CN106118517B - The thermally conductive pad pasting of high compactness - Google Patents

The thermally conductive pad pasting of high compactness Download PDF

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Publication number
CN106118517B
CN106118517B CN201610116967.5A CN201610116967A CN106118517B CN 106118517 B CN106118517 B CN 106118517B CN 201610116967 A CN201610116967 A CN 201610116967A CN 106118517 B CN106118517 B CN 106118517B
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parts
graphite
thermally conductive
degree
kapton
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CN106118517A (en
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金闯
梁豪
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Jiangsu Stick New Materials Polytron Technologies Inc
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Jiangsu Stick New Materials Polytron Technologies Inc
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    • B32B27/00—Layered products comprising a layer of synthetic resin
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    • B32—LAYERED PRODUCTS
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
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    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
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Abstract

The present invention discloses a kind of thermally conductive pad pasting of high compactness, thermally conductive attachment film is in heat generating components surface, the thermally conductive pad pasting includes graphite linings, thermally conductive adhesive layer and separated type material layer positioned at graphite layer surface, graphite linings are obtained by following process, this process is the following steps are included: the upper and lower surfaces in Kapton are coated with one layer graphite modified dose and obtain treated Kapton；The graphite modified dose of group by following parts by weight is grouped as: 28 parts of pyromellitic acid anhydride, 13.5 parts of benzophenone tetracarboxylic dianhydride, 25 parts of diaminodiphenylmethane, 24 parts of dimethylformamide, 9 parts of N-Methyl pyrrolidone, 2.2 parts of ethylene glycol, 2.2 parts of dimethyl silicone polymer；By treated, Kapton is warming up to 1200 DEG C, cooling after heat preservation, to obtain the carbonized film of pre-burned.The invention avoids the volume contractions in fold and graphitization sintering process, improve compactness and crystallinity, further improve heating conduction in the vertical direction and the horizontal direction.

Description

The thermally conductive pad pasting of high compactness
Technical field
The present invention relates to a kind of thermally conductive pad pastings of high compactness, belong to heat dissipation Filming Technology field.
Background technique
With modern microelectronic technology high speed development, electronic equipment (such as laptop, mobile phone, tablet computer) is increasingly Become ultra-thin, light, this structure significantly improves electronic equipment internal power density, and generated heat is not easy in operation It is discharged, is easy to accumulate rapidly and form high temperature.On the other hand, high temperature can reduce the performance of electronic equipment, reliability and use the longevity Life.Therefore, Current electronic industry proposes increasingly higher demands for the heat sink material as heat control system core component, urgently It needs a kind of high-efficiency heat conduction, light material to transfer heat away from rapidly, ensures that electronic equipment operates normally.
Kapton is mostly used for flexible circuit board in the prior art, is obtained although having using polyimide film sintered Graphite heat radiation fin, to be covered on heat source, but be constrained to Kapton product quality and performances the good and the bad not Together, influenced the performance of the two-sided pad pasting heat dissipation performance of heat dissipation, there are following technical problems: heat dissipation is uneven, adhesive tape easily occurs Hot-spot, the heat dissipation performance for improving product is unstable, reliability performance is poor, is unfavorable for product quality management control, influences product Competitiveness.
Summary of the invention
It is an object of the present invention to provide a kind of thermally conductive pad pasting of high compactness, the thermally conductive pad pasting of the high compactness avoids fold and stone Volume contraction in inkization sintering process, improves compactness and crystallinity, further improves in vertical direction and level side To heating conduction, improve heating conduction in the vertical direction and the horizontal direction, avoid adhesive tape hot-spot.
In order to achieve the above objectives, the technical solution adopted by the present invention is that: a kind of thermally conductive pad pasting of high compactness, the thermally conductive patch Film fits in heat generating components surface, and the thermally conductive pad pasting includes graphite linings, positioned at the thermally conductive adhesive layer of graphite layer surface and release Material layer, this separated type material layer fit in the thermally conductive adhesive layer surface opposite with graphite linings；The graphite linings pass through following technique Method obtain, this process the following steps are included:
Step 1: Kapton is risen to 250 DEG C from room temperature, near room temperature after 400 DEG C are risen to after heat preservation；
Step 2: the upper and lower surfaces in the Kapton Jing Guo step 1 are coated with one layer of graphite modified dose of acquisition Treated Kapton, graphite modified dose of the viscosity are 30000 ~ 48000CP；
The graphite modified dose of group by following parts by weight is grouped as:
28 parts of pyromellitic acid anhydride,
13.5 parts of benzophenone tetracarboxylic dianhydride,
25 parts of diaminodiphenylmethane,
24 parts of dimethylformamide,
9 parts of N-Methyl pyrrolidone,
2.2 parts of ethylene glycol,
2.2 parts of dimethyl silicone polymer；
Step 3: by treated, Kapton is warming up to 800 DEG C, is being warming up to 1200 DEG C, after heat preservation after heat preservation It is cooling, to obtain the carbonized film of pre-burned；
Step 4: rolling the carbonized film of the pre-burned of the step 4 using calender；
Step 5: being warming up to 2400 DEG C, 2900 DEG C are warming up to after heat preservation again, it is cooling after heat preservation, to obtain main firing Graphite film；
Step 6: the graphite film of the resulting main firing of step 5 is then carried out calendering to obtain the graphite linings.
Further improved scheme is as follows in above-mentioned technical proposal:
1, in above scheme, the graphite linings are obtained by following process, this process the following steps are included:
Step 1: Kapton is risen to 250 DEG C from room temperature with 4 ~ 6 degree/min speed, kept for 0.9 ~ 1.1 hour, Then with 2.5 ~ 3.5 degree/min, 400 DEG C are risen to, near room temperature after being kept for 1 hour；
Step 2: the upper and lower surfaces in the Kapton Jing Guo step 1 are coated with one layer of graphite modified dose of acquisition Treated Kapton；
Step 3: rising to 800 DEG C with the speed of 4 ~ 6 degree/min, kept for 0.9 ~ 1.1 hour；Again with the speed of 9 ~ 11 degree/min Degree rises to 1200 DEG C, cooling after saving 0.9 ~ 1.1 hour, to obtain the carbonized film of pre-burned；
Step 4: rolling the carbonized film of the pre-burned of the step 4 using calender；
Step 5: rising to 2400 DEG C with the speed of 19 ~ 21 degree/min, kept for 0.9 ~ 1.1 hour, then with 19 ~ 21 degree/min Speed rise to 2900 DEG C, it is cooling after being kept for 1.8 ~ 2.2 hours, to obtain the graphite film of main firing；
Step 6: then the graphite film of the resulting main firing of step 5 carries out calendering to obtain the graphite linings.
2, in above scheme, Kapton is risen to 250 from room temperature with 4 ~ 6 degree/min speed in the step 1 DEG C, it is kept for 0.9 ~ 1.1 hour, then with 2.5 ~ 3.5 degree/min, rises to 400 DEG C, near room temperature after being kept for 1 hour.
Since above-mentioned technical proposal is used, the present invention has following advantages and effect compared with prior art:
1, the thermally conductive pad pasting of high compactness of the present invention, in structure graphite linings by upper and lower surfaces be coated with one layer it is graphite modified The Kapton of agent is prepared, and improves heating conduction in the vertical direction and the horizontal direction, avoids adhesive tape part mistake Heat realizes the uniformity of adhesive tape heating conduction；Secondly, its be located at Kapton surface graphite modified dose is contained by specific Benzophenone tetracarboxylic dianhydride, pyromellitic acid anhydride, diaminodiphenylmethane, dimethylformamide, the N- crassitude of amount Ketone, ethylene glycol, dimethyl silicone polymer composition, are coated on Kapton, the pin hole being filled in heating process, improve Crystallinity simultaneously, also overcome be heat-shrinked it is excessive caused by it is uneven, improve graphite linings biaxial tension performance.
2, the thermally conductive pad pasting of high compactness of the present invention is located at graphite modified dose of Kapton surface by certain content Benzophenone tetracarboxylic dianhydride, pyromellitic acid anhydride, diaminodiphenylmethane, dimethylformamide, N-Methyl pyrrolidone, Ethylene glycol, dimethyl silicone polymer composition reduce azeotropic point and smooth using dimethylformamide, N-Methyl pyrrolidone Boiling point area, improve final products film forming flatness and flexibility；Secondly, Kapton surface is with graphite modified Agent improves graphite linings and thermally conductive adhesive layer heating conduction in two-sided pad pasting, and rolls the carbon of the pre-burned using calender Change film, the volume contraction for avoiding fold and being graphitized in sintering process improves compactness and crystallinity, further improves Heating conduction in the vertical direction and the horizontal direction.
3, the thermally conductive pad pasting of high compactness of the present invention, after Kapton is first risen to 400 DEG C of imidizations, then pre-burned Increase calendaring processes between carbonized film and graphitization, and roll again after re-forming heat conduction graphite patch, avoid fold and The volume contraction being graphitized in sintering process, improves compactness and crystallinity, further improves in vertical direction and level The heating conduction in direction.
Specific embodiment
The present invention will be further described below with reference to examples:
Embodiment: a kind of thermally conductive pad pasting of high compactness, the thermally conductive attachment film is in heat generating components surface, the thermally conductive patch Film includes graphite linings, thermally conductive adhesive layer and separated type material layer positioned at graphite layer surface, this separated type material layer fits in heat-conducting glue The adhesion coating surface opposite with graphite linings；The graphite linings are obtained by following process, this process the following steps are included:
Step 1: Kapton is risen to 250 DEG C from room temperature with 4 ~ 6 degree/min speed, kept for 0.9 ~ 1.1 hour, Then with 2.5 ~ 3.5 degree/min, 400 DEG C are risen to, near room temperature after being kept for 1 hour；
Step 2: the upper and lower surfaces in the Kapton Jing Guo step 1 are coated with one layer of graphite modified dose of acquisition Treated Kapton, the graphite modified dose of group by following parts by weight are grouped as:
28 parts of pyromellitic acid anhydride,
13.5 parts of benzophenone tetracarboxylic dianhydride,
25 parts of diaminodiphenylmethane,
24 parts of dimethylformamide,
9 parts of N-Methyl pyrrolidone,
2.2 parts of ethylene glycol,
2.2 parts of dimethyl silicone polymer；
Note: graphite modified dose of viscosity of embodiment 1 is 32000CP, and graphite modified dose of viscosity of embodiment 2 is Graphite modified dose of the viscosity of 35000CP, embodiment 3 are 38000CP, and graphite modified dose of viscosity of embodiment 4 is 42000CP, graphite modified dose of viscosity of embodiment 5 are 45000CP.
Step 3: rising to 800 DEG C with the speed of 4 ~ 6 degree/min, kept for 0.9 ~ 1.1 hour；Again with the speed of 9 ~ 11 degree/min Degree rises to 1200 DEG C, cooling after saving 0.9 ~ 1.1 hour, to obtain the carbonized film of pre-burned；
Step 4: rolling the carbonized film of the pre-burned of the step 4 using calender；
Step 5: rising to 2400 DEG C with the speed of 19 ~ 21 degree/min, kept for 0.9 ~ 1.1 hour, then with 19 ~ 21 degree/min Speed rise to 2900 DEG C, it is cooling after being kept for 1.8 ~ 2.2 hours, to obtain the graphite film of main firing；
Step 6: the graphite film of the resulting main firing of step 5 is then carried out calendering to obtain the graphite linings 6.
When pad pasting thermally conductive using above-mentioned high compactness, graphite linings are coated with one layer of graphite by upper and lower surfaces and change in structure Property agent Kapton be prepared, improve heating conduction in the vertical direction and the horizontal direction, avoid adhesive tape local Overheat, realizes the uniformity of adhesive tape heating conduction；Secondly, it is located at graphite modified dose of Kapton surface by specific Benzophenone tetracarboxylic dianhydride, pyromellitic acid anhydride, diaminodiphenylmethane, dimethylformamide, the N- methylpyrrole of content Alkanone, ethylene glycol, dimethyl silicone polymer composition, are coated on Kapton, the pin hole being filled in heating process mentions High crystallinity simultaneously, also overcome be heat-shrinked it is excessive caused by it is uneven, improve graphite linings biaxial tension performance, also reduce Azeotropic point and smooth boiling point area improve the flatness and flexibility of final products film forming；Again, Kapton Surface has graphite modified dose, improves graphite linings and thermally conductive adhesive layer heating conduction in two-sided pad pasting, and first by polyimides After film rises to 400 DEG C of imidizations, then increase calendaring processes between the carbonized film and graphitization of pre-burned, and re-forms thermally conductive Roll again after graphite patch, the volume contraction for avoiding fold and being graphitized in sintering process improves compactness and crystallization Degree, further improves heating conduction in the vertical direction and the horizontal direction.
The above embodiments merely illustrate the technical concept and features of the present invention, and its object is to allow person skilled in the art Scholar cans understand the content of the present invention and implement it accordingly, and it is not intended to limit the scope of the present invention.It is all according to the present invention Equivalent change or modification made by Spirit Essence, should be covered by the protection scope of the present invention.

Claims (2)

1. a kind of thermally conductive pad pasting of high compactness, for the thermally conductive attachment film in heat generating components surface, the thermally conductive pad pasting includes stone Layer of ink, thermally conductive adhesive layer and separated type material layer positioned at graphite layer surface, this separated type material layer fit in thermally conductive adhesive layer and stone The opposite surface of layer of ink；It is characterized by: the graphite linings are obtained by following process, this process includes following step It is rapid:
Step 1: Kapton is risen to 250 DEG C from room temperature with 4-6 degree/min speed, kept for 0.9-1.1 hours, Then with 2.5-3.5 degree/min, 400 DEG C are risen to, is down to room temperature after being kept for 1 hour；Step 2: by step 1 The upper and lower surfaces of Kapton are coated with one layer graphite modified dose and obtain treated Kapton, the graphite The viscosity of modifying agent is 38000cP；
The graphite modified dose of group by following parts by weight is grouped as:
28 parts of pyromellitic acid anhydride,
13.5 parts of benzophenone tetracarboxylic dianhydride,
25 parts of diaminodiphenylmethane,
24 parts of dimethylformamide,
9 parts of N-Methyl pyrrolidone,
2.2 parts of ethylene glycol,
2.2 parts of dimethyl silicone polymer；
Step 3: rising to 800 DEG C with the speed of 4 ~ 6 degree/min, kept for 0.9 ~ 1.1 hour；Again with the speed liter of 9 ~ 11 degree/min It is cooling after saving 0.9 ~ 1.1 hour to 1200 DEG C, to obtain the carbonized film of pre-burned；
Step 4: rolling the carbonized film of the pre-burned of the step 3 using calender；
Step 5: rising to 2400 DEG C with the speed of 19 ~ 21 degree/min, kept for 0.9 ~ 1.1 hour, then with the speed of 19 ~ 21 degree/min Degree rises to 2900 DEG C, cooling after being kept for 1.8 ~ 2.2 hours, to obtain the graphite film of main firing；
Step 6: then the graphite film of the resulting main firing of step 5 carries out calendering to obtain the graphite linings.
2. the thermally conductive pad pasting of high compactness according to claim 1, it is characterised in that: in the step 1 that polyimides is thin Film rises to 250 DEG C from room temperature with 4 ~ 6 degree/min speed, is kept for 0.9 ~ 1.1 hour, then with 2.5 ~ 3.5 degree/min, rises to 400 DEG C, room temperature is down to after being kept for 1 hour.
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CN201410036328.9A Active CN103756588B (en) 2014-01-26 2014-01-26 For the Pressuresensitive Tape of microelectronic device
CN201610119265.2A Active CN106118520B (en) 2014-01-26 2014-01-26 Manufacturing process for graphite glue band
CN201610119322.7A Active CN106393842B (en) 2014-01-26 2014-01-26 Stretch-proof graphite dissipates pad pasting
CN201610116960.3A Active CN106118516B (en) 2014-01-26 2014-01-26 Manufacturing process for high compactness heat dissipation pad pasting
CN201610119321.2A Pending CN106118521A (en) 2014-01-26 2014-01-26 Needleless pass height conductive graphite adhesive tape
CN201610116969.4A Pending CN106118518A (en) 2014-01-26 2014-01-26 The preparation technology of smart mobile phone pressure sensitive adhesive tape
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CN201610119265.2A Active CN106118520B (en) 2014-01-26 2014-01-26 Manufacturing process for graphite glue band
CN201610119322.7A Active CN106393842B (en) 2014-01-26 2014-01-26 Stretch-proof graphite dissipates pad pasting
CN201610116960.3A Active CN106118516B (en) 2014-01-26 2014-01-26 Manufacturing process for high compactness heat dissipation pad pasting
CN201610119321.2A Pending CN106118521A (en) 2014-01-26 2014-01-26 Needleless pass height conductive graphite adhesive tape
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CN107266076A (en) * 2017-07-12 2017-10-20 合肥东恒锐电子科技有限公司 A kind of manufacturing process of the heat conduction pad pasting of mobile phone

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