CN105969224B - Equal thermal bonding tape for electronic device - Google Patents

Equal thermal bonding tape for electronic device Download PDF

Info

Publication number
CN105969224B
CN105969224B CN201511028692.1A CN201511028692A CN105969224B CN 105969224 B CN105969224 B CN 105969224B CN 201511028692 A CN201511028692 A CN 201511028692A CN 105969224 B CN105969224 B CN 105969224B
Authority
CN
China
Prior art keywords
parts
kapton
graphite
film
coat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201511028692.1A
Other languages
Chinese (zh)
Other versions
CN105969224A (en
Inventor
金闯
梁豪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangsu Stick New Materials Polytron Technologies Inc
Original Assignee
Jiangsu Stick New Materials Polytron Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangsu Stick New Materials Polytron Technologies Inc filed Critical Jiangsu Stick New Materials Polytron Technologies Inc
Priority to CN201511028692.1A priority Critical patent/CN105969224B/en
Publication of CN105969224A publication Critical patent/CN105969224A/en
Application granted granted Critical
Publication of CN105969224B publication Critical patent/CN105969224B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/52—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite
    • C04B35/522—Graphite
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B11/00—Layered products comprising a layer of bituminous or tarry substances
    • B32B11/04—Layered products comprising a layer of bituminous or tarry substances comprising such bituminous or tarry substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B11/046—Layered products comprising a layer of bituminous or tarry substances comprising such bituminous or tarry substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/08—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the cooling method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/15—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/15—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state
    • B32B37/153—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state at least one layer is extruded and immediately laminated while in semi-molten state
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/16—Drying; Softening; Cleaning
    • B32B38/164—Drying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/10—Interconnection of layers at least one layer having inter-reactive properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/52—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite
    • C04B35/524—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite obtained from polymer precursors, e.g. glass-like carbon material
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/62218—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products obtaining ceramic films, e.g. by using temporary supports
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
    • B32B2037/243—Coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
    • B32B2255/102—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer synthetic resin or rubber layer being a foamed layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/24—Organic non-macromolecular coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/54—Yield strength; Tensile strength
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/558—Impact strength, toughness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B32B2307/734—Dimensional stability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/48—Organic compounds becoming part of a ceramic after heat treatment, e.g. carbonising phenol resins
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/60—Aspects relating to the preparation, properties or mechanical treatment of green bodies or pre-forms
    • C04B2235/612—Machining
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
    • C04B2235/6562—Heating rate
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
    • C04B2235/6567—Treatment time
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/66—Specific sintering techniques, e.g. centrifugal sintering
    • C04B2235/661—Multi-step sintering
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/96—Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
    • C04B2235/9607—Thermal properties, e.g. thermal expansion coefficient
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Inorganic Chemistry (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)

Abstract

A kind of equal thermal bonding tape for electronic device of the present invention, its first coat by film in Kapton upper surface graphite modified dosage form at this graphite modified dose painting is grouped as by the group of following parts by weight: 22.5 parts of benzophenone tetracarboxylic dianhydride, 18 parts of pyromellitic acid anhydride, 24.5 parts of diaminodiphenylmethane, 25 parts of dimethylformamide, 9 parts of N-Methyl pyrrolidone, 1.8 parts of ethylene glycol, 2.8 parts of dimethyl silicone polymer, 1.2 parts of dibutyl phthalate；Graphite modified dose of film is obtained into treated Kapton in the upper surface of Kapton；Will that treated is cooling after Kapton is warming up to 1200 DEG C, to obtain the carbonized film of pre-burned.The present invention avoids hot-spot, while realizing the uniformity of heating conduction, improves heat dissipation performance stability, the reliability of product, greatly reduces the cost of product.

Description

Equal thermal bonding tape for electronic device
Technical field
The present invention relates to a kind of equal thermal bonding tape for electronic device, belong to tape technology field.
Background technique
With modern microelectronic technology high speed development, electronic equipment (such as laptop, mobile phone, tablet computer) is increasingly Become ultra-thin, light, this structure significantly improves electronic equipment internal power density, and generated heat is not easy in operation It is discharged, is easy to accumulate rapidly and form high temperature.On the other hand, high temperature can reduce the performance of electronic equipment, reliability and use the longevity Life.Therefore, Current electronic industry proposes increasingly higher demands for the heat sink material as heat control system core component, urgently It needs a kind of high-efficiency heat conduction, light material to transfer heat away from rapidly, ensures that electronic equipment operates normally.
Kapton is mostly used for flexible circuit board in the prior art, is obtained although having using polyimide film sintered Graphite heat radiation fin, to be covered on heat source, but be constrained to Kapton product quality and performances the good and the bad not Together, influenced the performance of the two-sided pad pasting heat dissipation performance of heat dissipation, there are following technical problems: heat dissipation is uneven, adhesive tape easily occurs Hot-spot, the heat dissipation performance for improving product is unstable, reliability performance is poor, is unfavorable for product quality management control, influences product Competitiveness.
Summary of the invention
Objects of the present invention are to provide a kind of equal thermal bonding tape for electronic device, this is used for the equal hot glue of electronic device Band improves heating conduction in the vertical direction and the horizontal direction, avoids hot-spot, realizes the uniformity of heating conduction Meanwhile heat dissipation performance stability, the reliability of product are improved, greatly reduce the cost of product.
To achieve the above object of the invention, the technical solution adopted by the present invention is that: a kind of equal thermal bonding tape for electronic device, The equal thermal bonding tape includes heat conduction graphite patch, the thermally conductive adhesive layer positioned at heat conduction graphite patch surface, this thermally conductive adhesive layer with The opposite surface of heat conduction graphite patch is fitted with separated type material layer；The heat conduction graphite patch is applied by Kapton, first Coating and the second coat composition, first coat are located at Kapton upper surface；
First coat by film in Kapton upper surface graphite modified dosage form at this graphite modified dose Painting is grouped as by the group of following parts by weight: 22.5 parts of benzophenone tetracarboxylic dianhydride, 18 parts of pyromellitic acid anhydride, diamino hexichol 24.5 parts of methane, 25 parts of dimethylformamide, 9 parts of N-Methyl pyrrolidone, 1.8 parts of ethylene glycol, dimethyl silicone polymer 2.8 Part, 1.2 parts of dibutyl phthalate；
The heat conduction graphite patch is obtained by following steps:
Step 1: graphite modified dose of film is obtained in the upper surface of Kapton, treated that polyimides is thin Film；
Step 2: will that treated is cooling after Kapton is warming up to 1200 DEG C, to obtain the carbon of pre-burned Change film；
Step 3: rolling the carbonized film of the pre-burned using calender；
Step 4: it is cooling after carbonized film is warming up to 2850 DEG C ~ 2950 DEG C, to obtain the graphite film of main firing；
Step 5: the graphite film of resulting main firing is then carried out calendering to obtain the heat conduction graphite patch.
Since above-mentioned technical proposal is used, the present invention has following advantages and effect compared with prior art:
1, the present invention is used for the equal thermal bonding tape of electronic device, and graphite linings are coated with one layer of graphite by upper surface and change in structure Property agent Kapton be prepared, improve heating conduction in the vertical direction and the horizontal direction, avoid adhesive tape local Overheat, realizes the uniformity of adhesive tape heating conduction；Secondly, it is located at graphite modified dose of Kapton surface by hexichol 20 ~ 25 parts of ketone tetracid dianhydride, 12 ~ 18 parts of pyromellitic acid anhydride, 20 ~ 28 parts of diaminodiphenylmethane, dimethylformamide 30 ~ 35 parts, 1.5 ~ 2.5 parts of ethylene glycol, 2 ~ 3 parts of dimethyl silicone polymer compositions, are coated on Kapton, are filled with and add Pin hole in thermal process improves crystallinity simultaneously, also overcome be heat-shrinked it is excessive caused by it is uneven, it is double to improve graphite linings To tensile property.
2, the present invention is used for the equal thermal bonding tape of electronic device, is located at graphite modified dose of Kapton surface by two 20 ~ 25 parts of Benzophenone tetracid dianhydride, 12 ~ 18 parts of pyromellitic acid anhydride, 20 ~ 28 parts of diaminodiphenylmethane, dimethyl formyl 20 ~ 25 parts of amine, 8 ~ 10 parts of N-Methyl pyrrolidone, 1.5 ~ 2.5 parts of ethylene glycol, 2 ~ 3 parts of dimethyl silicone polymer compositions, using two 20 ~ 25 parts of methylformamide, 8 ~ 10 parts of N-Methyl pyrrolidone reduce azeotropic point and smooth boiling point area, improve final The flatness and flexibility of product film forming；；Secondly, 20 ~ 25 parts of dimethylformamide, 8 ~ 10 parts of N-Methyl pyrrolidone and adjacent benzene 0.8 ~ 1.5 part of Kapton surface of dibutyl carboxylic acid, prevents bubble from generating, is more advantageous to filled polyimide film Small pin hole, improve heat dissipation patch heating conduction uniformity.
3, the present invention is used for the equal thermal bonding tape of electronic device, increases calendering step between the carbonized film and graphitization of pre-burned Suddenly, and after re-forming heat conduction graphite patch roll again, the volume contraction for avoiding fold and being graphitized in sintering process mentions High compactness and crystallinity, further improve heating conduction in the vertical direction and the horizontal direction.
Detailed description of the invention
Attached drawing 1 is the soaking adhesive tape structure schematic diagram that the present invention is used for electronic device.
In the figures above: 1, heat conduction graphite patch；11, Kapton；12, the first coat；13, the second coating Layer；2, thermally conductive adhesive layer；3, separated type material layer.
Specific embodiment
The present invention will be further described below with reference to examples:
Embodiment: a kind of equal thermal bonding tape for electronic device, the equal thermal bonding tape include heat conduction graphite patch 1, are located at The thermally conductive adhesive layer 2 on 1 surface of heat conduction graphite patch, this thermally conductive adhesive layer 2 surface opposite with heat conduction graphite patch 1 be fitted with from The profile bed of material 3；The heat conduction graphite patch 1 is made of Kapton 11, the first coat 12 and the second coat 13, institute It states the first coat 12 and is located at 11 upper surface of Kapton；
First coat by film in Kapton upper surface graphite modified dosage form at this graphite modified dose Painting is grouped as by the group of following parts by weight: 22.5 parts of benzophenone tetracarboxylic dianhydride, 18 parts of pyromellitic acid anhydride, diamino hexichol 24.5 parts of methane, 25 parts of dimethylformamide, 9 parts of N-Methyl pyrrolidone, 1.8 parts of ethylene glycol, dimethyl silicone polymer 2.8 Part, 1.2 parts of dibutyl phthalate；
The heat conduction graphite patch 1 is obtained by following steps:
Step 1: graphite modified dose of film is obtained in the upper surface of Kapton 2, treated that polyimides is thin Film；
Step 2: will that treated is cooling after Kapton is warming up to 1200 DEG C, to obtain the carbon of pre-burned Change film；
Step 3: rolling the carbonized film of the pre-burned using calender；
Step 4: it is cooling after carbonized film is warming up to 2850 DEG C ~ 2950 DEG C, to obtain the graphite film of main firing；
Step 5: the graphite film of resulting main firing is then carried out calendering to obtain the heat conduction graphite patch 1.
When using the above-mentioned equal thermal bonding tape for electronic device, graphite linings are coated with one layer of graphite by upper surface in structure The Kapton of modifying agent is prepared, and improves heating conduction in the vertical direction and the horizontal direction, avoids adhesive tape office Portion's overheat, realizes the uniformity of adhesive tape heating conduction；Secondly, it is located at graphite modified dose of Kapton surface by two 20 ~ 25 parts of Benzophenone tetracid dianhydride, 12 ~ 18 parts of pyromellitic acid anhydride, 20 ~ 28 parts of diaminodiphenylmethane, dimethyl formyl 30 ~ 35 parts of amine, 1.5 ~ 2.5 parts of ethylene glycol, 2 ~ 3 parts of dimethyl silicone polymer compositions, are coated on Kapton, are filled with Pin hole in heating process improves crystallinity simultaneously, also overcome be heat-shrinked it is excessive caused by it is uneven, improve graphite linings Biaxial tension performance also reduces azeotropic point and smooth boiling point area, improves the flatness and flexible of final products film forming Property；Again, Kapton surface has graphite modified dose, and it is thermally conductive to improve graphite linings and thermally conductive adhesive layer in two-sided pad pasting Performance, and calender is used to roll the carbonized film of the pre-burned, it avoids fold and the volume being graphitized in sintering process is received Contracting, improves compactness and crystallinity, further improves heating conduction in the vertical direction and the horizontal direction；Again, diformazan 20 ~ 25 parts of base formamide, 8 ~ 10 parts of N-Methyl pyrrolidone and 0.8 ~ 1.5 part of Kapton of dibutyl phthalate Surface prevents bubble from generating, and is more advantageous to the small pin hole of filled polyimide film, improves heat dissipation patch heating conduction Uniformity.
The above embodiments merely illustrate the technical concept and features of the present invention, and its object is to allow person skilled in the art Scholar cans understand the content of the present invention and implement it accordingly, and it is not intended to limit the scope of the present invention.It is all according to the present invention Equivalent change or modification made by Spirit Essence, should be covered by the protection scope of the present invention.

Claims (1)

1. a kind of equal thermal bonding tape for electronic device, the equal thermal bonding tape includes heat conduction graphite patch (1), is located at heat conductive graphite The thermally conductive adhesive layer (2) on patch (1) surface, this thermally conductive adhesive layer (2) surface opposite with heat conduction graphite patch (1) be fitted with from The profile bed of material (3)；It is characterized by: the heat conduction graphite patch (1) by Kapton (11), the first coat (12) and Second coat (13) composition, first coat (12), the second coat (13) are located at Kapton (11) Upper and lower surfaces；
First coat by film in Kapton upper surface graphite modified dosage form at second coat (13) by film in Kapton lower surface graphite modified dosage form at, graphite modified dose of viscosity be 30000 ~ 48000cP, the graphite modified dose of group by following parts by weight are grouped as: 22.5 parts of benzophenone tetracarboxylic dianhydride, Pyromellitic Acid 18 parts of dianhydride, 24.5 parts of diaminodiphenylmethane, 25 parts of dimethylformamide, 9 parts of N-Methyl pyrrolidone, ethylene glycol 1.8 Part, 2.8 parts of dimethyl silicone polymer, 1.2 parts of dibutyl phthalate；
The heat conduction graphite patch (1) is obtained by following steps:
Step 1: graphite modified dose of film is obtained treated Kapton in the upper surface of Kapton (2)；
Step 2: will treated Kapton under inert gas protection, rise to 240 DEG C ~ 260 DEG C from room temperature, 480 DEG C ~ 500 DEG C are risen to after heat preservation, are warming up to 780 DEG C ~ 820 DEG C after heat preservation again, it is cold after 1200 DEG C are risen to after heat preservation But, to obtain the carbonized film of pre-burned；
Step 3: rolling the carbonized film of the pre-burned using calender；
Step 4: carbonized film is warming up to 2350 DEG C ~ 2450 DEG C, keep the temperature, then cooled down after being warming up to 2850 ~ 2950 DEG C, To obtain the graphite film of main firing；
Step 5: the graphite film of resulting main firing is then carried out calendering to obtain the heat conduction graphite patch (1).
CN201511028692.1A 2014-01-26 2014-01-26 Equal thermal bonding tape for electronic device Active CN105969224B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201511028692.1A CN105969224B (en) 2014-01-26 2014-01-26 Equal thermal bonding tape for electronic device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201511028692.1A CN105969224B (en) 2014-01-26 2014-01-26 Equal thermal bonding tape for electronic device
CN201410036121.1A CN103796493B (en) 2014-01-26 2014-01-26 Heat conduction graphite patch for adhesive tape and preparation method thereof

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201410036121.1A Division CN103796493B (en) 2014-01-26 2014-01-26 Heat conduction graphite patch for adhesive tape and preparation method thereof

Publications (2)

Publication Number Publication Date
CN105969224A CN105969224A (en) 2016-09-28
CN105969224B true CN105969224B (en) 2019-03-26

Family

ID=50671600

Family Applications (11)

Application Number Title Priority Date Filing Date
CN201610250629.0A Active CN105873414B (en) 2014-01-26 2014-01-26 Manufacturing process for graphite heat conducting heat dissipation patch
CN201511028692.1A Active CN105969224B (en) 2014-01-26 2014-01-26 Equal thermal bonding tape for electronic device
CN201511029000.5A Active CN105979751B (en) 2014-01-26 2014-01-26 Adhesive tape graphite heat conducting and heat radiating fin
CN201610249636.9A Active CN105860866B (en) 2014-01-26 2014-01-26 Equal thermal bonding tape
CN201511028635.3A Active CN105979750B (en) 2014-01-26 2014-01-26 Flexibility heat conduction graphite patch
CN201610255486.2A Pending CN105860868A (en) 2014-01-26 2014-01-26 Preparation process of heat dissipation lamination film
CN201511028668.8A Active CN105966019B (en) 2014-01-26 2014-01-26 For the heat conduction graphite patch of adhesive tape
CN201511014593.8A Active CN105965985B (en) 2014-01-26 2014-01-26 Preparation method for the heat conduction graphite patch of adhesive tape
CN201511014587.2A Active CN105969223B (en) 2014-01-26 2014-01-26 Manufacturing process for equal thermal bonding tape
CN201610250630.3A Pending CN105860867A (en) 2014-01-26 2014-01-26 Preparation technology of uniform heating rubber belt applied in electronic device
CN201410036121.1A Active CN103796493B (en) 2014-01-26 2014-01-26 Heat conduction graphite patch for adhesive tape and preparation method thereof

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN201610250629.0A Active CN105873414B (en) 2014-01-26 2014-01-26 Manufacturing process for graphite heat conducting heat dissipation patch

Family Applications After (9)

Application Number Title Priority Date Filing Date
CN201511029000.5A Active CN105979751B (en) 2014-01-26 2014-01-26 Adhesive tape graphite heat conducting and heat radiating fin
CN201610249636.9A Active CN105860866B (en) 2014-01-26 2014-01-26 Equal thermal bonding tape
CN201511028635.3A Active CN105979750B (en) 2014-01-26 2014-01-26 Flexibility heat conduction graphite patch
CN201610255486.2A Pending CN105860868A (en) 2014-01-26 2014-01-26 Preparation process of heat dissipation lamination film
CN201511028668.8A Active CN105966019B (en) 2014-01-26 2014-01-26 For the heat conduction graphite patch of adhesive tape
CN201511014593.8A Active CN105965985B (en) 2014-01-26 2014-01-26 Preparation method for the heat conduction graphite patch of adhesive tape
CN201511014587.2A Active CN105969223B (en) 2014-01-26 2014-01-26 Manufacturing process for equal thermal bonding tape
CN201610250630.3A Pending CN105860867A (en) 2014-01-26 2014-01-26 Preparation technology of uniform heating rubber belt applied in electronic device
CN201410036121.1A Active CN103796493B (en) 2014-01-26 2014-01-26 Heat conduction graphite patch for adhesive tape and preparation method thereof

Country Status (1)

Country Link
CN (11) CN105873414B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107418392A (en) * 2017-08-02 2017-12-01 合肥东恒锐电子科技有限公司 A kind of heat radiation coating of household electrical appliance and preparation method thereof
CN107441619A (en) * 2017-08-17 2017-12-08 成都三乙医疗科技有限公司 A kind of thermal conducting piece for electrotherapy
CN107551392A (en) * 2017-08-29 2018-01-09 成都三乙医疗科技有限公司 A kind of thermal conducting piece for thermotherapy

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011007510A1 (en) * 2009-07-13 2011-01-20 パナソニック株式会社 Graphite sheet and heat transfer structure using same
CN103045119A (en) * 2012-12-28 2013-04-17 苏州斯迪克新材料科技股份有限公司 Heat-dissipating double-sided adhesive tape with ultrahigh heat conductivity coefficient
CN103059761A (en) * 2012-12-28 2013-04-24 斯迪克新型材料（江苏）有限公司 High-heat conductivity coefficient graphite heat-radiation adhesive tape

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4119693B2 (en) * 2002-06-17 2008-07-16 株式会社カネカ Insulating graphite film and method for producing the same
CN1826288A (en) * 2003-09-02 2006-08-30 株式会社钟化 Filmy graphite and process for producing the same
JP4622429B2 (en) * 2004-09-30 2011-02-02 株式会社カネカ Manufacturing method of high thermal conductive casing
JP2008266416A (en) * 2007-04-18 2008-11-06 Ube Ind Ltd Method for producing polyimide film and polyimide film
EP2154109B1 (en) * 2007-05-17 2018-09-19 Kaneka Corporation Graphite film and graphite composite film
WO2010150300A1 (en) * 2009-06-22 2010-12-29 株式会社カネカ Graphite film and process for producing graphite film
CN102757736A (en) * 2011-04-29 2012-10-31 苏州沛德导热材料有限公司 Graphite heat conducting adhesive tape and production process thereof
CN202322703U (en) * 2011-11-07 2012-07-11 吴志高 Adhesive tape with heat conduction performance
CN202936356U (en) * 2012-11-01 2013-05-15 斯迪克新型材料（江苏）有限公司 Double-sided adhesive for heat dissipation of electronic elements
CN103011141A (en) * 2012-12-20 2013-04-03 宁波今山新材料有限公司 Method for manufacturing high thermal conductivity graphite film
CN103043657B (en) * 2012-12-28 2014-10-15 苏州斯迪克新材料科技股份有限公司 Graphite radiation fin for adhesive tapes

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011007510A1 (en) * 2009-07-13 2011-01-20 パナソニック株式会社 Graphite sheet and heat transfer structure using same
CN103045119A (en) * 2012-12-28 2013-04-17 苏州斯迪克新材料科技股份有限公司 Heat-dissipating double-sided adhesive tape with ultrahigh heat conductivity coefficient
CN103059761A (en) * 2012-12-28 2013-04-24 斯迪克新型材料（江苏）有限公司 High-heat conductivity coefficient graphite heat-radiation adhesive tape

Also Published As

Publication number Publication date
CN105860867A (en) 2016-08-17
CN105979750B (en) 2018-06-19
CN105965985A (en) 2016-09-28
CN105965985B (en) 2018-04-24
CN105873414A (en) 2016-08-17
CN103796493B (en) 2016-06-15
CN105979751B (en) 2019-02-26
CN105969224A (en) 2016-09-28
CN105873414B (en) 2018-08-31
CN105969223A (en) 2016-09-28
CN105966019B (en) 2018-06-19
CN105966019A (en) 2016-09-28
CN105969223B (en) 2019-01-01
CN105979750A (en) 2016-09-28
CN103796493A (en) 2014-05-14
CN105860866B (en) 2019-01-01
CN105860866A (en) 2016-08-17
CN105979751A (en) 2016-09-28
CN105860868A (en) 2016-08-17

Similar Documents

Publication Publication Date Title
CN106304783B (en) Thermal conductivity both-sided adhesive graphite flake
CN105969224B (en) Equal thermal bonding tape for electronic device
CN107043108B (en) Cooling fin manufacturing process for smart phone
CN104812205B (en) Stretch-proof radiating graphite paster
CN106118516B (en) Manufacturing process for high compactness heat dissipation pad pasting

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
CB02 Change of applicant information

Address after: 223900 Sihong Province Economic Development Zone, Suqian, West Ocean West Road, No. 6

Applicant after: JIANGSU SIDIKE NEW MATERIALS SIENCE & TECHNOLOGY Co.,Ltd.

Address before: 215400 Taicang, Suzhou, Taicang Economic Development Zone, Qingdao West Road, No. 11, No.

Applicant before: SUZHOU SIDIKE NEW MATERIALS SIENCE & TECHNOLOGY Co.,Ltd.

CB02 Change of applicant information
GR01 Patent grant
GR01 Patent grant
EE01 Entry into force of recordation of patent licensing contract

Application publication date: 20160928

Assignee: Sidike New Material (Jiangsu) Co.,Ltd.

Assignor: JIANGSU SIDIKE NEW MATERIALS SIENCE & TECHNOLOGY Co.,Ltd.

Contract record no.: X2024980013840

Denomination of invention: Thermal tape for electronic devices

Granted publication date: 20190326

License type: Common License

Record date: 20240903

EE01 Entry into force of recordation of patent licensing contract

Application publication date: 20160928

Assignee: TAICANG SDK NEW MATERIAL TECHNOLOGY Co.,Ltd.

Assignor: JIANGSU SIDIKE NEW MATERIALS SIENCE & TECHNOLOGY Co.,Ltd.

Contract record no.: X2024980014169

Denomination of invention: Thermal tape for electronic devices

Granted publication date: 20190326

License type: Common License

Record date: 20240905