CN111901985A - Composite lamination method based on microwave circuit board - Google Patents
Composite lamination method based on microwave circuit board Download PDFInfo
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- CN111901985A CN111901985A CN202010449489.6A CN202010449489A CN111901985A CN 111901985 A CN111901985 A CN 111901985A CN 202010449489 A CN202010449489 A CN 202010449489A CN 111901985 A CN111901985 A CN 111901985A
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- Prior art keywords
- circuit board
- microwave circuit
- microwave
- adhesive
- board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/085—Using vacuum or low pressure
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a composite lamination method based on a microwave circuit, which comprises the following steps from top to bottom: the first microwave circuit board, the first adhesive, the bonding board, the second adhesive and the second microwave circuit board are laminated in sequence and then are subjected to press molding by a vacuum hot pressing method. The composite laminated microwave circuit structure obtained by the invention can maintain the aging resistance and corrosion resistance of the circuit board while realizing the function of the microwave circuit, can improve the firmness of the system and enhance the mechanical performance of the system by utilizing the properties of high shear strength and good toughness of the bonding plate, and can also obtain good integral effect of the microwave circuit module by utilizing the external protection effect of the microwave circuit board. The composite laminated microwave circuit board produced by the invention has high reliability and strong environmental adaptability.
Description
Technical Field
The invention relates to the field of processes, in particular to a composite laminating method and a composite laminating process based on a microwave circuit.
Technical Field
With the continuous development of modern science and technology, the integration thought has been widely recognized and accepted by the families, and the composite laminated product based on the microwave circuit board is designed and manufactured by utilizing the integration thought, so that the microwave circuit board can be conformal to any curved surface, can be dynamically adjusted along with the change of the appearance, and can ensure that the microwave circuit has better adaptability and stability due to vibration and appearance change caused by pneumatics, cold and heat and the like.
Indeed, in the modern high-tech field, conformal design based on microwave circuit boards has played an increasingly important role, and composite lamination processes based on microwave circuit boards have also received increasingly extensive research and attention. A typical example of the conformal technology is a conformal array antenna, and in a modern wireless communication system, the conformal antenna can conform to the surface of a carrier platform running at a high speed, such as an airplane, a missile, a satellite, and the like, and does not damage the characteristics, such as the shape structure, the aerodynamics, and the like, of the carrier, so that the conformal antenna becomes a research hotspot in the antenna field. At present, as the conformal design based on the microwave circuit board is novel, relevant process reports in the literature are not seen.
Disclosure of Invention
The invention aims to provide a composite laminating method based on a microwave circuit.
The composite laminating method based on the microwave circuit board is characterized in that the composite laminating circuit comprises the following components from top to bottom: the first microwave circuit board, the first adhesive, the bonding board, the second adhesive and the second microwave circuit board are laminated in sequence and then are subjected to press molding by a vacuum hot pressing method.
The pressure loaded on the composite circuit board is not less than 3 standard atmospheric pressures, the hot pressing temperature is not less than 130 ℃, and the hot pressing time is 2.5-4 hours.
The first circuit board and the second circuit board comprise microwave dielectric plates, microwave circuit boards or microstrip patch antennas. Such as: the dielectric plate is Rogers 5880, the thickness of the dielectric plate is 0.254mm, and the thickness of the copper foil is 0.035 mm.
The first adhesive and the second adhesive comprise a cured sheet or a prepreg. Such as: prepreg taconli FR-27, 50um thick.
The adhesive sheet comprises a foam sheet. Such as: foam board degussa 71Hero, thickness 7 mm.
The specific processing method comprises the following steps:
(1) circuit board processing
The method is carried out according to the sequence of the standard steps of circuit board processing, namely material leading → material cutting → pretreatment → film pressing → negative film exposure imaging selection → development → etching pattern → film removing.
(2) Adhesive sheet processing
The bonding plate processing is carried out according to the sequence of 'material leading → cutting → cleaning → drying → heat treatment'.
Wherein the cleanness is for not letting there be impurity when bonding, and the stoving is for getting rid of steam, prevents that the later stage from arousing because of steam and bonding is invalid. Preferably, the drying is carried out by heating at a rate of 2-3 ℃/min and drying at a temperature of 130 ℃ for 5 hours in an air circulating oven. During the heat treatment, the temperature is raised to between 180 ℃ and 220 ℃ and kept for 48 hours.
(3) Pressing together
The press-fitting is performed in the order of "glue 2 on circuit board 2 → glue plate on glue 2 → glue 1 on glue plate → circuit board 1 on glue 1 → protection of upper and lower interlayer lamination release paper → vacuum heat pressing → cooling → plate removal".
Wherein, during vacuum hot pressing, the temperature is kept at 200 ℃ plus or minus 5 ℃, the pressure is kept at 4 standard atmospheric pressures, and the hot pressing time is 3 hours.
When cooling, the temperature is decreased gradually at 5 ℃ per 3 minutes until the temperature is normal.
The pressing sequence and the positions of all materials can not be changed, which is the advantage of the invention, so that the composite laminated microwave circuit structure can not only keep the aging-resistant and corrosion-resistant characteristics of the circuit board while realizing the functions of the microwave circuit, but also improve the firmness of the system and enhance the mechanical performance of the system by utilizing the properties of high shear strength and good toughness of the bonding plate, and can also obtain the good overall effect of the microwave circuit module by utilizing the external protection function of the microwave circuit board. The composite laminated microwave circuit board produced by the invention has high reliability and strong environmental adaptability.
(4) Machining and forming
CNC (computerized Numerical control) machining is adopted, and dust generated in cutting is sucked away by using a vacuum dust suction device in the machining process.
Preferably, a steel cutter is recommended in CNC machining, an industrial diamond blade with 60/72 grain size is embedded in a spiral mode, and the recommended rotating speed is 5400-12000r.p.m.
Preferably, compression molding techniques are recommended.
(5) Inspection package
Wherein, the first step and the second step are not time-sequential or can be carried out synchronously.
The invention solves the problem that no mature microwave circuit composite lamination process exists at home at present, and points out the direction for the engineering processing of the microwave circuit composite lamination technology. The composite laminated microwave circuit structure obtained by the invention can maintain the aging resistance and corrosion resistance of the circuit board while realizing the function of the microwave circuit, can improve the firmness of the system and enhance the mechanical performance of the system by utilizing the properties of high shear strength and good toughness of the bonding plate, and can also obtain good integral effect of the microwave circuit module by utilizing the external protection effect of the microwave circuit board. The composite laminated microwave circuit board produced by the invention has high reliability and strong environmental adaptability.
The invention has the technical effects that: the method of the invention is proposed for the first time, and compared with the method proposed by the similar document "Analysis and polarization of a two-wave polarization rotator for microwave frequency" (r.p.turres, and m.f. catedra, ieee ap), the processed polarization disk of the invention will not deform when being placed for a long time, and will not fail due to being affected by moisture, salt fog, etc.
Drawings
FIG. 1 is a schematic structural view of a composite layer produced by the present invention.
In the figure, the component 1 is a first microwave circuit board, the component 2 is a first adhesive, the component 3 is an adhesive board, the component 4 is a second adhesive, and the component 5 is a second microwave circuit board.
Detailed Description
The invention is further illustrated with reference to the following specific embodiments and the accompanying drawings.
Example (b):
plate material: rogers 5880, dielectric plate thickness 0.254mm, copper foil thickness 0.035 mm.
Prepreg preparation: taikangli FR-27, thickness 50 um.
And (3) bonding a plate: degussa 71Hero, thickness 7 mm.
1. Circuit board processing
The Rogers 5880 board is used, processing is carried out according to the sequence of 'leading material → cutting material → pretreatment → film pressing → negative film exposure imaging → development → etching pattern → film removing', and microstrip line etching of the microwave circuit board is carried out according to the specific engineering drawing requirements.
2. Adhesive sheet processing
The above-mentioned degussa 71Hero foam board was used, and the processing was performed in the order of "neck material → cutting → cleaning → drying → heat treatment".
As a preference
The drying is carried out by heating at the speed of 3-5 ℃/min and drying for 5 hours in an air circulation drying oven at the temperature of 150 ℃.
As a preference
During the heat treatment, the temperature is raised to between 180 ℃ and 220 ℃ and kept for 48 hours.
3. Pressing together
The lamination is performed in the sequence of "laminating prepreg on foam board → laminating circuit board on prepreg → laminating release paper protection between upper and lower layers → vacuum hot pressing → cooling → board removal", wherein the prepreg is Taconly FR-27, and the lamination sequence during lamination is as shown in FIG. 1.
4. Machining and forming
With CNC machining, dust generated during cutting is sucked away during machining.
As a preference
The CNC machining process recommends using a steel cutter, spirally embedding an industrial diamond blade with 60/72 granularity, and recommending the rotating speed of 5400-.
Preferably, compression molding techniques are used.
5. Inspection package
In the production process of the invention, the pressing sequence and the positions of all materials can not be changed, which is the advantage of the invention, so that the composite laminated microwave circuit structure can not only ensure the aging resistance and corrosion resistance of the circuit board while realizing the function of the microwave circuit, but also improve the firmness of the system and enhance the mechanical property of the system by utilizing the properties of high shear strength and good toughness of the bonding plate, and can also obtain the good integral effect of the microwave circuit module by utilizing the external protection function of the microwave circuit board. The composite laminated microwave circuit board produced by the invention has high reliability and strong environmental adaptability.
Claims (6)
1. A composite lamination method based on a microwave circuit board is characterized in that the composite lamination circuit comprises the following steps from top to bottom: the first microwave circuit board, the first adhesive, the bonding board, the second adhesive and the second microwave circuit board are laminated in sequence and then are subjected to press molding by a vacuum hot pressing method.
2. The microwave-based circuit board composite lamination method according to claim 1, wherein the pressure applied to the circuit board is not less than 3 standard atmospheres, the hot pressing temperature is not less than 130 ℃, and the hot pressing time is 2.5-4 hours.
3. The microwave-circuit-based composite lamination method according to claim 1, wherein the first microwave circuit board and the second microwave circuit board comprise microwave dielectric boards, microwave circuit boards, or microstrip patch antennas.
4. The microwave-circuit-board-based composite lamination method according to claim 1, wherein the first glue and the second glue comprise a cured sheet or a prepreg.
5. A microwave circuit board based composite lamination process according to claim 1, wherein the adhesive sheet comprises a foam sheet.
6. The composite laminating method based on the microwave circuit board according to any one of claims 1 to 5, characterized in that the specific processing method is as follows:
(1) circuit board processing
Performing the steps according to the sequence of the standard steps of circuit board processing, namely material leading → material cutting → pretreatment → film pressing → negative film exposure imaging selection → development → etching pattern → film removing;
(2) adhesive sheet processing
Processing the bonding plate according to the sequence of 'material leading → cutting → cleaning → drying → heat treatment'; wherein, the drying is carried out by heating at the speed of 2-3 ℃/min and drying for 5 hours in an air circulation drying oven at the temperature of 130 ℃; during heat treatment, the temperature is increased to between 180 ℃ and 220 ℃ and kept for 48 hours;
(3) pressing together
Laminating is carried out according to the sequence of 'laminating the second adhesive on the second circuit board → laminating the adhesive board on the second adhesive → laminating the first adhesive on the adhesive board → laminating the first circuit board on the first adhesive → laminating the release paper protection between the upper layer and the lower layer → vacuum hot pressing → cooling → board disassembling';
wherein during vacuum hot pressing, the temperature is kept at 200 +/-5 ℃, the pressure is kept at 4 standard atmospheric pressures, and the hot pressing time is 3 hours; when cooling, the temperature is decreased gradually at 5 ℃ for 3 minutes until the temperature is normal;
(4) machining and forming
Processing, wherein a vacuum dust suction device is used for sucking away dust generated in cutting in the processing process;
(5) inspection package
Wherein, the time of the (1) and the time of the (2) are not separated, and can also be synchronously carried out.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010449489.6A CN111901985A (en) | 2020-05-25 | 2020-05-25 | Composite lamination method based on microwave circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010449489.6A CN111901985A (en) | 2020-05-25 | 2020-05-25 | Composite lamination method based on microwave circuit board |
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| Publication Number | Publication Date |
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| CN111901985A true CN111901985A (en) | 2020-11-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010449489.6A Pending CN111901985A (en) | 2020-05-25 | 2020-05-25 | Composite lamination method based on microwave circuit board |
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Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3972755A (en) * | 1972-12-14 | 1976-08-03 | The United States Of America As Represented By The Secretary Of The Navy | Dielectric circuit board bonding |
| CN1070076A (en) * | 1991-08-27 | 1993-03-17 | 詹姆斯·A·约翰斯顿 | The parts of printed circuit board (PCB) |
| CN101351093A (en) * | 2008-09-08 | 2009-01-21 | 施吉连 | Method for preparing microwave high-frequency multi-layer circuit board |
| JP2011134907A (en) * | 2009-12-24 | 2011-07-07 | Nippon Zeon Co Ltd | Film for multilayer printed circuit board |
| TW201315317A (en) * | 2011-09-30 | 2013-04-01 | Zhen Ding Technology Co Ltd | Multilayer printed circuit board and method for manufacturing same |
| CN106658951A (en) * | 2017-02-23 | 2017-05-10 | 南京宏睿普林微波技术股份有限公司 | Manufacturing method for polytetrafluoroethylene and epoxy resin mixed and pressed circuit board |
| WO2017173350A1 (en) * | 2016-03-31 | 2017-10-05 | Snaptrack, Inc. | Multilayer interconnection substrate for high frequency and manufacturing method thereof |
| CN109219276A (en) * | 2018-10-31 | 2019-01-15 | 西安微电子技术研究所 | A method of improving multilayer printed circuit board laminating technology |
| CN109479377A (en) * | 2016-05-18 | 2019-03-15 | 伊索拉美国有限公司 | The manufacturing method of circuit board |
-
2020
- 2020-05-25 CN CN202010449489.6A patent/CN111901985A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3972755A (en) * | 1972-12-14 | 1976-08-03 | The United States Of America As Represented By The Secretary Of The Navy | Dielectric circuit board bonding |
| CN1070076A (en) * | 1991-08-27 | 1993-03-17 | 詹姆斯·A·约翰斯顿 | The parts of printed circuit board (PCB) |
| CN101351093A (en) * | 2008-09-08 | 2009-01-21 | 施吉连 | Method for preparing microwave high-frequency multi-layer circuit board |
| JP2011134907A (en) * | 2009-12-24 | 2011-07-07 | Nippon Zeon Co Ltd | Film for multilayer printed circuit board |
| TW201315317A (en) * | 2011-09-30 | 2013-04-01 | Zhen Ding Technology Co Ltd | Multilayer printed circuit board and method for manufacturing same |
| WO2017173350A1 (en) * | 2016-03-31 | 2017-10-05 | Snaptrack, Inc. | Multilayer interconnection substrate for high frequency and manufacturing method thereof |
| CN109074900A (en) * | 2016-03-31 | 2018-12-21 | 追踪有限公司 | High-frequency multilayer interconnection substrate and its manufacturing method |
| CN109479377A (en) * | 2016-05-18 | 2019-03-15 | 伊索拉美国有限公司 | The manufacturing method of circuit board |
| CN106658951A (en) * | 2017-02-23 | 2017-05-10 | 南京宏睿普林微波技术股份有限公司 | Manufacturing method for polytetrafluoroethylene and epoxy resin mixed and pressed circuit board |
| CN109219276A (en) * | 2018-10-31 | 2019-01-15 | 西安微电子技术研究所 | A method of improving multilayer printed circuit board laminating technology |
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Application publication date: 20201106 |
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