CN105979751A - Graphite heat conduction heat dissipation sheet applied to tape - Google Patents

Graphite heat conduction heat dissipation sheet applied to tape Download PDF

Info

Publication number
CN105979751A
CN105979751A CN201511029000.5A CN201511029000A CN105979751A CN 105979751 A CN105979751 A CN 105979751A CN 201511029000 A CN201511029000 A CN 201511029000A CN 105979751 A CN105979751 A CN 105979751A
Authority
CN
China
Prior art keywords
parts
graphite
heat
kapton
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201511029000.5A
Other languages
Chinese (zh)
Other versions
CN105979751B (en
Inventor
金闯
梁豪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Sidike New Material Science and Technology Co Ltd
Original Assignee
Suzhou Sidike New Material Science and Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Sidike New Material Science and Technology Co Ltd filed Critical Suzhou Sidike New Material Science and Technology Co Ltd
Priority to CN201511029000.5A priority Critical patent/CN105979751B/en
Publication of CN105979751A publication Critical patent/CN105979751A/en
Application granted granted Critical
Publication of CN105979751B publication Critical patent/CN105979751B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/52—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite
    • C04B35/522—Graphite
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B11/00—Layered products comprising a layer of bituminous or tarry substances
    • B32B11/04—Layered products comprising a layer of bituminous or tarry substances comprising such bituminous or tarry substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B11/046—Layered products comprising a layer of bituminous or tarry substances comprising such bituminous or tarry substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/08—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the cooling method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/15—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/15—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state
    • B32B37/153—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state at least one layer is extruded and immediately laminated while in semi-molten state
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/16—Drying; Softening; Cleaning
    • B32B38/164—Drying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/10—Interconnection of layers at least one layer having inter-reactive properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/52—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite
    • C04B35/524—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite obtained from polymer precursors, e.g. glass-like carbon material
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/62218—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products obtaining ceramic films, e.g. by using temporary supports
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
    • B32B2037/243—Coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
    • B32B2255/102—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer synthetic resin or rubber layer being a foamed layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/24—Organic non-macromolecular coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/54—Yield strength; Tensile strength
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/558—Impact strength, toughness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B32B2307/734—Dimensional stability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/48—Organic compounds becoming part of a ceramic after heat treatment, e.g. carbonising phenol resins
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/60—Aspects relating to the preparation, properties or mechanical treatment of green bodies or pre-forms
    • C04B2235/612—Machining
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
    • C04B2235/6562—Heating rate
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
    • C04B2235/6567—Treatment time
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/66—Specific sintering techniques, e.g. centrifugal sintering
    • C04B2235/661—Multi-step sintering
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/96—Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
    • C04B2235/9607—Thermal properties, e.g. thermal expansion coefficient
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Inorganic Chemistry (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)

Abstract

The invention provides a graphite heat conduction heat dissipation sheet applied to a tape. The first coating layer is located on the upper surface of a polyimide film. The first coating layer is formed by a graphite modifier coated on the upper surface of the polyimide film. The graphite modifier comprises, by weight, 22 parts of benzophenonetetracarboxylic dianhydride, 12.5 parts of pyromellitic dianhydride, 26 parts of diaminodiphenylmethane, 22.5 parts of dimethylformamide, 9.5 parts of N-methylpyrrolidone, 2.2 parts of ethylene glycol, 2.8 parts of polydimethylsiloxane and 0.9 part of dibutyl phthalate. The graphite modifier is coated on the upper surface of the polyimide film to acquire a treated polyimide film. The treated polyimide film is heated to 1200 DEG C, and then is cooled to acquire a pre-fired carbonized film. According to the invention, local overheating is avoided; the uniformity of thermal conductivity is realized; the stability and the reliability of the heat dissipation of a product are improved; and the product cost is greatly reduced.

Description

Adhesive tape graphite heat conducting and heat radiating fin
Technical field
The present invention relates to a kind of adhesive tape graphite heat conducting and heat radiating fin, belong to tape technology field.
Background technology
Along with modern microelectronic technology high-speed develops, electronic equipment (such as notebook computer, mobile phone, panel computer etc.) becomes ultra-thin, light day by day, this structure makes electronic equipment internal power density significantly improve, and in operation, produced heat is difficult to discharge, be prone to accumulate rapidly and form high temperature.On the other hand, high temperature can reduce the performance of electronic equipment, reliability and service life.Therefore, Current electronic industry proposes the highest requirement for the heat sink material as heat control system core component, transfers heat away from rapidly in the urgent need to a kind of high-efficiency heat conduction, light material, ensures that electronic equipment is properly functioning.
In prior art, Kapton is mostly used for flexible PCB, although there being the polyimide film sintered acquisition graphite heat radiation fin of employing, thus be covered on thermal source, but it is constrained to the very different of the product quality and performances of Kapton, have influence on the performance of heat radiation two-sided pad pasting heat dispersion, there is techniques below problem: dispel the heat uneven, adhesive tape hot-spot easily occurs, the heat dispersion that improve product is unstable, reliability performance is poor, it is unfavorable for product quality management control, affects the competitiveness of product.
Summary of the invention
Objects of the present invention are to provide a kind of adhesive tape graphite heat conducting and heat radiating fin, this adhesive tape graphite heat conducting and heat radiating fin is the most all improve heat conductivility, avoid hot-spot, while achieving the uniformity of heat conductivility, improve the heat dispersion stability of product, reliability, greatly reduce the cost of product.
To achieve the above object of the invention, the technical solution used in the present invention is: a kind of adhesive tape graphite heat conducting and heat radiating fin, the surface that described graphite heat conducting and heat radiating fin surface-coated has heat-conducting glue adhesion coating, this heat-conducting glue adhesion coating opposing with graphite heat conducting and heat radiating fin is fitted with separated type material layer；Described graphite heat conducting and heat radiating fin is made up of Kapton, the first coat and the second coat, and described first coat is positioned at Kapton upper surface；
Described first coat is formed in graphite modified dose of Kapton upper surface by film, and this graphite modified dose painting is made up of the component of following weight portion: benzophenone tetracarboxylic dianhydride 22 parts, pyromellitic acid anhydride 12.5 parts, MDA 26 parts, dimethylformamide 22.5 parts, N-Methyl pyrrolidone 9.5 parts, ethylene glycol 2.2 parts, polydimethylsiloxane 2.8 parts, dibutyl phthalate 0.9 part；
Described graphite heat conducting and heat radiating fin is obtained by following steps:
Step one, by graphite modified dose of film in Kapton upper surface acquisition process after Kapton；
Step 2, will process after Kapton be warming up to 1200 DEG C after cool down, thus obtain the carbonized film of pre-burned；
Step 3, employing calender roll the carbonized film of described pre-burned；
Step 4, carbonized film is warming up to 2850 DEG C ~ 2950 DEG C after cool down, thus obtain the main graphite film fired；
Step 5, then carry out rolling by the graphite film that the master of gained fires thus obtain described graphite heat conducting and heat radiating fin.
Owing to technique scheme is used, the present invention compared with prior art has following advantages and an effect:
1, adhesive tape graphite heat conducting and heat radiating fin of the present invention, the Kapton that in its structure, graphite linings is coated with one layer graphite modified dose by upper surface is prepared from, improve at heat conductivility both vertically and horizontally, it is to avoid adhesive tape hot-spot, it is achieved that the uniformity of adhesive tape heat conductivility；Secondly, its be positioned at Kapton surface graphite modified dose is made up of benzophenone tetracarboxylic dianhydride 22 parts, pyromellitic acid anhydride 12.5 parts, MDA 26 parts, dimethylformamide 22.5 parts, ethylene glycol 2.2 parts, polydimethylsiloxane 2.8 parts, it is coated on Kapton, the pin hole being filled with in heating process, improve degree of crystallinity simultaneously, also overcome thermal contraction excessive cause uneven, improve graphite linings biaxial tension performance.
2, adhesive tape graphite heat conducting and heat radiating fin of the present invention, its be positioned at Kapton surface graphite modified dose is made up of benzophenone tetracarboxylic dianhydride 20 ~ 25 parts, pyromellitic acid anhydride 12 ~ 18 parts, MDA 20 ~ 28 parts, dimethylformamide 20 ~ 25 parts, N-Methyl pyrrolidone 8 ~ 10 parts, ethylene glycol 1.5 ~ 2.5 parts, polydimethylsiloxane 2 ~ 3 parts, use dimethylformamide 20 ~ 25 parts, N-Methyl pyrrolidone 8 ~ 10 parts to reduce azeotropic point and smooth boiling point district, improve flatness and the pliability of final products film forming；；Secondly, dimethylformamide 20 ~ 25 parts, N-Methyl pyrrolidone 8 ~ 10 parts and 0.8 ~ 1.5 part of Kapton surface of dibutyl phthalate, prevent bubble from producing, be more beneficial for the small pin hole of filled polyimide thin film, improve the uniformity of heat radiation paster heat conductivility.
3, adhesive tape graphite heat conducting and heat radiating fin of the present invention, calendaring processes is increased between the carbonized film and graphitization of pre-burned, and again roll after forming heat conduction graphite patch again, avoid the volume contraction in fold and graphitization sintering process, improve compactness and degree of crystallinity, further increase at heat conductivility both vertically and horizontally.
Accompanying drawing explanation
Accompanying drawing 1 is adhesive tape graphite heat conducting and heat radiating fin structural representation of the present invention；
Accompanying drawing 2 is the partial structurtes schematic diagram of accompanying drawing 1.
In the figures above: 1, graphite heat conducting and heat radiating fin；11, Kapton；12, the first coat；13, the second coat；2, heat-conducting glue adhesion coating；3, separated type material layer.
Detailed description of the invention
Below in conjunction with embodiment, the invention will be further described:
Embodiment: a kind of adhesive tape graphite heat conducting and heat radiating fin, the surface that described graphite heat conducting and heat radiating fin 1 surface-coated has heat-conducting glue adhesion coating 2, this heat-conducting glue adhesion coating 2 opposing with graphite heat conducting and heat radiating fin 1 is fitted with separated type material layer 3；Described graphite heat conducting and heat radiating fin 1 is made up of Kapton the 11, first coat 12 and the second coat 13, and described first coat 12 is positioned at Kapton 11 upper surface；
Described first coat is formed in graphite modified dose of Kapton upper surface by film, and this graphite modified dose painting is made up of the component of following weight portion: benzophenone tetracarboxylic dianhydride 22 parts, pyromellitic acid anhydride 12.5 parts, MDA 26 parts, dimethylformamide 22.5 parts, N-Methyl pyrrolidone 9.5 parts, ethylene glycol 2.2 parts, polydimethylsiloxane 2.8 parts, dibutyl phthalate 0.9 part；
Described graphite heat conducting and heat radiating fin 1 is obtained by following steps:
Step one, by graphite modified dose of film in Kapton 2 upper surface acquisition process after Kapton；
Step 2, will process after Kapton be warming up to 1200 DEG C after cool down, thus obtain the carbonized film of pre-burned；
Step 3, employing calender roll the carbonized film of described pre-burned；
Step 4, carbonized film is warming up to 2850 DEG C ~ 2950 DEG C after cool down, thus obtain the main graphite film fired；
Step 5, then carry out rolling by the graphite film that the master of gained fires thus obtain described graphite heat conducting and heat radiating fin 1.
When using above-mentioned adhesive tape graphite heat conducting and heat radiating fin, the Kapton that in its structure, graphite linings is coated with one layer graphite modified dose by upper surface is prepared from, improve at heat conductivility both vertically and horizontally, it is to avoid adhesive tape hot-spot, it is achieved that the uniformity of adhesive tape heat conductivility；Secondly, it is positioned at graphite modified dose of Kapton surface by benzophenone tetracarboxylic dianhydride 20 ~ 25 parts, pyromellitic acid anhydride 12 ~ 18 parts, MDA 20 ~ 28 parts, dimethylformamide 30 ~ 35 parts, ethylene glycol 1.5 ~ 2.5 parts, polydimethylsiloxane 2 ~ 3 parts composition, it is coated on Kapton, the pin hole being filled with in heating process, improve degree of crystallinity simultaneously, also overcome thermal contraction excessive cause uneven, improve graphite linings biaxial tension performance, also reduce azeotropic point and smooth boiling point district, improve flatness and the pliability of final products film forming；Again, Kapton surface has graphite modified dose, improve graphite linings and heat-conducting glue adhesion coating heat conductivility in two-sided pad pasting, and use calender to roll the carbonized film of described pre-burned, avoid the volume contraction in fold and graphitization sintering process, improve compactness and degree of crystallinity, further increase at heat conductivility both vertically and horizontally；Again, dimethylformamide 20 ~ 25 parts, N-Methyl pyrrolidone 8 ~ 10 parts and 0.8 ~ 1.5 part of Kapton surface of dibutyl phthalate, prevent bubble from producing, be more beneficial for the small pin hole of filled polyimide thin film, improve the uniformity of heat radiation paster heat conductivility.
Above-described embodiment only for technology design and the feature of the present invention are described, its object is to allow person skilled in the art will appreciate that present disclosure and to implement according to this, can not limit the scope of the invention with this.All equivalence changes made according to spirit of the invention or modification, all should contain within protection scope of the present invention.

Claims (1)

1. an adhesive tape graphite heat conducting and heat radiating fin, the surface that described graphite heat conducting and heat radiating fin (1) surface-coated has heat-conducting glue adhesion coating (2), this heat-conducting glue adhesion coating (2) and graphite heat conducting and heat radiating fin (1) opposing is fitted with separated type material layer (3)；It is characterized in that: described graphite heat conducting and heat radiating fin (1) is made up of Kapton (11), the first coat (12) and the second coat (13), described first coat (12) is positioned at Kapton (11) upper surface；
Described first coat is formed in graphite modified dose of Kapton upper surface by film, and this graphite modified dose painting is made up of the component of following weight portion: benzophenone tetracarboxylic dianhydride 22 parts, pyromellitic acid anhydride 12.5 parts, MDA 26 parts, dimethylformamide 22.5 parts, N-Methyl pyrrolidone 9.5 parts, ethylene glycol 2.2 parts, polydimethylsiloxane 2.8 parts, dibutyl phthalate 0.9 part；
Described graphite heat conducting and heat radiating fin (1) is obtained by following steps:
Step one, by graphite modified dose of film in Kapton (2) upper surface acquisition process after Kapton；
Step 2, will process after Kapton be warming up to Cool down after 1200 DEG C, thus obtain the carbonized film of pre-burned；
Step 3, employing calender roll the carbonized film of described pre-burned；
Step 4, carbonized film is warming up to 2850 DEG C ~ 2950 DEG C Rear cooling, thus obtain the main graphite film fired；
Step 5, then carry out rolling by the graphite film that the master of gained fires thus obtain described graphite heat conducting and heat radiating fin (1).
CN201511029000.5A 2014-01-26 2014-01-26 Adhesive tape graphite heat conducting and heat radiating fin Active CN105979751B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201511029000.5A CN105979751B (en) 2014-01-26 2014-01-26 Adhesive tape graphite heat conducting and heat radiating fin

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201410036121.1A CN103796493B (en) 2014-01-26 2014-01-26 Heat conduction graphite patch for adhesive tape and preparation method thereof
CN201511029000.5A CN105979751B (en) 2014-01-26 2014-01-26 Adhesive tape graphite heat conducting and heat radiating fin

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201410036121.1A Division CN103796493B (en) 2014-01-26 2014-01-26 Heat conduction graphite patch for adhesive tape and preparation method thereof

Publications (2)

Publication Number Publication Date
CN105979751A true CN105979751A (en) 2016-09-28
CN105979751B CN105979751B (en) 2019-02-26

Family

ID=50671600

Family Applications (11)

Application Number Title Priority Date Filing Date
CN201511028692.1A Active CN105969224B (en) 2014-01-26 2014-01-26 Equal thermal bonding tape for electronic device
CN201610255486.2A Pending CN105860868A (en) 2014-01-26 2014-01-26 Preparation process of heat dissipation lamination film
CN201610250630.3A Pending CN105860867A (en) 2014-01-26 2014-01-26 Preparation technology of uniform heating rubber belt applied in electronic device
CN201511028668.8A Active CN105966019B (en) 2014-01-26 2014-01-26 For the heat conduction graphite patch of adhesive tape
CN201410036121.1A Active CN103796493B (en) 2014-01-26 2014-01-26 Heat conduction graphite patch for adhesive tape and preparation method thereof
CN201610249636.9A Active CN105860866B (en) 2014-01-26 2014-01-26 Equal thermal bonding tape
CN201511014593.8A Active CN105965985B (en) 2014-01-26 2014-01-26 Preparation method for the heat conduction graphite patch of adhesive tape
CN201511014587.2A Active CN105969223B (en) 2014-01-26 2014-01-26 Manufacturing process for equal thermal bonding tape
CN201610250629.0A Active CN105873414B (en) 2014-01-26 2014-01-26 Manufacturing process for graphite heat conducting heat dissipation patch
CN201511028635.3A Active CN105979750B (en) 2014-01-26 2014-01-26 Flexibility heat conduction graphite patch
CN201511029000.5A Active CN105979751B (en) 2014-01-26 2014-01-26 Adhesive tape graphite heat conducting and heat radiating fin

Family Applications Before (10)

Application Number Title Priority Date Filing Date
CN201511028692.1A Active CN105969224B (en) 2014-01-26 2014-01-26 Equal thermal bonding tape for electronic device
CN201610255486.2A Pending CN105860868A (en) 2014-01-26 2014-01-26 Preparation process of heat dissipation lamination film
CN201610250630.3A Pending CN105860867A (en) 2014-01-26 2014-01-26 Preparation technology of uniform heating rubber belt applied in electronic device
CN201511028668.8A Active CN105966019B (en) 2014-01-26 2014-01-26 For the heat conduction graphite patch of adhesive tape
CN201410036121.1A Active CN103796493B (en) 2014-01-26 2014-01-26 Heat conduction graphite patch for adhesive tape and preparation method thereof
CN201610249636.9A Active CN105860866B (en) 2014-01-26 2014-01-26 Equal thermal bonding tape
CN201511014593.8A Active CN105965985B (en) 2014-01-26 2014-01-26 Preparation method for the heat conduction graphite patch of adhesive tape
CN201511014587.2A Active CN105969223B (en) 2014-01-26 2014-01-26 Manufacturing process for equal thermal bonding tape
CN201610250629.0A Active CN105873414B (en) 2014-01-26 2014-01-26 Manufacturing process for graphite heat conducting heat dissipation patch
CN201511028635.3A Active CN105979750B (en) 2014-01-26 2014-01-26 Flexibility heat conduction graphite patch

Country Status (1)

Country Link
CN (11) CN105969224B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107418392A (en) * 2017-08-02 2017-12-01 合肥东恒锐电子科技有限公司 A kind of heat radiation coating of household electrical appliance and preparation method thereof
CN107441619A (en) * 2017-08-17 2017-12-08 成都三乙医疗科技有限公司 A kind of thermal conducting piece for electrotherapy
CN107551392A (en) * 2017-08-29 2018-01-09 成都三乙医疗科技有限公司 A kind of thermal conducting piece for thermotherapy

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010150300A1 (en) * 2009-06-22 2010-12-29 株式会社カネカ Graphite film and process for producing graphite film
WO2011007510A1 (en) * 2009-07-13 2011-01-20 パナソニック株式会社 Graphite sheet and heat transfer structure using same
CN103045119A (en) * 2012-12-28 2013-04-17 苏州斯迪克新材料科技股份有限公司 Heat-dissipating double-sided adhesive tape with ultrahigh heat conductivity coefficient
CN103059761A (en) * 2012-12-28 2013-04-24 斯迪克新型材料（江苏）有限公司 High-heat conductivity coefficient graphite heat-radiation adhesive tape

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4119693B2 (en) * 2002-06-17 2008-07-16 株式会社カネカ Insulating graphite film and method for producing the same
CN1826288A (en) * 2003-09-02 2006-08-30 株式会社钟化 Filmy graphite and process for producing the same
JP4622429B2 (en) * 2004-09-30 2011-02-02 株式会社カネカ Manufacturing method of high thermal conductive casing
JP2008266416A (en) * 2007-04-18 2008-11-06 Ube Ind Ltd Method for producing polyimide film and polyimide film
CN101687647B (en) * 2007-05-17 2013-04-17 株式会社钟化 Graphite film and graphite composite film
CN102757736A (en) * 2011-04-29 2012-10-31 苏州沛德导热材料有限公司 Graphite heat conducting adhesive tape and production process thereof
CN202322703U (en) * 2011-11-07 2012-07-11 吴志高 Adhesive tape with heat conduction performance
CN202936356U (en) * 2012-11-01 2013-05-15 斯迪克新型材料（江苏）有限公司 Double-sided adhesive for heat dissipation of electronic elements
CN103011141A (en) * 2012-12-20 2013-04-03 宁波今山新材料有限公司 Method for manufacturing high thermal conductivity graphite film
CN103043657B (en) * 2012-12-28 2014-10-15 苏州斯迪克新材料科技股份有限公司 Graphite radiation fin for adhesive tapes

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010150300A1 (en) * 2009-06-22 2010-12-29 株式会社カネカ Graphite film and process for producing graphite film
WO2011007510A1 (en) * 2009-07-13 2011-01-20 パナソニック株式会社 Graphite sheet and heat transfer structure using same
CN103045119A (en) * 2012-12-28 2013-04-17 苏州斯迪克新材料科技股份有限公司 Heat-dissipating double-sided adhesive tape with ultrahigh heat conductivity coefficient
CN103059761A (en) * 2012-12-28 2013-04-24 斯迪克新型材料（江苏）有限公司 High-heat conductivity coefficient graphite heat-radiation adhesive tape

Also Published As

Publication number Publication date
CN105979751B (en) 2019-02-26
CN105860866A (en) 2016-08-17
CN105860867A (en) 2016-08-17
CN105969224B (en) 2019-03-26
CN105965985A (en) 2016-09-28
CN105979750A (en) 2016-09-28
CN103796493B (en) 2016-06-15
CN105966019A (en) 2016-09-28
CN105969223A (en) 2016-09-28
CN105873414A (en) 2016-08-17
CN105873414B (en) 2018-08-31
CN105979750B (en) 2018-06-19
CN105965985B (en) 2018-04-24
CN105860868A (en) 2016-08-17
CN105966019B (en) 2018-06-19
CN105969224A (en) 2016-09-28
CN103796493A (en) 2014-05-14
CN105860866B (en) 2019-01-01
CN105969223B (en) 2019-01-01

Similar Documents

Publication Publication Date Title
CN106332522A (en) High-heat-conductivity graphite film
CN103805082B (en) High-heat-conductivity-coefficient radiating patch
CN103770415B (en) Heat conduction graphite sheet and manufacturing method thereof
CN105979751A (en) Graphite heat conduction heat dissipation sheet applied to tape
CN107043108B (en) Cooling fin manufacturing process for smart phone
CN104812205A (en) Tensile heat-radiating graphite patch
CN106118516B (en) Manufacturing process for high compactness heat dissipation pad pasting
CN104877586A (en) Film with high mechanical tensile property

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
CB02 Change of applicant information
CB02 Change of applicant information

Address after: 223900 Sihong Province Economic Development Zone, Suqian, West Ocean West Road, No. 6

Applicant after: JIANGSU SIDIKE NEW MATERIALS SIENCE & TECHNOLOGY Co.,Ltd.

Address before: 215400 Taicang, Suzhou, Taicang Economic Development Zone, Qingdao West Road, No. 11, No.

Applicant before: SUZHOU SIDIKE NEW MATERIALS SIENCE & TECHNOLOGY Co.,Ltd.

GR01 Patent grant
GR01 Patent grant
EE01 Entry into force of recordation of patent licensing contract
EE01 Entry into force of recordation of patent licensing contract

Application publication date: 20160928

Assignee: Sidike New Material (Jiangsu) Co.,Ltd.

Assignor: JIANGSU SIDIKE NEW MATERIALS SIENCE & TECHNOLOGY Co.,Ltd.

Contract record no.: X2024980013840

Denomination of invention: Graphite thermal conductive heat sink for adhesive tape

Granted publication date: 20190226

License type: Common License

Record date: 20240903

EE01 Entry into force of recordation of patent licensing contract
EE01 Entry into force of recordation of patent licensing contract

Application publication date: 20160928

Assignee: TAICANG SDK NEW MATERIAL TECHNOLOGY Co.,Ltd.

Assignor: JIANGSU SIDIKE NEW MATERIALS SIENCE & TECHNOLOGY Co.,Ltd.

Contract record no.: X2024980014169

Denomination of invention: Graphite thermal conductive heat sink for adhesive tape

Granted publication date: 20190226

License type: Common License

Record date: 20240905