CN101712224B - Method for manufacturing cover clad laminate preventing resin from flowing during pressing process - Google Patents
Method for manufacturing cover clad laminate preventing resin from flowing during pressing process Download PDFInfo
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- CN101712224B CN101712224B CN200910110330A CN200910110330A CN101712224B CN 101712224 B CN101712224 B CN 101712224B CN 200910110330 A CN200910110330 A CN 200910110330A CN 200910110330 A CN200910110330 A CN 200910110330A CN 101712224 B CN101712224 B CN 101712224B
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- 239000011347 resin Substances 0.000 title claims abstract description 67
- 229920005989 resin Polymers 0.000 title claims abstract description 67
- 238000000034 method Methods 0.000 title claims abstract description 63
- 238000003825 pressing Methods 0.000 title claims abstract description 52
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 37
- 230000000903 blocking effect Effects 0.000 claims abstract description 34
- 239000011889 copper foil Substances 0.000 claims abstract description 29
- 239000000463 material Substances 0.000 claims abstract description 23
- 230000004888 barrier function Effects 0.000 claims description 75
- 238000006243 chemical reaction Methods 0.000 claims description 6
- 239000002131 composite material Substances 0.000 claims description 4
- 238000010923 batch production Methods 0.000 claims description 3
- 238000000354 decomposition reaction Methods 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 abstract 8
- 239000010949 copper Substances 0.000 abstract 8
- 238000002791 soaking Methods 0.000 abstract 5
- 239000002184 metal Substances 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000012779 reinforcing material Substances 0.000 description 7
- 238000005194 fractionation Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 230000000630 rising effect Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 210000003141 lower extremity Anatomy 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
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Abstract
This invention relates to a method for manufacturing copper clad laminate preventing resin from flowing during pressing process, comprising the following steps: step one of determining a blocking method: providing a plurality of pre-soaking elements, covering a copper foil on each surface, pressing to form the copper clad plate, measuring and comparing the thickness of the edges on the copper clad laminate and the central thickness, finding out the part which does not conform to the edge thickness requirement, setting obstacles to the part which does not conform to the requirement, and determining the blocking method; step two of providing blocking plates made of heat-resistant sheet materials with certain thickness; and step three of determining the thickness of each blocking plate: covering a copper foil on the surface of each pre-soaking element, placing a blocking plate on corresponding edges of pre-soaking element according to the blocking method determined in step one to form a blocking unit, pressing to form a copper clad plate, measuring the thickness at the edges of the copper clad laminate and the central thickness, comparing, if the part which does not conform to the requirement, adjusting the thickness of the blocking plate of the part to form a new blocking unit, pressing the pre-soaking element and the copper foil according to the new blocking unit to manufacture the copper clad laminate, measuring the thickness at the edges of the copper clad laminate and the central thickness, comparing, repeating the steps unit the thicknesses of the edges meet the requirement and finally determining the thickness of each blocking plate in the blocking unit; and step four of mass production: pressing the pre-soaking element and the copper foils according to the blocking unit determined in step three to manufacture the copper clad laminates.
Description
Technical field
The present invention relates to a kind of preparation method of copper-clad plate, relate in particular to a kind of method for manufacturing cover clad laminate that stops that resin flows out in the pressing process.
Background technology
Printed circuit board has become most of electronic products and has reached the indispensable main building block of circuit interconnects.Extensive use along with swift and violent raising of circuit signal transfer rate and high-frequency circuit; Printed circuit board (PCB) is also had higher requirement, and promptly the circuit interconnects performance that provides of printed circuit board (PCB) must let complete in transmission course, reliable, accurate, the pulsation-free transmission of signal.And printed circuit board is processed by copper-clad plate (CCL), and integrality, reliability, accuracy, the uniformity of its signal transmission all receive the influence of copper-clad plate resin layer thickness.
To soak reinforcing material, and, make resin from uncured glue through overbaking, drying with resin; Become pre-preg material with certain state of cure; Then prepreg is processed in the section of pre-preg material, be superimposed together with one or more prepreg then again, and one or both sides are covered with Copper Foil; Process copper-clad laminate through heating up, pressurizeing, be called for short copper-clad plate (CCL).The resin that has certain state of cure in the prepreg is in the heating and pressurizing process; Can melt along with the rising of temperature; And the effect that is under pressure begin to around flow, if resin flow is not control effectively, resin can flow out outside the effective area of copper-clad plate; Make that the edge thickness of copper-clad plate is lower than interior thickness, form bigger thickness gradient.Existing method for manufacturing cover clad laminate mainly utilizes heating schedule and pressurization program to come thickness is controlled, but DeGrain has many drawbacks.
Having now utilizes heating schedule and pressurization program to come that the method for manufacturing cover clad laminate that thickness is controlled is had following drawback:
1, resin flows out from the copper-clad plate edge, causes edge resin layer thickness and center resin layer thickness to have bigger gradient difference, and edge thickness is than the thin 5-20% of interior thickness generally speaking, thus distortion and fluctuation when causing printed circuit board (PCB) to transmit signal.
2, resin flows out from the copper-clad plate edge, causes that the copper-clad plate marginal position is under-voltage, causes copper-clad plate edge resin can not soak into reinforcing material, forms hole, reduces the reliability of copper-clad plate.
3, fast when the resin formula reaction speed, when the resin melt viscosity is low, the technology controlling and process window just shows very narrowly, adjustment heats up and the pressurization program seems unable to do what one wishes for the outflow that the balance resin soaks into reinforcing material and control resin.
4, the edge resin might flow out Copper Foil, and each layer copper-clad plate sticked together, and causes follow-up fractionation and side cut to be difficult to carry out.
5, in the prepreg pressing process, the resin fusing is flowed, and causes dislocation slip (being commonly called as " slide plate ") between the prepreg easily.
Summary of the invention
The objective of the invention is to; A kind of method for manufacturing cover clad laminate that stops that resin flows out in the pressing process is provided, and it is simple to operate, can effectively reduce copper-clad plate edge thickness and center thickness gradient; Improve copper-clad plate performance reliability and uniformity; Can effectively avoid dislocation slip between prepreg, but also strengthen the process for pressing window of prepreg, can also help the operating efficiency of follow-up fractionation and side cut operation in addition.
For realizing above-mentioned purpose, the present invention provides a kind of method for manufacturing cover clad laminate that stops that resin flows out in the pressing process, comprises the steps:
Step 1, confirm to stop mode: several prepregs are provided; Cover with Copper Foil on its surface respectively; Copper-clad plate is processed in pressing, measures the edge thickness and the center thickness of copper-clad plate then respectively and compares, and finds out the undesirable position of edge thickness; The setting of undesirable position is stopped, thereby confirm to stop mode;
Step 2, provide by what heat-resisting flaky material was processed and have a certain thickness barrier plate;
Step 3, confirm the thickness of each barrier plate: cover with Copper Foil on the prepreg surface, and the mode of confirming according to step 1 that stops at the prepreg edge corresponding placement barrier plate, form blocking unit; Copper-clad plate is processed in pressing; Measure the edge thickness and the center thickness of copper-clad plate then respectively and compare, if there is the undesirable position of edge thickness, the thickness of then adjusting this position barrier plate forms new blocking unit; Then again according to new blocking unit pressing prepreg and Copper Foil; Process copper-clad plate, measure the edge thickness and the center thickness of copper-clad plate more respectively and compare so repetition; All meet the requirements until edge thickness, finally confirm each barrier plate thickness of blocking unit;
Step 4, batch process: the blocking unit of confirming according to step 3 comes pressing prepreg and Copper Foil, processes copper-clad plate.
The undesirable position of step 1 pair edge thickness is set and is stopped, this stops that mode comprises that the part stops that mode and all edges stop mode.
The heat decomposition temperature of said barrier plate is higher than the curing reaction temperature of said pre-preg material, and this heat proof material is composite, metal, pottery or yarn fabric.
Said barrier plate is processed by metal or pottery, and its surface need be carried out the demoulding and handled before pressing.
Said barrier plate is processed by the heat proof material that contains the exhaust space.
Said barrier plate is processed by the heat proof material that does not contain the exhaust space, and which is provided with air discharge duct or steam vent.
Said blocking unit splices in the edge of prepreg and is formed with the slit, and the splicing slit of each barrier plate and prepreg is less than 5mm.
The thickness of said barrier plate is 40%～120% of thickness of copper-clad plate.
In the step 2, the thickness of barrier plate is 40% of thickness of copper-clad plate, in step 3, if there is the undesirable position of edge thickness, then increases the thickness of this position barrier plate.
The thickness of said barrier plate is 80%～95% of thickness of copper-clad plate.
Beneficial effect of the present invention: the present invention can make the resin flow output minimizing of prepreg or not flow out the copper-clad plate edge through barrier plate is set, and can promote the edge resin to soak into reinforcing material, improves copper-clad plate performance reliability and uniformity; This method can also reduce copper-clad plate edge resin layer thickness and center resin layer thickness gradient, effectively improves integrality, reliability, accuracy and the uniformity of printed circuit board (PCB) transmission signal.In addition; Being provided with of barrier plate can prevent effectively that prepreg from producing prepreg interformational sliding phenomenon in resin fusing back; The copper-clad plate edge resin that utilizes this method to make no longer flows out Copper Foil; Can avoid each layer copper-clad plate to stick together, help improving the operating efficiency of follow-up fractionation and side cut operation.In addition, the present invention has increased in a kind of copper-clad plate pressing process the ways and means of control resin flows, indirect increasing the process for pressing window of prepreg, help improving the operating efficiency of follow-up fractionation and side cut operation.
In order further to understand characteristic of the present invention and technology contents, see also following about detailed description of the present invention and accompanying drawing, yet accompanying drawing only provide reference and the explanation usefulness, be not to be used for the present invention is limited.
Description of drawings
Below in conjunction with accompanying drawing, describe in detail through specific embodiments of the invention, will make technical scheme of the present invention and other beneficial effect obvious.
In the accompanying drawing,
Fig. 1 stops the schematic flow sheet of the method for manufacturing cover clad laminate that resin flows out in the pressing process for the present invention;
Fig. 2 is the prepreg of step 1 and the placement sketch map of Copper Foil;
Fig. 3 is a step 3 and step 4 blocking unit, prepreg, and the placement sketch map of Copper Foil;
Fig. 4-8 is the sketch map of blocking unit shape among the present invention.
The specific embodiment
Technological means and the effect thereof taked for further setting forth the present invention are described in detail below in conjunction with the preferred embodiments of the present invention and accompanying drawing thereof.
As shown in Figure 1, the present invention stops that the method for manufacturing cover clad laminate that resin flows out in the pressing process comprises:
Step 1, confirm to stop mode: several prepregs are provided; Cover with Copper Foil on its surface respectively; Copper-clad plate is processed in pressing, measures the edge thickness and the center thickness of copper-clad plate then respectively and compares, and finds out the undesirable position of edge thickness; The setting of undesirable position is stopped, thereby confirm to stop mode.
As shown in Figure 2; In the present embodiment, prepreg 10 two sides are covered with Copper Foil 20, the Copper Foil outside is placed two metal demarcation strips 30 again; By that analogy; At last preimpregnation film-making, Copper Foil, metal demarcation strip are superimposed together according to the suitable number of plies, place padded coaming 40 in the sheet material top and bottom of folding again, carry out pressing then.Along with the rising of temperature, resin begins fusing in the dipstick in the pressing process, flows around unobstructed at the lower limb resin that orders about of pressure.When resin reaction to cure stage, resin is no longer mobile, is solid.After meeting the requirements of state of cure, begin cooling and release pressure, final pressing and forming is processed copper-clad plate.In the pressing process, because barrier plate is not set, resin flow can flow out outside the effective area of copper-clad plate in moving process, makes that the edge thickness of copper-clad plate is lower than interior thickness, forms bigger thickness gradient.Through edge thickness and the center thickness of measuring this copper-clad plate; Measure the undesirable position of edge thickness; And, can be that local edge to copper-clad plate carries out gummosis and stops that promptly the part stops mode according to the distribution situation at the undesirable position of edge thickness; Also can be all edges of copper-clad plate to be carried out gummosis together stop, i.e. the mode that stops of all edges.In addition, according to the difference that stops mode, barrier plate can be shapes such as strip, L shaped, U-shaped or rectangle.
Step 2, provide by what heat-resisting flaky material was processed and have a certain thickness barrier plate.
This barrier plate is processed by heat proof material, and its heat decomposition temperature should be higher than the curing reaction temperature of pre-preg material, otherwise barrier plate will decompose in the temperature-rise period of pressing, brings safety problem, and influences its blocking effect and influence the copper-clad plate performance.This heat proof material can be composite, metal, pottery, yarn fabric etc., but is not limited to these materials.Owing to after copper-clad plate completes, need take the metal demarcation strip apart and copper-clad plate is cut into given size, therefore; If barrier plate is processed like composite, yarn fabric etc. by the material that cuts easily, the barrier plate surface need not carried out the demoulding and handled; Can treat to dismiss in the lump when copper-clad plate cuts; If barrier plate is processed by the material that is difficult to cut, as have certain thickness metal, pottery etc., the barrier plate surface need be carried out the demoulding and handle before pressing.Need to prove whether carry out the demoulding and handle, can't influence the blocking effect of barrier plate the copper-clad plate gummosis.
In addition, in the manufacturing process of prepreg, resin does not coat reinforcing material fully, and also have a lot of spaces by resin-coated not formed bubble in the reinforcing material this moment, and these bubbles can be got rid of through sheet edge in the pressing process; And for the prepreg of some resin solidification reaction system; They have the curing reaction accessory substance and discharge in the process of intensification pressing; Usually these accessory substances all are the little molecules of gaseous state, and these little molecules also are in the pressing process, get rid of through sheet edge.For the ease of above-mentioned bubble or the micromolecular eliminating of gaseous state, can on barrier plate, offer air discharge duct or steam vent, also can directly use by containing the barrier plate that process in the exhaust space.On barrier plate, offer the method that barrier plate that air discharge duct or vent openings and use contain the exhaust space impels bubble to discharge, be applicable to the barrier plate of all thickness, be specially adapted to barrier plate thickness and be 98%～120% situation of thickness of copper-clad plate.
Step 3, confirm the thickness of each barrier plate: cover with Copper Foil on the prepreg surface, and the mode of confirming according to step 1 that stops at the prepreg edge corresponding placement barrier plate, form blocking unit; Copper-clad plate is processed in pressing; Measure the edge thickness and the center thickness of copper-clad plate then respectively and compare, if there is the undesirable position of edge thickness, the thickness of then adjusting this position barrier plate forms new blocking unit; Then again according to new blocking unit pressing prepreg and Copper Foil; Process copper-clad plate, measure the edge thickness and the center thickness of copper-clad plate more respectively and compare so repetition; All meet the requirements until edge thickness, finally confirm each barrier plate thickness of blocking unit.
As shown in Figure 3; In the present embodiment, prepreg 10 two sides are covered with Copper Foil 20, and barrier plate 50 is set at the prepreg edge; The Copper Foil outside is placed two metal spacer 30 more then; By that analogy, at last preimpregnation film-making, Copper Foil, metal demarcation strip are superimposed together according to the suitable number of plies, place padded coaming 40 in the sheet material top and bottom of folding again.This barrier plate 50 splices in the edge of prepreg 10; In order to the effect that stops that resin in the pressing process flows out to be provided, and because barrier plate 50 and prepreg 10 slit (i.e. the tightness degree of splicing) between the two can determine the final effect that barrier resin of the present invention flows out; Influence the thickness distribution of the whole plate of copper-clad plate; Therefore, in the present embodiment, barrier plate and prepreg splicing slit need less than 5mm.Simultaneously; For guaranteeing that the motive force that barrier plate in use is unlikely to receive gummosis produces slip; This barrier plate need and the placed side between have bigger frictional force, when frictional force is low, but then can increase fixture and the use immobilization material is fixed; Through above-mentioned setting, make barrier plate can also prevent effectively that prepreg from producing prepreg interformational sliding phenomenon in resin fusing back.
In the present embodiment; The thickness range of barrier plate generally is no more than 40%～120% of thickness of copper-clad plate; And preferred barrier plate is 80%～95% of a thickness of copper-clad plate, but flows out many especially situation for resin, can use the barrier plate above thickness of copper-clad plate 100%.The thickness difference of slit between barrier plate and prepreg are pieced together (i.e. the tightness degree of splicing) and barrier plate and superimposed back prepreg has determined the final effect that barrier resin of the present invention flows out, and can influence the thickness distribution of the whole plate of copper-clad plate.The thickness of barrier plate can adopt 40% of thickness of copper-clad plate.Along with the rising of temperature, resin begins fusing in the prepreg 10 in the pressing process, pressure order about the lower limb resin to around flow.After resin had been filled up the slit between prepreg 10 and the barrier plate 50, resin flows was obstructed, and rim pressure improves; And resin can only through very little slit to around flow because barrier plate 50 with separate metal object 30 up and down and do not fit tightly, so temperature is lower slightly than prepreg 10; And temperature is low more more in the outer part; After certain distance was flowed out in the slit of resin between barrier plate 50 and Copper Foil 20, resin temperature can reduce, and heating rate also further slows down; At this moment resin viscosity begins to raise, and further slows down mobile.When reacting to cure stage, resin no longer flows, and is solid.After meeting the requirements of state of cure, begin cooling and release pressure, final pressing and forming is processed copper-clad plate.Measure the edge of copper-clad plate and the thickness at center, if edge thickness does not obviously improve, i.e. the center thickness of copper-clad plate and edge thickness still form bigger thickness gradient, and be undesirable, then need increase the thickness of barrier plate.
Step 4, batch process: the blocking unit of confirming according to step 3 comes pressing prepreg and Copper Foil, processes copper-clad plate.
In the present embodiment, be 1.6mm with a kind of thickness, and be shaped as the barrier plate 50 of strip, be arranged at thickness after the pressing and be 2.0mm prepreg 10 around (as shown in Figure 4), carry out pressing then.In other embodiments, barrier plate also can be other shapes, and is arranged at the part (like Fig. 5,6,7, shown in 8) of prepreg.After copper-clad plate is processed in the process pressing; Measure and calculate the average thickness of the center and peripheral position of this copper-clad plate; To there be the thickness of barrier plate and the thickness of without hindrance baffle plate to compare, can find that the marginal position average thickness of the copper-clad plate of barrier plate obviously improves, as shown in table 1.
Table 1
| Copper-clad plate center average thickness | Copper-clad plate marginal position average thickness | |
| Barrier plate is arranged | 2.073mm | 2.038mm |
| Without hindrance baffle plate | 2.047mm | 1.846mm |
In sum, the present invention can make the resin flow output minimizing of prepreg or not flow out the copper-clad plate edge through barrier plate is set, and can promote the edge resin to soak into reinforcing material, improves copper-clad plate performance reliability and uniformity; This method can also reduce copper-clad plate edge resin layer thickness and center resin layer thickness gradient, effectively improves integrality, reliability, accuracy and the uniformity of printed circuit board (PCB) transmission signal.In addition; Being provided with of barrier plate can prevent effectively that prepreg from producing prepreg interformational sliding phenomenon in resin fusing back; The copper-clad plate edge resin that utilizes this method to make no longer flows out Copper Foil; Can avoid each layer copper-clad plate to stick together, help improving the operating efficiency of follow-up fractionation and side cut operation.In addition, the present invention has increased in a kind of copper-clad plate pressing process the ways and means of control resin flows, indirect increasing the process for pressing window of prepreg, help improving the operating efficiency of follow-up fractionation and side cut operation.
The above for the person of ordinary skill of the art, can make other various corresponding changes and distortion according to technical scheme of the present invention and technical conceive, and all these changes and distortion all should belong to the protection domain of claim of the present invention.
Claims (6)
1. a method for manufacturing cover clad laminate that stops that resin flows out in the pressing process is characterized in that, comprises the steps:
Step 1, confirm to stop mode: several prepregs are provided; Cover with Copper Foil on its surface respectively; Copper-clad plate is processed in pressing, measures the edge thickness and the center thickness of copper-clad plate then respectively and compares, and finds out the undesirable position of edge thickness; The setting of undesirable position is stopped, thereby confirm to stop mode; The setting of undesirable position stops to edge thickness, and this stops that mode comprises that the part stops that mode and all edges stop mode;
Step 2, provide by what heat-resisting flaky material was processed and have a certain thickness barrier plate; The heat decomposition temperature of said barrier plate is higher than the curing reaction temperature of said pre-preg material, and this heat proof material is a composite;
Step 3, confirm the thickness of each barrier plate: cover with Copper Foil on the prepreg surface, and the mode of confirming according to step 1 that stops at the prepreg edge corresponding placement barrier plate, form blocking unit; Copper-clad plate is processed in pressing; Measure the edge thickness and the center thickness of copper-clad plate then respectively and compare, if there is the undesirable position of edge thickness, the thickness of then adjusting this position barrier plate forms new blocking unit; Then again according to new blocking unit pressing prepreg and Copper Foil; Process copper-clad plate, measure the edge thickness and the center thickness of copper-clad plate more respectively and compare so repetition; All meet the requirements until edge thickness, finally confirm each barrier plate thickness of blocking unit; The thickness of said barrier plate is 40%～120% of thickness of copper-clad plate;
Step 4, batch process: the blocking unit of confirming according to step 3 comes pressing prepreg and Copper Foil, processes copper-clad plate.
2. the method for manufacturing cover clad laminate that stops that resin flows out in the pressing process as claimed in claim 1 is characterized in that said barrier plate is processed by the heat proof material that contains the exhaust space.
3. the method for manufacturing cover clad laminate that stops that resin flows out in the pressing process as claimed in claim 1 is characterized in that said barrier plate is processed by the heat proof material that does not contain the exhaust space, and which is provided with air discharge duct or steam vent.
4. the method for manufacturing cover clad laminate that stops that resin flows out in the pressing process as claimed in claim 1 is characterized in that said blocking unit splices in the edge of prepreg and is formed with the slit, and the splicing slit of each barrier plate and prepreg is less than 5mm.
5. the method for manufacturing cover clad laminate that stops that resin flows out in the pressing process as claimed in claim 1 is characterized in that, in the step 2; The thickness of barrier plate is 40% of thickness of copper-clad plate; In step 3,, then increase the thickness of this position barrier plate if there is the undesirable position of edge thickness.
6. the method for manufacturing cover clad laminate that stops that resin flows out in the pressing process as claimed in claim 1 is characterized in that the thickness of said barrier plate is 80%～95% of thickness of copper-clad plate.
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| CN200910110330A CN101712224B (en) | 2009-10-26 | 2009-10-26 | Method for manufacturing cover clad laminate preventing resin from flowing during pressing process |
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| CN200910110330A CN101712224B (en) | 2009-10-26 | 2009-10-26 | Method for manufacturing cover clad laminate preventing resin from flowing during pressing process |
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| CN102267265A (en) * | 2011-06-10 | 2011-12-07 | 广东生益科技股份有限公司 | Prepreg for improving thickness uniformity of CCL (copper clad laminate) substrate and method for manufacturing CCL using prepreg |
| CN106671559A (en) * | 2016-12-27 | 2017-05-17 | 广东生益科技股份有限公司 | Production method for stopping glue flow in laminating process of copper-clad plate |
| CN106985396B (en) * | 2017-01-13 | 2020-04-14 | 王文潮 | Method for controlling glue flow of copper-clad plate |
| CN109651636A (en) * | 2018-12-24 | 2019-04-19 | 王新民 | A kind of preparation method of prepreg |
| CN113427882A (en) * | 2021-06-11 | 2021-09-24 | 宁波甬强科技有限公司 | Method for controlling glue overflow of copper-clad plate laminating process |
| CN114867230B (en) * | 2022-05-27 | 2023-06-23 | 江西省航宇电子材料有限公司 | Method for keeping thickness of stainless steel-based copper-clad plate consistent |
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| CN101351078A (en) * | 2008-08-15 | 2009-01-21 | 东莞生益电子有限公司 | Method for processing step ladder PCB plate |
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| CN101351078A (en) * | 2008-08-15 | 2009-01-21 | 东莞生益电子有限公司 | Method for processing step ladder PCB plate |
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Inventor after: Wu Xiaolian Inventor after: Zhong Jianwei Inventor after: Xing Yipan Inventor after: Yang Hong Inventor after: Pan Hongjie Inventor before: Wu Xiaolian Inventor before: Zhong Jianwei Inventor before: Xing Yipan Inventor before: Yang Hong Inventor before: Pan Hongjie |
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Granted publication date: 20121010 |