CN105860868A - Preparation process of heat dissipation lamination film - Google Patents

Preparation process of heat dissipation lamination film Download PDF

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Publication number
CN105860868A
CN105860868A CN201610255486.2A CN201610255486A CN105860868A CN 105860868 A CN105860868 A CN 105860868A CN 201610255486 A CN201610255486 A CN 201610255486A CN 105860868 A CN105860868 A CN 105860868A
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CN
China
Prior art keywords
graphite
parts
film
kapton
heat
Prior art date
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Pending
Application number
CN201610255486.2A
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Chinese (zh)
Inventor
金闯
梁豪
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Suzhou Sidike New Material Science and Technology Co Ltd
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Suzhou Sidike New Material Science and Technology Co Ltd
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Priority to CN201610255486.2A priority Critical patent/CN105860868A/en
Publication of CN105860868A publication Critical patent/CN105860868A/en
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    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
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    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/52—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite
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    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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    • C09J2400/10—Presence of inorganic materials

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Abstract

The invention provides a preparation process of a heat dissipation lamination film. A first coating layer is formed by a graphite modifier coating the upper surface of a polyimide film. The graphite modifier is prepared from the following components in parts by weight: diphenylketone tetracid dianhydride, benzenetetracarboxylic anhydride, diaminodiphenylmethane, dimethylformamide, N-methyl pyrrolidinone, ethylene glycol, polydimethylsiloxane and dibutyl phthalate. The preparation process comprises the following steps: coating the upper surface of the polyimide film with the graphite modifier to obtain a treated polyimide film; increasing the temperature of a carbonization film to 2350-2450 DEG C, keeping the temperature, increasing the temperature to 2850-2950 DEG C and cooling to obtain a main fired graphite film. Through the preparation process of the heat dissipation lamination film, the local overheating is avoided; the uniformity of the heat conduction performance is achieved; the non-uniformity of excessive heat shrinkage is overcome; the two-way tensile property of the graphite layer is improved.

Description

Preparation technology for the pad pasting that dispels the heat
Technical field
The present invention relates to a kind of preparation technology for the pad pasting that dispels the heat, belong to heat radiation Filming Technology field.
Background technology
Along with modern microelectronic technology high-speed develops, electronic equipment (such as notebook computer, mobile phone, panel computer etc.) becomes ultra-thin, light day by day, this structure makes electronic equipment internal power density significantly improve, and in operation, produced heat is difficult to discharge, be prone to accumulate rapidly and form high temperature.On the other hand, high temperature can reduce the performance of electronic equipment, reliability and service life.Therefore, Current electronic industry proposes the highest requirement for the heat sink material as heat control system core component, transfers heat away from rapidly in the urgent need to a kind of high-efficiency heat conduction, light material, ensures that electronic equipment is properly functioning.
In prior art, Kapton is mostly used for flexible PCB, although there being the polyimide film sintered acquisition graphite heat radiation fin of employing, thus be covered on thermal source, but it is constrained to the very different of the product quality and performances of Kapton, have influence on the performance of heat radiation two-sided pad pasting heat dispersion, there is techniques below problem: dispel the heat uneven, adhesive tape hot-spot easily occurs, the heat dispersion that improve product is unstable, reliability performance is poor, it is unfavorable for product quality management control, affects the competitiveness of product.
Summary of the invention
Objects of the present invention are to provide a kind of preparation technology for the pad pasting that dispels the heat, the preparation technology of this pad pasting that is used for dispelling the heat the most all is improve heat conductivility, avoid hot-spot, while achieving the uniformity of heat conductivility, overcome thermal contraction excessive cause uneven, improve graphite linings biaxial tension performance.
To achieve the above object of the invention, the technical solution used in the present invention is: a kind of preparation technology for the pad pasting that dispels the heat, and described heat radiation pad pasting includes heat conduction graphite patch and the surface being positioned at the heat-conducting glue adhesion coating on heat conduction graphite patch surface, this heat-conducting glue adhesion coating is opposing with heat conduction graphite patch is fitted with separated type material layer；Described heat conduction graphite patch is made up of Kapton, the first coat and the second coat, and described first coat is positioned at Kapton upper surface；
Described first coat is formed in graphite modified dose of Kapton upper surface by film, and this graphite modified dose painting is made up of the component of following weight portion: benzophenone tetracarboxylic dianhydride 25 parts, pyromellitic acid anhydride 16 parts, MDA 28 parts, dimethylformamide 23 parts, N-Methyl pyrrolidone 8.5 parts, ethylene glycol 2 parts, polydimethylsiloxane 3 parts, dibutyl phthalate 1.5 parts；The viscosity of described graphite modified dose is 30000 ~ 48000cP；
Described heat conduction graphite patch is obtained by following steps:
Step one, by graphite modified dose of film in Kapton upper surface acquisition process after Kapton；
Step 2, will process after Kapton be warming up to 1200 DEG C after cool down, thus obtain the carbonized film of pre-burned；
Step 3, employing calender roll the carbonized film of described pre-burned；
Step 4, carbonized film is warming up to 2350 DEG C ~ 2450 DEG C, insulation, then cool down after being warming up to 2850 DEG C ~ 2950 DEG C, thus obtain the main graphite film fired；
Step 5, then carry out rolling by the graphite film that the master of gained fires thus obtain described heat conduction graphite patch.
Owing to technique scheme is used, the present invention compared with prior art has following advantages and an effect:
1, the present invention is for the preparation technology of the pad pasting that dispels the heat, the Kapton that in its structure, graphite linings is coated with one layer graphite modified dose by upper surface is prepared from, improve at heat conductivility both vertically and horizontally, it is to avoid adhesive tape hot-spot, it is achieved that the uniformity of adhesive tape heat conductivility；Secondly, its be positioned at Kapton surface graphite modified dose is made up of benzophenone tetracarboxylic dianhydride 20 ~ 25 parts, pyromellitic acid anhydride 12 ~ 18 parts, MDA 20 ~ 28 parts, dimethylformamide 30 ~ 35 parts, ethylene glycol 1.5 ~ 2.5 parts, polydimethylsiloxane 2 ~ 3 parts, it is coated on Kapton, the pin hole being filled with in heating process, improve degree of crystallinity simultaneously, also overcome thermal contraction excessive cause uneven, improve graphite linings biaxial tension performance.
2, the present invention is for the preparation technology of the pad pasting that dispels the heat, its be positioned at Kapton surface graphite modified dose is made up of benzophenone tetracarboxylic dianhydride 20 ~ 25 parts, pyromellitic acid anhydride 12 ~ 18 parts, MDA 20 ~ 28 parts, dimethylformamide 20 ~ 25 parts, N-Methyl pyrrolidone 8 ~ 10 parts, ethylene glycol 1.5 ~ 2.5 parts, polydimethylsiloxane 2 ~ 3 parts, use dimethylformamide 20 ~ 25 parts, N-Methyl pyrrolidone 8 ~ 10 parts to reduce azeotropic point and smooth boiling point district, improve flatness and the pliability of final products film forming；；Secondly, dimethylformamide 20 ~ 25 parts, N-Methyl pyrrolidone 8 ~ 10 parts and 0.8 ~ 1.5 part of Kapton surface of dibutyl phthalate, prevent bubble from producing, be more beneficial for the small pin hole of filled polyimide thin film, improve the uniformity of heat radiation paster heat conductivility.
3, the present invention is for the preparation technology of the pad pasting that dispels the heat, calendaring processes is increased between the carbonized film and graphitization of pre-burned, and again roll after forming heat conduction graphite patch again, avoid the volume contraction in fold and graphitization sintering process, improve compactness and degree of crystallinity, further increase at heat conductivility both vertically and horizontally.
Accompanying drawing explanation
Accompanying drawing 1 dispels the heat film structure schematic diagram for the present invention.
In the figures above: 1, heat conduction graphite patch；11, Kapton；12, the first coat；13, the second coat；2, heat-conducting glue adhesion coating；3, separated type material layer.
Detailed description of the invention
Below in conjunction with embodiment, the invention will be further described:
Embodiment: a kind of preparation technology for the pad pasting that dispels the heat, described heat radiation pad pasting includes heat conduction graphite patch 1 and the surface being positioned at the heat-conducting glue adhesion coating 2 on heat conduction graphite patch 1 surface, this heat-conducting glue adhesion coating 2 is opposing with heat conduction graphite patch 1 is fitted with separated type material layer 3；Described heat conduction graphite patch 1 is made up of Kapton the 11, first coat 12 and the second coat 13, and described first coat 12 is positioned at Kapton 11 upper surface；
Described first coat is formed in graphite modified dose of Kapton upper surface by film, and this graphite modified dose painting is made up of the component of following weight portion: benzophenone tetracarboxylic dianhydride 25 parts, pyromellitic acid anhydride 16 parts, MDA 28 parts, dimethylformamide 23 parts, N-Methyl pyrrolidone 8.5 parts, ethylene glycol 2 parts, polydimethylsiloxane 3 parts, dibutyl phthalate 1.5 parts；The viscosity of described graphite modified dose is 30000 ~ 48000cP；
Described heat conduction graphite patch 1 is obtained by following steps:
Step one, by graphite modified dose of film in Kapton 2 upper surface acquisition process after Kapton；
Step 2, will process after Kapton be warming up to 1200 DEG C after cool down, thus obtain the carbonized film of pre-burned；
Step 3, employing calender roll the carbonized film of described pre-burned；
Step 4, carbonized film is warming up to 2350 DEG C ~ 2450 DEG C, insulation, then cool down after being warming up to 2850 DEG C ~ 2950 DEG C, thus obtain the main graphite film fired；
Step 5, then carry out rolling by the graphite film that the master of gained fires thus obtain described heat conduction graphite patch 1.
Use above-mentioned when the preparation technology of the pad pasting that dispels the heat, the Kapton that in its structure, graphite linings is coated with one layer graphite modified dose by upper surface is prepared from, improve at heat conductivility both vertically and horizontally, it is to avoid adhesive tape hot-spot, it is achieved that the uniformity of adhesive tape heat conductivility；Secondly, it is positioned at graphite modified dose of Kapton surface by benzophenone tetracarboxylic dianhydride 20 ~ 25 parts, pyromellitic acid anhydride 12 ~ 18 parts, MDA 20 ~ 28 parts, dimethylformamide 30 ~ 35 parts, ethylene glycol 1.5 ~ 2.5 parts, polydimethylsiloxane 2 ~ 3 parts composition, it is coated on Kapton, the pin hole being filled with in heating process, improve degree of crystallinity simultaneously, also overcome thermal contraction excessive cause uneven, improve graphite linings biaxial tension performance, also reduce azeotropic point and smooth boiling point district, improve flatness and the pliability of final products film forming；Again, Kapton surface has graphite modified dose, improve graphite linings and heat-conducting glue adhesion coating heat conductivility in two-sided pad pasting, and use calender to roll the carbonized film of described pre-burned, avoid the volume contraction in fold and graphitization sintering process, improve compactness and degree of crystallinity, further increase at heat conductivility both vertically and horizontally；Again, dimethylformamide 20 ~ 25 parts, N-Methyl pyrrolidone 8 ~ 10 parts and 0.8 ~ 1.5 part of Kapton surface of dibutyl phthalate, prevent bubble from producing, be more beneficial for the small pin hole of filled polyimide thin film, improve the uniformity of heat radiation paster heat conductivility.
Above-described embodiment only for technology design and the feature of the present invention are described, its object is to allow person skilled in the art will appreciate that present disclosure and to implement according to this, can not limit the scope of the invention with this.All equivalence changes made according to spirit of the invention or modification, all should contain within protection scope of the present invention.

Claims (1)

1., for dispelling the heat the preparation technology of pad pasting, described heat radiation pad pasting includes that heat conduction graphite patch (1) and the opposing surface of the heat-conducting glue adhesion coating (2) being positioned at heat conduction graphite patch (1) surface, this heat-conducting glue adhesion coating (2) and heat conduction graphite patch (1) are fitted with separated type material layer (3)；It is characterized in that: described heat conduction graphite patch (1) is made up of Kapton (11), the first coat (12) and the second coat (13), described first coat (12) is positioned at Kapton (11) upper surface；
Described first coat is formed in graphite modified dose of Kapton upper surface by film, and this graphite modified dose painting is made up of the component of following weight portion: benzophenone tetracarboxylic dianhydride 25 parts, pyromellitic acid anhydride 16 parts, MDA 28 parts, dimethylformamide 23 parts, N-Methyl pyrrolidone 8.5 parts, ethylene glycol 2 parts, polydimethylsiloxane 3 parts, dibutyl phthalate 1.5 parts；The viscosity of described graphite modified dose is 30000 ~ 48000cP；
Described heat conduction graphite patch (1) is obtained by following steps:
Step one, by graphite modified dose of film in Kapton (2) upper surface acquisition process after Kapton；
Step 2, will process after Kapton be warming up to Cool down after 1200 DEG C, thus obtain the carbonized film of pre-burned；
Step 3, employing calender roll the carbonized film of described pre-burned；
Step 4, carbonized film is warming up to 2350 DEG C ~ 2450 DEG C, insulation, then cool down after being warming up to 2850 DEG C ~ 2950 DEG C, thus obtain the main graphite film fired；
Step 5, then carry out rolling by the graphite film that the master of gained fires thus obtain described heat conduction graphite patch (1).
CN201610255486.2A 2014-01-26 2014-01-26 Preparation process of heat dissipation lamination film Pending CN105860868A (en)

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CN201511029000.5A Active CN105979751B (en) 2014-01-26 2014-01-26 Adhesive tape graphite heat conducting and heat radiating fin
CN201511014593.8A Active CN105965985B (en) 2014-01-26 2014-01-26 Preparation method for the heat conduction graphite patch of adhesive tape
CN201511014587.2A Active CN105969223B (en) 2014-01-26 2014-01-26 Manufacturing process for equal thermal bonding tape
CN201511028692.1A Active CN105969224B (en) 2014-01-26 2014-01-26 Equal thermal bonding tape for electronic device
CN201511028668.8A Active CN105966019B (en) 2014-01-26 2014-01-26 For the heat conduction graphite patch of adhesive tape
CN201610250630.3A Pending CN105860867A (en) 2014-01-26 2014-01-26 Preparation technology of uniform heating rubber belt applied in electronic device
CN201610250629.0A Active CN105873414B (en) 2014-01-26 2014-01-26 Manufacturing process for graphite heat conducting heat dissipation patch
CN201610255486.2A Pending CN105860868A (en) 2014-01-26 2014-01-26 Preparation process of heat dissipation lamination film
CN201410036121.1A Active CN103796493B (en) 2014-01-26 2014-01-26 Heat conduction graphite patch for adhesive tape and preparation method thereof
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CN201511014587.2A Active CN105969223B (en) 2014-01-26 2014-01-26 Manufacturing process for equal thermal bonding tape
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CN201610250630.3A Pending CN105860867A (en) 2014-01-26 2014-01-26 Preparation technology of uniform heating rubber belt applied in electronic device
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CN107418392A (en) * 2017-08-02 2017-12-01 合肥东恒锐电子科技有限公司 A kind of heat radiation coating of household electrical appliance and preparation method thereof
CN107441619A (en) * 2017-08-17 2017-12-08 成都三乙医疗科技有限公司 A kind of thermal conducting piece for electrotherapy
CN107551392A (en) * 2017-08-29 2018-01-09 成都三乙医疗科技有限公司 A kind of thermal conducting piece for thermotherapy

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CN105979750B (en) 2018-06-19
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