JPS5751423A - Preparation of thermosetting resin laminated plate - Google Patents
Preparation of thermosetting resin laminated plateInfo
- Publication number
- JPS5751423A JPS5751423A JP55127401A JP12740180A JPS5751423A JP S5751423 A JPS5751423 A JP S5751423A JP 55127401 A JP55127401 A JP 55127401A JP 12740180 A JP12740180 A JP 12740180A JP S5751423 A JPS5751423 A JP S5751423A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- laminated plate
- temperature
- thermosetting resin
- pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/20—Making multilayered or multicoloured articles
- B29C43/203—Making multilayered articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2101/00—Use of unspecified macromolecular compounds as moulding material
- B29K2101/10—Thermosetting resins
Abstract
PURPOSE: To obtain the captioned high quality laminated plate short of deviation of plate thickness, camber, tortion, etc. by a method wherein after thermosetting resin is heated and molded under pressure near the temperature showing the lowest viscosity, it is hardened sufficiently at increased temperature when it commences gelling.
CONSTITUTION: A plurality of veneers obtained by impregnating a substrate of sheet material such as paper or the like with thermosetting resin such as epoxy resin, phenol resin, etc. are laminated and then, the temperature of a hot platen on the outer side of the laminated plate is set preferably to T1±10°C and at the same time molded preferably under the pressure (under the max. pressure 100kg/cm2) less than 2W3 times the stress in equilibrium with the viscosity of the resin. After the hardening reaction of said resin progresses and the resin passes through the gelling point t3, the temperature of the hot platen is increased up to that necessary to realize properties of the laminated plate to harden the resin completely.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55127401A JPS5751423A (en) | 1980-09-12 | 1980-09-12 | Preparation of thermosetting resin laminated plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55127401A JPS5751423A (en) | 1980-09-12 | 1980-09-12 | Preparation of thermosetting resin laminated plate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5751423A true JPS5751423A (en) | 1982-03-26 |
Family
ID=14959071
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP55127401A Pending JPS5751423A (en) | 1980-09-12 | 1980-09-12 | Preparation of thermosetting resin laminated plate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5751423A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008117711A1 (en) * | 2007-03-27 | 2008-10-02 | Panasonic Electric Works Co., Ltd. | Metal-plated laminated board, multilayer laminated board and method for manufacturing the same |
EP1372364A4 (en) * | 2001-10-12 | 2011-01-12 | Panasonic Corp | Method of manufacturing circuit formed substrate |
JP2018027625A (en) * | 2016-08-17 | 2018-02-22 | 株式会社日本製鋼所 | Molding method for molding fiber-reinforced resin |
CN108883584A (en) * | 2015-12-11 | 2018-11-23 | 奥钢联钢铁公司 | Method for manufacturing the semi-finished product or component that are made of metal and fibre composites |
-
1980
- 1980-09-12 JP JP55127401A patent/JPS5751423A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1372364A4 (en) * | 2001-10-12 | 2011-01-12 | Panasonic Corp | Method of manufacturing circuit formed substrate |
WO2008117711A1 (en) * | 2007-03-27 | 2008-10-02 | Panasonic Electric Works Co., Ltd. | Metal-plated laminated board, multilayer laminated board and method for manufacturing the same |
JP2008307886A (en) * | 2007-03-27 | 2008-12-25 | Panasonic Electric Works Co Ltd | Metal-clad laminated board, multilayer laminated board and method for manufacturing the same |
CN108883584A (en) * | 2015-12-11 | 2018-11-23 | 奥钢联钢铁公司 | Method for manufacturing the semi-finished product or component that are made of metal and fibre composites |
JP2018538177A (en) * | 2015-12-11 | 2018-12-27 | フォエスタルピネ スタール ゲーエムベーハー | Method for producing semi-finished products or components made of metal and composite fibers |
JP2018027625A (en) * | 2016-08-17 | 2018-02-22 | 株式会社日本製鋼所 | Molding method for molding fiber-reinforced resin |
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