CN109451658A - A kind of flexible circuit board and preparation method - Google Patents
A kind of flexible circuit board and preparation method Download PDFInfo
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- CN109451658A CN109451658A CN201811452259.4A CN201811452259A CN109451658A CN 109451658 A CN109451658 A CN 109451658A CN 201811452259 A CN201811452259 A CN 201811452259A CN 109451658 A CN109451658 A CN 109451658A
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- flexible circuit
- circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention provides a kind of flexible circuit board, which stacks gradually the first covering glue film, screened film, substrate and the second covering glue film of combination；The first covering glue film, the second covering glue film include the carrier layer being oppositely arranged and protective layer; and the black glue layer between the carrier layer and the protective layer is set; wherein; it is in terms of 100% by the total weight of the black glue layer; the black glue layer includes the raw material components of following parts by weight: 55%~70% modified epoxy; 5%~25% promotor, 5%~20% dyestuff, 5%~10% dumb light powder.The flexible circuit plate thickness being prepared is controllable, and product stability is high, and ductility is good, tensile property enhancing, is less likely to be damaged, and efficiently solves the problems, such as that Kapton needs import.
Description
Technical field
The present invention relates to printed circuit board production technical field more particularly to a kind of flexible circuits for wireless charger
Plate and preparation method.
Background technique
With the development of electronic technology, the electronic equipments such as mobile phone, tablet computer and camera have become people's daily life
In indispensable a part, requirement of the people for electronic equipment be also higher and higher.In order to meet the requirement of people, wireless charging
Power technology is gradually applied in electronic equipment, and wireless charging technology can transmit energy by electromagnetic wave, realizes wireless charging
Device improves the convenience of electronic equipment charging process to the wireless charging of electronic equipment.
Wireless charger refers to the charger being connected on the terminal device for needing to charge without traditional charging power cord,
Electric energy, Inductive coupling techniques are transmitted by using the alternating magnetic field generated between coil using newest wireless charging technology
The bridge of connection charging base station and equipment will be become.
Currently, mobile terminal wireless charger generallys use flexible circuit board, wireless charging is generally included in flexible circuit board
Electric coil, while carrier polyimides (PI) film of wire coil is generally included in Wireless charging coil, PI film two sides
Coil, coil outer side covering PI insulator cover film.Wherein, the thickness of PI insulation cover film is larger, occupies the thickness of coil
Space.Secondly, the preparation process of PI insulating film is sufficiently complex, it is thin that layer of polyethylene (AD) is covered usually on black PI film
Film, and in coating process, it is harsher to external condition cleanliness, electrostatic requirement, design precision requirement, easily entrain dust
And the generation of compound bubble；Since bondline thickness only has 5um when production coating, equipment precision and external condition are also required that
Harshness, because adhesive is too thin, equally also required when cure parameter and process temperature are managed it is very high, during the preparation process, tradition
Process for pressing be also easy to cause cover film blistering, corrugation and be squeezed and be easy to cause breakage.
Summary of the invention
The purpose of the present invention is to provide a kind of flexible circuit boards, it is intended to solve the cover film former material of existing flexible circuit board
The problems such as material is expensive, preparation process is easy blistering, corrugation, modification.
For achieving the above object, The technical solution adopted by the invention is as follows:
A kind of flexible circuit board, the flexible circuit board stack gradually combination first covering glue film, screened film, substrate and
Second covering glue film；First covering glue film, second cover film include the carrier layer being oppositely arranged and protective layer, with
And the black glue layer between the carrier layer and the protective layer is set；Wherein, with the total weight of the black glue layer for 100%
Meter, the black glue layer includes the raw material components of following parts by weight: 55%~70% modified epoxy, 5%~25% promotor,
5%~20% dyestuff, 5%~10% dumb light powder.
Compared with prior art, flexible circuit board of the present invention stacks gradually the first covering glue film of combination, shielding
Film, substrate and the second covering glue film.First covering glue film, second cover film include the carrier layer being oppositely arranged and
Protective layer, and the black glue layer being arranged between the carrier layer and the protective layer, wherein with the total weight of the black glue layer
For 100% meter, the black glue layer includes the raw material components of following parts by weight: 55%~70% modified epoxy, and 5%~25%
Promotor, 5%~20% dyestuff, 5%~10% dumb light powder.Wherein, in black glue layer added modified epoxy have it is good
Good toughness, while can be improved ductility, so that it kept toughness during stretching, be not easy to break, and have certain
Cementability, do not need in addition to add adhesive material in overlay film, in coating process, can guarantee be coated with coplanar flat light
Sliding, obtained filling glue material is not in harmomegathus phenomenon；Added promotor is the shaping speed that can promote to fill glue,
Guarantee that speed is uniform when filling gelling is solid, it is not easy to aging.The covering glue film being prepared has viscous stickiness, can directly replace existing
There is a structure of composite membrane of+5 μm of polyethylene (AD) of 5 μm of black polyamides (PI) (or 8 μm of black PI+5 μm of AD) in technology, while
It does not need to increase other alite pastes in preparation process, it is possible to prevente effectively from blistering, corrugation, modification etc. occur for the film being prepared
Ill effect and cause flexible circuit board performance decline the problem of.The flexible circuit plate thickness being prepared is controllable, and product is stablized
Property it is high, ductility is good, tensile property enhancing, is less likely to be damaged, and efficiently solves Kapton and need import
The problem of.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of flexible circuit board provided in an embodiment of the present invention.
Fig. 2 is the structural schematic diagram of flexible circuit board provided in an embodiment of the present invention.
Fig. 3 is the specific structural schematic diagram of substrate of flexible circuit board provided in an embodiment of the present invention.
Appended drawing reference indicates in figure are as follows: 1- covers glue film；2- substrate；3- screened film；4- covers glue film.The second magnetic core of 21-；
22- coil；23- substrate；The first magnetic core of 24-.
Specific embodiment
To keep the purpose, technical solution and technical effect of the embodiment of the present invention clearer, below in conjunction with of the invention real
The attached drawing in example is applied, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described implementation
Example is a part of the embodiment of the present invention, instead of all the embodiments.In conjunction with the embodiment in the present invention, ordinary skill
Personnel's every other embodiment obtained without creative efforts, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that, term " first ", " second " are used for description purposes only, and cannot
It is interpreted as indication or suggestion relative importance or implicitly indicates the quantity of indicated technical characteristic.Define as a result, " the
One ", the feature of " second " can explicitly or implicitly include one or more of the features.In the description of the present invention,
The meaning of " plurality " is two or more, unless otherwise specifically defined.
The present invention provides a kind of flexible circuit board, and the flexible circuit board stacks gradually the first covering glue film, the screen of combination
Cover film, substrate and the second covering glue film；The first covering glue film, second cover film include the carrier layer being oppositely arranged
And protective layer, and the black glue layer being arranged between the carrier layer and the protective layer；Wherein, with the gross weight of the black glue layer
Amount is 100% meter, and the black glue layer includes the raw material components of following parts by weight: 55%~70% modified epoxy, 5%~
25% promotor, 5%~20% dyestuff, 5%~10% dumb light powder.
Specifically, the black glue layer includes the raw material components of following parts by weight: 55%~70% modified epoxy, 5%
~25% promotor, 5%~20% dyestuff, 5%~10% dumb light powder.
Specifically, modified epoxy is to obtain the property of epoxy resin by reacting organic solvent with resin
To improvement.Modified obtained modified epoxy, can be improved the impact flexibility, heat resistance, flame resistance of material, can extend use
Phase and Storage period.
Preferably, above-mentioned modified epoxy includes the component of following parts by weight: 20%~30% epoxy resin, 40%~
60% diluent, 5%~10% fire retardant.Specifically, epoxide resin material has, density height, water resistant, anti-leakage is good, intensity is high
The advantages that, therefore, epoxide resin material is selected black glue layer performance can be made relatively stable as the main material of filling glue,
In the preferred embodiment of the present invention, the preferred AS resin of resin.But ethoxyline resin antiflaming effect is poor, general anti-flammability ring
Oxygen resin is to pollute larger in preparation process with the resin containing fire-retardant group made from halogen, phosphorus monomer, is reacted more complex.
In order to improve the flame retardant property of epoxy resin, the black glue layer being prepared is made to have better impact flexibility, heat resistance, flame resistance,
It extends using period and Storage period.Preferably, the additive amount of epoxy resin is 20%~30%, if increasing the addition of epoxy resin
Amount, then will lead to black glue layer and be difficult to solidify in subsequent preparation process, keep the performance of black glue layer poor；If reducing epoxy resin
Additive amount then solidifies in black glue layer formation process and accelerates, colloid aging is caused not to be available.
Further, fire retardant is added in the epoxy resin, the ingredient of the preferred fire retardant of the present invention is Al (OH)3,
Relative density 2.42, Mohs' hardness 3.0.It has the characteristics that nontoxic, tasteless, good dispersion, whiteness are high, iron-content is low, is one
Kind of inorganic fire retardants, have it is fire-retardant, eliminate smoke, filling three zones, it is without secondary pollution in burning, when pyrolysis do not generate it is toxic and
Mordant gas simultaneously absorbs heat and releases water vapour, has fire-retardant self-extinguishment.
Following reaction generally occurs when aluminium hydroxide is as fire retardant:
The fire retardation of aluminium hydroxide derive from thirdly molecular crystalline water decomposition heat absorption principle, on the one hand, aluminium hydroxide by
Heat dehydration is decomposed, and caloric receptivity reaches 1967.2J/kg, can effectively inhibit the heating and thermal degradation of polymer.On the other hand, hydroxide
Aluminium decomposition, which releases a large amount of vapor, can dilute fuel gas, inhibit burning sprawling, the closelypacked bimorph crystal knot of aluminium hydroxide
Structure can capture the hydroxyl radical free radical for causing polymer combustion, break off chain reaction.Furthermore in polymer table after aluminium hydroxide dehydration
Face forms the fine and close three dichloroxide protective films of high temperature resistant, and isolation air prevents propagation of flame.High temperature resistant densification aluminum oxide is protected
Cuticula can also promote polymer carbonization, and adsorbent solid particle inhibits dense smoke to generate.By adding fire retardant in the epoxy,
The features such as improving the flame retardant property of epoxy resin, while being also able to maintain epoxy resin high temperature resistant, good mechanical strength.If black
Flame retardant constituent is excessively high in glue-line, then can reduce the additive amount of other substances to a certain degree, wherein major to be the reduction of ring
The additive amount of oxygen resin causes to be difficult to solidify when the formation of black glue layer；If reducing the additive amount of fire retardant, black glue layer will lead to
Flame retardant effect is unable to get further improvement.
Further, the diluent is selected from organic solvent, for dissolving the epoxy resin.The organic solvent can be selected from
Aromatic organic solvent and alcohol organic solvent, preferred organic solvent be toluene and methanol, in a preferred embodiment of the invention,
The additive amount of the diluent preferably mixed solution of 20%~30% toluene and 20%~30% methanol, the addition of organic solvent can
Resin is promoted to be modified, while in later period heating process, organic solvent is easy to volatilize under high temperature action, it will not be to material
It impacts.
In a particular embodiment, the additive amount of the modified epoxy is 55%~70%.If modified epoxy
Adding too much, during following process, since the ingredient of resin is higher, resin excessively will lead to solid during hot briquetting
It is bad to change effect, influences the molding of black glue layer；If additive amount is very few, the black glue layer poor toughness being prepared, tensile strength is low,
Embrittlement easily occurs in use process, service life is not grown.
Preferably, above-mentioned promotor includes the component of following parts by weight: 80%~90%, the modified epoxy, and 3%
~10% promotor.Wherein, modified epoxy is above-mentioned modified epoxy.Above-mentioned modified ring is added in the promotor
Oxygen resin is to make to fill in glue reaction process, reaction speed is equal to enable substance to be sufficiently mixed uniformly in stage and semi-finished product
It is even；If being directly individually added each substance, the production that material mixing is uneven, reacts will lead to when preparing black glue layer
Moral character can be poor.Specifically, adding the promotor is to accelerate the generation of black glue layer to improve reaction efficiency.Specifically, institute
Stating promotor is epoxy resin promotor, is a kind of substance for accelerating hot-melt resin reaction rate.Further, the promotion
Agent preferably selects organic accelerator, and organic accelerator efficiency is high, improves the physical mechanical property of black glue layer, and use is more wide
It is general.Main organic accelerator include 2-methylimidazole, 2- ethyl imidazol(e), 2-ethyl-4-methylimidazole, 2 isopropyl imidazole,
2- undecyl imidazole, 2- heptadecyl imidazole, 2- phenylimidazole, 2- phenyl -4-methylimidazole etc. are preferably implemented in the present invention
In example, the promotor preferably adds 2-methylimidazole.Promotor is added in black glue layer material, hot melt can be greatly speeded up
The reaction of black glue layer, reduces fusion temperature, shortens fusing time, improve the physical mechanical property of hot-melt resin, chemical property and
The corresponding property such as appearance.
In a particular embodiment, the additive amount of the promotor is 5%~25%.If the additive amount of promotor is less,
When reaction molding, the solidified forming time of black glue layer is lengthened, the reaction of long period, be will lead to colloidal substance and is easy aging, glue
Body cannot keep its good performance；If promotor additive amount is more, lead to molding black glue layer poor toughness, tensile strength
Low, later period using effect is bad.
Preferably, above-mentioned dyestuff includes 30%~40% carbon black, 40%~60% diluent.Specifically, being made using carbon black
For a kind of dye substance of the preferred embodiment of the present invention.Since carbon black is a kind of light, loose and superfine black powder, as powder
Shape substance, surface area is very big, can be attached to material surface well with other material mixings.Of the invention preferred real
It applies in example, the selected particle size carbon black is≤2um.Particle size carbon black is more tiny, then light absorption degree is higher, then can be preferably
Show its blackness.Further, the selection type of the diluent is consistent with above-mentioned diluent, including aromatics organic solvent and
Alcohol organic solvent.In a preferred embodiment of the invention, the diluent preferably added is methanol.Since methanol is a kind of relatively simple
Alcohol organic solvent keep consistent with above-mentioned diluent in use, it can be ensured that black glue layer does not introduce excessive its
His impurity.
In a particular embodiment, the additive amount of the dyestuff is 5%~20%.If additive amount is very few, dye powder without
Method is sufficiently mixed with modified epoxy, and the uneven color that will lead to black glue layer is even, keeps black glue layer quality effect bad；If addition
Amount is excessive, then the black glue layer being prepared can be caused to cannot keep good stretching due to reducing the content of other compositions
Intensity, flexibility are poor.
Specifically, the additive amount of the dumb light powder is 5%~10%.Preferably, above-mentioned dumb light powder includes following parts by weight
Component: 80%~90% modified epoxy, 5%~10% dumb light powder.Wherein, modified epoxy is above-mentioned preparation
It obtains.Since additive amount of the dumb light powder in black glue layer is less, and dumb light powder partial size is small, more frivolous, if directly making an addition to black
It is uneven that it is easy mixing in glue-line, causes the glossiness of black glue layer poor；Therefore, by first by dumb light powder and modified epoxy
Mixing, is uniformly mixed in dumb light powder in black glue layer, guarantees that molding black glue layer color is excellent, and color is not in black dull
Existing reflective black, keeps the product color more excellent.Meanwhile added dumb light powder property is stablized, and also further ensure that black
The stability of glue-line.
In above-mentioned black glue layer, wherein added modified epoxy has good toughness, while can be improved extension
Property, so that it kept toughness during stretching, be not easy to break, and there is certain cementability, is not needed in overlay film another
Outer addition adhesive material in coating process, can guarantee to be coated with that coplanar flat is smooth, and obtained black glue layer material is not in
Harmomegathus phenomenon；Added promotor is the shaping speed that can promote to fill glue, guarantees that speed is uniform when filling gelling is solid, no
It is easy aging；The material of 5 μm of black polyamides and 5 μm of polyethylene in ultra-thin cover film in the prior art can directly be replaced.
Correspondingly, the specific embodiment of the invention additionally provides the preparation method of above-mentioned black glue layer.This method includes following step
It is rapid:
S01: each component is weighed respectively according to above-mentioned black glue layer；
S02: the weighed modified epoxy, promotor, dyestuff, dumb light powder are subjected to mixing treatment, obtain first
Mixed material；
S03: the first mixed material is placed in high speed disperser progress decentralized processing and obtains the second mixed material；
S04: the second mixed material is filtered processing, obtains black glue layer.
Specifically, the black glue layer each component preferred content in above-mentioned steps S01 and type are as described above, in order to save a piece
Width, details are not described herein.
In above-mentioned steps S02, the mixing treatment can be carried out according to conventional mixing method, such as stirring, as long as will
Each component is uniformly mixed.
In above-mentioned steps S03, the first mixed material is placed in high speed disperser progress decentralized processing and obtains the second mixed material.
Specifically, the high speed disperser carried out in the step of decentralized processing, the revolving speed of high speed disperser is 800-1200r/min；Point
Dissipating the time is 3~5h.If the revolving speed of high speed disperser is too low, it is poor to will cause system stability, generates a large amount of aggregation, system
Viscosity is big, and strainability is poor；If the revolving speed of high speed disperser is excessively high, it is too small to will lead to material particles, is unfavorable for later product
Molding.When high speed disperser revolving speed be 800-1200r/min, keep material dispersion particle diameter moderate, stability and dispersibility
Can be more preferable, be conducive to subsequent filter and finished product sizing.
Preferably, during carrying out decentralized processing using high speed disperser, increase thermostatted water in high speed disperser
Slot.Since in high speed disperser operation process, high speed rotation causes temperature of charge to rise, in order to avoid temperature in dispersion process
It is excessively high, guarantee the superperformance of material, therefore increase thermostatic water bath during the reaction and cool down.It is preferably implemented in the present invention
In example, the water temperature of used thermostatic water bath is 20 DEG C~25 DEG C.If temperature is too high, material straight forming will lead to, simultaneously
The excessively high performance that also will affect black glue layer of temperature lead to not using；If temperature is too low, reaction speed is too slow, and rate is too low.
Specifically, the second mixed material is filtered processing, in this step, uses aperture in above-mentioned steps S04
Filter screen for 5~10 μm is filtered.Filter screen aperture is excessive, then will lead in black glue layer there are the biggish particle of partial size,
Be unfavorable for the molding of black glue layer, will lead to molding black glue layer surface it is uneven whole, be unfavorable for the use of later product；If filtering
Aperture is too small, then will affect the rate of filtering, while being also easy to cause filter effect bad.
Above-mentioned black glue layer preparation method only needs according to the proportion to carry out each component mixing treatment, again through high speed disperser point
It is filtered after dissipating, which can make each component be uniformly dispersed, and state the same of black glue layer beneficial effect in realization
When, assign the black glue layer stability.In addition, this preparation method simple process, condition is controllable, and equipment requirement is low, can be used for
Industrialized production.
Specifically, the first covering glue film, second cover film in flexible circuit board stacking include phase
To the carrier layer and protective layer of setting, and the black glue layer being arranged between the carrier layer and the protective layer.
Preferably, the black glue layer with a thickness of 5 μm~15 μm.Its thickness is controllable, during the reaction can be according to reality
Prepared by border demand, meet various demands.If bondline thickness is excessively thin, in the preparation process of later period Wireless charging coil entirety
In, it is easy to cause covering uneven, keeps product reliability poor；If bondline thickness is blocked up, the efficiency of product is influenced, is not used to
Production.
Specifically, the carrier layer, mainly provides a substrate for black glue layer.Preferably, the thickness of the carrier layer
It is 5 μm~50 μm.If support layer thickness is too thin, it be easy to cause damage during the preparation process, lead to film out-of-flatness and then influences
The performance of covering glue film will lead to waste of material if support layer thickness is too thick during the preparation process, further improve cost.
Preferably, the carrier layer can for PET release film, PE release film, OPP release film it is any.Due to carrier
Layer is to support to black glue as branch layer, therefore need preferably as the material of carrier layer with high tensile, high impact-resistant, high-ductility
The performances such as property.In a preferred embodiment of the invention, selected carrier layer is PET release film.
Specifically, the protective layer is the surface for being covered on black glue and deviating from carrier layer, to protect the black glue layer being prepared,
The property of black glue layer is influenced to avoid black glue layer dampness moisture absorption etc..Preferably, the protective layer thickness is 5 μm~50 μm.If
Protective layer thickness is excessively thin, then breakage is easy to appear when protecting to black glue layer surface, and protecting effect is poor, makes black glue layer
It is easy to be damaged；If protective layer thickness is blocked up, lead to waste of material during the preparation process, further improves cost.Into one
Preferably, the protective layer includes polyethylene film, polypropylene screen, polyester film, fitting paper to step.One is not dissolved under selected protective layer room temperature
As solvent, water imbibition is small, and electrical insulating property is excellent, therefore as protective film, comprehensive protecting effect can be played to black glue layer.
Above-mentioned first covering glue film, the second covering glue film include carrier layer, black glue layer and protective layer；Since black glue layer has
There is good toughness, therefore, the first covering glue film and the second covering glue film being prepared have good ductility, are not easy
It is crisp, be not easy to break during stretching；Simultaneously as black glue layer has good cementability, make preparing the first rubber cover
During film, the second covering glue film, does not need in addition to add adhesive material in overlay film, in coating process, can guarantee
Coating coplanar flat is smooth, and obtained the first covering glue film, the second covering glue film is not in harmomegathus phenomenon；It is added in black glue layer
Promotor can promote the shaping speed of black glue layer, guarantee speed during the first covering glue film, the second rubber cover film preparation
Uniformly, while black glue layer is directly to be coated, and the first covering glue film, the second covering film thickness being prepared are controllable, can
To replace the compound of 5 μm of black polyamide (PI)+5um polyethylene (AD) (or the black PI+5umAD of 8um) in the prior art completely
Membrane structure.Meanwhile the first covering glue film, the second covering glue film are in use, it is no longer necessary to black polyamide film and poly-
The materials such as vinyl film efficiently solve the problems, such as that Kapton needs import.
Correspondingly, the embodiment of the invention also provides the preparation method of above-mentioned first covering glue film, the second covering glue film, systems
Preparation Method is identical, includes the following steps:
S01., carrier layer is provided；
S02. it is coated with black glue layer solution in the carrier layer, forms the black glue layer through 40~120 DEG C of bakings；
S03. deviate from the surface protective mulch of carrier layer in the black glue layer.
Specifically, the carrier layer preferred kind in above-mentioned steps S01 and thickness are as described above, in order to save length,
This is repeated no more.
In above-mentioned steps S02, the preferred kind and content of black glue layer solution are as described above, in order to save length, herein
It repeats no more.By black glue layer solution coating after in carrier layer, toasted through 40~120 DEG C, it is preferred that the method for the baking
It is to be toasted using tunnel type baking oven, tunnel oven is dry using long cabinet hot air circulation and far-infrared ray drying mode
A kind of dry baking oven, its main feature is that first, tunnel oven heating element is mounted on baking oven top, improves the thermal efficiency；Second, it dries
Case is furnished with electric control cabinet, and temperature digital-display control can specifically control in any temperature constant state substance heating process；Third, out
Material is cooled down using the purification wind of vertical laminar flow at mouthful, material is made to be in the dustless state of rigorous aseptic.Use tunnel type
Baking oven is primarily to the demand required for prepared covering glue film high yield, high efficiency, high preparation.
Further, tunnel type baking oven is divided into six sections, it is each save temperature be followed successively by 40 DEG C, 60 DEG C, 80 DEG C, 120 DEG C, 120 DEG C,
60℃；Each section air inlet wind frequency is followed successively by 25Hz, 20Hz, 20Hz, 20Hz, 20Hz, 25Hz；Air draft wind frequency is 35Hz.Specific
In embodiment, the set temperature of tunnel type baking oven is 40~120 DEG C, dries black glue layer at this temperature, can fully ensure that black
Glue-line solidifies at such a temperature and the good characteristic for keeping it intrinsic may cause black glue layer solution one if temperature is too low
Start to solidify very well, in subsequent higher temperatures heating process, solidification is uneven, and the material flatness being prepared is bad,
Effect is poor；If temperature is excessively high, since the black glue layer is hot melt adhesive, it is easy to happen fusing under the high temperature conditions, therefore work as temperature
When higher than 120 DEG C, black glue layer can cross high-performance due to temperature and change, and be unfavorable for the use of subsequent covering glue film.
In a preferred embodiment of the invention, the air inlet wind frequency of tunnel type baking oven setting be followed successively by 25Hz, 20Hz, 20Hz,
20Hz,20Hz,25Hz；Air draft wind frequency is 35Hz.By cooperateing with the air inlet wind frequency and air draft wind frequency of tunnel type baking oven, make baking oven
Internal temperature is uniform, is conducive to preferably toast black glue layer.If wind frequency is excessive or too small, it can all lead to temperature in baking oven
Unevenly, influence will cause on the drying of black glue layer, is unfavorable for the formation of black glue layer.
The above-mentioned preparation method for being used to cover glue film, it is only necessary to black glue layer solution, warp are coated in provided carrier layer
40~120 DEG C of bakings can form black glue layer, and the method toasted is toasted using tunnel type baking oven, tunnel type baking oven
It is divided into six sections, it is 40 DEG C, 60 DEG C, 80 DEG C, 120 DEG C, 120 DEG C, 60 DEG C that each section temperature, which is set gradually,；Each section air inlet wind frequency is successively set
It is set to 25Hz, 20Hz, 20Hz, 20Hz, 20Hz, 25Hz；Air draft wind frequency is 35Hz.By the way that above-mentioned moderate baking temperature is arranged
And into air draft wind frequency, to reach the preparation of covering glue film.
The preparation method simple process, condition is controllable, can guarantee that the covering glue film being prepared keeps above-mentioned beneficial to effect
While fruit, assign the covering glue film excellent stability.In addition, this preparation method equipment requirement is low, it can be used for industry
Metaplasia produces.
Further, the embodiment of the present invention further provides for a kind of flexible circuit board, and the flexible circuit board stacks gradually
In conjunction with first covering glue film, screened film, substrate and second covering glue film.
Specifically, the first covering glue film, the second covering glue film are separately positioned on the surface of the substrate, for line
The surface of road plate is protected, to ensure that the performance of the flexible circuit board is stablized.
Preferably, the first covering glue film, the second thickness for covering glue film are 5 μm~50 μm.Due to flexible circuit
Plate using more and more extensive, the requirement to its property is higher and higher, including the requirement to its thickness.In the prior art,
Cover film is generally the composite membrane that polyimides and polyethylene are formed, and most thin composite membrane is 5 μm of black polyamides at present
(PI)+5 μm of polyethylene (AD) (or 8 μm of black PI+5 μm of AD), while when preparing the composite membrane, 5 μm of black polyamide films are both needed to
It to need to cover 5 μm of adhesive film polyethylene from external import, and during the preparation process and be engaged with forming viscosity, therefore,
The ultra-thin composite film thickness being typically prepared is not less than 10 μm.And in the present invention, the covering glue film, itself has bonding
Property, it does not need additionally to add bonding agent, therefore, the covering glue film preferred thickness being prepared is 5 μm~50 μm, and thickness is controllable,
More frivolous coating also can be obtained simultaneously, be conducive to making and using for flexible circuit board.
Preferably, the substrate includes: substrate, coil, magnetic core；Wherein, the coil tiling is incorporated in the substrate one
Surface, and the substrate corresponds to the part on the inside of the coil and offers through-hole, the magnetic core includes the first magnetic core and the second magnetic
Core, the first magnetic core stacking are incorporated in the surface that the substrate deviates from the coil, and second magnetic core passes through the through-hole
It is connect with first magnetic core.Meanwhile the size of second magnetic core and the through-hole is in the same size；And/or described first
The size of magnetic core is in the same size with the substrate.
Preferably, base material include but is not limited to copper foil base material (FCCL) can using the flexible copper foil as substrate
To be used to prepare three layers of traditional flexible board substrate (3L-FCCL), it can also be used to prepare two layers of flexible board substrate (2L-FCCL).As a result,
The flexible circuit board being prepared is more lightening, and has preferable flexible.Further, the substrate has line
Round line pattern, the spacing between route are not less than 10 μm.Route spacing is big, solves conventional flex circuits plate in use process
In since route spacing is too small lead to that resistance value is unstable, the big problem of fluctuation.
Preferably, the core material includes but is not limited to ferrite.Since ferrite has high resistivity, high dielectric property
And therefore higher magnetic conductivity in the use process of flexible circuit board, using ferrite as core material, can make to make
Standby obtained flexible circuit board has higher magnetic conductivity and dielectric properties, more excellent performance.
Specifically, the screened film is the interference in order to shield outer bound pair flexible circuit board internal magnetic field, to guarantee that this is soft
Property circuit board internal magnetic field stablize.In a preferred embodiment of the invention, the preferred graphite of the material of this screened film.
Preferably, the thickness of the flexible circuit board is not less than 10 μm.If the circuit board being prepared is too thin, will lead to
Product structure stability is poor, is easily damaged, and service life is short, while being also easy to influence the characteristic of circuit board, makes circuit board performance
Unstable, fluctuation is big, influence using.Preferably, which can be used in equipment such as wireless charger, display screen, switching screens
In.
To sum up, the flexible circuit board plate prepared by the present invention stacks gradually the first covering glue film, screened film, substrate of combination
With the second covering glue film；First covering glue film, second cover film include the carrier layer being oppositely arranged and protective layer,
And the black glue layer between the carrier layer and the protective layer is set；Wherein, with the total weight of the black glue layer for 100%
Meter, the black glue layer includes the raw material components of following parts by weight: 55%~70% modified epoxy, 5%~25% promotor,
5%~20% dyestuff, 5%~10% dumb light powder.Wherein, modified epoxy added by black glue layer has good toughness,
It can be improved ductility simultaneously, it made to keep toughness during stretching, be not easy to break, and there is certain cementability,
It does not need in addition to add adhesive material in overlay film, in coating process, can guarantee that coating coplanar flat is smooth, what is obtained is black
Glue line material is not in harmomegathus phenomenon；Added promotor is the shaping speed that can promote black glue layer, guarantees black glue layer
Speed is uniform when solidification, it is not easy to aging.The covering glue film being prepared has viscous stickiness, can directly replace 5 μ in the prior art
The structure of composite membrane of m black polyamide (PI)+5um polyethylene (AD) (or the black PI+5umAD of 8um), while in use
It does not need to increase other alite pastes, it is possible to prevente effectively from the bad effects such as blistering, corrugation, modification occur for the covering glue film being prepared
Fruit and cause flexible circuit board performance decline the problem of.The flexible circuit plate thickness being prepared is controllable, and product stability is high, prolongs
Malleability is good, tensile property enhancing, is less likely to be damaged, and efficiently solves the problems, such as that Kapton needs import.
It is further elaborated below with reference to embodiment
It please refers in Figure of description 1 or Fig. 2, the embodiment of the invention provides a kind of flexible circuit board, the flexible electrical
Road plate stacks gradually the first covering glue film 4, screened film 3, substrate 2, the second covering glue film 1.
It please refers to and illustrates in attached drawing 3, the embodiment of the invention provides the signals of the specific structure of the substrate 2 of flexible circuit board
Figure, the substrate 2 includes: substrate 23, coil 22, the first magnetic core 24, the second magnetic core 21；Wherein, the tiling of coil 22 combines
Through-hole, the magnetic core packet are offered in the part on 23 1 surface of substrate, and corresponding 22 inside of coil of the substrate 23
The first magnetic core 24 and the second magnetic core 21 are included, 24 sandwich layer of the first magnetic is folded in conjunction with the table for deviating from the coil 22 in the substrate 23
Face, second magnetic core 21 are connect by the through-hole with first magnetic core 24.
Embodiment 1
Filling glue constituent content and preparation method for Wireless charging coil diaphragm.Wherein, it is used for Wireless charging coil
Described in the included weight ratio ingredient of the filling glue component table 1 as follows of diaphragm.Wherein, modified epoxy used includes group
Point: 30% Resin A S-60,30% toluene, 30% methanol, 10% aluminium hydroxide；Promotor used includes component: 90% modified ring
Oxygen resin, 10%2- methylimidazole.Dyestuff used includes component: 40% carbon black, 60% methanol.Dumb light powder used includes component:
90% modified epoxy, 10% dumb light powder.
The preparation method of the filling glue of the Wireless charging coil diaphragm: at normal temperatures and pressures, according to above-mentioned each ingredient
Composition and ratio weighs required substance respectively, by 55% modified epoxy, 15% promotor, 20% dyestuff, 10% dumb light powder into
Row is stirred processing, obtains the first mixed material, and the first mixed material is then placed in high speed disperser and carries out decentralized processing
Obtain the second mixed material；Second mixed material is filtered processing, obtains filling glue.
The Wireless charging coil diaphragm being further prepared, the Wireless charging coil diaphragm include 5 μ being oppositely arranged
M PET release film and 5 μm of polyethylene films, and 5 μm of filling glue being arranged between the PET release film and the polyethylene film
Layer, the filling glue-line are the above-mentioned filling glue being prepared.
This is for Wireless charging coil diaphragm the preparation method comprises the following steps: offer PET release film, applies on the PET release film
Cloth fills sol solution, is filling glue-line by filling sol solution baking, deviates from the surface of PET release film in the filling glue-line
Cover polyethylene film；Wherein specific baking condition: be arranged tunnel type baking oven each section temperature be followed successively by 40 DEG C, 60 DEG C, 80 DEG C,
120℃,120℃,60℃；Each section air inlet wind frequency is followed successively by 25Hz, 20Hz, 20Hz, 20Hz, 20Hz, 25Hz；Air draft wind frequency is
35Hz。
The flexible circuit board of wireless charger is further prepared, the flexible circuit board is stacked gradually in conjunction with 15 μm
One Wireless charging coil diaphragm, 5 μm of graphite shielding films, 5 μm of substrates and 15 μm of second Wireless charging coil diaphragm, first nothing
Line charge electric coil diaphragm and and the second Wireless charging coil diaphragm include that above-mentioned filling glue is prepared.
Embodiment 2
Filling glue constituent content and preparation method for Wireless charging coil diaphragm.Wherein, it is used for Wireless charging coil
Described in the included weight ratio ingredient of the filling glue component table 1 as follows of diaphragm.Wherein, modified epoxy used includes group
Point: 30% Resin A S-60,30% toluene, 30% methanol, 10% aluminium hydroxide；Promotor used includes component: 90% modified ring
Oxygen resin, 10%2- methylimidazole.Dyestuff used includes component: 40% carbon black, 60% methanol.Dumb light powder used includes component:
90% modified epoxy, 10% dumb light powder.
The preparation method of filling glue for Wireless charging coil diaphragm: at normal temperatures and pressures, according to above-mentioned each ingredient
Composition and ratio weighs required substance respectively, by 66% modified epoxy, 20% promotor, 10% dyestuff, 10% dumb light powder into
Row is stirred processing, obtains the first mixed material, and the first mixed material is then placed in high speed disperser and carries out decentralized processing
Obtain the second mixed material；Second mixed material is filtered processing, obtains filling glue.
The Wireless charging coil diaphragm being further prepared, the Wireless charging coil diaphragm include 5 μ being oppositely arranged
M PET release film and 5 μm of polyethylene films, and 8 μm of filling glue being arranged between the PET release film and the polyethylene film
Layer, the filling glue-line are the above-mentioned filling glue being prepared.
This is for Wireless charging coil diaphragm the preparation method comprises the following steps: offer PET release film, applies on the PET release film
Cloth fills sol solution, is filling glue-line by filling sol solution baking, deviates from the surface of PET release film in the filling glue-line
Cover polyethylene film；Wherein specific baking condition: be arranged tunnel type baking oven each section temperature be followed successively by 40 DEG C, 60 DEG C, 80 DEG C,
120℃,120℃,60℃；Each section air inlet wind frequency is followed successively by 25Hz, 20Hz, 20Hz, 20Hz, 20Hz, 25Hz；Air draft wind frequency is
35Hz。
The flexible circuit board of wireless charger is further prepared, the flexible circuit board is stacked gradually in conjunction with 18 μm
One Wireless charging coil diaphragm, 5 μm of graphite shielding films, 5 μm of substrates and 18 μm of second Wireless charging coil diaphragm, first nothing
Line charge electric coil diaphragm and and the second Wireless charging coil diaphragm include that above-mentioned filling glue is prepared.
Embodiment 3
Filling glue constituent content and preparation method for Wireless charging coil diaphragm.Wherein, it is used for Wireless charging coil
Described in the included weight ratio ingredient of the filling glue component table 1 as follows of diaphragm.Wherein, modified epoxy used includes group
Point: 30% Resin A S-60,30% toluene, 30% methanol, 10% aluminium hydroxide；Promotor used includes component: 90% modified ring
Oxygen resin, 10%2- methylimidazole.Dyestuff used includes component: 40% carbon black, 60% methanol.Dumb light powder used includes component:
90% modified epoxy, 10% dumb light powder.
The preparation method of filling glue for Wireless charging coil diaphragm: at normal temperatures and pressures, according to above-mentioned each ingredient
Composition and ratio weighs required substance respectively, and 60% modified epoxy, 15% promotor, 20% dyestuff, 5% dumb light powder are carried out
It is stirred processing, obtains the first mixed material, the first mixed material is then placed in high speed disperser progress decentralized processing and is obtained
Second mixed material；Second mixed material is filtered processing, obtains filling glue.
The Wireless charging coil diaphragm being further prepared, the Wireless charging coil diaphragm include 5 μ being oppositely arranged
M PET release film and 5 μm of polyethylene films, and 10 μm of fillings being arranged between the PET release film and the polyethylene film
Glue-line, the filling glue-line are the above-mentioned filling glue being prepared.
This is for Wireless charging coil diaphragm the preparation method comprises the following steps: offer PET release film, applies on the PET release film
Cloth fills sol solution, is filling glue-line by filling sol solution baking, deviates from the surface of PET release film in the filling glue-line
Cover polyethylene film；Wherein specific baking condition: be arranged tunnel type baking oven each section temperature be followed successively by 40 DEG C, 60 DEG C, 80 DEG C,
120℃,120℃,60℃；Each section air inlet wind frequency is followed successively by 25Hz, 20Hz, 20Hz, 20Hz, 20Hz, 25Hz；Air draft wind frequency is
35Hz。
The flexible circuit board of wireless charger is further prepared, the flexible circuit board is stacked gradually in conjunction with 20 μm
One Wireless charging coil diaphragm, 5 μm of graphite shielding films, 5 μm of substrates and 20 μm of second Wireless charging coil diaphragm, first nothing
Line charge electric coil diaphragm and and the second Wireless charging coil diaphragm include that above-mentioned filling glue is prepared.
The each component parts by weight of 1 Examples 1 to 3 of table match (%)
The filling glue that Wireless charging coil diaphragm is used for prepared by embodiment 1-3 is tested for the property, test method
As described below.
Coating obtained by above-described embodiment is tested, test method is as follows:
(1) the filling glue that above-described embodiment 1-3 is prepared glue thickness: is measured into its glue-line thickness with micron micrometer
Degree；
(2) tensile strength: the filling glue that above-described embodiment 1-3 is prepared is measured it with tensilon and is stretched by force
Degree；
(3) it is small that the filling glue that above-described embodiment 1-3 is prepared soldering resistance: is reacted 1 in 300 DEG C of tin furnace respectively
When, 2 hours, observation filling glue form；
(4) peel strength test: filling glue that above-described embodiment 1-3 is prepared being carried out with stainless steel be bonded, is used in combination
Tensilon is at the uniform velocity pullled, and measures the peel strength of its 1 hour and 2 hours respectively；
(5) glue overflow amount: the filling glue that above-described embodiment 1-3 is prepared is placed in metallographic microscope and observes its excessive glue
Amount.
As a result such as the following table 2:
The comparison for the filling colloidality energy that 2 embodiment 1-3 of table is prepared
Such as table 2, the filling glue that each embodiment 1-3 is prepared has carried out glue thickness, tensile strength, soldering resistance, stripping respectively
Analysis from 5 intensity, glue overflow amount performances.Wherein, professional standard provides: the thickness for the glue being prepared should be " 10 ± 2 μm "；
The test of soldering resistance is that 1 hour, 2 hours are reacted at 300 DEG C, and not blistering obtained glue is qualification；Peel strength is that will fill out
It fills glue and is carried out with stainless steel be bonded, and at the uniform velocity pullled with tensilon, pull 1 hour, 2 hours, obtained peel strength
>=0.8N/mm is qualification；Glue overflow amount is that the filling glue that will be prepared is observed in metallographic microscope, glue overflow amount≤
0.1mm is qualification.
Specifically, for fill glue glue thickness measurement analyze, wherein the filling glue that embodiment 1 is prepared with a thickness of
12μm；The filling glue that embodiment 2 is prepared is with a thickness of 12 μm；The filling glue that embodiment 3 is prepared is with a thickness of 11 μm.It can be with
Find out, compared with the bondline thickness of professional standard carries out, the preparation-obtained glue line material thickness of the present invention is moderate, meets row
The standard of industry, while being more favorable to the preparation applied to Wireless charging coil diaphragm, flexible circuit board.
Secondly, analyzing for the measurement for filling glue tensile strength, the filling glue tensile strength that embodiment 1 is prepared is
12N/mm；The filling glue tensile strength that embodiment 2 is prepared is 13.4N/mm；The filling glue that embodiment 3 is prepared stretches
Intensity is 15.47N/mm；Thus, preparation-obtained filling glue can keep toughness during stretching, it is not easy to quilt
It breaks；It can also be preferably applied for the preparation of Wireless charging coil diaphragm, flexible circuit board simultaneously.
Analysis can be carried out to filling glue soldering resistance, soldering resistance refers to reacts 1 hour, 2 hours at 300 DEG C, and what is obtained fills out
It is qualification that it is not blistering, which to fill glue,.Embodiment 1, embodiment 2, the preparation-obtained filling glue of embodiment 3 is anti-respectively at 300 DEG C
1 hour, 2 hours are answered, obtained filling glue is not blistering, qualified.Thus, it is possible to prove the resistance to weldering of preparation-obtained filling glue
Performance is good, in coating process, it is ensured that coating coplanar flat is smooth, and the filling glue material being prepared is not in harmomegathus
Phenomenon；It can also be preferably applied for the preparation of Wireless charging coil diaphragm, flexible circuit board simultaneously.
Filling glue peel strength is analyzed, " peel strength is that will fill glue and stainless steel progress to professional standard regulation
Bonding, and at the uniform velocity pullled with tensilon, 1 hour, 2 hours are pullled, obtained peel strength >=0.8N/mm is to close
Lattice ".According to the data of table 2, after pullling 1 hour, the preparation-obtained filling glue peel strength of embodiment 1 is 1N/mm；Implement
The preparation-obtained filling glue peel strength of example 2 is 1.34N/mm；The preparation-obtained filling glue peel strength of embodiment 3 is
1.12N/mm；After pullling 2 hours, the preparation-obtained filling glue peel strength of embodiment 1 is 1.1N/mm；Embodiment 2 is made
Standby obtained filling glue peel strength is 1.47N/mm；The preparation-obtained filling glue peel strength of embodiment 3 is 1.25N/mm；
After pullling 1 hour, 2 hours, embodiment 1-3 it is preparation-obtained filling glue peel strength >=0.8N/mm, meet mark
It is quasi-.It can be seen that preparation-obtained filling glue have very strong cementability, make the Wireless charging coil diaphragm being prepared,
Flexible circuit board function admirable.
Filling glue glue overflow amount is analyzed, the filling glue being prepared is observed in metallographic microscope, excessive glue
Amount≤0.1mm is qualification.The filling glue that embodiment 1-3 is prepared is observed in metallographic microscope respectively, is overflow
Glue amount is respectively 0.06mm, 0.03mm, 0.04mm, meets the standard of " glue overflow amount≤0.1mm " described in industry, makes to be prepared
Wireless charging coil diaphragm, flexible circuit board function admirable.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (10)
1. a kind of flexible circuit board, which is characterized in that the flexible circuit board stacks gradually the first covering glue film of combination, shielding
Film, substrate and the second covering glue film；The first covering glue film, the second covering glue film include the carrier layer being oppositely arranged
And protective layer, and the black glue layer being arranged between the carrier layer and the protective layer, wherein with the gross weight of the black glue layer
Amount is 100% meter, and the black glue layer includes the raw material components of following parts by weight: 55%~70% modified epoxy, 5%~
25% promotor, 5%~20% dyestuff, 5%~10% dumb light powder.
2. flexible circuit board according to claim 1, which is characterized in that the total weight with the modified epoxy is
100% meter, the modified epoxy includes the raw material components of following parts by weight:
Epoxy resin 20%~30%
Diluent 40%~60%
Fire retardant 5%~10%.
3. flexible circuit board according to claim 1, which is characterized in that by the total weight of the promotor be 100% in terms of,
The promotor includes the component of following parts by weight:
The modified epoxy 80%~90%
Promotor 3%~10%.
4. flexible circuit board according to claim 1, which is characterized in that by the total weight of the dyestuff be 100% in terms of, institute
State the component that dyestuff includes following parts by weight:
Carbon black 30%~40%
Diluent 40%~60%.
5. flexible circuit board according to claim 1, which is characterized in that by the total weight of the dumb light powder be 100% in terms of,
The dumb light powder includes the component of following parts by weight:
The modified epoxy 80%~90%
Dumb light powder 5%~10%.
6. any flexible circuit board according to claim 1~5, which is characterized in that the black glue layer with a thickness of 5 μm~
15μm。
7. any flexible circuit board according to claim 1~5, which is characterized in that the thickness of the first covering glue film
It is 5 μm~50 μm；And/or
It is described second covering glue film with a thickness of 5 μm~50 μm.
8. any flexible circuit board according to claim 1~5, which is characterized in that the substrate include: substrate, coil,
Magnetic core；Wherein, the coil tiling is incorporated in one surface of substrate, and the substrate corresponds to the portion on the inside of the coil and separates
Equipped with through-hole, the magnetic core includes the first magnetic core and the second magnetic core, and the first magnetic core stacking is incorporated in the substrate away from institute
The surface of coil is stated, second magnetic core is connect by the through-hole with first magnetic core.
9. flexible circuit board according to claim 8, which is characterized in that the size of second magnetic core and the through-hole
It is in the same size；And/or
The size of first magnetic core is in the same size with the substrate.
10. any flexible circuit board according to claim 1~5, which is characterized in that the thickness of the flexible circuit board is not
Less than 10 μm.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112187975A (en) * | 2020-09-17 | 2021-01-05 | 淮安维嘉益集成科技有限公司 | Application of WOFC2 material in manufacturing of FPC (flexible printed circuit) substrate of camera module |
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| CN108335879A (en) * | 2018-04-19 | 2018-07-27 | 优尔特电子（深圳）有限公司 | A kind of flat surface transformer, electronic equipment and flat surface transformer production method |
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| JP2004095566A (en) * | 2002-07-08 | 2004-03-25 | Tatsuta Electric Wire & Cable Co Ltd | Shield film, shielded flexible printed wiring board, and their manufacturing methods |
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| CN101575489A (en) * | 2009-06-15 | 2009-11-11 | 新高电子材料（中山）有限公司 | White adhesive for flexible printed circuit and preparation method thereof |
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