WO2016188217A1

WO2016188217A1 - Terminal

Info

Publication number: WO2016188217A1
Application number: PCT/CN2016/077400
Authority: WO
Inventors: 黄竹邻
Original assignee: 中兴通讯股份有限公司
Priority date: 2015-10-14
Filing date: 2016-03-25
Publication date: 2016-12-01
Also published as: CN106604519A; CN106604519B

Abstract

A terminal comprises: a circuit board (102) provided with a chip (101); a shielding device (103), provided outside of the chip (101) and configured to shield electromagnetic irradiation of the chip (101); a connection layer (104), packed between the shielding device (103) and the circuit board (102) and sealing the shielding device (103) and the circuit board (102), such that the chip (101) is located in a sealed space formed by the shielding device (103) and the circuit board (102), wherein the connection layer (104) is made from a thermally and electrically conductive material transformable from a liquid state to a solid state.

Description

Terminal

Technical field

The present invention relates to a heat dissipation technology of a printed circuit board (PCB), and more particularly to a terminal.

Background technique

As the number of cores in mobile phone processors has gradually increased, the processing power has rapidly increased, and its thermal power consumption has reached a headache that developers have to pay attention to. Due to the high speed operation of the processor, it must be placed in the shield, causing the processor to dissipate heat very badly.

In the design of the processor item, the conventional design method of the heat dissipation of the PCB with the shield frame is as follows: the shield cover of the processor is opened, the thermal conductive silicone sheet is adhered on the surface of the processor, and then the heat sink of the mobile phone (magnesium alloy case) Add conductive material between the shielding cover (such as conductive foam, etc.); or directly use the magnesium alloy aluminum frame and PCB structure of the portable device to lock the shield, and the surface of the processor is bonded with thermal silica film.

Since neither of the above solutions can properly handle the tolerances of the structural member and the heat dissipating material, it is impossible to solve the problem that the heat dissipation and the electromagnetic interference shielding are achieved at the same time.

Summary of the invention

In order to solve the above technical problem, embodiments of the present invention are expected to provide a terminal.

The technical solution of the embodiment of the present invention is implemented as follows:

A terminal includes: a circuit board provided with a chip; a shielding device disposed on an outer side of the chip, configured to shield electromagnetic radiation of the chip; and a connection layer filled between the shielding device and the circuit board, Sealing the shielding device and the circuit board such that the chip is in a sealed space formed by the shielding device and the circuit board; wherein the connection layer is thermally conductive Made of a conductive material that can be converted from a liquid state to a solid state.

In the above aspect, when the shielding device is a shield bracket that is wrapped around the chip and is not capped, the terminal further includes: a metal middle frame configured to fix the circuit board; the connection layer is configured to Filling a gap between the metal middle frame, the chip, and the shield bracket such that the chip is sealed in a sealed space formed by the metal middle frame, the circuit board, and the shield bracket.

In the above aspect, the thickness of the connection layer disposed between the chip and the metal middle frame is greater than the actual pitch of the chip and the metal middle frame.

In the above aspect, the connecting layer and the metal middle frame are shaped.

In the above aspect, when the screen device is a shielding wall that covers the chip and encloses the chip, the device further includes: a metal middle frame having the shielding wall; the connection The layer is configured to fill a gap between the circuit board and the shielding wall such that the chip seal forms a sealed space in the circuit board and the shielding wall.

In the above aspect, the connection layer is further configured to fill a gap between the chip and the shielding wall.

In the above aspect, the metal middle frame is a magnesium aluminum alloy middle frame.

In the above aspect, the circuit board is a PCB.

An embodiment of the present invention provides a terminal, the terminal includes a circuit board provided with a chip, and a shielding device disposed on an outer side of the chip, configured to shield electromagnetic radiation of the chip, and a connection layer filled in the shielding device and Between the circuit boards, the shielding device and the circuit board are sealed such that the chip is in a sealed space formed by the shielding device and the circuit board; wherein the connection layer is made of a thermally conductive material It is produced that the thermally conductive electrically conductive material can be converted from a liquid state to a solid state. In this way, since the thermally conductive conductive material used in the connection layer can be converted from a liquid state to a solid state, the liquid thermally conductive conductive material can flow between the shielding device and the circuit board during filling, and when the thermally conductive conductive material is cured, the connection layer The shielding device and the circuit board are closed, and because The connecting layer has a conductive capability, so that the sealed space formed by the shielding device and the circuit board can shield electromagnetic interference of the chip contained therein, and at the same time, the connecting layer also has a guiding capability, so that the heat of the chip It can act as a heat sink on the shielding device that can be conducted through the connection layer. In this way, the chip heat dissipation and shielding electromagnetic interference can achieve good results.

DRAWINGS

1 is a schematic cross-sectional view of a terminal in an embodiment of the present invention;

2 is another schematic cross-sectional view of a terminal in an embodiment of the present invention;

3 is a top plan view of a terminal in an embodiment of the present invention;

FIG. 4 is a schematic flow chart of a method for dissipating heat of a chip according to an embodiment of the present invention.

detailed description

The technical solutions in the embodiments of the present invention will be clearly and completely described in the following with reference to the accompanying drawings.

In various embodiments of the present invention, the shielding device of the terminal is disposed outside the terminal chip and configured to shield electromagnetic radiation of the chip; the connection layer of the terminal is filled between the shielding device and the circuit board of the terminal, and sealed The shielding device and the circuit board are disposed such that the chip is in a sealed space formed by the shielding device and the circuit board; the circuit board is provided with the chip; wherein the connection layer is Made of a thermally conductive electrically conductive material that can be converted from a liquid to a solid.

The embodiment of the present invention provides a terminal 10, as shown in FIG. 1, the terminal 10 may include: a circuit board 102 provided with a chip 101; a shielding device 103 disposed outside the chip 101 and configured to shield electromagnetic radiation of the chip 101; The connection layer 104 is filled between the shielding device 103 and the circuit board 102, and the shielding device 103 and the circuit board 102 are sealed, so that the chip 101 is in a sealed space formed by the shielding device 103 and the circuit board 102.

Wherein, the connection layer 104 is made of a heat conductive material, and the heat conductive material can be made of a liquid state. Converted to solid state.

In this way, since the material of the connection layer 104 can be converted from a liquid state to a solid state, the liquid heat conductive conductive material can flow between the shielding device 103 and the circuit board 102 during filling, and when the heat conductive conductive material is fixed, the connection layer 104 The shielding device 103 and the circuit board 102 are closed, so that the chip 101 is in the sealed space formed by the shielding device 103 and the circuit board 102, and the shielding effect is achieved. At the same time, the heat conductive conductive material also has a heat conducting function and arrives. The effect of heat dissipation.

In the embodiment of the present invention, the shielding device 103 may include a shielding bracket wrapped around the chip 101 and not capped, and a shielding wall covering the chip 101 and enclosing the chip 101.

As shown in FIG. 2, when the shielding device 103 is a shield bracket 1031 that is wrapped around the chip 101 and is not capped, the terminal 10 further includes: a metal middle frame 105 configured to include the circuit board 102;

The connection layer 104 is specifically configured to: fill the gap between the metal middle frame 105, the chip 101 and the shield bracket 1031, sealing the metal middle frame 105, the circuit board 102, the chip 101 and the shield bracket 1031;

The connection layer 104 is formed by fixing a liquid heat conductive material that penetrates into the gap between the metal middle frame 105 and the chip 101 and the shield holder 1031. Here, since the circuit board 102 and the shield bracket 1031 are seamlessly connected, in the embodiment of the present invention, only the gap between the metal middle frame 105 and the shield bracket 1031, the gap between the metal middle frame 105 and the chip 101 can be used. .

In an embodiment, the thickness of the connection layer 104 disposed between the chip 101 and the metal middle frame 105 is greater than the actual pitch of the chip 101 and the metal middle frame 104.

Here, the connection layer 104 and the metal middle frame 105 are formed by molding.

In the embodiment of the present invention, the heat conductive conductive material is hardened with time, and the liquid heat conductive conductive material is uniformly applied to the upper surface of the chip 101 and the upper surface of the shield bracket by a dispenser to ensure the full filling of the chip. The shielding frame 1031 and the metal middle frame 105 are covered, and after refilling, the thickness of the connection layer 104 between the chip 101 and the metal middle frame 105 is slightly larger than the actual distance between the chip 101 and the metal middle frame 105. Since the thermally conductive material is initially soft as a paste, In order to infiltrate the chip 101 and the metal middle frame 105, the rough super-surface which is invisible to the naked eye of the surface of the shield 1031 is shielded, and the heat dissipation area is increased. Moreover, the initial shape and the structure fit very well, and wait until about 0.5- After 1 hour, the thermally conductive electrically conductive material cures to form the desired integral thermally conductive structure. Here, the metal component is added to the heat conductive conductive material, and is formed by the frame molding of the magnesium alloy, which can ensure good conductive shielding.

It should be noted that the change process of the heat conductive conductive material from the liquid state to the solid state proposed by the embodiment of the present invention is irreversible.

In an embodiment, as shown in FIG. 3, when the screen device 103 is the shielding wall 1032 that covers the chip 101 and encloses the chip 101, the terminal 10 further includes: a metal middle frame 105 in which the shielding wall 1032 grows. ;

The connection layer 104 is specifically configured to: fill a reserved gap between the circuit board 102 and the shielding wall 1032, so that the circuit board 102 and the shielding wall 105 are in a closed space;

The connecting layer 104 is formed by fixing a liquid conductive material that penetrates a reserved gap between the circuit board 102 and the shielding wall 1032, so that the shielding wall 1032 and the circuit board 102 form a sealed space.

In an embodiment, the connection layer 104 is also configured to fill the voids of the chip 101 and the shield wall 1032.

At the beginning of the structural design, a groove is reserved between the shielding wall 1032 and the circuit board 102 which are grown in the metal frame 105, and the conductive and heat conductive materials are spotted by the dispenser, and after 0.5-1 hour, the heat is formed. The cured protective layer can be shielded, and the surface of the chip is also coated with a layer of this material to ensure sufficient contact with the metal middle frame and sufficient heat dissipation.

In an embodiment, the circuit board 102 may be a PCB; the metal middle frame 105 may be a magnesium aluminum alloy middle frame.

In an embodiment, the liquid thermally conductive electrically conductive material may be in the form of a paste.

It can be seen from the method provided by the embodiment of the present invention that the terminal provided by the embodiment of the present invention has The following advantages:

The operation method is simple and easy; the material can change the hardness with time, and the thermal conductivity and the double performance can fully contact the surface of the heat dissipating object, and form a solid shielding structure to ensure the performance of heat dissipation and electromagnetic shielding. Only one material and one operating step are required to achieve heat dissipation and electromagnetic shielding without additional processes.

Based on the same inventive concept, an embodiment of the present invention further provides a chip heat dissipation method. As shown in FIG. 4, the method includes:

S401, injecting a material of a liquid connecting layer into a dispenser, the material of the connecting layer being a thermally conductive conductive material capable of being converted from a liquid to a solid.

S402. Fill a thermal conductive material between the shielding device and the circuit board through a dispenser to seal the shielding device from the circuit board.

In this way, since the material of the connection layer can be converted from a liquid state to a solid state, when filling, the liquid heat conductive conductive material can flow between the shielding device and the circuit board, and when the heat conductive conductive material is fixed, the connection layer makes the shielding device and The circuit board is closed, so that the chip is in a sealed space formed by the shielding device and the circuit board, and the shielding effect is achieved. At the same time, the heat conductive conductive material has a heat conduction function and reaches the heat dissipation effect.

While the preferred embodiment of the invention has been described, it will be understood that Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and the modifications and

It is apparent that those skilled in the art can make various modifications and variations to the invention without departing from the spirit and scope of the invention. Thus, it is intended that the present invention cover the modifications and modifications of the invention

Claims

A terminal, the terminal comprising:

a circuit board provided with a chip;

a shielding device disposed outside the chip and configured to shield electromagnetic radiation of the chip;

a connecting layer filled between the shielding device and the circuit board, sealing the shielding device and the circuit board, such that the chip is in a sealed space formed by the shielding device and the circuit board;

Wherein the connecting layer is made of a thermally conductive electrically conductive material capable of being converted from a liquid state to a solid state.
The terminal according to claim 1, wherein when the shielding device is a shield bracket that is wrapped around the chip and is not capped, the terminal further includes: a metal middle frame configured to fix the circuit board;

The connection layer is configured to fill a gap between the metal middle frame, the chip and the shield bracket, so that the chip is sealed in the metal middle frame, the circuit board and the shield bracket In a confined space.
The terminal according to claim 2, wherein a thickness of the connection layer disposed between the chip and the metal middle frame is larger than an actual pitch of the chip and the metal middle frame.
The terminal of claim 3, wherein the connecting layer and the metal middle frame are shaped.
The terminal according to claim 1, wherein when the screen device is a shield wall that covers the chip and encloses the chip, the device further includes: a metal having the shield wall Middle frame

The connection layer is configured to fill a gap between the circuit board and the shielding wall such that the chip is sealed in the circuit board and the shielding wall to form a sealed space.
The terminal of claim 5, wherein the connection layer is further configured to fill the a gap between the chip and the shielding wall.
The terminal according to any one of claims 2 to 6, wherein the metal middle frame is a magnesium aluminum alloy middle frame.
The terminal according to any one of claims 1 to 6, wherein the circuit board is a printed circuit board PCB.