CN101965099A - Internal board structure for printed circuit board - Google Patents
Internal board structure for printed circuit board Download PDFInfo
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- CN101965099A CN101965099A CN 201010269586 CN201010269586A CN101965099A CN 101965099 A CN101965099 A CN 101965099A CN 201010269586 CN201010269586 CN 201010269586 CN 201010269586 A CN201010269586 A CN 201010269586A CN 101965099 A CN101965099 A CN 101965099A
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- inner plating
- printed circuit
- adhesive
- circuit board
- internal board
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Abstract
The invention discloses an internal board structure for a printed circuit board, which comprises an internal board and a flowing adhesive scrapping area arranged on the internal board, and is characterized in that: the entire surface of the flowing adhesive scraping area is plated with a copper layer; and both the upper and lower panels of the internal board are laminated with an adhesive piece. In the invention, the surface of the flowing adhesive area of the internal board is modified into an all-copper structure, so in the laminating process, the adverse phenomenon that part of the adhesive which is flowable flows to the areas without copper and generate wrinkles is eliminated; enough adhesive is filled, the laminating is convenient and quick, and the production quality of the internal board is improved.
Description
Technical field
What the present invention relates to is a kind of lamination field of printed circuit board (PCB), and what be specifically related to is a kind of inner plating structure that is applied in the printed circuit board (PCB).
Background technology
Along with popularizing and extensive use of electronic product, the production of printed circuit board (PCB) (Print Circuit board is called for short pcb board) and manufacturing technology are also brought in constant renewal in and are disliked development.For producing the demand of different electronic products, the pcb board of designed manufacturing develops into doubling plate or multiple-plate design and application by lamina.
Many item number inner platings have following design in the existing factory: break edge, Dummy PAD zone greatly, scrape gummosis district PAD and have and design such as separate, all there is no copper zone, because of pressing process glue has flowability, can make part glue fill up above no copper zone, so in actual pressing operation process, because Dummy PAD zone is big and many, being easy to generate the filler deficiency can starved promptly occur, causes the bad generation of gauffer.
Summary of the invention
In view of the deficiency that exists on the prior art, the present invention seeks to be to provide a kind of avoid that the gauffer bad phenomenon takes place be applied to inner plating structure in the printed circuit board (PCB).
To achieve these goals, the present invention realizes by the following technical solutions:
A kind of inner plating structure that is applied in the printed circuit board (PCB) comprises inner plating and is arranged on and scrapes the gummosis district on the inner plating; It is characterized in that, all be coated with the copper floor on the described surface, gummosis district of scraping; Upper and lower panel at described inner plating all is superimposed with film; Full steel structure has been adopted in the spacious zone of this inner plating, avoids because of pressing process glue has flowability, can make part glue fill up above no copper zone.
Aforesaid a kind of inner plating structure that is applied in the printed circuit board (PCB), wherein, described film is the resin film.
The beneficial effect that the present invention is compared with prior art had:
The present invention is full steel structure with the gummosis district surface modified of scraping of inner plating, in the pressing process, has avoided can making part glue fill up above no copper zone because glue has flowability, produces the gauffer bad phenomenon and takes place; Make its filler abundance, pressing is convenient, fast, improves the quality of production of inner plating.
Description of drawings
Describe the present invention in detail below in conjunction with the drawings and specific embodiments;
Fig. 1 is a pressing process schematic diagram of the present invention;
Fig. 2 is the structural representation after the pressing of the present invention;
Fig. 3 is the plate face schematic diagram of inner plating of the present invention.
Embodiment
For technological means, creation characteristic that the present invention is realized, reach purpose and effect is easy to understand, below in conjunction with embodiment, further set forth the present invention.
Referring to Fig. 1 to Fig. 3, present embodiment provides a kind of inner plating structure that is applied in the printed circuit board (PCB), comprises inner plating 1 and be arranged on scraping gummosis district 11 on the inner plating 1; All be coated with the copper floor scraping 11 surfaces, gummosis district; Be superimposed with film 2 at the upper and lower panel of described inner plating 1 on all; This inner plating 1 has adopted full steel structure, avoids because of pressing process glue has flowability, can make part glue fill up above no copper zone.
In the present embodiment, what film 2 adopted is the resin film, when originally being implemented in pressing, many inner platings that have circuit being passed through press, and provide the condition of high temperature, high pressure to utilize the resin film to bond them together.In addition, before the multi-layer sheet lamination, need core material is carried out treatment process.The treatment process of inner plating has black oxidation processing technique and brown treatment process, and oxidation processing technique is to form one deck black oxide film on the internal layer Copper Foil, and the black oxidation film thickness is 0.25-4) .50mg/cm2.Brown treatment process (horizontal brown) is to form one deck organic membrane on the internal layer Copper Foil.Increased the specific surface that the internal layer Copper Foil contacts with resin by inner plating 1 treatment process, the adhesion between the two is strengthened; And to effective wettability of copper layer, make mobile resin have sufficient ability to stretch in people's oxide-film when increase melting resin glue sheet flows, represent powerful earth-grasping force after the curing, avoid the gauffer bad phenomenon to take place.
It should be noted that, there is the several temperature parameter important in the temperature of present embodiment, the lamination process, be the curing temperature of melt temperature, the resin of resin, the velocity variations of heat dish design temperature, material actual temperature and intensification, melt temperature be temperature when being elevated to 70 ℃ resin begin fusing.Further rising just because of temperature, resin further melts and begins and flows, temperature 70-140 ℃ during this period of time in, resin is easy fluid, at this moment, because present embodiment covers by copper facing and all scrapes in the gummosis district scraping the gummosis district, has avoided Dummy PAD zone starved to occur, causes the bad generation of gauffer.Simultaneously, but just because of the fluidity of resin, just guarantee the filler, moistening of resin.
Along with temperature raises gradually, resin flow experienced one change from small to big, again to little, at last when temperature reaches 160-170 ℃, the resin flow degree is 0, temperature at this moment is called curing temperature.For making resin filler, moistening preferably, controlling heating rate well must be very important, and heating rate is specializing of laminating temperature, controls promptly when how high temperature be raised to.The control of heating rate is an important parameter of multi-layer sheet lamination quality, and heating rate generally is controlled to be 2-4 ℃/MIN.
In the present embodiment, heating rate and PP different model, quantity etc. are closely related.To the 7628PP heating rate can the quicker 2-4 of being ℃/min, to 1080, the 2116PP heating rate is controlled at 1.5-2 ℃/MIN PP quantity is many simultaneously, heating rate can not be too fast, because heating rate is too fast, the wettability of PP is poor, Resin Flow is big, time is short, cause slide plate easily, influence the lamination quality.
Based on above-mentioned, the present invention changes to full steel structure design with the gummosis district 11 (compartment PAD, red color area is a copper face) of scraping of inner plating 1, in the pressing process, avoided to make part glue fill up above no copper zone, produced the gauffer bad phenomenon and take place because glue has flowability; Make its filler abundance, pressing is convenient, fast, improves the quality of production of inner plating.
More than show and described basic principle of the present invention and principal character and advantage of the present invention.The technical staff of the industry should understand; the present invention is not restricted to the described embodiments; that describes in the foregoing description and the specification just illustrates principle of the present invention; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements all fall in the claimed scope of the invention.The claimed scope of the present invention is defined by appending claims and equivalent thereof.
Claims (2)
1. inner plating structure that is applied in the printed circuit board (PCB) comprises inner plating and is arranged on and scrapes the gummosis district on the inner plating; It is characterized in that, all be coated with the copper floor on the described surface, gummosis district of scraping; Be superimposed with film at the upper and lower panel of described inner plating on all.
2. a kind of inner plating structure that is applied in the printed circuit board (PCB) according to claim 1 is characterized in that described film is the resin film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010269586 CN101965099A (en) | 2010-08-30 | 2010-08-30 | Internal board structure for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010269586 CN101965099A (en) | 2010-08-30 | 2010-08-30 | Internal board structure for printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101965099A true CN101965099A (en) | 2011-02-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010269586 Pending CN101965099A (en) | 2010-08-30 | 2010-08-30 | Internal board structure for printed circuit board |
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| CN (1) | CN101965099A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102883534A (en) * | 2012-09-27 | 2013-01-16 | 沪士电子股份有限公司 | Method for solving problem of voltage loss in inner copper-free area of thick copper printed circuit board |
| CN111565508A (en) * | 2020-05-27 | 2020-08-21 | 广合科技（广州）有限公司 | PCB structure for verifying heat resistance of different materials |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1427661A (en) * | 2001-12-19 | 2003-07-02 | 耀文电子工业股份有限公司 | Manufacturing method of printed circuit board having stepped high density interconnection structure |
| US20100124035A1 (en) * | 2008-11-20 | 2010-05-20 | International Business Machines Corporation | Integrating Capacitors Into Vias Of Printed Circuit Boards |
-
2010
- 2010-08-30 CN CN 201010269586 patent/CN101965099A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1427661A (en) * | 2001-12-19 | 2003-07-02 | 耀文电子工业股份有限公司 | Manufacturing method of printed circuit board having stepped high density interconnection structure |
| US20100124035A1 (en) * | 2008-11-20 | 2010-05-20 | International Business Machines Corporation | Integrating Capacitors Into Vias Of Printed Circuit Boards |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102883534A (en) * | 2012-09-27 | 2013-01-16 | 沪士电子股份有限公司 | Method for solving problem of voltage loss in inner copper-free area of thick copper printed circuit board |
| CN102883534B (en) * | 2012-09-27 | 2015-08-12 | 沪士电子股份有限公司 | The thick copper coin internal layer of printed circuit is without copper district decompression problem-solving approach |
| CN111565508A (en) * | 2020-05-27 | 2020-08-21 | 广合科技（广州）有限公司 | PCB structure for verifying heat resistance of different materials |
| CN111565508B (en) * | 2020-05-27 | 2021-10-12 | 广州广合科技股份有限公司 | PCB structure for verifying heat resistance of different materials |
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Application publication date: 20110202 |