CN1754910A - High temperature resistant, antistatic, high-tensioned composite material - Google Patents
High temperature resistant, antistatic, high-tensioned composite material Download PDFInfo
- Publication number
- CN1754910A CN1754910A CN 200510031563 CN200510031563A CN1754910A CN 1754910 A CN1754910 A CN 1754910A CN 200510031563 CN200510031563 CN 200510031563 CN 200510031563 A CN200510031563 A CN 200510031563A CN 1754910 A CN1754910 A CN 1754910A
- Authority
- CN
- China
- Prior art keywords
- solvent
- matrix material
- solidifying agent
- diaminodiphenyl oxide
- carbon black
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Reinforced Plastic Materials (AREA)
Abstract
The invention provides a hot antistatic complex material comprised 20-50 epoxy resin, 10-20 curing agent, 40-60 glass fiber, 0.5-4 conductive carbon black, and processing agent. The preparation method comprises: dispersing said material in some solvent to obtain slurry; coating the slurry on glass fiber felt; after volatilization of solvent, holding temperature and procuring to given degree; curing for two hours respectively on 5-8MPa and 130-150Deg, and 7-9MPa and 190-220Deg; holding pressure to cool till under 100Deg, and demoulding to obtain product. This product has high mechanic intensity and fit well to wave soldering and all processes of SMT.
Description
Technical field
Patent of the present invention relates to a kind of high temperature resistant, antistatic, high-tensioned composite material, refers in particular to a kind of high-temperature-resistant antistatic matrix material that contains Resins, epoxy that can at high temperature use continuously.
Background technology
Electronic product; particularly circuit card is in crest formula scolding tin process; need stand 200～400 ℃ temperature; and circuit card can not stand so high temperature usually; this just needs to use a kind of high temperature resistant and material that thermal conductivity is low that circuit card is protected; circuit card is remained intact in the scolding tin process,, require this protecting materials to have static electricity resistance simultaneously for the electronic devices and components on the holding circuit plate are not subjected to the influence of extra electric field.
At present, numerous domestic Electronics Factory all adopts the refractory glass fibre strongthener of external import, contain the synthetic stone that French DUROSTONE company is acted on behalf of by scientific and technological electronics technology company limited as Dongguan City wound, also be the chilled glass fiberboard, Singapore ROECHLING-DUROSTONE glass mat or the like is acted on behalf of by Ping Mao Electronics Co., Ltd. in Shenzhen.Imported product work-ing life is long and cost an arm and a leg, and has restricted the development of electron trade undoubtedly.
Summary of the invention
The objective of the invention is in order to overcome the shortcoming of above technology, a kind of matrix material that can at high temperature continue use and anti-electrostatic is provided.
For achieving the above object, the solution that the present invention takes is: high-temperature-resistant antistatic matrix material, the composition proportion of its material (mass percent): Resins, epoxy 20～50, solidifying agent 10～20, glass fibre 40～60, conductive carbon black 0.5～4, processing aid surplus.
The preparation method of this high-temperature-resistant antistatic matrix material is as follows: Resins, epoxy is dissolved in an amount of solvent (toluene, acetone, ethyl acetate etc.), adds solidifying agent, graphitized carbon black and processing aid stir each component is fully disperseed, obtain slurry.
Make sheet material with this kind high-temperature-resistant antistatic matrix material, its manufacturing technology parameter is: with above-mentioned slurry coating on glass mat; The glass mat that is coated with resin is placed the vacuum drying oven of a band solvent recovery unit, vacuumize and allow solvent fully volatilize and reclaim solvent; And the Procuring that acquires a certain degree, the mould of packing into then is transferred on the vulcanizing press, solidifies 2 hours in 130～150 ℃, 5～8MPa, is warming up to 190～220 ℃, 7～9MPa again and solidifies 2 hours, and pressurize is cooled to below 100 ℃, and mould unloading promptly gets product.The main performance index of this sheet material is as follows:
1. can use 20 seconds 350 ℃ of short-terms, but at 260 ℃ of life-time service;
2. surface resistivity: 10
6Ω～10
8Ω
3. Young's modulus 18000MPa
4. bending strength-three vertical support 〉=360MPa
5. water-intake rate≤0.2%
6. density 1.85～1.90g/cm
3
This matrix material is applicable to the every process in wave soldering and the SMT harness, can mechanical workout reach the required precision of SMT processing procedure, and in successive wave soldering and Reflow Soldering circulation, keep smooth, its high mechanical strength low heat conductivity can prevent that substrate from deforming, can improve the quality of PCBA in crest formula scolding tin process, avoid golden finger or contact hole and polluted because of artificial touching; Synthetic resins composition in this matrix material can effectively intercept the activity of soldering flux, prevents that the tin point from producing; Because this material has these characteristics, is adorning tool by the substrate of its manufacturing and can be used for precision sizing, mainly uses as follows:
1, the tin furnace tool of wave soldering process has following function:
The SMT element of bottom is covered, prevent curved substrate, enable pass is crossed the reflow equipment of standard and is done local welding;
Use multimode hole edge tool to increase productivity;
Prevent the tin pollution substrate surface that overflows.
2, the Reflow Soldering tool of SMT harness process is used for paste solder printing, SMT harness and reflow.The SMT pallet tool made from this matrix material has following function:
1) supports broad type substrate or flexible circuit board
2) can be used for the substrate of irregular external form
3) can carry many connecting plates to boost productivity
Embodiment
Embodiment 1
Extracting epoxy resin 400g, solidifying agent 130g, graphitized carbon black 15g by mass percentage, glass mat 550g, processing aid 0.5g.Resins, epoxy is dissolved in the 600g acetone, adds solidifying agent, graphitized carbon black and processing aid stirring each component is fully disperseed, obtain slurry.Glass mat is cut into a certain size (as 400mm*400mm), slurry evenly is coated on the glass mat.The glassmat that is coated with resin is placed the vacuum drying oven of a band solvent recovery unit, vacuumize and allow solvent fully volatilize and reclaims solvent, be incubated certain Procuring degree that reaches.The multilayer coated glass mat that resin arranged is piled up the mould of packing into to be transferred on the vulcanizing press, solidified 2 hours in 130 ℃, 5MPa then, be warming up to 220 ℃, 7MPa again and solidified 2 hours, pressurize is cooled to below 100 ℃, and mould unloading promptly gets high temperature resistant, antistatic, high-tensioned composite material.
Embodiment 2
Extracting epoxy resin 300g, solidifying agent 100g, graphitized carbon black 20g by mass percentage, glass mat 600g, processing aid 1g.Resins, epoxy is dissolved in the 500g acetone, adds solidifying agent, graphitized carbon black and processing aid stirring each component is fully disperseed, obtain slurry.Glass mat is cut into a certain size (as 400mm*400mm), slurry evenly is coated on the glass mat.The glassmat that is coated with resin is placed the vacuum drying oven of a band solvent recovery unit, vacuumize and allow solvent fully volatilize and reclaims solvent, be incubated certain Procuring degree that reaches.There is the glass mat of resin to be piled up with multilayer coated, the mould of packing into is transferred on the vulcanizing press, solidifies 2 hours in 150 ℃, 6MPa, is warming up to 200 ℃, 8.5MPa again and solidifies 2 hours, pressurize is cooled to below 100 ℃, and mould unloading promptly gets high temperature resistant, antistatic, high-tensioned composite material.
Claims (3)
1. high-temperature-resistant antistatic matrix material, the composition proportion of its material (mass percent): Resins, epoxy 20～50, solidifying agent 10～20, glass fibre 40～60, conductive carbon black 0.5～4, processing aid surplus.
2. as claim 1 described high-temperature-resistant antistatic matrix material, wherein solidifying agent is one or more in diaminodiphenyl oxide sulfobenzide (BDAS), diamino diphenyl sulfone (DDS), diaminodiphenyl oxide phenyl ether (BDAO), diaminodiphenyl oxide dihydroxyphenyl propane (BDAP), the diaminodiphenyl oxide-6F-dihydroxyphenyl propane.
3. as the preparation method of claim 1 described high-temperature-resistant antistatic matrix material, it is characterized in that: Resins, epoxy is dissolved in an amount of solvent (toluene, acetone, ethyl acetate etc.), adds solidifying agent, graphitized carbon black and processing aid stir each component is fully disperseed, obtain slurry; With above-mentioned slurry coating on glass mat; The glassmat that is coated with resin is placed the vacuum drying oven of a band solvent recovery unit, vacuumize and allow solvent fully volatilize and reclaim solvent; Insulation reaches certain Procuring degree.The glass mat that will the be coated with resin again mould of packing into is transferred on the vulcanizing press, solidifies 2 hours in 130～150 ℃, 5～8MPa, is warming up to 190～220 ℃, 7～9MPa again and solidifies 2 hours, and pressurize is cooled to below 100 ℃, and mould unloading promptly gets product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510031563 CN1754910A (en) | 2005-05-20 | 2005-05-20 | High temperature resistant, antistatic, high-tensioned composite material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510031563 CN1754910A (en) | 2005-05-20 | 2005-05-20 | High temperature resistant, antistatic, high-tensioned composite material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1754910A true CN1754910A (en) | 2006-04-05 |
Family
ID=36688482
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200510031563 Pending CN1754910A (en) | 2005-05-20 | 2005-05-20 | High temperature resistant, antistatic, high-tensioned composite material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1754910A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106473261A (en) * | 2016-11-17 | 2017-03-08 | 无锡市长安曙光手套厂 | A kind of detachable plate exposure suit |
| CN109575520A (en) * | 2018-11-15 | 2019-04-05 | 浙江华正新材料股份有限公司 | A kind of jig plate of antistatic and preparation method thereof |
-
2005
- 2005-05-20 CN CN 200510031563 patent/CN1754910A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106473261A (en) * | 2016-11-17 | 2017-03-08 | 无锡市长安曙光手套厂 | A kind of detachable plate exposure suit |
| CN109575520A (en) * | 2018-11-15 | 2019-04-05 | 浙江华正新材料股份有限公司 | A kind of jig plate of antistatic and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112574521B (en) | Fluorine-containing resin composition, resin glue solution containing same, fluorine-containing medium sheet, laminated board, copper-clad plate and printed circuit board | |
| CN103805144B (en) | A kind of Graphene heat conducting film and preparation method thereof | |
| CN1200970C (en) | Modified dimaleimide resin and its preparation method and application in cladding copper plate | |
| WO1998010920A1 (en) | Maleimide containing formulations and uses therefor | |
| CN102712173B (en) | Circuit substrate and manufacture method thereof | |
| CN106883786A (en) | A kind of preparation method of comprehensive thermal setting conductive glue | |
| CN1754910A (en) | High temperature resistant, antistatic, high-tensioned composite material | |
| CN112477363A (en) | Preparation method of low-warpage copper-clad plate | |
| CN1204567C (en) | Conducting slurry for direct laser writing | |
| CN101808466B (en) | Manufacturing method of copper-clad plate and glue solution for copper-clad plate | |
| CN111432566A (en) | Preparation process of 3OZ single-side thick copper aluminum substrate precise circuit | |
| CN107188407B (en) | Circuit board glass substrate manufactured by using alkali-free glass fiber waste silk and preparation method | |
| CN114276654A (en) | Resin composition, prepreg and high CTI copper-clad plate | |
| CN114179461A (en) | Glass fiber cloth reinforced copper-clad plate and preparation method thereof | |
| CN1645986A (en) | Production for printing circuit basilar plate | |
| CN217834975U (en) | UV curing layer shelters from type copper-clad plate | |
| CN207692129U (en) | Copper substrate | |
| JPS593991A (en) | Printed circuit board | |
| CN114466508B (en) | Stretchable circuit structure and production method | |
| CN109451658A (en) | A kind of flexible circuit board and preparation method | |
| CN109439227A (en) | A kind of Wireless charging coil covering glue film and preparation method thereof | |
| JPS5968990A (en) | Printed circuit board | |
| TWI794554B (en) | Method for manufacturing a multilayer structure and a substrate | |
| CN110733225B (en) | Preparation method of high-thermal-conductivity high-toughness copper-clad plate | |
| JPH0484490A (en) | Manufacture of printed wiring board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |