CN217834975U

CN217834975U - UV curing layer shelters from type copper-clad plate

Info

Publication number: CN217834975U
Application number: CN202221993478.5U
Authority: CN
Inventors: 张继祖; 张笑吟; 王福钦
Original assignee: Laizhou Pengzhou Electronics Co ltd
Current assignee: Laizhou Pengzhou Electronics Co ltd
Priority date: 2022-08-01
Filing date: 2022-08-01
Publication date: 2022-11-18
Anticipated expiration: 2032-08-01

Abstract

The utility model discloses a UV cured layer shelters from type copper-clad plate, including base plate and copper foil, the base plate upper surface covers has the UV cured layer, the copper foil covers at the upper surface of the UV cured layer, the surface covers has insulating heat-conducting layer under the base plate, the surface covers has the reinforcement crack prevention layer under the insulating heat-conducting layer. The substrate and the copper foil are integrated by the peek material through the UV curing layer, the peek characteristic is corrosion-resistant, ageing-resistant, anti-solubility, high-temperature, high-frequency and high-voltage electrical property conditions, the toughness and the rigidity are both good, the wear-resistant, anti-static and electrical insulation properties are good, the mechanical strength requirement is high, the smoke and toxic gas emission performance is low, the electromagnetic shielding effect is achieved through the copper-clad layer, the reinforcing anti-cracking layer and the insulation heat conduction layer, the reinforcing anti-cracking layer has the advantages of being high in strength, strong in flexibility and light in specific gravity, the thickness and the weight of the copper-clad plate are reduced, the heat conduction performance of the boron nitride heat conduction rubber material is excellent, and compared with a common heat conduction material under the same condition, the temperature of a device can be reduced by more than 20 ℃ and the device is insulated.

Description

UV curing layer shelters from type copper-clad plate

Technical Field

The utility model relates to an electron field, what specifically say is a UV solidified layer shelters from type copper-clad plate.

Background

The copper clad laminate is a plate-shaped material which is prepared by soaking a reinforcing material in resin, covering one or two surfaces of the reinforcing material with copper foil and performing hot pressing, and is called a copper clad laminate. The copper clad laminate is a basic material in the electronic industry, is mainly used for manufacturing printed circuit boards and is widely used in electronic products such as televisions, radios, computers, mobile communication and the like, a Copper Clad Laminate (CCL) is a product formed by soaking wood pulp paper or glass fiber cloth and the like serving as a reinforcing material in resin, coating copper foil on one side or two sides and carrying out hot pressing, and the copper clad laminate is a basic material in the electronic industry, is mainly used for processing and manufacturing Printed Circuit Boards (PCBs), is widely used in electronic products such as televisions, radios, computers, mobile communication and the like, is easy to break and has an unstable structure.

SUMMERY OF THE UTILITY MODEL

Therefore, in order to solve the above-mentioned not enough, the utility model provides a UV cured layer shelters from type copper-clad plate herein, and the substrate upper surface covers has the UV cured layer, and the UV cured layer is carried out by the peek material and is formed wholly with base plate and copper foil, and sound construction, the heat conduction is effectual, and the thickness is thinner.

The utility model discloses a realize like this, construct a UV cured layer and shelter from type copper-clad plate, including base plate and copper foil, the base plate upper surface covers there is the UV cured layer, the copper foil covers at the UV cured layer upper surface, the surface covers has insulating heat-conducting layer under the base plate, the surface covers under the insulating heat-conducting layer has the reinforcement anticracking layer.

Further, the thickness of the copper foil is 10 to 15 μm.

The purpose of this setting lies in, under the prerequisite that does not influence copper-clad plate functionality, reduces the quantity of copper, reduces the loss, practices thrift the cost.

Further, the thickness of the substrate is 1.2-1.5 mm.

The purpose of this setting lies in under the condition that does not influence copper-clad plate work for the copper-clad plate is more frivolous.

Further, the UV curing layer is made of a peek material.

The purpose of the arrangement is that the peek characteristic is corrosion resistant, ageing resistant, solubility resistant, high temperature, high frequency and high voltage electrical property, the toughness and rigidity are both provided, the size requires precise condition, the radiation resistant, wear resistant, corrosion resistant condition, hydrolysis resistant, the excellent characteristic can be maintained under high temperature and high pressure, the light weight replaces metal to be used as the optical fiber element, the abrasion resistant, antistatic and electrical insulation performance is good, the mechanical strength requires high parts, the smoke and toxic gas emission is low

Furthermore, the thickness of the UV curing layer is 5-7 μm.

The purpose of this arrangement is to reduce the thickness and weight of the copper clad laminate without affecting the performance of the UV curable layer.

Furthermore, the insulating heat conduction layer is made of a boron nitride heat conduction rubber material.

The boron nitride heat-conducting rubber material has excellent heat-conducting property, and can lower the temperature of a device by more than 20 ℃ and is insulated compared with the common heat-conducting material under the same condition.

Furthermore, the thickness of the insulating heat conduction layer is 25-30 μm.

The purpose of this setting lies in, does not influence the heat conduction and the insulating properties of insulating heat-conducting layer when reducing copper clad plate thickness and weight.

Furthermore, the reinforcing anti-cracking layer is made of an aluminum-titanium alloy material.

The aluminum-titanium alloy has the characteristics of high die-casting yield, high finished product strength, no fracture, strong flexibility and light specific gravity.

Furthermore, the thickness of the reinforced anti-cracking layer is 28-32 μm.

The purpose of this setting lies in, does not influence the intensity and the toughness of absolute reinforcement anticracking layer when reducing copper-clad plate thickness and weight.

The utility model has the advantages of as follows: the substrate and the copper foil are integrated by the peek material through the UV curing layer, the peek characteristic is corrosion-resistant, ageing-resistant, anti-solubility, high-temperature, high-frequency and high-voltage electrical property conditions, the toughness and the rigidity are both, the wear-resistant, anti-static and electrical insulation properties are good, the mechanical strength requires high parts, the smoke dust and toxic gas emission are low, the electromagnetic shielding effect is achieved through the copper-clad layer, the reinforcing anti-cracking layer and the insulating heat conduction layer, the reinforcing anti-cracking layer has the advantages of being high in strength, strong in flexibility and light in specific gravity, the thickness and the weight of the copper-clad layer are reduced, the heat conduction property of the boron nitride heat conduction rubber material is excellent, the temperature of a device can be reduced by more than 20 ℃ compared with a common heat conduction material under the same condition, the insulation is achieved, the heat of the aluminum-titanium alloy material can be effectively transferred out, the corrosion resistance and the high hardness are good, and the copper-clad layer is not prone to cracking.

Drawings

Fig. 1 is a schematic structural diagram of the present invention.

In the figure: 1. copper foil; 2. a substrate; 3. an insulating heat-conducting layer; 4. reinforcing the anti-cracking layer; 5. and curing the layer by UV.

Detailed Description

The present invention will be described in detail with reference to the accompanying drawings 1, wherein the technical solutions in the embodiments of the present invention are clearly and completely described, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

The utility model discloses an improve and provide a UV cured layer shelters from type copper-clad plate here, including base plate 2 and

copper foil

1, 2 upper surface covers of base plate have UV cured layer 5, copper foil 1 covers at UV cured layer 5 upper surface, 2 lower surface covers of base plate have insulating heat-conducting

layer

3, 3 lower surface covers of insulating heat-conducting layer have reinforcement crack prevention layer 4.

Preferably, the thickness of the copper foil is 10-15 μm, and on the premise of not influencing the functionality of the copper-clad plate, the copper consumption is reduced, the loss is reduced, and the cost is saved.

Preferably, the thickness of the substrate 2 is 1.2-1.5 mm, so that the copper-clad plate is thinner and thinner under the condition that the work of the copper-clad plate is not influenced.

Preferably, the UV curing layer 5 is made of a peek material, has the characteristics of corrosion resistance, ageing resistance, solubility resistance, high-temperature, high-frequency and high-voltage electrical performance, toughness and rigidity, has precise dimensional requirements, radiation resistance, wear resistance, corrosion resistance and hydrolysis resistance, can still maintain excellent characteristics under high temperature and high pressure, is used as an optical fiber element by replacing metal with light weight, has good wear resistance and antistatic electrical insulation performance, has high mechanical strength requirements on parts, and has low smoke and toxic gas emission.

Preferably, the thickness of the UV curing layer 5 is 5-7 μm, and the thickness does not affect the performance of the UV curing layer while reducing the thickness and weight of the copper-clad plate.

Preferably, the insulating heat conduction layer 3 is made of a boron nitride heat conduction rubber material, the boron nitride heat conduction rubber material has excellent heat conduction performance, and compared with a common heat conduction material under the same condition, the temperature of a device can be reduced by more than 20 ℃, and the device is insulating.

Preferably, the thickness of the insulating and heat conducting layer 3 is 25 to 30 μm, so that the thickness and weight of the copper clad plate are reduced, and the heat conduction and insulation performance of the insulating and heat conducting layer 3 are not affected.

Preferably, the reinforcing anti-cracking layer 4 is made of an aluminum-titanium alloy material, and the aluminum-titanium alloy has the characteristics of high die-casting yield, high finished product strength, no fracture, strong flexibility and light specific gravity.

Preferably, the thickness of the reinforcing crack-proof layer 4 is 28-32 μm, so that the strength and toughness of the reinforcing crack-proof layer 4 are not influenced while the thickness and weight of the copper-clad plate are reduced.

In the using process, the substrate 2 and the copper foil 1 are integrally formed by a peek material through a UV curing layer, the peek material has the advantages of corrosion resistance, ageing resistance, solubility resistance, high-temperature, high-frequency and high-voltage electrical property conditions, toughness and rigidity are both good, abrasion resistance, antistatic and electrical insulation properties are good, parts with high mechanical strength requirements are high, smoke dust and toxic gas emission are low, the electromagnetic shielding effect is achieved through the copper-clad layer, the reinforcing anti-cracking layer and the insulating and heat-conducting layer, the reinforcing anti-cracking layer has the advantages of being high in strength, strong in flexibility and light in specific gravity, the thickness and weight of the copper-clad layer are reduced, the heat-conducting performance of the boron nitride heat-conducting rubber material is excellent, and compared with a common heat-conducting material under the same conditions, the temperature of a device can be reduced by more than 20 ℃, the boron nitride heat-conducting rubber material is insulating, the heat of an aluminum-titanium alloy material can be effectively transferred, the corrosion resistance and the hardness are good, and the copper-clad layer is not prone to cracking.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A UV curing layer shelters from the type copper-clad plate, characterized by that; the anti-cracking and anti-cracking heat conducting plate comprises a substrate (2) and a copper foil (1), wherein a UV curing layer (5) covers the upper surface of the substrate (2), the copper foil (1) covers the upper surface of the UV curing layer (5), an insulating heat conducting layer (3) covers the lower surface of the substrate (2), and a reinforcing anti-cracking layer (4) covers the lower surface of the insulating heat conducting layer (3).

2. The UV cured layer shielding copper-clad plate according to claim 1, wherein; the thickness of the copper foil (1) is 10-15 mu m.

3. The UV cured layer shielding copper-clad plate according to claim 1, wherein; the thickness of the substrate (2) is 1.2-1.5 mm.

4. The UV cured layer shielding copper-clad plate according to claim 1, wherein; the UV curing layer (5) is made of a peek material.

5. The UV cured layer blocking type copper-clad plate according to claim 1 or 4, wherein; the thickness of the UV curing layer (5) is 5-7 mu m.

6. The UV cured layer shielding copper-clad plate according to claim 1, wherein; the insulating heat conduction layer (3) is made of a boron nitride heat conduction rubber material.

7. The UV cured layer-shielding copper-clad plate according to claim 1 or 6, wherein; the thickness of the insulating heat conduction layer (3) is 25-30 μm.

8. The UV cured layer shielding copper-clad plate according to claim 1, wherein; the reinforced anti-cracking layer (4) is made of an aluminum-titanium alloy material.

9. The UV cured layer shielding copper-clad plate according to claim 8, wherein; the thickness of the reinforcing anti-cracking layer (4) is 28-32 mu m.