CN106686965A - Highly efficient bilayer electromagnetic shield film and making method thereof - Google Patents
Highly efficient bilayer electromagnetic shield film and making method thereof Download PDFInfo
- Publication number
- CN106686965A CN106686965A CN201710031531.0A CN201710031531A CN106686965A CN 106686965 A CN106686965 A CN 106686965A CN 201710031531 A CN201710031531 A CN 201710031531A CN 106686965 A CN106686965 A CN 106686965A
- Authority
- CN
- China
- Prior art keywords
- layer
- film layer
- metallic conduction
- film
- attached
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention discloses a highly efficient bilayer electromagnetic shield film. The highly efficient bilayer electromagnetic shield film comprises in an orderly attached way a carrier film, an insulating film, a composite shield layer, an electrically conductive adhesive layer and a release film. The composite shield layer comprises a first metal conductive film, an insulation-structured support layer and a second metal conductive film. The first metal conductive film is attached to the upper surface of the insulating film; the support layer is attached to the upper surface of the first metal conductive film; the second metal conductive film is attached to the upper surface of the support layer; the electrically conductive adhesive layer is attached to the upper surface of the second metal conductive film; the support layer in perforative setting and at intervals is provided with a conductive sheet. The first and second metal conductive films are electrically connected by means of the conductive sheet set by the perforative support layer and are physical metal films rather than metal mesh layers. Therefore, the highly efficient bilayer electromagnetic shield film has the advantages of highly efficiently reflecting outside high-frequency interference signals twice, and meanwhile grounding the electrically conductive adhesive layer to induce charges to a ground plane and thereby realizing high shielding effectiveness.
Description
Technical field
The present invention relates to a kind of shield technology field, more particularly to a kind of Double layer high efficient electromagnetism with high shield effectiveness
Screened film and its manufacture method.
Background technology
With the improvement of people's safety consciousness, precision instrument it is anti-interference, keep precision the need for, " electromagnetic pollution " is more next
More paid attention to by society, many countries have put into effect the electromagenetic wave radiation limitation standard of each electronic product in succession.At this stage, hand
The microprocessor of the precision instruments such as machine, notebook, digital camera, medicine equipment needs certain electromagnetic protection means, existing
In electromagnetic protection means, attachment electromagnetic shielding film has more preferable practicality, more preferable operability, has more cost advantage, more can
Meet slimming to require and more favored by major electronics firms.
Especially in printed circuit board industry, printed substrate is indispensable material in electronic product, extensive at present
It is applied in computer and its ancillary equipment, communication product and consumption electronic products, with consumption electronic products demand
Sustainable growth, is also growing day by day for the requirement of printed circuit board (PCB).
In flexible print circuit board industry, with the update of the electronic equipments such as smart mobile phone, Ipad, to electromagnetic shielding
Requirement also more and more higher.In the process of FPC, will be real using electromagnetic shielding film in large quantities on circuit
Existing electro-magnetic screen function;Meanwhile, the component internal that is triggered under the driving of the high frequency and high speed of communication system and outside
Electromagnetic interference problem will be gradually serious, and electromagnetic shielding turns into inevitable.
Existing electromagnetic shielding film main flow structure composition is:Carrier film is done by the PET film for scribbling matte release layer, in carrier
The side that film scribbles matte release layer sets one layer of flexible insulating barrier of black, is formed with each to same on the flexible insulating barrier of black
Property conductive adhesive layer, metal packing addition is higher as screen layer in the conducting resinl, be combined thereon one layer scribble it is release
Layer diaphragm, the screened film of this structure is only screened film in general sense, it is impossible to meet shield effectiveness high (60dB with
On) require.
Therefore, a kind of electromagnetic shielding film with high-efficiency shielding efficiency is needed badly.
The content of the invention
It is an object of the invention to provide a kind of Double layer high efficient electromagnetic shielding film with high-efficiency shielding efficiency.
It is an object of the invention to provide a kind of manufacture method of Double layer high efficient electromagnetic shielding film, produce in the method
Double layer high efficient electromagnetic shielding film there is excellent high-efficiency shielding efficiency.
To achieve the above object, the invention provides a kind of Double layer high efficient electromagnetic shielding film, including carrier layer, dielectric film
Layer, shielding combination layer, conductive adhesive layer and release film layer, the insulating film layer is attached to the upper surface of the carrier layer, described
Shielding combination layer is attached to the upper surface of the insulating film layer, and the conductive adhesive layer is attached to the upper table of the shielding combination layer
Face, the release film layer is attached to the upper surface of the conductive adhesive layer, wherein, the shielding combination layer includes the first metallic conduction
Film layer, the supporting layer in insulation system and the second metallic conduction film layer, the first metallic conduction film layer are attached to the insulation
The upper surface of film layer, the supporting layer is attached to the upper surface of the first metallic conduction film layer, second metal conductive film
Layer is attached to the upper surface of the supporting layer, and the conductive adhesive layer is attached to the upper surface of the second metallic conduction film layer, institute
State supporting layer and be also provided through conducting strip in interval, the first metallic conduction film layer and the second metallic conduction film layer by
The conducting strip set through the supporting layer is electrically connected with.
Compared with prior art, because Double layer high efficient electromagnetic shielding film of the present invention has the first metallic conduction being electrically connected with
Film layer and the second metallic conduction film layer, and the first metallic conduction film layer and the second metallic conduction film layer make due to being metallic diaphragm
The first metallic conduction film layer and the second metallic conduction film layer are the very thin solid metal layer of two-layer, rather than wire netting compartment, from
And enable that high-frequency interferencing signal is carried out the present invention to external world by the first metallic conduction film layer and the second metallic conduction film layer
Efficient reflection, while conductive adhesive layer is carried out into grounding, you can excess charge is imported into ground plane, realizes high screen twice
Cover efficiency;Separately, the first metallic conduction film layer of the invention and the second metallic conduction film layer are by interval through supporting layer
Conducting strip and realize being electrically connected with so that the first metallic conduction film layer and the second metallic conduction film layer are on the one hand by supporting layer
Supporting role so that it has excellent bending performance, and under the support and protective effect of supporting layer, the first metallic conduction
Film layer and the second metallic conduction film layer can be fabricated to very thin structure, can also reduce while ensuring with high-efficiency shielding efficiency
Thickness, is particularly suitable for being used in flexible PCB;Meanwhile, by conducting strip by through supporting layer so that supporting layer is to leading
Electric piece has carried out effective fixation, it is ensured that the first metallic conduction film layer and the second metallic conduction film layer can be remained and electrically connected
Connect, it is ensured that the application has high-efficiency shielding efficiency;In summary, the Double layer high efficient electromagnetic shielding film of the application has efficiently screen
Cover efficiency, excellent buckle resistance and very thin structure.
It is preferred that the shielding combination layer is in integral structure.
It is preferred that the carrier layer of the Double layer high efficient electromagnetic shielding film is PET film layer.
It is preferred that the thickness of the carrier layer of the Double layer high efficient electromagnetic shielding film is 20-80 μm.
It is preferred that the release film layer of the Double layer high efficient electromagnetic shielding film is PET mould release membrance of the off-type force between 5-10gf
Layer.
A kind of manufacture method of Double layer high efficient electromagnetic shielding film that the present invention is provided, it comprises the following steps:(1) one is provided
Carrier layer;(2) one layer of insulating film layer is formed on the carrier layer;(3) one layer first is formed on the insulating film layer
Metallic conduction film layer;(4) one layer of supporting layer is formed in the first metallic conduction film layer, the supporting layer is in insulation system,
The supporting layer is also in the conducting strip that is provided through at interval, the lower end of the conducting strip and the first metallic conduction film layer electricity
Property contact;(5) one layer of second metallic conduction film layer, the upper end of the conducting strip and second gold medal are formed on the supporting layer
Category conductive film layer is in electrical contact, and the first metallic conduction film layer sets with the second metallic conduction film layer by through the supporting layer
The conducting strip put is electrically connected with;(6) one layer of conductive adhesive layer is formed in the second metallic conduction film layer;(7) in the conduction
One layer of release film layer is formed on glue-line.
Compared with prior art, because the Double layer high efficient that the manufacture method provided according to the present invention is produced is electromagnetically shielded
Film, the first metallic conduction film layer and the second metallic conduction film layer of electric connection are solid metal layer, rather than wire netting compartment, from
And high-frequency interferencing signal is carried out to external world to enable the Double layer high efficient electromagnetic shielding film that produces according to preparation method of the invention
Efficient reflection, while conductive adhesive layer is carried out into grounding, you can excess charge is imported into ground plane, realizes high screen twice
Cover efficiency;Separately, the first metallic conduction film layer and the second metallic conduction film layer are on the one hand by the supporting role of supporting layer so that its
With excellent bending performance, and under the support and protective effect of supporting layer, the first metallic conduction film layer and the second metal
Conductive film layer can be fabricated to very thin structure, while ensuring with high-efficiency shielding efficiency can also reduce thickness, be especially suitable for
In being used in flexible PCB;Meanwhile, supporting layer has also carried out effective fixation to conducting strip, it is ensured that the first metallic conduction
Film layer and the second metallic conduction film layer can remain electric connection, it is ensured that the application has high-efficiency shielding efficiency;To sum up may be used
Know, the Double layer high efficient electromagnetic shielding film that produces of manufacture method provided according to the present invention has high-efficiency shielding efficiency, excellent
Buckle resistance and very thin structure.
Brief description of the drawings
Fig. 1 is the dimensional structure diagram of Double layer high efficient electromagnetic shielding film of the present invention.
Fig. 2 is the cross section structure diagram of the line A-A along Fig. 1.
Specific embodiment
With reference now to Description of Drawings embodiments of the invention, the element numbers being similar in accompanying drawing represent similar element.
As shown in Figures 1 and 2, Double layer high efficient electromagnetic shielding film 100 of the invention, including carrier layer 10, insulating film layer
20th, shielding combination layer 30, conductive adhesive layer 40 and release film layer 50, insulating film layer 20 are attached to the upper surface of carrier layer 10, shield
The upper surface that combination layer 30 is attached to insulating film layer 20 is covered, conductive adhesive layer 40 is attached to the upper surface of shielding combination layer 30, release
Film layer 50 is attached to the upper surface of conductive adhesive layer 40, wherein, shielding combination layer 30 is including the first metallic conduction film layer 31, in insulation
The metallic conduction film layer 33 of supporting layer 32 and second of structure, the first metallic conduction film layer 31 is attached to the upper table of insulating film layer 20
Face, supporting layer 32 is attached to the upper surface of the first metallic conduction film layer 31, and the second metallic conduction film layer 33 is attached to supporting layer 32
Upper surface, conductive adhesive layer 40 is attached to the upper surface of the second metallic conduction film layer 33, also the passing through in interval of supporting layer 32
Wear and be equipped with conducting strip 321, due to conducting strip 321 run through supporting layer 32, therefore conducting strip 321 upper end 321a and the second metal
Conductive film layer 33 is contacted, and the lower end 321b of conducting strip 321 is contacted with the first metallic conduction film layer 31, so that the first metal conductive film
Layer 31 is electrically connected with the second metallic conduction film layer 33 by the conducting strip 321 set through supporting layer 32;Directly use entity
Conducting strip 321 realize the electric connection of the first metallic conduction film layer 31 and the second metallic conduction film layer 33, it is ensured that first
The stability of the electric connection of the metallic conduction film layer 33 of metallic conduction film layer 31 and second, it is to avoid by set minimal clearance come
Realize the two unstability being electrically connected with;Due to the first metallic conduction film layer 31 of the invention and the second metallic conduction film layer 33 by
In being metallic diaphragm so that the first metallic conduction film layer 31 and the second metallic conduction film layer 33 are the very thin solid metal of two-layer
Layer, rather than wire netting compartment, so that the present invention is by the first metallic conduction film layer 31 and the second metallic conduction film layer 33
Efficient reflection twice can be carried out by high-frequency interferencing signal to external world, while conductive adhesive layer 40 is carried out into grounding, you can will be many
Remaining electric charge imports ground plane, realizes high shield effectiveness;Separately, the first metallic conduction film layer 31 of the invention and the second metallic conduction
Film layer 33 can be fabricated to very thin structure under the support protective effect of supporting layer 32, ensure with the same of high-efficiency shielding efficiency
When can also reduce thickness, be particularly suitable for being used in flexible PCB;Meanwhile, by conducting strip 321 by through supporting layer 32,
So that supporting layer 32 has carried out effective fixation to conducting strip 321, it is ensured that the first metallic conduction film layer 31 and the second metal are led
Electrolemma layer 33 can remain electric connection, it is ensured that the application has high-efficiency shielding efficiency;After tested, in frequency more than 1GHz
When, the shield effectiveness of Double layer high efficient electromagnetic shielding film 100 of the invention can reach more than 82dB.
With reference to shown in Fig. 1 and Fig. 2, preferably, the shielding combination layer 30 is in integral structure.
With reference to shown in Fig. 1 and Fig. 2, preferably, the carrier layer 10 of the Double layer high efficient electromagnetic shielding film 100 is PET film
Layer (PET English:Polyethylene terephthalate, abbreviation PET, chemistry are entitled:Polyethylene terephthalate).
With reference to shown in Fig. 1 and Fig. 2, preferably, the thickness of the carrier layer 10 of the Double layer high efficient electromagnetic shielding film 100 is
20-80μm。
With reference to shown in Fig. 1 and Fig. 2, preferably, the release film layer 50 of the Double layer high efficient electromagnetic shielding film 100 is off-type force
Between the PET release film layers of 5-10gf.
Continuing with shown in Fig. 1 and Fig. 2, because Double layer high efficient electromagnetic shielding film 100 of the present invention has be electrically connected with the
One metallic conduction film layer 31 and the second metallic conduction film layer 33, and the first metallic conduction film layer 31 and the second metallic conduction film layer 33
Due to being metallic diaphragm so that the first metallic conduction film layer 31 and the second metallic conduction film layer 33 are the very thin solid metal of two-layer
Layer, rather than wire netting compartment, so that the present invention is by the first metallic conduction film layer 31 and the second metallic conduction film layer 33
Efficient reflection twice can be carried out by high-frequency interferencing signal to external world, while conductive adhesive layer 40 is carried out into grounding, you can will be many
Remaining electric charge imports ground plane, realizes high shield effectiveness;Separately, the first metallic conduction film layer 31 of the invention and the second metallic conduction
Film layer 33 realizes electric connection through the conducting strip 321 of supporting layer 32 by interval so that the first metallic conduction film layer
31 and the one side of the second metallic conduction film layer 33 by the supporting role of supporting layer 32 so that it has excellent bending performance,
And under the support and protective effect of supporting layer 32, the first metallic conduction film layer 31 and the second metallic conduction film layer 33 can make
Into very thin structure, while ensuring with high-efficiency shielding efficiency can also reduce thickness, be particularly suitable in flexible PCB
In use;Meanwhile, by conducting strip 321 by through supporting layer 32 so that supporting layer 32 has carried out effective consolidating to conducting strip 321
It is fixed, it is ensured that the first metallic conduction film layer 31 and the second metallic conduction film layer 33 can remain electric connection, it is ensured that this Shen
There please be high-efficiency shielding efficiency;In summary, the Double layer high efficient electromagnetic shielding film 100 of the application has high-efficiency shielding efficiency, excellent
Different buckle resistance and very thin structure.
With reference to shown in Fig. 1 and Fig. 2, the manufacture method of Double layer high efficient electromagnetic shielding film of the invention, it comprises the following steps:
Step 1:One carrier layer 10 is provided;
Step 2:One layer of insulating film layer 20 is formed on the carrier layer 10;
Step 3:One layer of first metallic conduction film layer 31 is formed on the insulating film layer 20;
Step 4:One layer of supporting layer 32 is formed in the first metallic conduction film layer 31, the supporting layer 32 is tied in insulation
Structure, the supporting layer 32 is also provided through conducting strip 321 in interval, the lower end 321b of the conducting strip 321 and described the
One metallic conduction film layer 31 is in electrical contact;
Step 5:One layer of second metallic conduction film layer 33, the upper end of the conducting strip 321 are formed on the supporting layer 32
321a is in electrical contact with the second metallic conduction film layer 33, the first metallic conduction film layer 31 and the second metallic conduction film layer
33 are electrically connected with by the conducting strip 321 set through the supporting layer 32;
Step 6:One layer of conductive adhesive layer 40 is formed in the second metallic conduction film layer 33;
Step 7:One layer of release film layer 50 is formed on the conductive adhesive layer 40;So as to form Double layer high efficient electricity of the invention
Magnetic shield film 100, after tested, the Double layer high efficient electromagnetic shielding film 100 for producing according to the method described above, in frequency more than 1GHz
When, shield effectiveness can reach more than 82dB.
Continuing with shown in Fig. 1 and Fig. 2, due to the Double layer high efficient electromagnetism that the manufacture method provided according to the present invention is produced
Screened film 100, the first metallic conduction film layer 31 of electric connection and the second metallic conduction film layer 33 are solid metal layer, Er Feijin
Category clathrum, so that can be high to external world according to the Double layer high efficient electromagnetic shielding film 100 that preparation method of the invention is produced
Frequency interference signal carries out efficient reflection twice, while conductive adhesive layer 40 is carried out into grounding, you can excess charge is imported
Ground plane, realizes high shield effectiveness;Separately, the first metallic conduction film layer 31 and the one side of the second metallic conduction film layer 33 are by branch
Support the supporting role of layer 32 so that it has excellent bending performance, and under the support and protective effect of supporting layer 32, the
One metallic conduction film layer 31 and the second metallic conduction film layer 33 can be fabricated to very thin structure, ensure with high-efficiency shielding efficiency
While can also reduce thickness, be particularly suitable for being used in flexible PCB;Meanwhile, supporting layer 32 also enters to conducting strip 321
Effective fixation is gone, it is ensured that the first metallic conduction film layer 31 and the second metallic conduction film layer 33 can be remained and electrically connected
Connect, it is ensured that the application has high-efficiency shielding efficiency;In summary, the bilayer that the manufacture method for being provided according to the present invention is produced
High-efficiency electromagnetic screened film 100 has high-efficiency shielding efficiency, excellent buckle resistance and very thin structure.
Above disclosed is only the preferred embodiments of the present invention, can not limit the right of the present invention with this certainly
Scope, therefore the equivalent variations made according to scope of the present invention patent, still belong to the scope that the present invention is covered.
Claims (6)
1. a kind of Double layer high efficient electromagnetic shielding film, including carrier layer, insulating film layer, shielding combination layer, conductive adhesive layer and release
Film layer, the insulating film layer is attached to the upper surface of the carrier layer, and the shielding combination layer is attached to the insulating film layer
Upper surface, the conductive adhesive layer is attached to the upper surface of the shielding combination layer, and the release film layer is attached to the conduction
The upper surface of glue-line, it is characterised in that the shielding combination layer includes the first metallic conduction film layer, the supporting layer in insulation system
And the second metallic conduction film layer, the first metallic conduction film layer is attached to the upper surface of the insulating film layer, the supporting layer
The upper surface of the first metallic conduction film layer is attached to, the second metallic conduction film layer is attached to the upper table of the supporting layer
Face, the conductive adhesive layer is attached to the upper surface of the second metallic conduction film layer, and the supporting layer is also in interval through setting
Conducting strip is equipped with, the first metallic conduction film layer is with the second metallic conduction film layer by the conduction set through the supporting layer
Piece is electrically connected with.
2. Double layer high efficient electromagnetic shielding film as claimed in claim 1, it is characterised in that the shielding combination layer is in integral type knot
Structure.
3. Double layer high efficient electromagnetic shielding film as claimed in claim 1, it is characterised in that the carrier layer is PET film layer.
4. Double layer high efficient electromagnetic shielding film as claimed in claim 1, it is characterised in that the thickness of the carrier layer is 20-
80μm。
5. Double layer high efficient electromagnetic shielding film as claimed in claim 1, it is characterised in that the release film layer be off-type force between
The PET release film layers of 5-10gf.
6. a kind of manufacture method of Double layer high efficient electromagnetic shielding film, it is characterised in that comprise the following steps:
(1) carrier layer is provided;
(2) one layer of insulating film layer is formed on the carrier layer;
(3) one layer of first metallic conduction film layer is formed on the insulating film layer;
(4) one layer of supporting layer is formed in the first metallic conduction film layer, the supporting layer is in insulation system, the supporting layer
Conducting strip also is provided through in interval, the lower end of the conducting strip is in electrical contact with the first metallic conduction film layer;
(5) one layer of second metallic conduction film layer, the upper end of the conducting strip and second metal are formed on the supporting layer
Conductive film layer is in electrical contact, and the first metallic conduction film layer is set with the second metallic conduction film layer by through the supporting layer
Conducting strip be electrically connected with;
(6) one layer of conductive adhesive layer is formed in the second metallic conduction film layer;
(7) one layer of release film layer is formed on the conductive adhesive layer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710031531.0A CN106686965A (en) | 2017-01-17 | 2017-01-17 | Highly efficient bilayer electromagnetic shield film and making method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710031531.0A CN106686965A (en) | 2017-01-17 | 2017-01-17 | Highly efficient bilayer electromagnetic shield film and making method thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
CN106686965A true CN106686965A (en) | 2017-05-17 |
Family
ID=58859137
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710031531.0A Pending CN106686965A (en) | 2017-01-17 | 2017-01-17 | Highly efficient bilayer electromagnetic shield film and making method thereof |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN106686965A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110769677A (en) * | 2018-07-27 | 2020-02-07 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
CN110769669A (en) * | 2018-07-27 | 2020-02-07 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
CN111182776A (en) * | 2018-11-09 | 2020-05-19 | 昇印光电(昆山)股份有限公司 | Electromagnetic shielding film |
WO2020253290A1 (en) * | 2019-06-18 | 2020-12-24 | 昇印光电(昆山)股份有限公司 | Electromagnetic shielding film |
CN117799212A (en) * | 2024-01-10 | 2024-04-02 | 湖北津耀德新材料科技有限公司 | Preparation process of anti-radiation floor mat of electric automobile |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102510712A (en) * | 2011-11-14 | 2012-06-20 | 广州方邦电子有限公司 | Paper-thin screened film with extremely high screening efficiency and manufacturing method therefor |
CN203311395U (en) * | 2013-03-19 | 2013-11-27 | 宏科有限公司 | Capacitive touch screen with three-dimensional via hole |
CN203407073U (en) * | 2013-08-30 | 2014-01-22 | 海阳比艾奇电子有限公司 | Flexible circuit board used for cell phone side key |
CN203455815U (en) * | 2013-08-05 | 2014-02-26 | 东莞市中沛光电科技有限公司 | Double-conducting film touch screen |
CN106255312A (en) * | 2016-08-23 | 2016-12-21 | 凯普金业电子科技(昆山)有限公司 | A kind of dust-proof antifouling antistatic HDI flexible circuit board and processing technique thereof |
-
2017
- 2017-01-17 CN CN201710031531.0A patent/CN106686965A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102510712A (en) * | 2011-11-14 | 2012-06-20 | 广州方邦电子有限公司 | Paper-thin screened film with extremely high screening efficiency and manufacturing method therefor |
CN203311395U (en) * | 2013-03-19 | 2013-11-27 | 宏科有限公司 | Capacitive touch screen with three-dimensional via hole |
CN203455815U (en) * | 2013-08-05 | 2014-02-26 | 东莞市中沛光电科技有限公司 | Double-conducting film touch screen |
CN203407073U (en) * | 2013-08-30 | 2014-01-22 | 海阳比艾奇电子有限公司 | Flexible circuit board used for cell phone side key |
CN106255312A (en) * | 2016-08-23 | 2016-12-21 | 凯普金业电子科技(昆山)有限公司 | A kind of dust-proof antifouling antistatic HDI flexible circuit board and processing technique thereof |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110769677A (en) * | 2018-07-27 | 2020-02-07 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
CN110769669A (en) * | 2018-07-27 | 2020-02-07 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
CN110769669B (en) * | 2018-07-27 | 2024-02-06 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
CN111182776A (en) * | 2018-11-09 | 2020-05-19 | 昇印光电(昆山)股份有限公司 | Electromagnetic shielding film |
CN111182776B (en) * | 2018-11-09 | 2021-10-19 | 昇印光电(昆山)股份有限公司 | Electromagnetic shielding film |
WO2020253290A1 (en) * | 2019-06-18 | 2020-12-24 | 昇印光电(昆山)股份有限公司 | Electromagnetic shielding film |
WO2020253772A1 (en) * | 2019-06-18 | 2020-12-24 | 昇印光电(昆山)股份有限公司 | Electromagnetic shielding film |
US11716837B2 (en) | 2019-06-18 | 2023-08-01 | Shine Optoelectronics (Kunshan) Co., Ltd. | Electromagnetic shielding film |
CN117799212A (en) * | 2024-01-10 | 2024-04-02 | 湖北津耀德新材料科技有限公司 | Preparation process of anti-radiation floor mat of electric automobile |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN106686965A (en) | Highly efficient bilayer electromagnetic shield film and making method thereof | |
KR20190104131A (en) | Electronic shielding film and its manufacturing method | |
JP2015133474A (en) | Electromagnetic shield film and method of manufacturing circuit board including shield film | |
CN107426957A (en) | Conducting resinl film layer, preparation method and electromagnetic shielding film | |
TWI270341B (en) | Electronic assembly unit with conductive film, conductive film and method of making the same thereof | |
CN204104291U (en) | Slimming high-transmission electromagnetic absorption screened film | |
CN103619154A (en) | Electromagnetic protection film with efficient shielding and electromagnetism absorption function | |
CN105960157A (en) | Electromagnetic shielding protection film and FPC (flexible printed circuit) | |
CN103929933B (en) | Structure for inhibition of electromagnetic wave interference and flexible printed circuit comprising same | |
CN205105522U (en) | Electromagnetic wave shielding piece and electronic equipment | |
KR101628212B1 (en) | Transparent Electromagnetic Wave Shield Film and Manufacturing Method Thereof | |
CN208754632U (en) | Electromagnetic shielding film and wiring board | |
CN103295670A (en) | Transparent conducting film | |
CN206181714U (en) | Flexible shield membrane, FPC shield assembly and cell -phone touch and show module shield assembly | |
TW201134380A (en) | Power transmission circuit with EMI shielding, lighting module, and a panel display module | |
CN107589871A (en) | A kind of pressure sensitivity touch module, preparation method, touch-screen and display device | |
CN208095043U (en) | Electromagnetic shielding film and wiring board | |
TW202215709A (en) | Transparent Antenna and Display Module | |
JP5428339B2 (en) | Planar antenna and manufacturing method thereof | |
CN108925028B (en) | Flexible circuit board, array substrate, display panel and display device | |
CN106659108A (en) | Electromagnetic shielding film and preparation method thereof | |
CN204256703U (en) | Touch-screen and conducting film thereof | |
CN203105046U (en) | Structure for inhibition of electromagnetic wave interference, and flexible printed circuit comprising the same | |
CN109575827A (en) | The preparation method and display device of electromagnetic shielding film, electromagnetic shielding film | |
TWM411099U (en) | Electromagnetic shielding |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170517 |
|
RJ01 | Rejection of invention patent application after publication |