CN207201068U - Electromagnetic shielding film and printed substrate - Google Patents
Electromagnetic shielding film and printed substrate Download PDFInfo
- Publication number
- CN207201068U CN207201068U CN201721023190.4U CN201721023190U CN207201068U CN 207201068 U CN207201068 U CN 207201068U CN 201721023190 U CN201721023190 U CN 201721023190U CN 207201068 U CN207201068 U CN 207201068U
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- electromagnetic shielding
- shielding film
- layer
- film
- conducting resinl
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Abstract
A kind of electromagnetic shielding film and printed substrate,It is related to printed substrate preparing technical field,The electromagnetic shielding film includes folded metal level and the conducting resinl film layer being located at together,Metal level includes at least one layer of Ni coats of metal and at least one layer of good conductor coating,Conducting resinl film layer is coated with by adhesive to be formed,Adhesive is counted mainly by 18~20 parts of gluing main bodys in parts by weight,30 parts of conductive materials and 25~35 parts of solvent compositions,Gluing main body is modified epoxy,Polyacrylic resin,Modified rubber,Polyester resin,One or more of mixtures in polyurethane resin,Conductive material is mainly by Ni powder,One or more of mixtures in the conducting powder and conductive carbon nanotube of its modifier composition,The electromagnetic shielding film is electro-magnetic wave absorption type electromagnetic shielding film,With frivolous,High temperature resistant,The excellent properties such as flex endurant,Grounding resistance is low,There is fabulous capability of electromagnetic shielding in wide frequency range simultaneously.Printed substrate is good covered with above-mentioned electromagnetic shielding film, its capability of electromagnetic shielding.
Description
Technical field
Printed substrate preparing technical field is the utility model is related to, in particular to a kind of electromagnetic shielding film and print
Brush wiring board.
Background technology
Printed substrate is material indispensable in electronic product, be widely used in computer and its ancillary equipment,
In communication product and consumption electronic products.With consumption electronic products demand sustainable growth, people are for printed wire
The requirement of plate is also growing day by day.When manufacturing printed substrate, electromagnetic shielding is to improve electronic product and installation electromagnetical compatibility
Property one of important measures, it refers to energy transmission is prevented or reduced using shield, each in air so as to effectively reduce
A kind of mode of kind electromagnetic interference.Electromagnetic shielding be broadly divided into electrical shielding (referring mainly to shield using electrostatic field and alternating electric field),
Magnetic screen (referring mainly to shield using magnetostatic field and alternating magnetic field) and electromagnetic shielding (referring to electromagnetic wave shielding).
Specifically, electromagnetic shielding is exactly by the interference of component, circuit, sub-assembly, cable or whole system with shield
Source is surrounded, and prevents from disturbing electromagnetic field to external diffusion；Or be surrounded receiving circuit, equipment or system with shield, prevent
Only they are influenceed by external electromagnetic field.To realize good ground connection and shielding properties, existing electromagnetic shielding film is mostly adopted
With high conductive precious metal material, predominantly silver powder, copper powder, silver-coated copper powder etc., costly, and it is mainly by right for its price
Reflecting to play a part of electromagnetic shielding for electromagnetic wave, does not completely eliminate electromagnetic wave.Meanwhile powder in existing electromagnetic shielding film
Body loading is higher, and shield effectiveness typically can only achieve 50-60dB or so, can not meet setting for electronic product high-speed high frequency
Meter.
Therefore, it is necessary to which a kind of cost is low, the high electromagnetic shielding film of shielding properties, to meet electronic product high-speed high frequency
Design.
Utility model content
The purpose of this utility model is to provide a kind of electromagnetic shielding film, and it is electro-magnetic wave absorption type electromagnetic shielding film, tool
There are the excellent properties such as frivolous, high temperature resistant, flex endurant, grounding resistance is low, while has fabulous electromagnetic shielding in wide frequency range
Performance.
Another object of the present utility model is to provide a kind of printed substrate, and its capability of electromagnetic shielding is good.
What embodiment of the present utility model was realized in：
A kind of electromagnetic shielding film, it includes folded metal level and the conducting resinl film layer being located at together, and metal level includes at least one
The layer Ni coats of metal and at least one layer of good conductor coating, conducting resinl film layer is coated with by adhesive to be formed, and adhesive is in parts by weight
Meter is mainly made up of 18~20 parts of gluing main bodys, 30 parts of conductive materials and 25~35 parts of solvents, and gluing main body is modified epoxy tree
One or more of mixtures in fat, polyacrylic resin, modified rubber, polyester resin, polyurethane resin, conductive material are
One or more of mixtures in the conducting powder and conductive carbon nanotube that are mainly made up of Ni powder, its modifier, conducting powder are in
It is sheet, spherical and fibrous.
In the utility model preferred embodiment, the thickness of above-mentioned conducting resinl film layer is 5-15 μm.
In the utility model preferred embodiment, the thickness of above-mentioned metal level is 0.05-0.3 μm.
In the utility model preferred embodiment, the black that above-mentioned electromagnetic shielding film also includes being stacked under metal level is exhausted
Edge layer, black insulating barrier are epoxy resin, polyacrylic resin, modified rubber, phenolic resin, polyester resin, polyurethane resin
In one or more of mixtures.
In the utility model preferred embodiment, the thickness of above-mentioned black insulating barrier is 5-20 μm.
In the utility model preferred embodiment, above-mentioned electromagnetic shielding film is also resistance under black insulating barrier including being stacked at
Hot pressing film layer, heat-resisting press mold layer are one or more of modified films of PET, PEN, PI, PBT, PPS film.
In the utility model preferred embodiment, the thickness of above-mentioned heat-resisting press mold layer is 25-200 μm.
In the utility model preferred embodiment, above-mentioned electromagnetic shielding film also includes the guarantor being stacked in conducting resinl film layer
Sheath, one or more of modified films of protective layer PET, PEN, PI, PBT, PPS film.
In the utility model preferred embodiment, above-mentioned protective layer thickness is 25-200 μm.
A kind of printed substrate, it includes wiring board and above-mentioned electromagnetic shielding film, and electromagnetic shielding film is covered in wiring board
On.
The beneficial effect of the utility model embodiment is：The electromagnetic shielding film of the utility model embodiment, which includes folding, is located at one
The metal level and conducting resinl film layer, metal level risen includes at least one layer of Ni coats of metal and at least one layer of good conductor coating, conductive
Adhesive film is coated with by adhesive and formed, and adhesive is counted mainly by 18~20 parts of gluing main bodys, 30 parts of conductive materials in parts by weight
Formed with 25~35 parts of solvents, gluing main body is modified epoxy, polyacrylic resin, modified rubber, polyester resin, poly- ammonia
One or more of mixtures in ester resin, conductive material are the conducting powder and conduction being mainly made up of Ni powder, its modifier
One or more of mixtures in CNT, conducting powder in the form of sheets, it is spherical and fibrous, the electromagnetic shielding film is electromagnetic wave
Absorption-type electromagnetic shielding film, there are the excellent properties such as frivolous, high temperature resistant, flex endurant, grounding resistance is low, while in wide frequency range
With fabulous capability of electromagnetic shielding.The printed substrate of the utility model embodiment is covered with above-mentioned electromagnetic shielding film, its electricity
Magnetic shield performance is good.
Brief description of the drawings
, below will be to required use in embodiment in order to illustrate more clearly of the technical scheme of the utility model embodiment
Accompanying drawing be briefly described, it will be appreciated that the following drawings illustrate only some embodiments of the present utility model, therefore should not be by
Regard the restriction to scope as, for those of ordinary skill in the art, on the premise of not paying creative work, may be used also
To obtain other related accompanying drawings according to these accompanying drawings.
Fig. 1 is applying structure schematic diagram in the utility model embodiment；
Fig. 2 is the structural representation of the conducting resinl film layer shown in Fig. 1；
Fig. 3 is a kind of structural representation for electromagnetic shielding film that the utility model embodiment 4 provides；
Fig. 4 is a kind of structural representation for electromagnetic shielding film that the utility model embodiment 5 provides；
Fig. 5 is a kind of structural representation for electromagnetic shielding film that the utility model embodiment 6 provides.
Icon：001- guide wheels；002- adhesives；003- base material delivery outlets；004- conducting resinl film layers；005- sheets of conductive
Powder；100- electromagnetic shielding films；The 131-Ni coats of metal；132- good conductor coating；140- conducting resinl film layers；200- is electromagnetically shielded
Film；The heat-resisting press mold layers of 210-；The 231-Ni coats of metal；232- good conductor coating；240- conducting resinl film layers；250- protective layers；
300- electromagnetic shielding films；The heat-resisting press mold layers of 310-；320- black insulating barriers；The 331-Ni coats of metal；332- good conductor coating；
340- conducting resinl film layers；350- protective layers.
Embodiment
It is new below in conjunction with this practicality to make the purpose, technical scheme and advantage of the utility model embodiment clearer
Accompanying drawing in type embodiment, the technical scheme in the embodiment of the utility model is clearly and completely described, it is clear that is retouched
The embodiment stated is the utility model part of the embodiment, rather than whole embodiments.Generally here described in accompanying drawing and
The component of the utility model embodiment shown can be configured to arrange and design with a variety of.
Therefore, the detailed description of the embodiment of the present utility model to providing in the accompanying drawings is not intended to limit requirement below
The scope of the utility model of protection, but it is merely representative of selected embodiment of the present utility model.Based in the utility model
Embodiment, the every other embodiment that those of ordinary skill in the art are obtained under the premise of creative work is not made, all
Belong to the scope of the utility model protection.
It should be noted that：Similar label and letter represents similar terms in following accompanying drawing, therefore, once a certain Xiang Yi
It is defined, then it further need not be defined and explained in subsequent accompanying drawing in individual accompanying drawing.
, it is necessary to the orientation or position relationship of the instruction such as explanation, term " on ", " under " in description of the present utility model
For based on orientation shown in the drawings or position relationship, or the utility model product using when the orientation or position usually put
Relation, it is for only for ease of description the utility model and simplifies description, rather than indicates or imply that signified device or element must
There must be specific orientation, with specific azimuth configuration and operation, therefore it is not intended that to limitation of the present utility model.
In description of the present utility model, it is also necessary to which explanation, unless otherwise clearly defined and limited, term " are set
Put " it should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected, or it is integrally connected；It can be machine
Tool connects or electrical connection；Can be joined directly together, can also be indirectly connected by intermediary, can be two members
Connection inside part.For the ordinary skill in the art, it can understand that above-mentioned term is new in this practicality with concrete condition
Concrete meaning in type.
The utility model embodiment provides a kind of conducting resinl film layer, and it is coated with by adhesive and formed, and adhesive is by weight
Number meter is mainly made up of 18~20 parts of gluing main bodys, 30 parts of conductive materials being distributed in gluing main body and 25~35 parts of solvents,
Gluing main body is modified epoxy, polyacrylic resin, modified rubber, polyester resin, one kind in polyurethane resin or several
Kind mixture, conductive material for one kind in the conducting powder and conductive carbon nanotube that are mainly made up of Ni powder, its modifier or
Several mixtures, conducting powder in the form of sheets, it is spherical and fibrous.Wherein, conducting powder accounts for the overall mass ratio of solid constituent and is
40%-75%, the viscosity of adhesive is preferably 200-500cps, and the thickness of conducting resinl film layer is 5-15 μm.
In the technology of such scheme, adhesive also includes 0.2~0.3 part of coupling agent；Or adhesive also includes 2~5
Part curing agent, 0.4~0.6 part of curing accelerator；Or adhesive also includes 0.4~0.6 part of dispersant, 0.05~0.2 part of stream
Flat agent；Or adhesive also includes the one or more in said components.
Shown in Figure 1, the utility model embodiment provides a kind of preparation method of above-mentioned conducting resinl film layer 004, leads
Electric adhesive film 004 is coated with adhesive 002 particular by the guide wheel 001 with permanent magnetism, until the conducting powder in adhesive 002
In what is be uniformly directed arrangement and formed, particular by the guide wheel 001 with permanent magnetism in the base exported by base material delivery outlet 003
Adhesive 002 is coated with material, conducting resinl film layer 004 is formed on base material, conductive adhesive film layer 004 can be made to reach more preferable shielding
Effect.
Referring to shown in Fig. 1 and Fig. 2, the utility model embodiment (is coated with by using the guide wheel 001 with permanent magnetism
Wheel), while the viscosity of adhesive 002 is adjusted, the viscosity of adhesive 002 is preferably 200-500cps so that in adhesive 002
Sheets of conductive powder 005 is easier to move in the presence of magnetic force, while will not produce the sagging phenomenon of adhesive 002 so that after coating
Adhesive 002 in conductive material, mainly sheets of conductive powder 005 can be oriented in arranging.Conducting powder is oriented in arranging, and one
Aspect enables conducting powder preferably to form reflecting interface, increases its reflection for electromagnetic wave；On the other hand conduction is caused
Powder can form magnetic hystersis loss field similar in an orientation, absorption of the increase magnetic material for electromagnetic field so that the electricity of product
Magnetic shield performance significantly improves.In addition, by adding other shapes of conductive material, it can further increase conducting resinl film layer
004 capability of electromagnetic shielding：Spherical conducting powder primarily serves the effect of auxiliary earth, can preferably realize the ground connection of product
Performance；And the conducting powder or conductive carbon nanotube of threadiness can preferably realize the connection between conductive material, increase is led
Electric material contact probability, the addition of conductive material is reduced, while can also preferably conduct heat, so as to distribute production well
Product heat caused by because of electromagnetic wave absorption.
The utility model embodiment provides a kind of electromagnetic shielding film, and it, which includes folding, is located at metal level together and above-mentioned leads
Electric adhesive film, metal level include at least one layer of Ni coats of metal and at least one layer of good conductor coating, and good conductor coating is copper metal
One kind in coating, silver metal coating, aluminum metal coating, the thickness of metal level is 0.05-0.3 μm.The utility model passes through excellent
NI metal or its modified metal of the choosing equally with good conductive and magnetic property, are realized by having magnetic coating roller
The uniform orientations of conductive material, there is good absorption and shielding properties for electromagnetic wave, while in black insulating barrier
The upper NI coats of metal for plating very thin magnetic conduction respectively and another good conductor coating, are realized excellent in wide frequency ranges
Shielding.Preferably, electromagnetic shielding film also includes the black insulating barrier being stacked under metal level, is stacked under black insulating barrier
Heat-resisting press mold layer, and the electromagnetic shielding film also protective layer including being stacked in conducting resinl film layer.It is furthermore preferred that as shown in figure 1,
Electromagnetic shielding film includes from bottom to top folding the heat-resisting press mold layer set, black insulating barrier, metal level (including layer of Ni metal-plated successively
Layer and one layer of good conductor coating), conducting resinl film layer and protective layer totally 6 stacking structure, wherein, heat-resisting press mold layer, which is covered in, to be needed to shield
On the printed substrate or electronic product of protection, or protective layer is covered in the printed substrate for needing shielding protection or electronics production
On product.
Wherein, heat-resisting press mold layer is high molecular polymer film, mainly presses conducting resinl film layer aliquation protection and carrying to make
With it can be one or more of modified films of PET, PEN, PI, PBT, PPS film, and the thickness of heat-resisting press mold layer is 25-
200μm.Meanwhile the lower surface of heat-resisting press mold layer scribbles mould release (silicone oil mould release or non-silicone oil mould release) so that product heat
It can be torn off after pressure.
Black insulating barrier has the function of insulation, can be epoxy resin, polyacrylic resin, modified rubber, phenolic aldehyde tree
One or more of mixtures in fat, polyester resin, polyurethane resin, the thickness of black insulating barrier is 5-20 μm.
Metal level is very thin the NI coats of metal and good conductor coating, according to plating process can adjust the Ni coats of metal and
Overlying relation between good conductor coating.By selecting two kinds of coats of metal：The Ni coats of metal of magnetic conductivity and good conduction
The good conductor coating of property, on the one hand there is very strong shielding action for the electromagnetic wave in 0-10GHz band limits, adds pair
In the frequency range of electromagnetic signal shielding, on the other hand, the Ni coats of metal belong to magnetic material, being capable of effective electromagnetic wave absorption
Signal, substantially increase the shield effectiveness of product.
Conducting resinl film layer is to be coated with formation by using the coating wheel with permanent magnetism, while adjusts the viscous of adhesive
Degree so that the sheets of conductive powder in adhesive is easier to move in the presence of magnetic force, while will not produce adhesive sagging phenomenon,
So that the conducting powder in adhesive after coating, the mainly conducting powder of sheet can be oriented in arranging.Conducting powder is oriented in arranging
Row, on the one hand enable conductive material preferably to form reflecting interface, increase its reflection for electromagnetic wave；On the other hand make
Magnetic hystersis loss field similar in an orientation, absorption of the increase magnetic material for electromagnetic field so that production can be formed by obtaining conducting powder
The capability of electromagnetic shielding of product significantly improves.
Protective layer is high molecular polymer film, mainly to conducting resinl film layer serve protection and carrying, can for PET,
One or more of modified films of PEN, PI, PBT, PPS film, protective layer thickness are 25-200 μm, and it mainly passes through hot pressing
Or the mode of transfer is pressed together in conducting resinl film layer.Meanwhile the upper surface of protective layer scribbles and mould release (silicon is scribbled on mould release film
Oily mould release or non-silicone oil mould release) so that product can be torn off.
Feature of the present utility model and performance are described in further detail with reference to embodiments.
Embodiment 1
Shown in Figure 1, the present embodiment provides a kind of conducting resinl film layer 004, and it uses following preparation method to be made：
Following raw material is mixed evenly, allotment obtains adhesive 002：Bisphenol A type epoxy resin 10g, it is modified flexible
Epoxy resin 5g, end carboxyl nitrile rubber 4g, solvent 30g, coupling agent 0.25g, conductive material 30g (wherein, sheets of conductive powder
005：Spherical conducting powder：Conductive carbon nanotube=88：10：2, conducting powder accounts for the overall mass ratio of solid constituent as 70%), Gu
Agent 2g, curing accelerator 0.5g.
Adhesive 002 is coated with base material using the guide wheel 001 with permanent magnetism, until the sheet in adhesive 002 is led
Electric powder 005 obtains conducting resinl film layer 004 in arrangement is uniformly directed, so as to be formed on base material.
Embodiment 2
Shown in Figure 1, the present embodiment provides a kind of conducting resinl film layer 004, and it uses following preparation method to be made：
Following raw material is mixed evenly, allotment obtains adhesive 002：Bisphenol f type epoxy resin 12g, it is modified flexible
Epoxy resin 8g, solvent 25g, coupling agent 0.25g, conductive material 30g (wherein, sheets of conductive powder 005：Spherical conducting powder：Fiber
Shape conducting powder=85：10：5, conducting powder accounts for the overall mass ratio of solid constituent as 70%), curing agent 3g, curing accelerator
0.5g。
Adhesive 002 is coated with base material using the guide wheel 001 with permanent magnetism, until the sheet in adhesive 002 is led
Electric powder 005 obtains conducting resinl film layer 004 in arrangement is uniformly directed, so as to be formed on base material.
Embodiment 3
Shown in Figure 1, the present embodiment provides a kind of conducting resinl film layer 004, and it uses following preparation method to be made：
Following raw material is mixed evenly, allotment obtains adhesive 002：Epoxide modified acryl resin 20g, solvent
35g, dispersant 0.5g, coupling agent 0.25g, levelling agent 0.1g, conductive material 30g (wherein, sheets of conductive powder 005：Spherical conduction
Powder：Fibrous conducting powder=80：15：5, it is 70%) epoxies curing agent that conducting powder, which accounts for the overall mass ratio of solid constituent,
1g。
Adhesive 002 is coated with base material using the guide wheel 001 with permanent magnetism, until the sheet in adhesive 002 is led
Electric powder 005 obtains conducting resinl film layer 004 in arrangement is uniformly directed, so as to be formed on base material.
Embodiment 4
Shown in Figure 3, the present embodiment provides a kind of electromagnetic shielding film 100, and it uses following preparation method to be made：
The Ni coats of metal 131 and good conductor coating 132 are sequentially formed on base material, good conductor coating 132 plates for copper metal
Layer, the thickness of metal level is 0.3 μm.
Using method same as Example 1, conducting resinl film layer 140 same as Example 1 is formed on the metal layer, from
And formed on base material and obtain electromagnetic shielding film 100.
Embodiment 5
Shown in Figure 4, the present embodiment provides a kind of electromagnetic shielding film 200, and it uses following preparation method to be made：
Heat-resisting press mold layer 210 is formed on base material, the heat-resisting press mold layer 210 is the modified film of PET and PEN films, resistance to
The thickness of hot pressing film layer 210 is 100 μm.
Good conductor coating 232 and the Ni coats of metal 231 are sequentially formed on heat-resisting press mold layer 210, good conductor coating 232 is
Silver metal coating, the thickness of metal level is 0.1 μm.
Using method same as Example 2, conducting resinl film layer 240 same as Example 2 is formed on the metal layer.
Protective layer 250 is formed in conducting resinl film layer 240, protective layer 250 is the modified film of PET and PEN films, is protected
250 thickness of layer are 100 μm, and electromagnetic shielding film 200 is obtained so as to be formed on base material.
Embodiment 6
Shown in Figure 5, the present embodiment provides a kind of electromagnetic shielding film 300, and it uses following preparation method to be made：
Heat-resisting press mold layer 310 is formed on base material, the heat-resisting press mold layer 310 is the modified film of PI, PBT and PPS film,
The thickness of heat-resisting press mold layer 310 is 50 μm.
Black insulating barrier 320 is formed in heat-resisting press mold layer 310, black insulating barrier 320 is epoxy resin, polyacrylic resin
Mixture, the thickness of black insulating barrier 320 is 5 μm.
The Ni coats of metal 331 and good conductor coating 332 are sequentially formed on black insulating barrier 320, good conductor coating 332 is
Aluminum metal coating, the thickness of metal level is 0.1 μm.
Using method same as Example 3, conducting resinl film layer 340 same as Example 3 is formed on the metal layer.
Protective layer 350 is formed in conducting resinl film layer 340, protective layer 350 is the modified film of PI, PBT and PPS film,
The thickness of protective layer 350 is 50 μm, and electromagnetic shielding film 300 is obtained so as to be formed on base material.
The finished product that above-described embodiment 1-6 is obtained carries out shield effectiveness detection, actual test result in the range of 0-10GHz
For shown in following table：
The shield effectiveness testing result for the finished product that the embodiment 1-6 of table 1 is obtained
As can be seen from the above table, the conducting resinl film layer of the utility model embodiment and electromagnetic shielding film are respectively provided with good shielding
Efficiency, there is fabulous capability of electromagnetic shielding especially in wide frequency range.
In summary, the utility model electromagnetic shielding film is electro-magnetic wave absorption type electromagnetic shielding film, has frivolous, resistance to height
The excellent properties such as temperature, flex endurant, grounding resistance is low, while has fabulous capability of electromagnetic shielding in wide frequency range；Track
The capability of electromagnetic shielding of road plate is good.
Preferred embodiment of the present utility model is the foregoing is only, is not limited to the utility model, for this
For the technical staff in field, the utility model can have various modifications and variations.It is all in the spirit and principles of the utility model
Within, any modification, equivalent substitution and improvements made etc., it should be included within the scope of protection of the utility model.
Claims (10)
1. a kind of electromagnetic shielding film, it is characterised in that it includes folded metal level and the conducting resinl film layer being located at together, the metal
Layer includes at least one layer of Ni coats of metal and at least one layer of good conductor coating, and the conducting resinl film layer is coated with by adhesive to be formed.
2. electromagnetic shielding film according to claim 1, it is characterised in that the thickness of the conducting resinl film layer is 5-15 μm.
3. electromagnetic shielding film according to claim 1, it is characterised in that the thickness of the metal level is 0.05-0.3 μm.
4. electromagnetic shielding film according to claim 1, it is characterised in that the electromagnetic shielding film is also described including being stacked at
Black insulating barrier under metal level.
5. electromagnetic shielding film according to claim 4, it is characterised in that the thickness of the black insulating barrier is 5-20 μm.
6. electromagnetic shielding film according to claim 4, it is characterised in that the electromagnetic shielding film is also described including being stacked at
Heat-resisting press mold layer under black insulating barrier.
7. electromagnetic shielding film according to claim 6, it is characterised in that the thickness of the heat-resisting press mold layer is 25-200 μ
m。
8. electromagnetic shielding film according to claim 1, it is characterised in that the electromagnetic shielding film is also described including being stacked at
Protective layer in conducting resinl film layer.
9. electromagnetic shielding film according to claim 8, it is characterised in that the protective layer thickness is 25-200 μm.
10. a kind of printed substrate, it is characterised in that it includes wiring board and as claimed in any one of claims 1-9 wherein electricity
Magnetic shield film, the electromagnetic shielding film are covered on the wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721023190.4U CN207201068U (en) | 2017-08-16 | 2017-08-16 | Electromagnetic shielding film and printed substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721023190.4U CN207201068U (en) | 2017-08-16 | 2017-08-16 | Electromagnetic shielding film and printed substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207201068U true CN207201068U (en) | 2018-04-06 |
Family
ID=61797558
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721023190.4U Active CN207201068U (en) | 2017-08-16 | 2017-08-16 | Electromagnetic shielding film and printed substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207201068U (en) |
-
2017
- 2017-08-16 CN CN201721023190.4U patent/CN207201068U/en active Active
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Address after: 215300 Dongping Road, Bacheng Town, Suzhou City, Jiangsu Province, 399 Patentee after: Suzhou Chengbang Dayi Material Technology Co., Ltd. Address before: 215300 Dongping Road, Bacheng Town, Suzhou City, Jiangsu Province, 399 Patentee before: Suzhou City-State Dali Material Technology Co., Ltd. |