insulator, and this insulator can be the materials such as BT resin, epoxy resin, ABF, polytetrafluoroethylene, hydrocarbon pottery.Due to thinner without central layer, easily there is plate and damage or warpage, the prop carrier of this programme is set, can play a supporting role when manufacture is without central layer.
In a present embodiment, prop carrier comprises: insulating trip, and divide the carrier copper foil being located at insulating trip both sides, carrier copper foil is thicker, and thickness is 12 ~ 15 μm, can better for providing stressed support without the manufacture of central layer.In addition, roughening treatment is carried out in the both sides of carrier copper foil, can increase the adhesion after pressing.
In other embodiments, at the arranged outside outer copper foil of carrier copper foil, whole prop carrier is bonded together by pre-pressing, the opposing face of carrier copper foil and outer copper foil is through roughening treatment, i.e. surface roughening, can increase the adhesion after pressing, convenient carrier copper foil is separated with outer copper foil.
The structure of this outer copper foil can be applicable to without in central layer, namely in advance the vibrational power flow of outer copper foil on insulating trip, as the composition structure without central layer, be follow-uply separated this outer copper foil and carrier copper foil by separating technology.
In other embodiments, prop carrier can adopt ice to replace.In the process manufactured without central layer, first to make in the operating space lower than 0 °, then in the both sides of ice successively pressing without central layer, after pressing completes, improve the temperature of operating space, after ice melts automatically, two can be separated automatically without central layer.What this ice adopted is the ice that pure water is made, and not trace after ice-out, can not impact without central layer.
Without central layer, comprising: interior prepreg, outer prepreg, internal layer Copper Foil and outer copper foil.Particularly, the both sides of interior prepreg arrange internal layer Copper Foil, can arrange multilayer, namely arrange multiple internal layer Copper Foil, also will arrange multiple interior prepreg between multiple internal layer Copper Foil simultaneously, can press together by lamination according to design needs.Finally outer prepreg is set on outermost internal layer Copper Foil again, then outer copper foil is set outside this outer prepreg.Internal layer Copper Foil can be the same with the thickness of outer copper foil, is all 2 ~ 5 μm.
Further, internal layer Copper Foil offers gap, and this gap is all located at the edge surrounding of internal layer Copper Foil, and the direction offered, gap can the frame of vertical internal layer Copper Foil, also can angledly arrange, this gap design effectively can reduce the problem of lamination filler without cavity.In addition, can also arrange round pad in the inside of internal layer Copper Foil, this circle pad is arranged on the inner side of the frame of internal layer Copper Foil uniformly, arranges ringwise.Adopt the design of circle pad, can the cavity of more effective minimizing lamination filler.In the present embodiment, gap is 0.5 ~ 1.5mm, and the gap of circle pad is between 0.2 ~ 0.5mm.
In other embodiments, can also carry out patterned process at the inner surface of outer copper foil, this is patterned as small embossment, in the process of lamination filler, effectively extrudes the bubble in filler.
Outer copper foil, is arranged on outermost, has two outer copper foils.Particularly, outer copper foil offers gap, and this gap is all located at the surrounding of internal layer Copper Foil, and the direction offered, gap can the frame of vertical outer Copper Foil, and also can angledly arrange, this gap design effectively can reduce the problem of lamination filler without cavity.In addition, be all arranged on same vertical face in the gap that internal layer Copper Foil and outer copper foil are offered, better can reduce the problem of lamination filler without cavity.
In other embodiments, the thickness of the frame of internal layer Copper Foil and outer copper foil is thicker than the thickness at middle part, effectively can increase the intensity without central layer.
In one embodiment, the interior prepreg of component, outer prepreg is manufactured all containing glass without central layer.
Because the structure of prop carrier both sides is identical, in order to more clearly describe the structure of this programme, be described with the structure of wherein side.
Particularly, the main component of interior cured sheets and outer cured sheets is resin, containing fiberglass layer in resin.The fiberglass layer thickness of interior cured sheets is 10 ~ 25 μm, and the gel content of resin is more than 75%; At least large than the glass thickness of interior cured sheets 8 μm of the glass thickness of outer cured sheets, and the resin gel content of outer cured sheets is less than 65%.By the resin content of differentiation and, can effectively control board internal stress distribution, reduction angularity.
Embodiment one
Embodiment two
Embodiment three
Wherein depth of camber refers to the difference in height without central layer plate two ends; Warpage rate is the value of difference in height divided by plate length, to represent the warpage degree of plate.
Above embodiment all represents, the glass thickness difference controlling outer cured sheets and interior cured sheets is greater than 8 μm, and effectively can control warpage rate below 1%, depth of camber difference is not higher than 5mm.And glass difference in thickness is larger, warpage rate is lower.
By mating with asymmetric adjustment the glass thickness of different layers prepreg and resin gel content, the reduction of centreless slab warping can be realized simply, at low cost.
In addition, double-deck glass structure can be also provided with in outer cured sheets.Double-deck glass structure comprises the first fiberglass layer and the second fiberglass layer, and wherein the first fiberglass layer is in outside, and the second fiberglass layer is in inner side, and the Thickness Ratio second fiberglass layer thickness of the first fiberglass layer is large, and difference in thickness is greater than 8 μm.
The large I of glass difference in thickness regulates according to the quantity of laser blind hole and distribution density, and drilling hole amount is more, and distribution density is larger, and difference in thickness should be larger.Double-deck glass comparatively individual layer glass, more effectively can reduce the angularity without central layer.
Manufacture component based on above-mentioned without central layer and without central layer, also propose a kind of centreless board manufacturing method, comprising:
S100: provide support carrier, this prop carrier comprises: insulating trip, and divide the carrier copper foil being located at insulating trip both sides, wherein carrier copper foil comprises the carrier copper foil and outer copper foil combined, and outer copper foil Thickness Ratio carrier copper foil thickness is little.Add prop carrier can increase and provide beaer when making without central layer, can better for the manufacture without central layer provides support.
S200: lamination pressing Copper Foil on prop carrier, is provided with interior prepreg between each copper foil layer, makes without central layer.
S300: be separated from prop carrier without central layer.
Adopt this method, two can be produced once without central layer, double than traditional mode of production efficiency, and make a thick supporter for thinner without central layer, alleviation centreless slab warping problem.
In above-mentioned steps S200, this comprises interior prepreg, outer prepreg, internal layer Copper Foil and outer copper foil without central layer.Particularly, the layers of copper on prop carrier two sides is first sticked the outer cured sheets of one deck, then sticks internal layer Copper Foil, and the number of plies as required controls the internal layer Copper Foil number of plies that adds, and be connected and between two internal layer Copper Foils, accompany at least cured sheets in one deck.
To manufacture five layers without central layer, prop carrier two sides is outer copper foil, outer copper foil adds the outer prepreg of one deck, carries out one step press; Add three layers of internal layer Copper Foil successively again, all have prepreg in one deck between every two-layer internal layer Copper Foil, and often add one deck internal layer Copper Foil, just carry out one step press.Finally, in the outer cured sheets of third layer internal layer Copper Foil upper berth one deck, and layer overlay outer copper foil in cured sheets outside, then carry out last pressing.After pressing, by separating technology, peel off at prop carrier, obtain two piece of five laminate that up-down structure is identical.
The both sides of interior prepreg arrange internal layer Copper Foil, can arrange multilayer, namely arrange multiple internal layer Copper Foil, also will arrange multiple interior prepreg between multiple internal layer Copper Foil simultaneously, can press together by lamination according to design needs.Finally outer prepreg is set on outermost internal layer Copper Foil again, then outer copper foil is set at this outer prepreg.
In one embodiment, internal layer Copper Foil is not identical with the pressing condition of outer copper foil.
Particularly, the pressing maximum temperature of pressing internal layer Copper Foil and interior cured sheets is 140 ~ 180 DEG C, and pressing time is 60min ~ 100min, and maximal pressure force value is at 30 ~ 50kgf/cm
2; The maximum temperature of the outer cured sheets of pressing and outer copper foil is 220 ~ 260 DEG C, and pressing time is greater than 110min, and maximal pressure force value is at 30 ~ 50kgf/cm
2.Be below the specific experiment data according to this programme pressing:
Embodiment four
Embodiment 5
Embodiment 6
In bonding processes, interior prepreg and internal layer Copper Foil adopt pre-pressing, and the outer total head that adopts is closed, and pressing-in temp and pressing time all improve.Compared with the pressing of routine, the interior prepreg state of cure after the pressing parameter pressing in this programme is adopted only to account for 70 ~ 95% of conventional parameter, adopt total head to close parameter again at final outer field bonding processes and carry out pressing, reduce the residual stress of each internal layer prepreg entirety, reduce the warpage without central layer.
In one embodiment, internal layer Copper Foil offers gap, and this gap is all located at the surrounding of internal layer Copper Foil, and the direction offered, gap can the frame of vertical internal layer Copper Foil, also can angledly arrange, this gap design effectively can reduce the problem of lamination filler without cavity.In addition, can also arrange round pad in the inside of internal layer Copper Foil, this circle pad is arranged on the inner side of the frame of internal layer Copper Foil uniformly, arranges ringwise.Adopt the design of circle pad, can the cavity of more effective minimizing lamination filler.In the present embodiment, gap is 0.5 ~ 1.5mm, and the gap of circle pad is between 0.2 ~ 0.5mm.
In other embodiments, can also carry out patterned process at the inner surface of outer copper foil, this is patterned as small embossment, in the process of lamination filler, and the bubble in effective extruding filler.
Outer copper foil, is arranged on outermost, has two outer copper foils.Particularly, outer copper foil offers gap, and this gap is all located at the surrounding of internal layer Copper Foil, and the direction offered, gap can the frame of vertical outer Copper Foil, and also can angledly arrange, this gap design effectively can reduce the problem of lamination filler without cavity.
In addition, the thickness of the frame of internal layer Copper Foil and outer copper foil can arrange thicker, effectively can increase the intensity without central layer.
In one embodiment, in the prop carrier that step S100 provides, this prop carrier directly to be superposed with outer copper foil by carrier copper foil and makes, and the structure of this outer copper foil can be applicable to without in central layer, namely shift to an earlier date the vibrational power flow of outer copper foil on insulating trip, as the composition structure without central layer; Carrier copper foil also can be applicable to another side without in central layer, as outermost outer copper foil.
In this embodiment, after step S300, also comprise step S400: copper is subtracted to carrier copper foil.Particularly, after being separated prop carrier, prop carrier is in two without one of central layer, needs to subtract copper to what have a prop carrier without central layer, is generally 2 ~ 5mm, two consistency of thickness without central layer being.
Adopt this programme, eliminate the insulating trip in prop carrier, avoid extra waste of material, improve economic benefit.
In addition, when separation two is without central layer, cannot confirms that prop carrier is at which block without central layer, therefore need artificial visually examine to confirm, greatly reduce operating efficiency.For this reason, there is a need to increase step S300A before step S400: provide laser range finder, measure two respectively without the thickness of central layer, thicker for have prop carrier without central layer, then this is entered step S400 without central layer.
Particularly, this laser range finder comprises Laser emission end and laser pick-off end composition, and Laser emission end and laser pick-off end are separately positioned on the two ends without central layer, and from the height preset from Laser emission end Emission Lasers, laser pick-off termination receives laser.When laser pick-off end does not receive laser signal, be now the thickness without central layer.Similar, other one just adopts identical method to its Thickness sensitivity without central layer.Finally by comparing, can confirm which is thicker in central layer without central layer, be have prop carrier without central layer.
In one embodiment, step S200 specifically comprises:
S200A: carry out Graphic transitions on the outer copper foil on prop carrier two sides, wherein the figure of one side is the figure after another side adjusts turnback.
S200C: prepreg and internal layer Copper Foil in adding outside prop carrier two, and Graphic transitions is carried out on the internal layer Copper Foil of both sides, the figure of prop carrier side is the figure after opposite side adjusts turnback, and carries out pressing.
S200D: repeat step S200B, until reach the number of plies of setting.
Without central layer in order to bearing semiconductor vigour part, therefore without central layer having needed corresponding circuit trace.Circuit layer without central layer is internal layer Copper Foil and the outer copper foil of every one deck, realizes conducting between each layer Copper Foil by bore process.And due to upper and lower be upside-down mounting relation without core plate structure, two pieces that strip down from prop carrier is mirror without the circuit layout on core plate structure, in any case it is all not identical to overturn two pieces of circuit layouts without central layer, two cover flow processs need be divided to make, and production efficiency is slower.And by the Image Reversal of circuit reference will be made in advance, follow-up only need upset wherein one piece without central layer, two pieces of figures obtained without central layer and identical, can carry out subsequent treatment process simultaneously.
Further, also comprise after step S200A:
S200B, offers location hole onboard.Correspondingly, step S200C is specially: prepreg and internal layer Copper Foil in adding outside prop carrier two, and Graphic transitions is carried out on the internal layer Copper Foil of both sides, the figure of prop carrier side is the figure after opposite side revolves turnback, figure is that contraposition reference shifts with location hole, and carries out pressing.
Offer pattern alignment when location hole can contribute to Graphic transitions, and mark action can be played after separation is without central layer, be convenient to the figure direction being distinguished plate by the distribution of location hole.Needed to carry out milling limit to internal layer Copper Foil before beginning location hole, the size on milling limit is less than 2 ~ 6mm, meanwhile, and outer copper foil size 5 ~ 15mm larger than the size of internal layer Copper Foil.
Location hole is mal-distribution.In addition, location hole can also be the positioning datums such as such as specific telltale mark, mainly plays with reference to effect, and is not limited to the form of location hole.
The above embodiment only have expressed several execution mode of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (10)
1. without central layer manufacture a component, it is characterized in that, comprising: prop carrier, and be arranged on described prop carrier both sides without central layer;
Describedly to comprise without central layer: interior prepreg, outer prepreg, internal layer Copper Foil and outer copper foil; Described internal layer Copper Foil both sides arrange described interior prepreg, arrange described outer prepreg, arrange outer copper foil in described outer cured sheets at described outermost internal layer Copper Foil; The frame of described internal layer Copper Foil offers gap.
2. according to claim 1 without central layer manufacture component, it is characterized in that, the inside of described internal layer Copper Foil arranges round pad, and described round pad is laid around the frame of described internal layer Copper Foil.
3. according to claim 2 without central layer manufacture component, it is characterized in that, the frame of described outer copper foil offers gap.
4. according to claim 3ly manufacture component without central layer, it is characterized in that, the frame that the frame of described internal layer Copper Foil offers gap and described outer copper foil is offered gap and is in same vertical face.
5. according to claim 4 without central layer manufacture component, it is characterized in that, the thickness of the frame of described internal layer Copper Foil and described outer copper foil is greater than the thickness in the middle part of it.
6. according to Claims 1 to 5 any one, manufacture component without central layer, it is characterized in that, described prop carrier comprises: insulating trip, point to be located at the carrier copper foil of described insulating trip both sides.
7. according to claim 6 without central layer manufacture component, it is characterized in that, the surface coarsening process of described carrier copper foil.
8. without a central layer, it is characterized in that, comprising: interior prepreg, outer prepreg, internal layer Copper Foil and outer copper foil; Described internal layer Copper Foil both sides arrange described interior prepreg, arrange described outer prepreg, arrange outer copper foil in described outer cured sheets at described outermost internal layer Copper Foil; The frame of described internal layer Copper Foil offers gap.
9. according to claim 8 without central layer manufacture component, it is characterized in that, the inside of described internal layer Copper Foil arranges round pad, and described round pad is laid around the frame of described internal layer Copper Foil.
10. a centreless board manufacturing method, comprising:
S100: provide support carrier;
S200: lamination pressing internal layer Copper Foil on prop carrier, interior prepreg is provided with between each internal layer copper foil layer, at the outer prepreg of the arranged outside of internal layer Copper Foil, then make without central layer at described outer prepreg arranged outside outer copper foil, the frame of described internal layer Copper Foil offers gap;
S300: be separated from prop carrier without central layer.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410857699.3A CN104540339B (en) | 2014-12-31 | 2014-12-31 | Without core plate manufacture component, without core plate and centreless board manufacturing method |
| PCT/CN2015/080251 WO2016107059A1 (en) | 2014-12-31 | 2015-05-29 | Coreless plate fabricating member, coreless plate and method for fabricating coreless plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410857699.3A CN104540339B (en) | 2014-12-31 | 2014-12-31 | Without core plate manufacture component, without core plate and centreless board manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104540339A true CN104540339A (en) | 2015-04-22 |
| CN104540339B CN104540339B (en) | 2017-11-17 |
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| CN201410857699.3A Active CN104540339B (en) | 2014-12-31 | 2014-12-31 | Without core plate manufacture component, without core plate and centreless board manufacturing method |
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| CN (1) | CN104540339B (en) |
| WO (1) | WO2016107059A1 (en) |
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| WO2016107059A1 (en) * | 2014-12-31 | 2016-07-07 | 广州兴森快捷电路科技有限公司 | Coreless plate fabricating member, coreless plate and method for fabricating coreless plate |
| WO2016107060A1 (en) * | 2014-12-31 | 2016-07-07 | 广州兴森快捷电路科技有限公司 | Coreless board manufacturing method |
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Also Published As
| Publication number | Publication date |
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| WO2016107059A1 (en) | 2016-07-07 |
| CN104540339B (en) | 2017-11-17 |
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