CN102310616B - Weight and pressure reducing compacting method of copper-clad plate - Google Patents
Weight and pressure reducing compacting method of copper-clad plate Download PDFInfo
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- CN102310616B CN102310616B CN201110224875.6A CN201110224875A CN102310616B CN 102310616 B CN102310616 B CN 102310616B CN 201110224875 A CN201110224875 A CN 201110224875A CN 102310616 B CN102310616 B CN 102310616B
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Abstract
The invention discloses a weight and pressure reducing compacting method of a copper-clad plate. The method comprises steps of: (1) a compacting process with a temperature from low to high gradually and an increasing pressure; (2) a compacting process after a temperature continuously rises to a rated high value and a pressure continuously rises to a rated high value; (3) a compacting process with a temperature reducing from the rated high value to a low value and a pressure reducing from the rated high value to a low value, wherein, in the compacting process in step (2), reducing the pressure to a preset low value and returning to the rated high pressure is repeated more than twice. According to the weight and pressure reducing compacting method provided by the invention, the pressure is reduced to a preset low value repeatedly during a traditional high temperature and high pressure compacting process, so as to release stress continuously and reduce internal stress of a sheet material. Copper-clad plate produced by the method of the invention has better sheet material planarization, greatly reduced warping probability and obviously improved dimension stability.
Description
Technical field
The present invention relates to copper-clad laminate and manufacture field, be specifically related to the compressing technology of copper-clad laminate.
Background technology
The basic framework of electric equipment products is pcb board, and PCB is based upon copper-clad laminate (lower abbreviation: on basis copper-clad plate), form through boring, plating, line pattern transfer, etching, the printed circuit operation such as anti-welding.High speed development along with electronic technology, various mounting technologies make rapid progress, components and parts packaging density in unit are is more and more higher, particularly package module, BGA technical elements, the planarization of PCB, dimensional stability are had higher requirement, and this also correspondingly requires the basic material copper-clad plate of pcb board to have the feature of high planarization and dimensional stability.
Copper-clad laminate will pass through production of adhesive, reinforcing material impregnation, the large basic manufacture process of HTHP compacting three.The main product FR-4 series of products of take below describe as example:
Shown in Fig. 1, the traditional drawing method of FR-4 plate is that the folded prepreg preparing is sent into hot press, first adds less pressure, is generally 5～6kg/cm
2, then heat up, along with material temperature ground constantly raises, the resin on prepreg starts melting, and applied pressure also constantly raises, and is gradually added to the maximum pressure of technological requirement, is generally 20～45kg/cm
2.Whole process, the resin melting viscosity on prepreg experiences following process: viscosity is large, and------viscosity diminishes, and-----viscosity is minimum, and-----viscosity starts to become large---viscosity no longer changes----solidify.
The above traditional drawing method of concrete analysis, when temperature is by 110～120 ℃ to 170～185 ℃ of initial temperatures (approximately 150～160 ℃ of material temperature), pressure is by 5～6kg/cm
2to 20～45kg/cm
2in process, it is large that resin is experiencing viscosity, and------viscosity diminishes, and-----the minimum-----viscosity of viscosity starts a process that becomes large, from chemical constitution, this process belongs to the process of little molecule resin polymerization, the functional group that participates in reaction is epoxy radicals ring-opening polymerisation under the effect of amine curing agent that specific activity is higher, has formed the high molecular polymer of certain chain length, but this high molecular polymer still has certain plasticity.When temperature is higher than 170～180 ℃ (150～160 ℃ of material temperature), high molecular polymer degree of depth polymerization again, some OH bases start polymerization, and will there is the process that a larger plasticity changes in macromolecule now, form rigid structure.In two change procedures, high molecular polymer will produce internal stress, under this stress high pressure, can not be released, and remains in curing resin structure.
On the other hand, glass cloth weave cotton cloth process, gluing process because transmission tension force do use, glass strands in footpath, latitude direction also can be subjected to displacement and form physics internal stress in prepreg, when in pressing process, resin melting, this displacement under high pressure can not be released and residue in sheet material.No matter be the physics internal stress forming in immersing glue process, or the internal stress forming in polymerization process, all remain in sheet material always.
Serious internal stress in copper-clad plate, shows to make that sheet material planarization is poor, angularity is large, the several aspects of poor dimensional stability, has a strong impact on the assembling of postorder PCB components and parts; Slight internal stress,, when components and parts assemble, the heat treatment process through operations such as wave-soldering or Reflow Solderings, will discharge, and causes pcb board change in size or deformation, also can affect the surface-mounted precision of components and parts.
Summary of the invention
The present invention seeks to solve the problem of internal stress remaining in copper-clad plate, by the adjustment to compacting pressuring method, two kinds of remaining internal stress in sheet material are released, for macromolecule resin polymerization stress, are unfolded, discharge especially, thus planarization and the dimensional stability of raising sheet material.
Copper-clad plate subtracts pound and falls to pressing a drawing method, comprising: the pressing process of boosting is heated up, followed simultaneously in (1) from low to high gradually; (2) continue to be warming up to high temperature rated value, continue to boost to the pressing process after rated high voltage value; (3) from high temperature rated value, be down to low temperature, from rated high voltage value, be down to the pressing process of low pressure; It is characterized in that, in the pressing process of described step (2), repeatedly after twice above low voltage value that pressure decreased is extremely set, return to again rated high voltage value.
Described in above-mentioned steps (1), heat up gradually and refer to from low to high, by initial temperature 110-120 ℃, be warming up to 170-180 ℃, described in follow boost and refer to, pressure is by 5～6kg/cm
2boost to 20～45kg/cm
2.
High temperature rated value described in above-mentioned steps (2) is 200～210 ℃.
The number of times that repeatedly reduces pressure described in above-mentioned steps (2) is three times.
The low voltage value of setting described in above-mentioned steps (2) is 8～10kg/cm
2.
The pound that subtracts provided by the invention falls to pressing pressing, in the pressing process of traditional high temperature, high pressure, and the low voltage value of repeatedly pressure decreased extremely being set, thus stress is constantly discharged, reduce the internal stress in sheet material.The sheet material planarization of the copper-clad plate of producing by the present invention is better, warpage probability significantly reduces, dimensional stability also improves significantly.
Accompanying drawing explanation
Fig. 1 is that traditional FR-4 plate is suppressed pressure, temperature, the time diagram of formula.
Fig. 2 for the embodiment of the present invention provide subtract pound fall to pressing under drawing method, the execution curve map of its temperature, pressure.
The specific embodiment
Shown in Fig. 2, the present embodiment provides subtracts pound and falls to pressing pressing, is resin again in polymerization process in compacting, at high temperature, high pressure phase, (be namely in Fig. 2 after 180 ℃, enter the stage of 205 ℃), regularly pressure decreased is extremely set value, as 8kg/cm
2, polymer molecule is unfolded, internal stress is released, and then, then boosts to operation pressure, and so repeatedly several times, the internal stress in its sheet material will be discharged effectively, and as shown in Figure 2, the present embodiment design subtracts pound and falls to pressing three times.
The step of utilizing press to carry out copper-clad plate compacting mainly comprises: the superimposed sheet material assembling is pushed to press; Matched moulds, close pressure gate; Start compacting formula, system automatic vacuum.In the present embodiment, after compacting formula starts, according to the form below 1 formula is moved automatically.
Table 1
Shown in Figure 2, wherein temperature controlled process is as follows:
The 1st step: the laminate assembling pushes pressure and wants machine, 120 ℃ of machine temperature, and keep 2min.
The 2nd step: 2min hot plate is warmed up to 155 ℃ from 120 ℃.
3rd, 4 steps: hot plate is at 155 ℃ of constant temperature, 34min.
The 5th step: hot plate heats up, 7min rises and is raised to 170 ℃ from 155 ℃.
The 6th step: hot plate heats up, 18min rises and is raised to 205 ℃ from 170 ℃.
7th, 8,9 steps: hot plate constant temperature, at 205 ℃ of constant temperature 38min.
The 10th step: cooling, 15min drops to 175 ℃ from 205 ℃.
The 11st step: hot plate cooling, 10min drops to 140 ℃ from 175 ℃.
The 12nd step: hot plate cooling, 6min drops to 120 ℃ from 140 ℃.Temperature formula finishes.
Continuation is referring to Fig. 2, and wherein pressure controlled process is as follows:
1st, 2 steps: press closes matched moulds, plus-pressure is 6kg/cm2, keeps 10min.
The 3rd step: boost, 1min pressure is raised to 14kg/cm2 from 6kg/cm2.
The 4th step: constant voltage, pressure keeps 33min at 14kg/cm2.
The 5th step: boost, 1min pressure is raised to 22kg/cm2 from 14kg/cm2.
The 6th step: constant voltage, pressure keeps 21min at 22kg/cm2.
The 7th step: subtract pound for the 1st time and fall to pressing, in 1min, pressure is dropped to 8kg/cm2 from 22kg/cm2.
The 8th step: the 2min that boosts, pressure is raised to 30kg/cm2 from 8kg/cm2.
The 9th step: constant voltage, pressure keeps 10min at 30kg/cm2.
The 10th step: subtract pound for the 2nd time and fall to pressing, in 1min, pressure is dropped to 8kg/cm2 from 30kg/cm2.
The 11st step: boost, 2min pressure is raised to 30kg/cm2 from 8kg/cm2.
The 12nd step: constant voltage, pressure keeps 18min at 30kg/cm2.
The 13rd step: subtract pound for the 3rd time and fall to pressing, in 1min, pressure is dropped to 8kg/cm2 from 30kg/cm2.
The 14th step: boost, 2min pressure is raised to 30kg/cm2 from 8kg/cm2.
The 15th step: constant voltage, pressure keeps 14min at 30kg/cm2.
The 16th step: temperature enters the stage of cooling, pressure step-down, drops to 20kg/cm2 by pressure from 30kg/cm2 in 1min.
The 17th step: constant voltage, pressure keeps 7min at 20kg/cm2, and this process press also cools continuing.
The 18th step: step-down, drops to 8kg/cm2 by pressure from 20kg/cm2 in 1min.
The 19th step: constant voltage, pressure keeps 6min at 8kg/cm2, and afterwards, pressure formula finishes, and now, temperature formula also finishes simultaneously, and whole pressing process finishes.
In addition, in above-mentioned pressing process, the process that cooperation vacuumizes control is as follows:
The 1st step: vacuum is wanted matched moulds from pressing, the operation of pressure formula, in the time of the operation of temperature formula, vacuum formula starts.Approximately 7～10min reaches the high vacuum of 750mm Hg of technique initialization.
The 2nd step: vacuum reaches maintains this vacuum always, and if vacuum is lower than setting value, vavuum pump starts automatically, makes vacuum reach setting value.
The 3rd step: when pressure formula runs to the 14th step 1min, the formula that maintains vacuum 750mm Hg finishes, but press doors or closed condition, after this, as vacuum pressure reduces, start vacuum no longer automatically.
The 4th step: when pressure formula moves to the 19th step 1min, vacuum discharges.Vacuum formula finishes.
During the 19th EOS, temperature, pressure, vacuum control process finish, and press doors is opened automatically, automatic die sinking, and whole compaction procedure finishes.
Below by data comparison, method that the present embodiment provides beneficial effect is compared to existing technology described:
With the two-sided half OZ Copper Foil assessment of 1.6mm, with 100,000 sheet material outputs, add up: traditional compacting formula institute pressed sheet, between its angularity 0.5～1.0%, probability is 10%; Angularity is at 0.3～0.5% probability 40%, and angularity is at 0.1～0.3% probability 50%.The size expansion rate of X, Y-direction is: 270～320ppm; The pound that subtracts that the present embodiment provides falls to pressing pressing pressed sheet, between its angularity 0.5～1.0%, probability is 0%, angularity is at 0.3～0.5% probability 10%, and angularity is that the size expansion rate of X, Y-direction is: 240～260ppm at 0.1～0.3% probability 90%.
Claims (5)
1. copper-clad plate subtracts pound and falls to pressing a drawing method, comprising: step 1, heat up gradually from low to high, follow simultaneously the pressing process of boosting; Step 2, continue to be warming up to high temperature rated value, continue to boost to the pressing process after rated high voltage value; Step 3, from high temperature rated value, be down to low temperature, from rated high voltage value, be down to the pressing process of low pressure; It is characterized in that, in the pressing process of described step 2, repeatedly after twice above low voltage value that pressure decreased is extremely set, return to again rated high voltage value; Wherein for the second time pressure decreased is returned in the process of rated high voltage value to the low voltage value of setting again, temperature reduces gradually from high temperature rated value, for the last time pressure decreased is returned in the process of rated high voltage value to the low voltage value of setting again, temperature remains on low temperature always, finally pressure is down to the pressing process of low pressure from rated high voltage value, temperature remains on low temperature always, and whole pressing process is accompanied by and vacuumizes control.
2. copper-clad plate according to claim 1 subtracts pound and falls to pressing drawing method, it is characterized in that: described in step 1, heat up gradually and refer to from low to high, by initial temperature 110-120 ℃, be warming up to 170-180 ℃, described in follow boost and refer to, pressure is by 5-6kg/cm
2boost to 20-45kg/cm
2.
Copper-clad plate according to claim 1 subtract pound fall to pressing drawing method, it is characterized in that: the high temperature rated value described in step 2 is 200-210 ℃.
Copper-clad plate according to claim 1 subtract pound fall to pressing drawing method, it is characterized in that: the number of times that repeatedly reduces pressure described in step 2 is three times.
Copper-clad plate according to claim 1 subtract pound fall to pressing drawing method, it is characterized in that: the low voltage value of setting described in step 2 is 8-10kg/cm
2.
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| CN102310616B true CN102310616B (en) | 2014-03-12 |
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Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103612464B (en) * | 2013-11-11 | 2015-11-25 | 莱芜金鼎电子材料有限公司 | A kind of double side flexible copper coated board and preparation method thereof |
| CN104066278A (en) * | 2014-06-19 | 2014-09-24 | 四川普瑞森电子有限公司 | Resistance welding pretreatment method of printed circuit board and resistance welding pretreatment roughening micro-etching agent |
| CN104080281B (en) * | 2014-07-04 | 2017-01-25 | 华进半导体封装先导技术研发中心有限公司 | Laminating method of printed circuit board |
| CN105873367B (en) * | 2016-05-27 | 2019-03-05 | 深圳崇达多层线路板有限公司 | A method of reducing multi-layer board angularity |
| CN106476405B (en) * | 2016-09-30 | 2019-04-16 | 生益电子股份有限公司 | The lamination sheeting process and PCB of PCB |
| CN110557899B (en) * | 2019-08-28 | 2020-12-29 | 广州广合科技股份有限公司 | Method for processing expansion and shrinkage of PCB finished board |
| CN111774437B (en) * | 2020-07-28 | 2022-04-08 | 宁波江丰电子材料股份有限公司 | Pressurizing and shaping method for target material after welding |
| CN113635649B (en) * | 2021-08-17 | 2023-09-22 | 天长市京发铝业有限公司 | Copper-clad plate pressing method |
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|---|---|---|---|---|
| CN1424868A (en) * | 2001-12-08 | 2003-06-18 | 周献刚 | Method for producing basalt fiber reinforced copper coated boards |
| CN101733995A (en) * | 2009-12-08 | 2010-06-16 | 广东生益科技股份有限公司 | Copper-clad plate lamination and pressurization method |
| CN102069615A (en) * | 2010-11-11 | 2011-05-25 | 广东生益科技股份有限公司 | Fabrication method of copper-clad plate |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01221244A (en) * | 1988-03-01 | 1989-09-04 | Mitsubishi Gas Chem Co Inc | Manufacture of copper-clad laminated sheet |
| KR100576385B1 (en) * | 2005-12-07 | 2006-05-03 | 이이근 | A method of manufacturing the heavy clad material(hcm) using anchor-treated cold-rolled copper foil |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1424868A (en) * | 2001-12-08 | 2003-06-18 | 周献刚 | Method for producing basalt fiber reinforced copper coated boards |
| CN101733995A (en) * | 2009-12-08 | 2010-06-16 | 广东生益科技股份有限公司 | Copper-clad plate lamination and pressurization method |
| CN102069615A (en) * | 2010-11-11 | 2011-05-25 | 广东生益科技股份有限公司 | Fabrication method of copper-clad plate |
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| Title |
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| JP平1-221244A 1989.09.04 |
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