CN106118519A - The pressure-sensitive pad pasting of microelectronic component - Google Patents

The pressure-sensitive pad pasting of microelectronic component Download PDF

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Publication number
CN106118519A
CN106118519A CN201610116970.7A CN201610116970A CN106118519A CN 106118519 A CN106118519 A CN 106118519A CN 201610116970 A CN201610116970 A CN 201610116970A CN 106118519 A CN106118519 A CN 106118519A
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China
Prior art keywords
parts
graphite
kapton
pressure
pad pasting
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CN201610116970.7A
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Chinese (zh)
Inventor
金闯
梁豪
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Suzhou Sidike New Material Science and Technology Co Ltd
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Suzhou Sidike New Material Science and Technology Co Ltd
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Priority to CN201610116970.7A priority Critical patent/CN106118519A/en
Publication of CN106118519A publication Critical patent/CN106118519A/en
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    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/52—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite
    • C04B35/522—Graphite
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    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
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    • B32—LAYERED PRODUCTS
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    • B32B27/00—Layered products comprising a layer of synthetic resin
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    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
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Abstract

The present invention discloses a kind of pressure-sensitive pad pasting of microelectronic component, and it fits in heat generating components surface, and graphite linings is obtained by following process: the upper and lower surface of Kapton is coated with the Kapton after one layer of graphite modified dose of acquisition processes；Graphite modified dose is made up of the component of following weight portion: pyromellitic acid anhydride 28 parts, benzophenone tetracarboxylic dianhydride 13.5 parts, MDA 25 parts, dimethylformamide 24 parts, N methyl pyrrolidone 9 parts, ethylene glycol 2.2 parts, polydimethylsiloxane 2.2 parts；Kapton after processing is warming up to 800 DEG C, obtains the carbonized film of pre-burned being warming up to 1200 DEG C after insulation；Use the carbonized film of the pre-burned of the calender described step 4 of calendering.The present invention improves degree of crystallinity simultaneously, also improves compactness and degree of crystallinity, further increases at heat conductivility both vertically and horizontally.

Description

The pressure-sensitive pad pasting of microelectronic component
Technical field
The present invention relates to a kind of pressure-sensitive pad pasting of microelectronic component, belong to heat radiation Filming Technology field.
Background technology
Along with modern microelectronic technology high-speed develops, electronic equipment (such as notebook computer, mobile phone, panel computer etc.) is day by day Becoming ultra-thin, light, this structure makes electronic equipment internal power density significantly improve, and in operation, produced heat is difficult to Discharge, be prone to accumulate rapidly and form high temperature.On the other hand, high temperature can reduce the performance of electronic equipment, reliability and use longevity Life.Therefore, Current electronic industry is for proposing the highest requirement as the heat sink material of heat control system core component, urgently Need a kind of high-efficiency heat conduction, light material to transfer heat away from rapidly, ensure that electronic equipment is properly functioning.
In prior art, Kapton is mostly used for flexible PCB, although has and uses polyimide film sintered obtaining Obtain graphite heat radiation fin, thus be covered on thermal source, but be constrained to the good and the bad of the product quality and performances of Kapton not Together, have influence on the performance of heat radiation two-sided pad pasting heat dispersion, there is techniques below problem: dispel the heat uneven, adhesive tape easily occurs Hot-spot, the heat dispersion that improve product is unstable, reliability performance is poor, is unfavorable for product quality management control, affects product Competitiveness.
Summary of the invention
It is an object of the present invention to provide a kind of pressure-sensitive pad pasting of microelectronic component, this pressure-sensitive pad pasting is in vertical direction and level side To all improve heat conductivility, it is to avoid adhesive tape hot-spot, it is achieved that while the uniformity of adhesive tape heat conductivility, improve product The heat dispersion stability of product, reliability, greatly reduce the cost of product.
For reaching above-mentioned purpose, the technical solution used in the present invention is: a kind of pressure-sensitive pad pasting of microelectronic component, described pressure Quick attachment film in heat generating components surface, described pressure-sensitive pad pasting include graphite linings, the heat-conducting glue adhesion coating being positioned at graphite linings surface and Separated type material layer, this separated type material laminating is together in the opposing surface of heat-conducting glue adhesion coating and graphite linings；Described graphite linings is by following Process obtains, and this process comprises the following steps:
Step one, Kapton is risen to 250 DEG C from room temperature, near room temperature after rising to 400 DEG C after insulation；
Step 2, it is coated with one layer of graphite modified dose of acquisition on the upper and lower surface of the Kapton through step one and processes After Kapton, the viscosity of described graphite modified dose is 30000 ~ 48000CP；
Described graphite modified dose is made up of the component of following weight portion:
Pyromellitic acid anhydride 28.5 parts,
Benzophenone tetracarboxylic dianhydride 12.5 parts,
MDA 26 parts,
Dimethylformamide 22 parts,
N-Methyl pyrrolidone 8.5 parts,
Ethylene glycol 1.5 parts,
Polydimethylsiloxane 2 parts；
Step 3, will process after Kapton be warming up to 800 DEG C, be warming up to 1200 DEG C after insulation, after insulation cool down, Thus obtain the carbonized film of pre-burned；
Step 4, employing calender roll the carbonized film of the pre-burned of described step 4；
Step 5, it is warming up to 2400 DEG C, after insulation, is warming up to 2900 DEG C again, cool down after insulation, thus obtain the main graphite fired Film；
Step 6, then carry out rolling by the graphite film that the master of step 5 gained fires thus obtain described graphite linings.
In technique scheme, further improved plan is as follows:
1, in such scheme, described step 5 rises to 2400 DEG C with the speed of 19 ~ 21 degree/min, keep 0.9 ~ 1.1 hour, then Rise to 2900 DEG C with the speed of 19 ~ 21 degree/min, cool down after keeping 1.8 ~ 2.2 hours, thus obtain the main graphite film fired.
2, in such scheme, Kapton is risen to 250 with 4 ~ 6 degree/min speed from room temperature by described step one DEG C, keep 0.9 ~ 1.1 hour, then with 2.5 ~ 3.5 degree/min, rise to 400 DEG C, near room temperature after keeping 1 hour.
Owing to technique scheme is used, the present invention compared with prior art has following advantages and an effect:
1, the pressure-sensitive pad pasting of microelectronic component of the present invention, in its structure graphite linings by upper and lower surface be coated with one layer graphite modified The Kapton of agent is prepared from, and improves at heat conductivility both vertically and horizontally, it is to avoid adhesive tape local mistake Heat, it is achieved that the uniformity of adhesive tape heat conductivility；Secondly, its be positioned at Kapton surface graphite modified dose is contained by specific The benzophenone tetracarboxylic dianhydride of amount, pyromellitic acid anhydride, MDA, dimethylformamide, N-crassitude Ketone, ethylene glycol, polydimethylsiloxane form, and are coated on Kapton, the pin hole being filled with in heating process, improve Degree of crystallinity simultaneously, also overcome thermal contraction excessive cause uneven, improve graphite linings biaxial tension performance.
2, the pressure-sensitive pad pasting of microelectronic component of the present invention, it is positioned at graphite modified dose of Kapton surface by specific The benzophenone tetracarboxylic dianhydride of content, pyromellitic acid anhydride, MDA, dimethylformamide, N-methylpyrrole Alkanone, ethylene glycol, polydimethylsiloxane form, and use dimethylformamide, N-Methyl pyrrolidone to reduce azeotropic point also And smooth boiling point district, improve flatness and the pliability of final products film forming；Secondly, Kapton surface has stone Ink modifying agent, improves graphite linings and heat-conducting glue adhesion coating heat conductivility in two-sided pad pasting, and uses calender to roll described pre-burning The carbonized film of system, it is to avoid the volume contraction in fold and graphitization sintering process, improves compactness and degree of crystallinity, further Improve at heat conductivility both vertically and horizontally.
3, the pressure-sensitive pad pasting of microelectronic component of the present invention, after first Kapton being risen to 400 DEG C of imidizations, then pre-burning Increase calendaring processes between carbonized film and the graphitization of system, and again roll after forming heat conduction graphite patch again, it is to avoid pleat Volume contraction in wrinkle and graphitization sintering process, improves compactness and degree of crystallinity, further increase in vertical direction and The heat conductivility of horizontal direction.
Detailed description of the invention
Below in conjunction with embodiment, the invention will be further described:
Embodiment: a kind of pressure-sensitive pad pasting of microelectronic component, described pressure-sensitive attachment film in heat generating components surface, described pressure-sensitive patch Film includes graphite linings, the heat-conducting glue adhesion coating being positioned at graphite linings surface and separated type material layer, and this separated type material laminating is together in heat-conducting glue The surface that adhesion coating is opposing with graphite linings；Described graphite linings is obtained by following process, and this process comprises the following steps:
Step one, Kapton is risen to 250 DEG C with 4 ~ 6 degree/min speed from room temperature, keep 0.9 ~ 1.1 hour, then With 2.5 ~ 3.5 degree/min, rise to 400 DEG C, near room temperature after keeping 1 hour；
Step 2, it is coated with one layer of graphite modified dose of acquisition on the upper and lower surface of the Kapton through step one and processes After Kapton, described graphite modified dose is made up of the component of following weight portion:
Pyromellitic acid anhydride 28.5 parts,
Benzophenone tetracarboxylic dianhydride 12.5 parts,
MDA 26 parts,
Dimethylformamide 22 parts,
N-Methyl pyrrolidone 8.5 parts,
Ethylene glycol 1.5 parts,
Polydimethylsiloxane 2 parts；
Note: the viscosity of graphite modified dose of embodiment 1 is 32000CP, the viscosity of graphite modified dose of embodiment 2 is 35000CP, The viscosity of graphite modified dose of embodiment 3 is 38000CP, and the viscosity of graphite modified dose of embodiment 4 is 42000CP, embodiment 5 The viscosity of graphite modified dose be 45000CP.
Step 3, rise to 800 DEG C with the speed of 4 ~ 6 degree/min, keep 0.9 ~ 1.1 hour；Again with the speed of 9 ~ 11 degree/min Degree rises to 1200 DEG C, cools down, thus obtain the carbonized film of pre-burned after preserving 0.9 ~ 1.1 hour；
Step 4, employing calender roll the carbonized film of the pre-burned of described step 4；
Step 5, rise to 2400 DEG C with the speed of 19 ~ 21 degree/min, keep 0.9 ~ 1.1 hour, then the speed with 19 ~ 21 degree/min Degree rises to 2900 DEG C, cools down after keeping 1.8 ~ 2.2 hours, thus obtains the main graphite film fired；
Step 6, then carry out rolling by the graphite film that the master of step 5 gained fires thus obtain described graphite linings 6.
When using the pressure-sensitive pad pasting of above-mentioned microelectronic component, in its structure, graphite linings is coated with one layer of stone by upper and lower surface The Kapton of ink modifying agent is prepared from, and improves at heat conductivility both vertically and horizontally, it is to avoid adhesive tape Hot-spot, it is achieved that the uniformity of adhesive tape heat conductivility；Secondly, its be positioned at graphite modified dose of Kapton surface by The benzophenone tetracarboxylic dianhydride of certain content, pyromellitic acid anhydride, MDA, dimethylformamide, N-methyl Ketopyrrolidine, ethylene glycol, polydimethylsiloxane form, and are coated on Kapton, the pin being filled with in heating process Hole, improves degree of crystallinity simultaneously, also overcome thermal contraction excessive cause uneven, improve graphite linings biaxial tension performance, Also reduce azeotropic point and smooth boiling point district, improve flatness and the pliability of final products film forming；Again, polyamides is sub- Amine film surface has graphite modified dose, improves graphite linings and heat-conducting glue adhesion coating heat conductivility in two-sided pad pasting, and first will be poly- After imide membrane rises to 400 DEG C of imidizations, then between the carbonized film of pre-burned and graphitization, increase calendaring processes, and shape again Become after heat conduction graphite patch and again roll, it is to avoid the volume contraction in fold and graphitization sintering process, improve compactness And degree of crystallinity, further increase at heat conductivility both vertically and horizontally.
Above-described embodiment, only for technology design and the feature of the explanation present invention, its object is to allow person skilled in the art Scholar will appreciate that present disclosure and implements according to this, can not limit the scope of the invention with this.All according to the present invention The equivalence that spirit is made changes or modifies, and all should contain within protection scope of the present invention.

Claims (3)

1. the pressure-sensitive pad pasting of microelectronic component, described pressure-sensitive attachment film in heat generating components surface, described pressure-sensitive pad pasting bag Including graphite linings, the heat-conducting glue adhesion coating being positioned at graphite linings surface and separated type material layer, this separated type material laminating is together in heat-conducting glue adhesion coating The surface opposing with graphite linings；It is characterized in that: described graphite linings is obtained by following process, this process include with Lower step:
Step one, Kapton is risen to 250 DEG C from room temperature, near room temperature after rising to 400 DEG C after insulation；
Step 2, it is coated with one layer of graphite modified dose of acquisition on the upper and lower surface of the Kapton through step one and processes After Kapton, the viscosity of described graphite modified dose is 30000 ~ 48000CP；
Described graphite modified dose is made up of the component of following weight portion:
Pyromellitic acid anhydride 28.5 parts,
Benzophenone tetracarboxylic dianhydride 12.5 parts,
MDA 26 parts,
Dimethylformamide 22 parts,
N-Methyl pyrrolidone 8.5 parts,
Ethylene glycol 1.5 parts,
Polydimethylsiloxane 2 parts；
Step 3, will process after Kapton be warming up to 800 DEG C, be warming up to 1200 DEG C after insulation, after insulation cool down, Thus obtain the carbonized film of pre-burned；
Step 4, employing calender roll the carbonized film of the pre-burned of described step 4；
Step 5, it is warming up to 2400 DEG C, after insulation, is warming up to 2900 DEG C again, cool down after insulation, thus obtain the main graphite fired Film；
Step 6, then carry out rolling by the graphite film that the master of step 5 gained fires thus obtain described graphite linings.
Pressure-sensitive pad pasting the most according to claim 1, it is characterised in that: by Kapton with 4 ~ 6 in described step one Degree/min speed rises to 250 DEG C from room temperature, keeps 0.9 ~ 1.1 hour, then with 2.5 ~ 3.5 degree/min, rises to 400 DEG C, keeps 1 Near room temperature after hour.
Pressure-sensitive pad pasting the most according to claim 1, it is characterised in that: with the speed of 19 ~ 21 degree/min in described step 5 Rise to 2400 DEG C, keep 0.9 ~ 1.1 hour, then rise to 2900 DEG C with the speed of 19 ~ 21 degree/min, after keeping 1.8 ~ 2.2 hours Cooling, thus obtain the main graphite film fired.
CN201610116970.7A 2014-01-26 2014-01-26 The pressure-sensitive pad pasting of microelectronic component Pending CN106118519A (en)

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CN201410036328.9A CN103756588B (en) 2014-01-26 2014-01-26 For the Pressuresensitive Tape of microelectronic device
CN201610116970.7A CN106118519A (en) 2014-01-26 2014-01-26 The pressure-sensitive pad pasting of microelectronic component

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CN201610116966.0A Pending CN106433500A (en) 2014-01-26 2014-01-26 Pressure-sensitive adhesive tape for electronic products
CN201610119322.7A Active CN106393842B (en) 2014-01-26 2014-01-26 Stretch-proof graphite dissipates pad pasting
CN201410036328.9A Active CN103756588B (en) 2014-01-26 2014-01-26 For the Pressuresensitive Tape of microelectronic device
CN201610116969.4A Pending CN106118518A (en) 2014-01-26 2014-01-26 The preparation technology of smart mobile phone pressure sensitive adhesive tape
CN201610116960.3A Active CN106118516B (en) 2014-01-26 2014-01-26 Manufacturing process for high compactness heat dissipation pad pasting
CN201610116970.7A Pending CN106118519A (en) 2014-01-26 2014-01-26 The pressure-sensitive pad pasting of microelectronic component
CN201610119321.2A Pending CN106118521A (en) 2014-01-26 2014-01-26 Needleless pass height conductive graphite adhesive tape
CN201610119265.2A Active CN106118520B (en) 2014-01-26 2014-01-26 Manufacturing process for graphite glue band
CN201610116967.5A Active CN106118517B (en) 2014-01-26 2014-01-26 The thermally conductive pad pasting of high compactness

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CN201610116966.0A Pending CN106433500A (en) 2014-01-26 2014-01-26 Pressure-sensitive adhesive tape for electronic products
CN201610119322.7A Active CN106393842B (en) 2014-01-26 2014-01-26 Stretch-proof graphite dissipates pad pasting
CN201410036328.9A Active CN103756588B (en) 2014-01-26 2014-01-26 For the Pressuresensitive Tape of microelectronic device
CN201610116969.4A Pending CN106118518A (en) 2014-01-26 2014-01-26 The preparation technology of smart mobile phone pressure sensitive adhesive tape
CN201610116960.3A Active CN106118516B (en) 2014-01-26 2014-01-26 Manufacturing process for high compactness heat dissipation pad pasting

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CN201610119265.2A Active CN106118520B (en) 2014-01-26 2014-01-26 Manufacturing process for graphite glue band
CN201610116967.5A Active CN106118517B (en) 2014-01-26 2014-01-26 The thermally conductive pad pasting of high compactness

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CN107266076A (en) * 2017-07-12 2017-10-20 合肥东恒锐电子科技有限公司 A kind of manufacturing process of the heat conduction pad pasting of mobile phone

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CN106393842B (en) 2018-06-19
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CN103756588A (en) 2014-04-30
CN103756588B (en) 2016-04-27
CN106118516A (en) 2016-11-16
CN106118517B (en) 2019-06-18
CN106393842A (en) 2017-02-15
CN106433500A (en) 2017-02-22
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CN106118520A (en) 2016-11-16
CN106118516B (en) 2019-03-26

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