CN112477363A - Preparation method of low-warpage copper-clad plate - Google Patents
Preparation method of low-warpage copper-clad plate Download PDFInfo
- Publication number
- CN112477363A CN112477363A CN202011289200.5A CN202011289200A CN112477363A CN 112477363 A CN112477363 A CN 112477363A CN 202011289200 A CN202011289200 A CN 202011289200A CN 112477363 A CN112477363 A CN 112477363A
- Authority
- CN
- China
- Prior art keywords
- copper
- clad plate
- drying
- prepreg
- drying process
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002360 preparation method Methods 0.000 title claims abstract description 10
- 238000001035 drying Methods 0.000 claims abstract description 40
- 238000004026 adhesive bonding Methods 0.000 claims abstract description 8
- 238000005245 sintering Methods 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 239000011889 copper foil Substances 0.000 claims description 3
- 238000007598 dipping method Methods 0.000 claims description 2
- 239000003292 glue Substances 0.000 claims description 2
- 238000012545 processing Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 5
- 238000001816 cooling Methods 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/16—Drying; Softening; Cleaning
- B32B38/164—Drying
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/16—Drying; Softening; Cleaning
- B32B38/164—Drying
- B32B2038/166—Removing moisture
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/732—Dimensional properties
- B32B2307/734—Dimensional stability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
Abstract
The invention discloses a preparation method of a low-warpage copper-clad plate, wherein a prepreg layer of the copper-clad plate is subjected to two different drying processes, wherein the first drying process is finished on a vertical gluing machine, the tension of the prepreg layer is set to be 50-120N, the temperature of a drying tunnel is 160-220 ℃, the speed of a vehicle is 0.5-5m/min, and the drying time is 5-25 min; the second stage of drying process is to place the wound prepreg layer in an oven for independent completion, wherein the oven temperature is 280-350 ℃, and the drying time is 4-6 h. The copper-clad plate prepared from the treated prepreg can effectively solve the problems of plate warping, large loss and the like, improves the dimensional stability of the copper-clad plate and reduces the plate loss. So that the final printed circuit board meets the expected reliability requirements of electrical and mechanical processing and the like.
Description
Technical Field
The invention relates to a preparation technology of a copper-clad plate, in particular to a preparation method of a low-warpage copper-clad plate.
Background
With the continuous development of communication and electronic products, the market demand of copper-clad plates is rapidly increased, and the copper-clad plates are widely used in the manufacturing industries of communication equipment, computers, automotive electronics, household appliances and the like. The copper-clad plate is a plate-shaped material which is prepared by impregnating a reinforcing material with resin to obtain a prepreg, then covering copper foil on one surface or two surfaces of the prepreg and carrying out hot-pressing sintering. The copper-clad plate is an indispensable component of the current Printed Circuit Board (PCB), and the performance of the copper-clad plate directly influences the subsequent processing and use of the PCB. When the copper-clad plate has a warping problem, the copper-clad plate is easily damaged due to overhigh instantaneous voltage in the using process, and serious loss is caused.
In the conventional process of preparing the prepreg by using a vertical gluing machine, the internal stress and warp and weft inclination of the prepreg are increased due to the fact that the traction force is large in the high-temperature drying process, so that the size stability of a copper-clad plate is poor, the warping is increased, and the influence on thin glass fiber cloth is more obvious. In the prior art, in order to improve the warping problem of the copper clad plate, the warping problem is improved by prolonging the cooling time of the final cooling stage during hot press molding in most industries, but the prolonging of the cooling time has a great influence on energy consumption, and the problems of overlarge internal stress and increased warp and weft inclination of a prepreg cannot be fundamentally improved, so that the warping of the prepared copper clad plate needs to be further improved.
Disclosure of Invention
In view of the problems and defects in the prior art, the invention provides the preparation method of the low-warpage copper-clad plate, and the copper-clad plate prepared by the method can effectively solve the problems of plate warpage, large loss and the like, so that the final printed circuit board meets the expected reliability requirements of electrical and mechanical processing and the like.
The technical scheme adopted by the invention is as follows: a preparation method of a low-warpage copper-clad plate comprises the steps of glue preparation, dipping, drying and sintering, wherein the prepared copper-clad plate structure comprises a copper foil layer and a prepreg layer, and is characterized in that the prepreg layer is subjected to two-stage drying process treatment, wherein the first-stage drying process is finished on a vertical gluing machine, the tension of the prepreg layer is set to be 50-120N in the first-stage drying process, the temperature of a drying tunnel is 160-220 ℃, the vehicle speed is 0.5-5m/min, and the drying time is 5-25 min; the second stage of drying process is to place the wound prepreg layer in an oven for independent completion, wherein the oven temperature is 280-350 ℃, and the drying time is 4-6 h.
The beneficial effects produced by the invention are as follows:
1. in the first drying process on the vertical gluing machine, the prepreg passes through a lower drying tunnel temperature under lower traction force, so that the problems of internal stress of the prepreg and increase of warp and weft inclination are effectively solved, and the problems of warping and dimensional stability of the copper-clad plate are improved.
2. In the second-stage drying process in the subsequent drying oven, the residual stress in the prepreg can be fully released by enough drying time, and small molecular impurities and the like in the prepreg are thoroughly decomposed and discharged, so that residues in the laminating process are avoided, the size stability of the copper-clad plate is improved, and the loss of the plate is reduced.
Detailed Description
The present invention will be described in detail with reference to specific examples.
Comparative example:
in the drying process of the prepreg on the vertical gluing machine, the tension is controlled to be 200N, and the temperature of a drying tunnel is 400 ℃. The obtained prepreg is subjected to lamination and sintering to obtain the copper-clad plate, and the warpage of the plate is 1.0% through testing.
Example 1:
in the first drying process of the prepreg on the vertical gluing machine, the tension is controlled to be 80N, the temperature of a drying tunnel is 160 ℃, the speed of the vehicle is 1m/min, and the drying time is 25 min. And in the second-stage drying process of placing the wound roll in an oven, the temperature of the oven is 280 ℃, and the drying time is 6 hours. The obtained prepreg is subjected to lamination and sintering to obtain the copper-clad plate, and the warpage of the plate is 0.2% through testing.
Example 2:
in the first drying process of the prepreg on the vertical gluing machine, the tension is controlled to be 120N, the temperature of a drying tunnel is 220 ℃, the speed of the vehicle is 5m/min, and the drying time is 5 min. And in the second-stage drying process of placing the wound roll in an oven, the temperature of the oven is 350 ℃, and the drying time is 4 hours. The obtained prepreg is subjected to lamination and sintering to obtain the copper-clad plate, and the warpage of the plate is 0.3% through testing.
Compared with the prior art, the invention fundamentally improves the problems of overlarge internal stress and increased warp and weft inclination of the prepreg, and the prepared copper-clad plate can effectively improve the problems of plate warping, large loss and the like, so that the final printed circuit board meets the expected reliability requirements of electrical and mechanical processing and the like. The invention has simple process and meets the requirements of production and use.
Claims (1)
1. A preparation method of a low-warpage copper-clad plate comprises the steps of glue preparation, dipping, drying and sintering, wherein the prepared copper-clad plate structure comprises a copper foil layer and a prepreg layer, and is characterized in that the prepreg layer is subjected to two-stage drying process treatment, wherein the first-stage drying process is finished on a vertical gluing machine, the tension of the prepreg layer is set to be 50-120N in the first-stage drying process, the temperature of a drying tunnel is 160-220 ℃, the vehicle speed is 0.5-5m/min, and the drying time is 5-25 min; the second stage of drying process is to place the wound prepreg layer in an oven for independent completion, wherein the oven temperature is 280-350 ℃, and the drying time is 4-6 h.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011289200.5A CN112477363A (en) | 2020-11-17 | 2020-11-17 | Preparation method of low-warpage copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011289200.5A CN112477363A (en) | 2020-11-17 | 2020-11-17 | Preparation method of low-warpage copper-clad plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112477363A true CN112477363A (en) | 2021-03-12 |
Family
ID=74931208
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011289200.5A Pending CN112477363A (en) | 2020-11-17 | 2020-11-17 | Preparation method of low-warpage copper-clad plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112477363A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114103307A (en) * | 2021-12-06 | 2022-03-01 | 中国电子科技集团公司第四十六研究所 | Low-warpage thermosetting resin copper-clad plate and preparation method thereof |
| CN115505279A (en) * | 2022-08-30 | 2022-12-23 | 中山新高电子材料股份有限公司 | LCP single-sided copper-clad plate and preparation method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102114453A (en) * | 2011-03-03 | 2011-07-06 | 吴江市东风电子有限公司 | Preparation method of dielectric cloth for preparing copper-clad plate |
| CN102490413A (en) * | 2011-12-16 | 2012-06-13 | 广东生益科技股份有限公司 | Manufacturing method of PTFE (polytetrafluoroethylene) coller clad plate |
| CN104070765A (en) * | 2014-06-30 | 2014-10-01 | 铜陵浩荣华科复合基板有限公司 | Manufacture process of halogen-free CEM-3 copper-clad plate with low warping degree and high peel resistance |
| CN105644064A (en) * | 2016-01-28 | 2016-06-08 | 深圳市弘海电子材料技术有限公司 | Method for preparing flexible non-adhesive polyimide copper-clad plate through two-layer method |
| CN105898984A (en) * | 2016-05-04 | 2016-08-24 | 江苏富仕德科技发展有限公司 | Production technology for baseplate made of polytetrafluoroethylene glass fiber composite |
| CN106854330A (en) * | 2016-11-25 | 2017-06-16 | 常州中英科技股份有限公司 | A kind of fluorine resin mixture and its prepreg and the copper-clad plate of preparation |
-
2020
- 2020-11-17 CN CN202011289200.5A patent/CN112477363A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102114453A (en) * | 2011-03-03 | 2011-07-06 | 吴江市东风电子有限公司 | Preparation method of dielectric cloth for preparing copper-clad plate |
| CN102490413A (en) * | 2011-12-16 | 2012-06-13 | 广东生益科技股份有限公司 | Manufacturing method of PTFE (polytetrafluoroethylene) coller clad plate |
| CN104070765A (en) * | 2014-06-30 | 2014-10-01 | 铜陵浩荣华科复合基板有限公司 | Manufacture process of halogen-free CEM-3 copper-clad plate with low warping degree and high peel resistance |
| CN105644064A (en) * | 2016-01-28 | 2016-06-08 | 深圳市弘海电子材料技术有限公司 | Method for preparing flexible non-adhesive polyimide copper-clad plate through two-layer method |
| CN105898984A (en) * | 2016-05-04 | 2016-08-24 | 江苏富仕德科技发展有限公司 | Production technology for baseplate made of polytetrafluoroethylene glass fiber composite |
| CN106854330A (en) * | 2016-11-25 | 2017-06-16 | 常州中英科技股份有限公司 | A kind of fluorine resin mixture and its prepreg and the copper-clad plate of preparation |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114103307A (en) * | 2021-12-06 | 2022-03-01 | 中国电子科技集团公司第四十六研究所 | Low-warpage thermosetting resin copper-clad plate and preparation method thereof |
| CN115505279A (en) * | 2022-08-30 | 2022-12-23 | 中山新高电子材料股份有限公司 | LCP single-sided copper-clad plate and preparation method thereof |
| CN115505279B (en) * | 2022-08-30 | 2024-02-27 | 中山新高电子材料股份有限公司 | LCP (liquid crystal display) single-sided copper-clad plate and preparation method thereof |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210312 |