JPH0484490A - Manufacture of printed wiring board - Google Patents
Manufacture of printed wiring boardInfo
- Publication number
- JPH0484490A JPH0484490A JP19771890A JP19771890A JPH0484490A JP H0484490 A JPH0484490 A JP H0484490A JP 19771890 A JP19771890 A JP 19771890A JP 19771890 A JP19771890 A JP 19771890A JP H0484490 A JPH0484490 A JP H0484490A
- Authority
- JP
- Japan
- Prior art keywords
- laminate
- glass cloth
- yarn
- fibers
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 4
- 239000004744 fabric Substances 0.000 claims abstract description 22
- 238000005476 soldering Methods 0.000 claims abstract description 19
- 239000011521 glass Substances 0.000 claims abstract description 18
- 239000011347 resin Substances 0.000 claims abstract description 9
- 229920005989 resin Polymers 0.000 claims abstract description 9
- 239000003822 epoxy resin Substances 0.000 claims abstract description 8
- 239000003365 glass fiber Substances 0.000 claims abstract description 8
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000011889 copper foil Substances 0.000 claims abstract description 5
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 5
- 239000002966 varnish Substances 0.000 claims abstract description 5
- 238000001035 drying Methods 0.000 claims abstract description 4
- 238000000465 moulding Methods 0.000 claims abstract description 3
- 230000035699 permeability Effects 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 3
- 238000009941 weaving Methods 0.000 claims description 2
- 239000000835 fiber Substances 0.000 abstract description 4
- 229910000679 solder Inorganic materials 0.000 abstract description 3
- 238000005470 impregnation Methods 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 abstract 1
- 238000010030 laminating Methods 0.000 abstract 1
- 238000003825 pressing Methods 0.000 abstract 1
- 238000009423 ventilation Methods 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 3
- 239000003292 glue Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229940023462 paste product Drugs 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 238000003303 reheating Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、従来のものに比べてリフロー半田付は加工時
の耐熱性に優れたプリント回路板に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a printed circuit board in which reflow soldering has superior heat resistance during processing compared to conventional soldering.
近年、プリント回路板は極めて広範囲の用途に使用され
、この様なプリント回路板に対する要求特性も益々多岐
にわたっている。こうした中で電子機器の高性能化、小
型化に伴い、プリント回路板の高密度化の要求も強まっ
てきており、実装形態も表面実装型となり、その半田付
は方式としてリフロー半田付は法が多く用いられる様に
なってきている。In recent years, printed circuit boards have been used for an extremely wide range of applications, and the characteristics required for such printed circuit boards have become increasingly diverse. Under these circumstances, as electronic devices become more sophisticated and smaller, the demand for higher density printed circuit boards is also increasing, and the mounting form has also become surface-mounted, and reflow soldering is no longer legal. It is becoming more and more used.
しかしなから、このリフロー半田付は時にプリント回路
板の基材間に剥離或いはミーズリングを生しるといった
問題か発生している。However, this reflow soldering sometimes causes problems such as peeling or measling between the substrates of the printed circuit board.
これは基板か銅箔回路よりも２０〜３０℃高い温度とな
ることから基板内に吸湿した水分か爆発的に膨張するた
めに発生する。また、板厚か薄くなる程、基板の耐熱性
が低下し、剥離が発生しやすくなる。This occurs because the temperature of the board is 20 to 30°C higher than that of the copper foil circuit, and moisture absorbed within the board expands explosively. Furthermore, as the plate thickness becomes thinner, the heat resistance of the substrate decreases and peeling becomes more likely to occur.
この問題を解決するには、リフロー半田付は時の温度条
件を見直すとかりフロー半田付は前に基板を乾燥すると
いった消極的な対策しか取られていない。To solve this problem, only passive measures have been taken, such as reconsidering the temperature conditions for reflow soldering and drying the board before flow soldering.
本発明はりフロー半田耐熱性の優れているプリント回路
板を得んとして研究した結果、ガラス繊維を緩りヤーン
として、これを織ったのちヤーンを開繊し、ヤーン間の
間隙を小さ（して通気度を５ ｃｃ ／ ａｄ ／ ｓ
ｅｅ以下としたガラスクロスを基材として得た積層板を
用いることによりリフロー半田付は時の剥離、ミーズリ
ングを抑えられるとの知見を得たものである。その目的
とするところは、リフロー半田耐熱性に優れていて通常
のものと同等の電気的及び機械的特性を有するプリント
回路板を提供するにある。As a result of research in an effort to obtain a printed circuit board with excellent soldering heat resistance, the inventors of the present invention discovered that glass fibers were woven into loose yarns, and the yarns were then opened to reduce the gaps between the yarns. Air permeability 5 cc/ad/s
It has been found that peeling and measling during reflow soldering can be suppressed by using a laminate made of a glass cloth with an ee or less as a base material. The purpose is to provide a printed circuit board that has excellent reflow soldering heat resistance and has electrical and mechanical properties equivalent to those of ordinary circuit boards.
本発明はガラス繊維を絣りヤーンとし、これを織ったの
ち、ヤーンを開繊し、ヤーン間の間隙を小さくして通気
度を５ ｃｃ ／ ａｄ ／ ｓｅｃ以下としたガラス
クロスを用い、これにエポキシ樹脂などの熱硬化性樹脂
ワニスを含浸、乾燥してプリプレグを得、これを所定枚
数積層して銅箔を重ねて加熱加圧成形して積層板を得、
この積層板に回路で形成した後、リフロー半田付は加工
を行うことを特徴とするプリント回路板の製造方法であ
る。In the present invention, glass fibers are used as Kasuri yarns, and after weaving the yarns, the yarns are opened, and the gaps between the yarns are reduced to have an air permeability of 5 cc/ad/sec or less using glass cloth. A prepreg is obtained by impregnating and drying a thermosetting resin varnish such as an epoxy resin, and a predetermined number of sheets of this are laminated, copper foil is layered, and heat and pressure molding is performed to obtain a laminate.
A printed circuit board manufacturing method is characterized in that after a circuit is formed on the laminated board, reflow soldering is performed.
本発明の特徴はガラスクロスを開繊することにある。通
気度はこの開繊の程度を定量的に表現するためのもので
ある。The feature of the present invention is that glass cloth is opened. Air permeability is used to quantitatively express the degree of fiber opening.
ガラスクロスを開繊することにより、クロス中のガラス
繊維への樹脂の含浸性が向上し、ガラス繊維と樹脂との
密着性か強まると共にボイドの発生を抑えることかでき
る。従って、このようなガラスクロスを使用して製造さ
れた積層板はりフロー半田耐熱性か向上することか見出
された。By opening the glass cloth, the impregnation of the resin into the glass fibers in the cloth is improved, the adhesion between the glass fibers and the resin is strengthened, and the generation of voids can be suppressed. Therefore, it has been found that the flow soldering heat resistance of laminate beams manufactured using such glass cloth is improved.
従来から積層板用として使用されているガラスクロスの
通気度を測定するとＩ Ｏｃｃ ／ ｃｉ／ ｓｅｃ以
上である。これに対して本発明において使用するガラス
クロスはヤーンを開繊し、通気度において５ ｃｃ ／
ＣｌＩｒ／ ｓｅｃ以下とすることにより、プリント
回路基板のりフロー半田付は時に剥離やミーズリングか
発生するといった問題が解決される。The air permeability of glass cloth conventionally used for laminates is measured to be greater than IOcc/ci/sec. On the other hand, the glass cloth used in the present invention has yarns opened and has an air permeability of 5 cc/
By setting the ClIr/sec or less, problems such as peeling and measling that sometimes occur during glue flow soldering of printed circuit boards can be solved.
ガラスクロスのヤーンを開繊する方法は、機械的に行え
ばよく、特に限定されないが、クロス全体にわたり均一
にほぐすことが望ましい。The method for opening the yarns of the glass cloth may be mechanical, and is not particularly limited, but it is desirable to unravel the fibers uniformly over the entire cloth.
なお、通気度の測定はＪＩＳ Ｌ ＋０９６の６．
２７．１に記載されたフラジール形試験機を用いていっ
た。The air permeability is measured according to JIS L +096 6.
The Frazier type tester described in 27.1 was used.
ガラスクロスの縦、横の打込み数及びモノフィラメント
径等は従来のガラスクロスに用いられるものと同じでよ
い。クロス厚みについては特に限定されない。The number of vertical and horizontal strokes of the glass cloth, the monofilament diameter, etc. may be the same as those used for conventional glass cloth. The thickness of the cloth is not particularly limited.
本発明に用いられる熱硬化性樹脂はエポキシ樹脂、ポリ
イミド樹脂、フェノール樹脂、ポリエステル樹脂等で特
に限定されない。The thermosetting resin used in the present invention may be an epoxy resin, a polyimide resin, a phenol resin, a polyester resin, etc., and is not particularly limited.
本発明を実施例により説明する。 The present invention will be explained by examples.
実施例
比較例１て使用する従来のガラスクロスを開繊して、通
気度か３．０ ｃｃ ／ ａｔ ／ ｓｅｃのガラスク
ロスを得た。The conventional glass cloth used in Examples and Comparative Example 1 was opened to obtain a glass cloth having an air permeability of 3.0 cc/at/sec.
別にエポキシ樹脂（油化シェルエポキシ樹脂練製品名Ｅ
ｐ−５０４５）１００重量部（以下、部という）硬化剤
としてジシアンジアミド４．７部、硬化促進剤として２
エチル−４−メチル−イミダプール及び溶剤からなるエ
ポキシ樹脂ワニスを調Ｘし、上記ガラスクロスに含浸乾
燥して、ＲＣ４Ｏ％のプリプレグを得た。このプリプレ
グを板厚０．６■の場合は３枚、０．４−の場合は２枚
積層し両面に銅箔（１８μｍ）を重ね、加熱加圧成形し
てエポキシ樹脂銅張積層板を得た。Separately, epoxy resin (oiled shell epoxy resin paste product name E)
p-5045) 100 parts by weight (hereinafter referred to as parts) 4.7 parts of dicyandiamide as a curing agent, 2 parts as a curing accelerator
An epoxy resin varnish consisting of ethyl-4-methyl-imidapool and a solvent was prepared, and the glass cloth was impregnated and dried to obtain a prepreg with RC4O%. Three sheets of this prepreg are laminated if the thickness is 0.6, or two sheets are laminated if the thickness is 0.4. Ta.
比較例 のエポキシ樹脂鋼張積層板を得た。Comparative example An epoxy resin steel clad laminate was obtained.
実施例と比較例で得られた銅張積層板に銅メツキ２５μ
ｍを施し、次いてサイズ１５０Ｘ９０ｍの回路基板に表
面実装用回路パターンを作成した。Copper plating of 25 μm was applied to the copper-clad laminates obtained in Examples and Comparative Examples.
Then, a circuit pattern for surface mounting was created on a circuit board with a size of 150 x 90 m.
その後、前処理として、それぞれＣ処理（４０”Ｃ１９
０％ＲＨ）を０，１６８．２６４．４８０時間、及びプ
レッシャークツカー処理（ＰＣＴ）１２５℃蒸気圧２．
３ｋｇｆ／ｃｄ３０分間を行った。ランド上の温度を２
６０．２８０，３００℃と設定し、評価基板を遠赤外線
リフロー炉に２回通した後、基板のふくれ、剥離を判定
した。Ｃ処理での結果を第１表、プレッシャークツカー
処理での結果を第２表に示す。After that, as pre-treatment, C treatment (40"C19
0% RH) for 0,168.264.480 hours and pressure combing treatment (PCT) at 125°C vapor pressure 2.
3 kgf/cd for 30 minutes. The temperature on the land is 2
After passing the evaluation board through a far-infrared reflow oven twice at temperatures of 60, 280 and 300°C, blistering and peeling of the board were determined. The results for the C treatment are shown in Table 1, and the results for the pressure cutter treatment are shown in Table 2.
第 １ 表
×：剥離あり
第１表及び第２表から明らかな様に、本発明で得られた
プリント回路板のりフロー半田耐熱性は従来のプリント
回路板に比較して極めて優れていることかわかる。Table 1 ×: Peeling As is clear from Tables 1 and 2, the printed circuit board glue flow solder heat resistance obtained by the present invention is extremely superior compared to conventional printed circuit boards. Recognize.
本発明で得られるプリント回路板は通常のものと比較し
てリフロー半田付は時の耐熱性に優れている。従ってリ
フロー半田付は前の再加熱などをしなくても良く、また
リフローソルダー時の温度アソント
の高い分野にも利用でき、更に通常の≠≠≠≠手回路手
回同板に穴明け、メツキ等の加工が可能であることから
、工業的なりフロー半田耐熱性に優れたプリント回路板
の製造に最適である。The printed circuit board obtained according to the present invention has excellent heat resistance when subjected to reflow soldering compared to ordinary ones. Therefore, reflow soldering does not require previous reheating, and can be used in fields where the temperature is high during reflow soldering. It is ideal for manufacturing printed circuit boards with excellent industrial flow soldering heat resistance.
Claims (1)
、ヤーンを開繊し、ヤーン間の間隙を小さくして通気度
を５ｃｃ／ｃｍ＾２／ｓｅｃ以下としたガラスクロスを
用い、これにエポキシ樹脂などの熱硬化性樹脂ワニスを
含浸、乾燥してプリプレグを得、これを所定枚数積層し
て銅箔を重ねて加熱加圧成形して、積層板を得、この積
層板に回路を形成した後、リフロー半田付け加工を行う
ことを特徴とするプリント回路板の製造方法。(1) After twisting glass fibers into yarn and weaving this, the yarn is opened, and the gap between the yarns is reduced to make the air permeability less than 5cc/cm^2/sec using glass cloth. A prepreg is obtained by impregnating and drying a thermosetting resin varnish such as epoxy resin, a predetermined number of sheets are laminated, copper foil is layered, and heat and pressure molding is performed to obtain a laminate, and a circuit is formed on this laminate. A method for manufacturing a printed circuit board, which comprises performing a reflow soldering process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19771890A JPH0484490A (en) | 1990-07-27 | 1990-07-27 | Manufacture of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19771890A JPH0484490A (en) | 1990-07-27 | 1990-07-27 | Manufacture of printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0484490A true JPH0484490A (en) | 1992-03-17 |
Family
ID=16379201
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19771890A Pending JPH0484490A (en) | 1990-07-27 | 1990-07-27 | Manufacture of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0484490A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002212319A (en) * | 2001-01-23 | 2002-07-31 | Hitachi Chem Co Ltd | Prepreg, laminated plate and printed circuit board |
| JP2003031957A (en) * | 2001-07-18 | 2003-01-31 | Hitachi Chem Co Ltd | Manufacturing method of multilayer printed wiring board |
| JP2009241476A (en) * | 2008-03-31 | 2009-10-22 | Nitto Boseki Co Ltd | Laminated sheet and method for manufacturing laminated sheet |
-
1990
- 1990-07-27 JP JP19771890A patent/JPH0484490A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002212319A (en) * | 2001-01-23 | 2002-07-31 | Hitachi Chem Co Ltd | Prepreg, laminated plate and printed circuit board |
| JP2003031957A (en) * | 2001-07-18 | 2003-01-31 | Hitachi Chem Co Ltd | Manufacturing method of multilayer printed wiring board |
| JP2009241476A (en) * | 2008-03-31 | 2009-10-22 | Nitto Boseki Co Ltd | Laminated sheet and method for manufacturing laminated sheet |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS607796A (en) | Copper-lined laminated board for printed circuit and method of producing same | |
| JPH0484490A (en) | Manufacture of printed wiring board | |
| JP4442938B2 (en) | Laser drilling method for laminated board and laminated board for laser drilling | |
| JP3171360B2 (en) | Prepreg | |
| JPH11100767A (en) | Base material for laminate board and its production, and prepreg and laminate board | |
| JP2894496B2 (en) | Manufacturing method of printed circuit board | |
| JP2002348754A (en) | Glass cloth, prepreg, laminated sheet, and printed wiring board | |
| JPH0356583B2 (en) | ||
| JP3750147B2 (en) | Laminate manufacturing method | |
| JP2000334871A (en) | Base material for laminated sheet, prepreg and production thereof | |
| JP3227874B2 (en) | Manufacturing method of laminated board | |
| JP2950969B2 (en) | Manufacturing method of laminated board | |
| JP3542612B2 (en) | Metal clad laminate | |
| JPH07100360B2 (en) | Copper clad laminate | |
| JPS62169828A (en) | Production of substrate for printed circuit | |
| JP2742124B2 (en) | Manufacturing method of printed circuit board | |
| JPS6364740A (en) | Copper-lined laminated board | |
| JP2002265634A (en) | Glass fiber nonwoven fabric for electric insulation, composite laminate and printed circuit board | |
| JPS59109350A (en) | Laminated board | |
| JP2001303417A (en) | Base material for laminate sheet and method of producing the same | |
| JPH073912B2 (en) | Multilayer printed wiring board | |
| JPH05327150A (en) | Laminated plate for printed circuit | |
| JPH0771839B2 (en) | Laminated board manufacturing method | |
| JP2001205740A (en) | Laminated sheet | |
| JPS588615A (en) | Manufacture of cloth substrate laminated plate |