CN106118520A - Manufacturing process for graphite adhesive tape free of pinholes - Google Patents

Manufacturing process for graphite adhesive tape free of pinholes Download PDF

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Publication number
CN106118520A
CN106118520A CN201610119265.2A CN201610119265A CN106118520A CN 106118520 A CN106118520 A CN 106118520A CN 201610119265 A CN201610119265 A CN 201610119265A CN 106118520 A CN106118520 A CN 106118520A
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China
Prior art keywords
graphite
kapton
adhesive tape
pinholes
parts
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Granted
Application number
CN201610119265.2A
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Chinese (zh)
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CN106118520B (en
Inventor
金闯
梁豪
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Suzhou Sidike New Material Science and Technology Co Ltd
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Suzhou Sidike New Material Science and Technology Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/52—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite
    • C04B35/522—Graphite
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
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    • B32B7/10—Interconnection of layers at least one layer having inter-reactive properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/045—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/52—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite
    • C04B35/524—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite obtained from polymer precursors, e.g. glass-like carbon material
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    • C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
    • C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
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    • C04B35/64—Burning or sintering processes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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    • C04B2235/612—Machining
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    • C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
    • C04B2235/6562—Heating rate
    • C—CHEMISTRY; METALLURGY
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    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
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    • C04B2235/6567—Treatment time
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    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/66—Specific sintering techniques, e.g. centrifugal sintering
    • C04B2235/661—Multi-step sintering
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J2400/00—Presence of inorganic and organic materials
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    • C09J2479/00—Presence of polyamine or polyimide
    • C09J2479/08—Presence of polyamine or polyimide polyimide
    • C09J2479/081—Presence of polyamine or polyimide polyimide in the barrier layer

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Ceramic Products (AREA)

Abstract

The present invention discloses a kind of manufacturing process for graphite adhesive tape free of pinholes, comprises the following steps: be coated with the Kapton after one layer of graphite modified dose of acquisition processes on the upper and lower surface of Kapton；Described graphite modified dose is made up of the component of following weight portion: pyromellitic acid anhydride, benzophenone tetracarboxylic dianhydride, MDA, dimethylformamide, N methyl pyrrolidone, ethylene glycol, polydimethylsiloxane；Kapton after processing is warming up to 1200 DEG C, cools down, thus obtain the carbonized film of pre-burned after insulation；Then carry out rolling by the main graphite film fired thus obtain described graphite linings.The present invention improves at heat conductivility both vertically and horizontally, it also avoid the volume contraction in graphitization sintering process.

Description

Manufacturing process for graphite adhesive tape free of pinholes
Technical field
The present invention relates to a kind of manufacturing process for graphite adhesive tape free of pinholes, belong to heat radiation Filming Technology field.
Background technology
Along with modern microelectronic technology high-speed develops, electronic equipment (such as notebook computer, mobile phone, panel computer etc.) is day by day Becoming ultra-thin, light, this structure makes electronic equipment internal power density significantly improve, and in operation, produced heat is difficult to Discharge, be prone to accumulate rapidly and form high temperature.On the other hand, high temperature can reduce the performance of electronic equipment, reliability and use longevity Life.Therefore, Current electronic industry is for proposing the highest requirement as the heat sink material of heat control system core component, urgently Need a kind of high-efficiency heat conduction, light material to transfer heat away from rapidly, ensure that electronic equipment is properly functioning.
In prior art, Kapton is mostly used for flexible PCB, although has and uses polyimide film sintered obtaining Obtain graphite heat radiation fin, thus be covered on thermal source, but be constrained to the good and the bad of the product quality and performances of Kapton not Together, have influence on the performance of heat radiation two-sided pad pasting heat dispersion, there is techniques below problem: dispel the heat uneven, adhesive tape easily occurs Hot-spot, the heat dispersion that improve product is unstable, reliability performance is poor, is unfavorable for product quality management control, affects product Competitiveness.
Summary of the invention
It is an object of the present invention to provide a kind of manufacturing process for graphite adhesive tape free of pinholes, this is used for graphite adhesive tape free of pinholes Manufacturing process avoid the volume contraction in fold and graphitization sintering process, improve compactness and degree of crystallinity, further Improve at heat conductivility both vertically and horizontally, the most all improve heat conductivility, keeping away Exempt from adhesive tape hot-spot.
For reaching above-mentioned purpose, the technical solution used in the present invention is: a kind of manufacture work for graphite adhesive tape free of pinholes Skill, described graphite adhesive tape free of pinholes fits in heat generating components surface, and described graphite adhesive tape free of pinholes includes graphite linings, is positioned at graphite The layer heat-conducting glue adhesion coating on surface and separated type material layer, this separated type material laminating is together in the opposing table of heat-conducting glue adhesion coating and graphite linings Face；It is characterized in that: described graphite linings is obtained by following process, this process comprises the following steps:
Step one, Kapton is risen to 250 DEG C from room temperature, near room temperature after rising to 400 DEG C after insulation；
Step 2, it is coated with one layer of graphite modified dose of acquisition on the upper and lower surface of the Kapton through step one and processes After Kapton；
Described graphite modified dose is made up of the component of following weight portion:
Pyromellitic acid anhydride 26 parts,
Benzophenone tetracarboxylic dianhydride 10 parts,
MDA 20 parts,
Dimethylformamide 23 parts,
N-Methyl pyrrolidone 8 parts,
Ethylene glycol 2.5 parts,
Polydimethylsiloxane 3 parts；
Step 3, will process after Kapton be warming up to 800 DEG C, be warming up to 1200 DEG C after insulation, after insulation cool down, Thus obtain the carbonized film of pre-burned；
Step 4, employing calender roll the carbonized film of the pre-burned of described step 4；
Step 5, it is warming up to 2400 DEG C, after insulation, is warming up to 2900 DEG C again, cool down after insulation, thus obtain the main graphite fired Film；
Step 6, then carry out rolling by the graphite film that the master of step 5 gained fires thus obtain described graphite linings.
In technique scheme, further improved plan is as follows:
1, in such scheme, Kapton is risen to 250 DEG C with 4 ~ 6 degree/min speed from room temperature by described step one, protect Hold 0.9 ~ 1.1 hour, then with 2.5 ~ 3.5 degree/min, rise to 400 DEG C, near room temperature after keeping 1 hour.
2, in such scheme, in described step 2, the viscosity of graphite modified dose is 30000 ~ 48000CP.
Owing to technique scheme is used, the present invention compared with prior art has following advantages and an effect:
1, the present invention is for the manufacturing process of graphite adhesive tape free of pinholes, and in its structure, graphite linings is coated with one layer by upper and lower surface The Kapton of graphite modified dose is prepared from, and improves at heat conductivility both vertically and horizontally, it is to avoid glue Band hot-spot, it is achieved that the uniformity of adhesive tape heat conductivility；Secondly, it is positioned at graphite modified dose of Kapton surface By the benzophenone tetracarboxylic dianhydride of certain content, pyromellitic acid anhydride, MDA, dimethylformamide, N-first Base ketopyrrolidine, ethylene glycol, polydimethylsiloxane form, and are coated on Kapton, are filled with in heating process Pin hole, improves degree of crystallinity simultaneously, also overcome thermal contraction excessive cause uneven, improve graphite linings two-way stretchability Energy.
2, the present invention is for the manufacturing process of graphite adhesive tape free of pinholes, and it is positioned at the graphite modified of Kapton surface Agent is by the benzophenone tetracarboxylic dianhydride of certain content, pyromellitic acid anhydride, MDA, dimethylformamide, N- Methyl pyrrolidone, ethylene glycol, polydimethylsiloxane form, and use dimethylformamide, N-Methyl pyrrolidone to reduce Azeotropic point and smooth boiling point district, improve flatness and the pliability of final products film forming；Secondly, Kapton table Mask has graphite modified dose, improves graphite linings and heat-conducting glue adhesion coating heat conductivility in two-sided pad pasting, and uses calender calendering The carbonized film of described pre-burned, it is to avoid the volume contraction in fold and graphitization sintering process, improves compactness and crystallization Degree, further increases at heat conductivility both vertically and horizontally.
3, the present invention is for the manufacturing process of graphite adhesive tape free of pinholes, and Kapton first rises to 400 DEG C of imidizations After, then between the carbonized film of pre-burned and graphitization, increase calendaring processes, and again roll after forming heat conduction graphite patch again, Avoid the volume contraction in fold and graphitization sintering process, improve compactness and degree of crystallinity, further increase and hanging down Nogata is to the heat conductivility with horizontal direction.
Detailed description of the invention
Below in conjunction with embodiment, the invention will be further described:
Embodiment: a kind of manufacturing process for graphite adhesive tape free of pinholes, described graphite adhesive tape free of pinholes fits in heat generating components Surface, described graphite adhesive tape free of pinholes includes graphite linings, the heat-conducting glue adhesion coating being positioned at graphite linings surface and separated type material layer, this from Shaped material laminating is together in the opposing surface of heat-conducting glue adhesion coating and graphite linings；It is characterized in that: described graphite linings is by following technique Method obtains, and this process comprises the following steps:
Step one, Kapton is risen to 250 DEG C with 4 ~ 6 degree/min speed from room temperature, keep 0.9 ~ 1.1 hour, then With 2.5 ~ 3.5 degree/min, rise to 400 DEG C, near room temperature after keeping 1 hour；
Step 2, it is coated with one layer of graphite modified dose of acquisition on the upper and lower surface of the Kapton through step one and processes After Kapton, described graphite modified dose is made up of the component of following weight portion:
Pyromellitic acid anhydride 26 parts,
Benzophenone tetracarboxylic dianhydride 10 parts,
MDA 20 parts,
Dimethylformamide 23 parts,
N-Methyl pyrrolidone 8 parts,
Ethylene glycol 2.5 parts,
Polydimethylsiloxane 3 parts；
Note: the viscosity of graphite modified dose of embodiment 1 is 32000CP, the viscosity of graphite modified dose of embodiment 2 is 35000CP, The viscosity of graphite modified dose of embodiment 3 is 38000CP, and the viscosity of graphite modified dose of embodiment 4 is 42000CP, embodiment 5 The viscosity of graphite modified dose be 45000CP.
Step 3, rise to 800 DEG C with the speed of 4 ~ 6 degree/min, keep 0.9 ~ 1.1 hour；Again with the speed of 9 ~ 11 degree/min Degree rises to 1200 DEG C, cools down, thus obtain the carbonized film of pre-burned after preserving 0.9 ~ 1.1 hour；
Step 4, employing calender roll the carbonized film of the pre-burned of described step 4；
Step 5, rise to 2400 DEG C with the speed of 19 ~ 21 degree/min, keep 0.9 ~ 1.1 hour, then the speed with 19 ~ 21 degree/min Degree rises to 2900 DEG C, cools down after keeping 1.8 ~ 2.2 hours, thus obtains the main graphite film fired；
Step 6, then carry out rolling by the graphite film that the master of step 5 gained fires thus obtain described graphite linings 6.
Using above-mentioned when the manufacturing process of graphite adhesive tape free of pinholes, in its structure, graphite linings is all coated with by upper and lower surface The Kapton covering one layer graphite modified dose is prepared from, and improves at heat conductivility both vertically and horizontally, Avoid adhesive tape hot-spot, it is achieved that the uniformity of adhesive tape heat conductivility；Secondly, it is positioned at the graphite on Kapton surface Modifying agent is by the benzophenone tetracarboxylic dianhydride of certain content, pyromellitic acid anhydride, MDA, dimethyl formyl Amine, N-Methyl pyrrolidone, ethylene glycol, polydimethylsiloxane form, and are coated on Kapton, are filled with heated Pin hole in journey, improves degree of crystallinity simultaneously, also overcome thermal contraction excessive cause uneven, improve that graphite linings is two-way draws Stretch performance, also reduce azeotropic point and smooth boiling point district, improve flatness and the pliability of final products film forming；Again Secondary, Kapton surface has graphite modified dose, improves graphite linings and heat-conducting glue adhesion coating heat conductivility in two-sided pad pasting, And after first Kapton being risen to 400 DEG C of imidizations, then between the carbonized film of pre-burned and graphitization, increase calendaring processes, And again roll after forming heat conduction graphite patch again, it is to avoid the volume contraction in fold and graphitization sintering process, improves Compactness and degree of crystallinity, further increase at heat conductivility both vertically and horizontally.
Above-described embodiment, only for technology design and the feature of the explanation present invention, its object is to allow person skilled in the art Scholar will appreciate that present disclosure and implements according to this, can not limit the scope of the invention with this.All according to the present invention The equivalence that spirit is made changes or modifies, and all should contain within protection scope of the present invention.

Claims (3)

1., for a manufacturing process for graphite adhesive tape free of pinholes, described graphite adhesive tape free of pinholes fits in heat generating components surface, Described graphite adhesive tape free of pinholes includes graphite linings, the heat-conducting glue adhesion coating being positioned at graphite linings surface and separated type material layer, this release material The bed of material fits in the surface that heat-conducting glue adhesion coating is opposing with graphite linings；It is characterized in that: described graphite linings is by following process Obtaining, this process comprises the following steps:
Step one, Kapton is risen to 250 DEG C from room temperature, near room temperature after rising to 400 DEG C after insulation；
Step 2, it is coated with one layer of graphite modified dose of acquisition on the upper and lower surface of the Kapton through step one and processes After Kapton；
Described graphite modified dose is made up of the component of following weight portion:
Pyromellitic acid anhydride 26 parts,
Benzophenone tetracarboxylic dianhydride 10 parts,
MDA 20 parts,
Dimethylformamide 23 parts,
N-Methyl pyrrolidone 8 parts,
Ethylene glycol 2.5 parts,
Polydimethylsiloxane 3 parts；
Step 3, will process after Kapton be warming up to 800 DEG C, be warming up to 1200 DEG C after insulation, after insulation cool down, Thus obtain the carbonized film of pre-burned；
Step 4, employing calender roll the carbonized film of the pre-burned of described step 4；
Step 5, it is warming up to 2400 DEG C, after insulation, is warming up to 2900 DEG C again, cool down after insulation, thus obtain the main graphite fired Film；
Step 6, then carry out rolling by the graphite film that the master of step 5 gained fires thus obtain described graphite linings.
Manufacturing process for graphite adhesive tape free of pinholes the most according to claim 1, it is characterised in that: in described step one Kapton is risen to 250 DEG C with 4 ~ 6 degree/min speed from room temperature, keeps 0.9 ~ 1.1 hour, then with 2.5 ~ 3.5 degree/ Min, rises to 400 DEG C, near room temperature after keeping 1 hour.
Manufacturing process for graphite adhesive tape free of pinholes the most according to claim 1, it is characterised in that: in described step 2 The viscosity of graphite modified dose is 30000 ~ 48000CP.
CN201610119265.2A 2014-01-26 2014-01-26 Manufacturing process for graphite glue band Active CN106118520B (en)

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CN201610116966.0A Pending CN106433500A (en) 2014-01-26 2014-01-26 Pressure-sensitive adhesive tape for electronic products
CN201610116969.4A Pending CN106118518A (en) 2014-01-26 2014-01-26 The preparation technology of smart mobile phone pressure sensitive adhesive tape
CN201410036328.9A Active CN103756588B (en) 2014-01-26 2014-01-26 For the Pressuresensitive Tape of microelectronic device
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CN201610116966.0A Pending CN106433500A (en) 2014-01-26 2014-01-26 Pressure-sensitive adhesive tape for electronic products
CN201610116969.4A Pending CN106118518A (en) 2014-01-26 2014-01-26 The preparation technology of smart mobile phone pressure sensitive adhesive tape
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CN107266076A (en) * 2017-07-12 2017-10-20 合肥东恒锐电子科技有限公司 A kind of manufacturing process of the heat conduction pad pasting of mobile phone

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