CN109496076B - Manufacturing process of unidirectional fiber circuit board - Google Patents
Manufacturing process of unidirectional fiber circuit board Download PDFInfo
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- CN109496076B CN109496076B CN201811559597.8A CN201811559597A CN109496076B CN 109496076 B CN109496076 B CN 109496076B CN 201811559597 A CN201811559597 A CN 201811559597A CN 109496076 B CN109496076 B CN 109496076B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
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Abstract
A manufacturing process of a unidirectional fiber circuit board comprises the steps of stacking two unidirectional fiber prepregs according to the fiber direction, covering the upper surface and the lower surface of each unidirectional fiber prepreg with copper foils, enabling the rough surface of each copper foil to face the prepreg, enabling the smooth surface of each copper foil to face outwards to obtain a sample, stacking a plurality of samples, covering the upper surface and the lower surface of each sample with mirror steel plates, putting the samples into a vacuum compressor, and preparing a unidirectional fiber copper-clad plate through a hot pressing process; cutting the unidirectional fiber copper-clad plate into working plates according to the direction of fiber cloth, polishing and drying the copper foil surface of the working plates, coating ink on the two surfaces of the dried working plates, drying, exposing, stripping and etching circuits; and passivating the etched fiber circuit board to obtain the unidirectional fiber circuit board. The invention overcomes the defects that the traditional gum dipping glass cloth base circuit board has low elasticity, cannot generate large-scale elastic deformation, is easy to warp and deform at low thickness, has low yield and the like, and is widely suitable for jacquard combs of textile machinery, ferroelectric driver devices of automatic control systems and the like.
Description
Technical Field
The invention relates to a manufacturing method of a high-elasticity copper-clad thin plate and a manufacturing process of an elastic PCB (printed Circuit Board), belonging to the crossing field of the special copper-clad plate field and the material field. The high-elasticity copper-clad plate is widely applied to the fields of textile industry, medical instruments, marine military products and the like due to excellent insulativity, excellent elasticity and good operation processability, and particularly relates to a manufacturing process of a unidirectional fiber circuit board.
Background
The gum dipping glass cloth-based copper-clad plate produced according to the traditional copper-clad plate manufacturing technology has extremely low elasticity, cannot adapt to large-scale elastic deformation and is difficult to meet the working requirement of the copper-clad plate on the occasion of continuous elastic deformation; in addition, the sheet copper-clad plate has the problems of poor thickness precision and difficult effective control.
Disclosure of Invention
The invention aims to overcome the defects in the traditional copper-clad plate technology and provide a manufacturing process of a unidirectional fiber circuit sheet with good elasticity and excellent insulativity.
In order to achieve the purpose, the invention adopts the following technical scheme:
a manufacturing process of a unidirectional fiber circuit board comprises the following steps:
1) the manufacturing process of the unidirectional fiber copper-clad plate comprises the following steps:
stacking two unidirectional fiber prepregs according to the fiber direction, respectively covering the upper surface and the lower surface of the unidirectional fiber prepregs with copper foils, enabling the rough surfaces of the copper foils to face the prepregs and the smooth surfaces of the copper foils to face outwards to obtain samples, after stacking a plurality of samples, covering the upper surface and the lower surface with mirror steel plates, then putting the samples into a vacuum compressor, and preparing the unidirectional fiber copper-clad plate through a hot pressing process;
2) the manufacturing process of the fiber circuit board comprises the following steps:
cutting the unidirectional fiber copper-clad plate into working plates according to the direction of fiber cloth, polishing and drying the copper foil surface of the working plates, coating ink on the two surfaces of the dried working plates, drying, exposing, stripping and etching circuits; and passivating the etched fiber circuit board to obtain the unidirectional fiber circuit board.
The invention is further improved in that the number of the samples in the step 1) is 10-15.
The further improvement of the invention is that the unidirectional fiber prepreg comprises, by mass, 34-37% of resin and 63-66% of unidirectional fiber.
The further improvement of the invention is that the gelation time of the unidirectional fiber prepreg is 130-150 s, and the thickness of the unidirectional fiber prepreg is 1.15-2.5 mm.
The invention has the further improvement that the hot pressing process comprises the following steps:
after the hot press is started, timing is started when the initial temperature is 40 ℃ and the initial pressure is 8 kpa; when the time is 10min, the temperature is increased to 80 ℃, and the pressure is increased to 12 kpa; when the time is 20min, the temperature is increased to 100 ℃, and the pressure is increased to 18 kpa; when the time is 45min, the temperature is increased to 110 ℃, and the pressure is increased to 22 kpa; when the time is 55min, the temperature is increased to 130 ℃, and the pressure is increased to 26 kpa; when the time is 60min, the temperature is increased to 140 ℃, and the pressure is increased to 30 kpa; the temperature is increased to 145 ℃ and the pressure is increased to 32kpa during 80min, and the temperature is kept constant at 145 ℃ and the pressure is kept constant at 32kpa during 180 min; when the temperature is reduced to 120 ℃ within 210min, the pressure is 32 kpa; when the temperature is reduced to 80 ℃ in 220min, the pressure is 32 kpa; at 230min, the temperature is reduced to 40 ℃, and the pressure is still 32 kpa; when 240min, the temperature is reduced to 30 ℃, and the pressure is reduced to 0 kpa; the whole temperature and pressure rising and reducing process is a uniform-speed rising and reducing process; or
After the hot press is started, 10kpa is obtained; at 18min, the temperature is increased to 90 ℃, and the pressure is increased to 18 kpa; at 40min, the temperature is increased to 100 ℃, and the pressure is increased to 21 kpa; when the time is 60min, the temperature is increased to 120 ℃, and the pressure is increased to 25 kpa; when the time is 75min, the temperature is increased to 130 ℃, and the pressure is increased to 30 kpa; when the time is 100min, the temperature is increased to 140 ℃, and the pressure is increased to 32 kpa; at 150 min and 200min, the temperature is raised to 145 ℃ and kept unchanged, and the pressure is kept unchanged until 32 kpa; when the temperature is reduced to 110 ℃ in 220min, the pressure is 32 kpa; when the temperature is reduced to 60 ℃ at 230min, the pressure is 32 kpa; when the time is 240min, the temperature is reduced to 35 ℃, and the pressure is reduced to 0 kpa; the whole temperature and pressure rising and reducing process is a uniform-speed rising and reducing process; or
After the hot press is started, timing is started when the initial temperature is 40 ℃ and the initial pressure is 6 kpa; when the time is 8min, the temperature is increased to 75 ℃, and the pressure is increased to 11 kpa; when the time is 15min, the temperature is increased to 90 ℃, and the pressure is increased to 16 kpa; when the time is 35min, the temperature is increased to 110 ℃, and the pressure is increased to 20 kpa; when the time is 50min, the temperature is increased to 120 ℃, and the pressure is increased to 22 kpa; at 70min, the temperature is raised to 130 ℃, and the pressure is raised to 25 kpa; when the time is 90min, the temperature is increased to 140 ℃, and the pressure is increased to 30 kpa; 145 and 190min, the temperature is increased to 145 ℃ and kept unchanged, and the pressure is increased to 32kpa and kept unchanged; when the temperature is reduced to 90 ℃ in 220min, the pressure is 32 kpa; when the temperature is reduced to 55 ℃ at 230min, the pressure is 32 kpa; when the time is 250min, the temperature is reduced to 30 ℃, and the pressure is reduced to 0 kpa; the whole temperature and pressure rising and reducing process is a uniform-speed rising and reducing process; or
After the hot press is started, timing is started when the initial temperature is 40 ℃ and the initial pressure is 7 kpa; when 7min, the temperature is increased to 65 ℃, and the pressure is increased to 10 kpa; when the time is 14min, the temperature is increased to 80 ℃, and the pressure is increased to 15 kpa; when the time is 35min, the temperature is increased to 100 ℃, and the pressure is increased to 18 kpa; when the time is 50min, the temperature is increased to 120 ℃, and the pressure is increased to 22 kpa; at 70min, the temperature is raised to 140 ℃, and the pressure is raised to 25 kpa; when the time is 85min, the temperature is increased to 145 ℃, and the pressure is increased to 28 kpa; when the time is 130min, the temperature is increased to 145 ℃, and the pressure is increased to 31 kpa; when the time is 200min, the temperature is increased to 145 ℃, and the pressure is increased to 32 kpa; when the time is 220min, the temperature is reduced to 95 ℃, and the pressure is reduced to 31 kpa; when the temperature is reduced to 60 ℃ at 230min, the pressure is 31 kpa; when 240min, the temperature is reduced to 45 ℃, and the pressure is 31 kpa; when the time is 250min, the temperature is reduced to 35 ℃, and the pressure is reduced to 0 kpa; the whole temperature and pressure rising and reducing process is a uniform-speed rising and reducing process; or
After the hot press is started, timing is started when the initial temperature is 40 ℃ and the initial pressure is 6 kpa; when the time is 7min, the temperature is increased to 55 ℃, and the pressure is increased to 9 kpa; when the time is 12min, the temperature is increased to 80 ℃, and the pressure is increased to 12 kpa; when the time is 30min, the temperature is increased to 95 ℃, and the pressure is increased to 16 kpa; when the time is 45min, the temperature is increased to 110 ℃, and the pressure is increased to 20 kpa; at 65min, the temperature is increased to 135 ℃, and the pressure is increased to 28 kpa; when the time is 85min, the temperature is increased to 140 ℃, and the pressure is increased to 28 kpa; at 120min, the temperature is increased to 145 ℃, and the pressure is increased to 30 kpa; at 150 min and 210min, the temperature is kept constant when the temperature reaches 145 ℃, and the pressure is kept constant when the pressure is increased to 32 kpa; when the temperature is reduced to 90 ℃ during 230min, the pressure is reduced to 30 kpa; when 240min, the temperature is reduced to 55 ℃, and the pressure is reduced to 30 kpa; when the time is 250min, the temperature is reduced to 40 ℃, and the pressure is reduced to 0 kpa; the whole temperature and pressure rising and reducing process is a uniform-speed rising and reducing process.
A further development of the invention is that the passivation is carried out in particular with a K concentration of 15% by mass2Cr2O7Soaking in the solution for 6-10 min.
Compared with the prior art, the invention has the following beneficial effects:
the invention combines the FR-4 copper clad laminate manufacturing technology on the basis of the traditional copper clad laminate manufacturing technology, solves the problems of large thickness deviation, serious warpage, low dimensional precision and no elasticity of the unidirectional fiber copper clad laminate by adopting a hot pressing process, and has the key technology that the problem of low elasticity and accurate thickness control of the traditional FR-4 copper clad laminate are solved by using the special unidirectional gum dipping glass fiber and the subsequent corresponding hot pressing process, thereby effectively solving the problem of low qualification rate caused by large outline dimension deviation of the unidirectional fiber circuit board. The unidirectional fiber circuit board prepared by the invention has the advantages of good insulation resistance, good elasticity, no warpage, small thickness, small deviation, high outline dimension precision, easy processing into different lines, and suitability for jacquard combs of textile machinery, ferroelectric driver parts of automatic control systems and the like.
Furthermore, the invention adopts a specific hot pressing process, and prepares the unidirectional glass fiber copper-clad plate with better performance by controlling temperature, time and pressure, thereby preparing the unidirectional glass fiber circuit board with excellent elasticity and insulating property.
Drawings
FIG. 1 is a schematic structural diagram of a unidirectional glass fiber copper-clad plate.
Fig. 2 is a schematic structural diagram of a fiber circuit board.
FIG. 3 is a process flow diagram of a unidirectional glass fiber copper-clad plate.
Fig. 4 is a process flow diagram of a fiber circuit board.
In the figure, 1 is copper foil, 2 is unidirectional glass fiber glue dipping adhesive layer, and 3 is copper foil circuit.
Detailed Description
The invention provides a manufacturing process of a unidirectional fiber circuit board with good elasticity and excellent insulation, which is described below by combining a process flow chart with a process flow chart shown in figure 3 and figure 4.
According to the mass percent, the unidirectional fiber prepreg comprises 34-37% of resin and 63-66% of unidirectional fiber. The gelation time of the unidirectional fiber prepreg is 130-150 s, and the thickness of the unidirectional fiber prepreg is 1.15-2.5 mm.
The base material of the unidirectional fiber copper-clad plate is a prepreg which is prepared by soaking unidirectional glass fiber in epoxy resin adhesive and baking, the prepreg is used as an intermediate layer, electrolytic copper foils are arranged on the upper layer and the lower layer, and the unidirectional fiber copper-clad thin-layer circuit board with the interlayer structure is prepared by putting the prepreg into a vacuum press and pressing the prepreg at a certain temperature and under a certain pressure state. Then blanking the unidirectional fiber copper-clad plate according to the required size, shearing the unidirectional fiber copper-clad plate into a fiber circuit working plate, punching a positioning hole on the working plate, and then carrying out polishing, printing ink, exposure, stripping, etching, inspection, appearance milling, edge grinding, size inspection and a plurality of links, thereby completing the process manufacturing process of the fiber circuit board. The specific process is as follows:
the production raw materials adopted by the invention are as follows: the specification requirements of the unidirectional glass fiber impregnated prepreg are shown in Table 1
Electrolytic copper foil 520 x 620mm, thickness 0.018 mm.
The method specifically comprises the following steps:
1) manufacturing procedure of unidirectional fiber copper-clad plate
And (3) preparing a plurality of 500 × 600mm unidirectional fiber prepreg glue surfaces to glue surfaces according to the direction of the fiber cloth, and neatly stacking. Wiping a mirror steel plate by using dust-free cloth, placing a copper foil on the mirror steel plate to require the copper foil surface to be smooth and wrinkle-free, then placing a prepared fiber cloth prepreg on the copper foil, placing a copper foil on the fiber cloth prepreg, placing a clean mirror steel plate on the copper foil, stacking foil plates from bottom to top in sequence, requiring the upper and lower steel plates and the loaded fiber prepreg on each layer on a vertical line, after four sides of the loaded plate are fixed, slowly pushing the plate into a vacuum press, setting hot pressing parameters for pressing different control points according to any hot pressing process in tables 2-6 (namely in examples 1-5), starting the press, automatically completing a laminating process by the press, reducing the temperature of the press to be below 40 ℃, taking out the pressed plate, and removing burrs to obtain the unidirectional fiber copper-clad plate with the specified thickness.
2) Manufacturing process of fiber circuit board
And cutting the qualified unidirectional fiber copper-clad plate into a working plate with the size of 300 x 250mm according to the direction of the fiber cloth. Drilling a positioning hole at the edge of the working plate according to the process file; polishing is started, and the polished working plate is placed into a drying oven with hot air circulation to be dried for 10-15 min at the temperature of 80-90 ℃; coating ink on two sides of the polished working plate, drying the first side printed at 80-85 ℃ for 5-8 min, cooling and printing the other side, and drying at 80-85 ℃ for 10-15 min after printing; exposing the printed working plate, removing ink, drying, and etching the circuit in an etching machine (the ratio of etching solution to hydrochloric acid: H)2O2：H2Preparing O-; polishing and drying the etched fiber circuit board again, cooling and placing 15 wt% of K2Cr2O7Passivating the solution for 6-10 min, taking out, washing with purified water, and drying in an oven with hot air circulation at 50-55 ℃ for 20-25 min; performing circuit inspection on working boardChecking, namely milling the checked working plate into a shape on a numerical control machine according to the process parameters; lightly grinding the milled rough edges of the fiber circuit board by using 1000-mesh abrasive paper to remove the rough edges; inspecting the fiber circuit board with burrs ground off, wherein the length and width deviation is +0.1mm, and the thickness deviation is +0.02 mm; and packaging and labeling the qualified fiber circuit board.
Example 1
1) Manufacturing process of unidirectional fiber copper-clad plate
As shown in the process flow chart of fig. 3, firstly, the unidirectional glass fiber prepregs (specification requirements are shown in table 1) qualified by inspection are cut into the sizes required by the specification on a clean working platform, a plurality of unidirectional glass fiber prepregs (determined according to the thickness and the size of the final product) are stacked in order according to the fiber orientation, the upper and lower surfaces of the stacked unidirectional glass fiber prepregs (namely, the unidirectional glass fiber glue dipping adhesive layer 2) are covered by copper foils 1 with the specified thickness, the rough surfaces of the copper foils face the prepregs, and the smooth surfaces face outwards, so that a sandwich structure is formed, as shown in fig. 1. And stacking the sandwich samples with about 10-15 layers of sandwich structures, covering the upper surface and the lower surface with mirror steel plates, then placing the sandwich samples into a vacuum press, fixing the four sides, and heating and pressurizing, wherein the hot pressing process adopted in the example 1 is shown in the table 2. And after the hot pressing is finished, stopping heating, cooling to below 40 ℃, opening a cabin door of the pressing machine, taking out a pressed finished product, and finishing the manufacturing process of the unidirectional fiber copper-clad plate. The process technology is mainly in a hot-press molding stage, and the process parameters in the stage are key indexes for ensuring the thickness uniformity and no warpage of the manufactured unidirectional fiber copper-clad plate and are basic processes for ensuring that all technical indexes of the later-stage fiber circuit board are qualified.
TABLE 1 unidirectional fiber prepreg (500X 600mm) index
| Mass content of fiber | Mass content of resin | Gelation time | Deviation in thickness |
| 63～66％ | 34～37％ | 130 to 150 seconds | 1.20+0.05mm |
Table 2 hot pressing process conditions of example 1 (divided into 12 control points)
| Process parameters | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 |
| Pressure (kpa) | 8 | 12 | 18 | 22 | 26 | 30 | 32 | 32 | 32 | 32 | 32 | 0 |
| Temperature (. degree.C.) | 40 | 80 | 100 | 110 | 130 | 140 | 145 | 145 | 120 | 80 | 40 | 30 |
| Time (min) | 0 | 10 | 20 | 45 | 55 | 60 | 80 | 180 | 210 | 220 | 230 | 240 |
Referring to table 2, the hot pressing process conditions of example 1 were: after the hot press is started, timing is started when the initial temperature is 40 ℃ and the initial pressure is 8 kpa; when the time is 10min, the temperature is increased to 80 ℃, and the pressure is increased to 12 kpa; when the time is 20min, the temperature is increased to 100 ℃, and the pressure is increased to 18 kpa; when the time is 45min, the temperature is increased to 110 ℃, and the pressure is increased to 22 kpa; when the time is 55min, the temperature is increased to 130 ℃, and the pressure is increased to 26 kpa; when the time is 60min, the temperature is increased to 140 ℃, and the pressure is increased to 30 kpa; the temperature is increased to 145 ℃ and the pressure is increased to 32kpa during 80min, and the temperature is kept constant at 145 ℃ and the pressure is kept constant at 32kpa during 180 min; when the temperature is reduced to 120 ℃ within 210min, the pressure is 32 kpa; when the temperature is reduced to 80 ℃ in 220min, the pressure is 32 kpa; at 230min, the temperature is reduced to 40 ℃, and the pressure is still 32 kpa; at 240min, the temperature was reduced to 30 ℃ and the pressure was reduced to 0 kpa. The whole temperature and pressure rising and reducing process is a computer-controlled uniform-speed rising and falling process.
2) Manufacturing process of fiber circuit board
And as shown in a process flow chart 4, cutting the qualified unidirectional fiber copper-clad plate into working plates with the size of 300 x 250mm according to the direction of the fiber cloth. Drilling a positioning hole at the edge of the working plate according to the process file; polishing, namely putting the polished working plate into a drying oven with hot air circulation to dry for 15min at 80 ℃; coating ink on two sides of the polished working plate, printing the first side, drying at 85 ℃ for 6min, cooling to print the other side, and drying at 80 ℃ for 15min after printing; exposing the printed working plate, removing ink, drying, and etching the circuit in an etching machine (the ratio of etching solution to hydrochloric acid: H)2O2：H2O is 3:1 by volume ratioPreparation); polishing and drying the etched fiber circuit board again, cooling and placing 15 wt% of K2Cr2O7Passivating the solution for 8min, taking out, washing with purified water, and oven drying at 55 deg.C for 20 min; carrying out line inspection on the working plate, and milling the inspected working plate into an appearance on a numerical control machine according to the technological parameters; lightly grinding the milled rough edges of the fiber circuit board by using 1000-mesh abrasive paper to remove the rough edges; inspecting the fiber circuit board with burrs ground off, wherein the length and width deviation is +0.1mm, and the thickness deviation is +0.02 mm; and packaging and labeling the qualified fiber circuit board. The structure of the prepared unidirectional fiber circuit board is shown in figure 2, the upper layer is a copper foil circuit 3, the lower layer is a copper foil circuit 3, and a unidirectional glass fiber gumming bonding layer 2 is arranged between the upper layer and the lower layer.
Example 2
The difference from example 1 lies in the hot pressing process, which is specified in table 3.
Table 3 hot pressing process conditions of example 2 (divided into 12 control points)
Referring to table 3, the hot pressing process conditions of example 2 were: after the hot press is started, timing is started when the initial temperature is 40 ℃ and the initial pressure is 7 kpa; when the time is 9min, the temperature is increased to 70 ℃, and the pressure is increased to 10 kpa; at 18min, the temperature is increased to 90 ℃, and the pressure is increased to 18 kpa; at 40min, the temperature is increased to 100 ℃, and the pressure is increased to 21 kpa; when the time is 60min, the temperature is increased to 120 ℃, and the pressure is increased to 25 kpa; when the time is 75min, the temperature is increased to 130 ℃, and the pressure is increased to 30 kpa; when the time is 100min, the temperature is increased to 140 ℃, and the pressure is increased to 32 kpa; at 150 min and 200min, the temperature is raised to 145 ℃ and kept unchanged, and the pressure is kept unchanged until 32 kpa; when the temperature is reduced to 110 ℃ in 220min, the pressure is 32 kpa; when the temperature is reduced to 60 ℃ at 230min, the pressure is 32 kpa; at 240min, the temperature was reduced to 35 ℃ and the pressure to 0 kpa. The whole temperature and pressure rising and reducing process is a computer-controlled uniform-speed rising and falling process.
Example 3
The difference from example 1 lies in the hot pressing process, which is specified in table 4.
Table 4 hot pressing process conditions of example 3 (divided into 12 control points)
Referring to table 4, the hot pressing process conditions of example 3 were: after the hot press is started, timing is started when the initial temperature is 40 ℃ and the initial pressure is 6 kpa; when the time is 8min, the temperature is increased to 75 ℃, and the pressure is increased to 11 kpa; when the time is 15min, the temperature is increased to 90 ℃, and the pressure is increased to 16 kpa; when the time is 35min, the temperature is increased to 110 ℃, and the pressure is increased to 20 kpa; when the time is 50min, the temperature is increased to 120 ℃, and the pressure is increased to 22 kpa; at 70min, the temperature is raised to 130 ℃, and the pressure is raised to 25 kpa; when the time is 90min, the temperature is increased to 140 ℃, and the pressure is increased to 30 kpa; 145 and 190min, the temperature is increased to 145 ℃ and kept unchanged, and the pressure is increased to 32kpa and kept unchanged; when the temperature is reduced to 90 ℃ in 220min, the pressure is 32 kpa; when the temperature is reduced to 55 ℃ at 230min, the pressure is 32 kpa; at 250min, the temperature was reduced to 30 ℃ and the pressure was reduced to 0 kpa. The whole temperature and pressure rising and reducing process is a computer-controlled uniform-speed rising and falling process.
Example 4
The difference from example 1 lies in the hot pressing process, which is specified in table 5.
TABLE 5 Hot pressing Process conditions for example 4 (divided into 13 control points)
| Examples | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 |
| Pressure (kpa) | 7 | 10 | 15 | 18 | 22 | 25 | 28 | 31 | 32 | 31 | 31 | 31 | 0 |
| Temperature (. degree.C.) | 40 | 65 | 80 | 100 | 120 | 140 | 145 | 145 | 145 | 95 | 60 | 45 | 35 |
| Time (min) | 0 | 7 | 14 | 35 | 50 | 70 | 85 | 130 | 200 | 220 | 230 | 240 | 250 |
Referring to table 5, the hot pressing process conditions of example 4 were: after the hot press is started, timing is started when the initial temperature is 40 ℃ and the initial pressure is 7 kpa; when 7min, the temperature is increased to 65 ℃, and the pressure is increased to 10 kpa; when the time is 14min, the temperature is increased to 80 ℃, and the pressure is increased to 15 kpa; when the time is 35min, the temperature is increased to 100 ℃, and the pressure is increased to 18 kpa; when the time is 50min, the temperature is increased to 120 ℃, and the pressure is increased to 22 kpa; at 70min, the temperature is raised to 140 ℃, and the pressure is raised to 25 kpa; when the time is 85min, the temperature is increased to 145 ℃, and the pressure is increased to 28 kpa; when the time is 130min, the temperature is increased to 145 ℃, and the pressure is increased to 31 kpa; when the time is 200min, the temperature is increased to 145 ℃, and the pressure is increased to 32 kpa; when the time is 220min, the temperature is reduced to 95 ℃, and the pressure is reduced to 31 kpa; when the temperature is reduced to 60 ℃ at 230min, the pressure is 31 kpa; when 240min, the temperature is reduced to 45 ℃, and the pressure is 31 kpa; at 250min, the temperature was reduced to 35 ℃ and the pressure to 0 kpa. The whole temperature and pressure rising and reducing process is a computer-controlled uniform-speed rising and falling process.
Example 5
The difference from example 1 lies in the hot pressing process, which is specified in table 6.
TABLE 6 Hot pressing Process conditions for example 5 (divided into 13 control points)
| Examples | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 |
| Pressure (kpa) | 6 | 9 | 12 | 16 | 20 | 28 | 28 | 30 | 32 | 32 | 30 | 30 | 0 |
| Temperature (. degree.C.) | 40 | 55 | 80 | 95 | 110 | 135 | 140 | 145 | 145 | 145 | 90 | 55 | 40 |
| Time (min) | 0 | 7 | 12 | 30 | 45 | 65 | 85 | 120 | 150 | 210 | 230 | 240 | 250 |
Referring to table 6, the hot pressing process conditions of example 5 were: after the hot press is started, timing is started when the initial temperature is 40 ℃ and the initial pressure is 6 kpa; when the time is 7min, the temperature is increased to 55 ℃, and the pressure is increased to 9 kpa; when the time is 12min, the temperature is increased to 80 ℃, and the pressure is increased to 12 kpa; when the time is 30min, the temperature is increased to 95 ℃, and the pressure is increased to 16 kpa; when the time is 45min, the temperature is increased to 110 ℃, and the pressure is increased to 20 kpa; at 65min, the temperature is increased to 135 ℃, and the pressure is increased to 28 kpa; when the time is 85min, the temperature is increased to 140 ℃, and the pressure is increased to 28 kpa; at 120min, the temperature is increased to 145 ℃, and the pressure is increased to 30 kpa; at 150 min and 210min, the temperature is kept constant when the temperature reaches 145 ℃, and the pressure is kept constant when the pressure is increased to 32 kpa; when the temperature is reduced to 90 ℃ during 230min, the pressure is reduced to 30 kpa; when 240min, the temperature is reduced to 55 ℃, and the pressure is reduced to 30 kpa; at 250min, the temperature was reduced to 40 ℃ and the pressure was reduced to 0 kpa. The whole temperature and pressure rising and reducing process is a computer-controlled uniform-speed rising and falling process.
The properties of the unidirectional glass fiber copper-clad plates and unidirectional glass fiber circuit boards prepared in examples 1, 2 and 3 are shown in tables 7 and 8.
3) Performance indexes of the unidirectional fiber copper-clad plate and the unidirectional fiber circuit board are as follows:
TABLE 7 technical Properties of copper-clad unidirectional glass fiber plate (sample size: 0.27X 200X 300mm)
TABLE 8 technical Properties of unidirectional glass fiber circuit board (sample size: 0.27X 7.0X 52mm)
As can be seen from Table 7, the unidirectional glass fiber copper-clad plate prepared by the invention has excellent performance, and as can be seen from Table 8, the unidirectional glass fiber circuit board prepared by the invention has excellent elasticity and insulating property.
According to the unidirectional fiber circuit board, the intermediate layer is made of unidirectional glass fiber dipped with epoxy resin, the prepreg prepared by a baking process is used as an insulating bonding layer, and the upper layer and the lower layer are made of electrolytic copper foils. The three-layer structure is subjected to a certain temperature and pressure process, and then is subjected to hot pressing to form the high-elasticity unidirectional fiber copper-clad plate (figure 1). Then the unidirectional fiber copper-clad plate is manufactured into a unidirectional glass fiber thin-layer circuit board (figure 2) according to a PCB (printed circuit board) manufacturing process. The invention overcomes the defects that the traditional gum dipping glass cloth base circuit board has low elasticity, cannot generate large-scale elastic deformation, is easy to warp and deform at low thickness, has low yield and the like, and is widely suitable for jacquard combs of textile machinery, ferroelectric driver devices of automatic control systems and the like.
Claims (6)
1. A manufacturing process of a unidirectional fiber circuit board is characterized by comprising the following steps:
1) the manufacturing process of the unidirectional fiber copper-clad plate comprises the following steps:
stacking two unidirectional fiber prepregs according to the fiber direction, respectively covering the upper surface and the lower surface of the unidirectional fiber prepregs with copper foils, enabling the rough surfaces of the copper foils to face the prepregs and the smooth surfaces of the copper foils to face outwards to obtain samples, after stacking a plurality of samples, covering the upper surface and the lower surface with mirror steel plates, then putting the samples into a vacuum compressor, and preparing the unidirectional fiber copper-clad plate through a hot pressing process; wherein the thickness of the unidirectional fiber prepreg is 1.15-2.5 mm; the unidirectional fiber prepreg is prepared by the following processes: the unidirectional glass fiber is prepared by dipping epoxy resin glue and baking;
2) the manufacturing process of the fiber circuit board comprises the following steps:
cutting the unidirectional fiber copper-clad plate into working plates according to the direction of fiber cloth, polishing and drying the copper foil surface of the working plates, coating ink on the two surfaces of the dried working plates, drying, exposing, stripping and etching circuits; and passivating the etched fiber circuit board to obtain the unidirectional fiber circuit board.
2. The manufacturing process of a unidirectional fiber circuit board according to claim 1, wherein the number of the samples in the step 1) is 10-15.
3. The manufacturing process of the unidirectional fiber circuit board as claimed in claim 1, wherein the unidirectional fiber prepreg comprises, by mass, 34-37% of resin and 63-66% of unidirectional fiber.
4. The manufacturing process of the unidirectional fiber circuit board according to claim 1, wherein the gelation time of the unidirectional fiber prepreg is 130-150 s.
5. The manufacturing process of the unidirectional fiber circuit board as claimed in claim 1, wherein the hot pressing process is:
after the hot press is started, timing is started when the initial temperature is 40 ℃ and the initial pressure is 8 kpa; when the time is 10min, the temperature is increased to 80 ℃, and the pressure is increased to 12 kpa; when the time is 20min, the temperature is increased to 100 ℃, and the pressure is increased to 18 kpa; when the time is 45min, the temperature is increased to 110 ℃, and the pressure is increased to 22 kpa; when the time is 55min, the temperature is increased to 130 ℃, and the pressure is increased to 26 kpa; when the time is 60min, the temperature is increased to 140 ℃, and the pressure is increased to 30 kpa; the temperature is increased to 145 ℃ and the pressure is increased to 32kpa during 80min, and the temperature is kept constant at 145 ℃ and the pressure is kept constant at 32kpa during 180 min; when the temperature is reduced to 120 ℃ within 210min, the pressure is 32 kpa; when the temperature is reduced to 80 ℃ in 220min, the pressure is 32 kpa; at 230min, the temperature is reduced to 40 ℃, and the pressure is still 32 kpa; when 240min, the temperature is reduced to 30 ℃, and the pressure is reduced to 0 kpa; the whole temperature and pressure rising and reducing process is a uniform-speed rising and reducing process; or
After the hot press is started, 10kpa is obtained; at 18min, the temperature is increased to 90 ℃, and the pressure is increased to 18 kpa; at 40min, the temperature is increased to 100 ℃, and the pressure is increased to 21 kpa; when the time is 60min, the temperature is increased to 120 ℃, and the pressure is increased to 25 kpa; when the time is 75min, the temperature is increased to 130 ℃, and the pressure is increased to 30 kpa; when the time is 100min, the temperature is increased to 140 ℃, and the pressure is increased to 32 kpa; at 150 min and 200min, the temperature is raised to 145 ℃ and kept unchanged, and the pressure is kept unchanged until 32 kpa; when the temperature is reduced to 110 ℃ in 220min, the pressure is 32 kpa; when the temperature is reduced to 60 ℃ at 230min, the pressure is 32 kpa; when the time is 240min, the temperature is reduced to 35 ℃, and the pressure is reduced to 0 kpa; the whole temperature and pressure rising and reducing process is a uniform-speed rising and reducing process; or
After the hot press is started, timing is started when the initial temperature is 40 ℃ and the initial pressure is 6 kpa; when the time is 8min, the temperature is increased to 75 ℃, and the pressure is increased to 11 kpa; when the time is 15min, the temperature is increased to 90 ℃, and the pressure is increased to 16 kpa; when the time is 35min, the temperature is increased to 110 ℃, and the pressure is increased to 20 kpa; when the time is 50min, the temperature is increased to 120 ℃, and the pressure is increased to 22 kpa; at 70min, the temperature is raised to 130 ℃, and the pressure is raised to 25 kpa; when the time is 90min, the temperature is increased to 140 ℃, and the pressure is increased to 30 kpa; 145 and 190min, the temperature is increased to 145 ℃ and kept unchanged, and the pressure is increased to 32kpa and kept unchanged; when the temperature is reduced to 90 ℃ in 220min, the pressure is 32 kpa; when the temperature is reduced to 55 ℃ at 230min, the pressure is 32 kpa; when the time is 250min, the temperature is reduced to 30 ℃, and the pressure is reduced to 0 kpa; the whole temperature and pressure rising and reducing process is a uniform-speed rising and reducing process; or
After the hot press is started, timing is started when the initial temperature is 40 ℃ and the initial pressure is 7 kpa; when 7min, the temperature is increased to 65 ℃, and the pressure is increased to 10 kpa; when the time is 14min, the temperature is increased to 80 ℃, and the pressure is increased to 15 kpa; when the time is 35min, the temperature is increased to 100 ℃, and the pressure is increased to 18 kpa; when the time is 50min, the temperature is increased to 120 ℃, and the pressure is increased to 22 kpa; at 70min, the temperature is raised to 140 ℃, and the pressure is raised to 25 kpa; when the time is 85min, the temperature is increased to 145 ℃, and the pressure is increased to 28 kpa; when the time is 130min, the temperature is increased to 145 ℃, and the pressure is increased to 31 kpa; when the time is 200min, the temperature is increased to 145 ℃, and the pressure is increased to 32 kpa; when the time is 220min, the temperature is reduced to 95 ℃, and the pressure is reduced to 31 kpa; when the temperature is reduced to 60 ℃ at 230min, the pressure is 31 kpa; when 240min, the temperature is reduced to 45 ℃, and the pressure is 31 kpa; when the time is 250min, the temperature is reduced to 35 ℃, and the pressure is reduced to 0 kpa; the whole temperature and pressure rising and reducing process is a uniform-speed rising and reducing process; or
After the hot press is started, timing is started when the initial temperature is 40 ℃ and the initial pressure is 6 kpa; when the time is 7min, the temperature is increased to 55 ℃, and the pressure is increased to 9 kpa; when the time is 12min, the temperature is increased to 80 ℃, and the pressure is increased to 12 kpa; when the time is 30min, the temperature is increased to 95 ℃, and the pressure is increased to 16 kpa; when the time is 45min, the temperature is increased to 110 ℃, and the pressure is increased to 20 kpa; at 65min, the temperature is increased to 135 ℃, and the pressure is increased to 28 kpa; when the time is 85min, the temperature is increased to 140 ℃, and the pressure is increased to 28 kpa; at 120min, the temperature is increased to 145 ℃, and the pressure is increased to 30 kpa; at 150 min and 210min, the temperature is kept constant when the temperature reaches 145 ℃, and the pressure is kept constant when the pressure is increased to 32 kpa; when the temperature is reduced to 90 ℃ during 230min, the pressure is reduced to 30 kpa; when 240min, the temperature is reduced to 55 ℃, and the pressure is reduced to 30 kpa; when the time is 250min, the temperature is reduced to 40 ℃, and the pressure is reduced to 0 kpa; the whole temperature and pressure rising and reducing process is a uniform-speed rising and reducing process.
6. A process for manufacturing a unidirectional fiber circuit board as claimed in claim 1, wherein the passivation is performed by using K with a mass concentration of 15%2Cr2O7Soaking in the solution for 6-10 min.
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