JPS5658827A - Preparation of epoxy resin laminated plate - Google Patents

Preparation of epoxy resin laminated plate

Info

Publication number
JPS5658827A
JPS5658827A JP13556079A JP13556079A JPS5658827A JP S5658827 A JPS5658827 A JP S5658827A JP 13556079 A JP13556079 A JP 13556079A JP 13556079 A JP13556079 A JP 13556079A JP S5658827 A JPS5658827 A JP S5658827A
Authority
JP
Japan
Prior art keywords
epoxy resin
condition
substrate material
substrate materials
stacked
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13556079A
Other languages
Japanese (ja)
Inventor
Toshiharu Mikawa
Kunio Sakamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP13556079A priority Critical patent/JPS5658827A/en
Publication of JPS5658827A publication Critical patent/JPS5658827A/en
Pending legal-status Critical Current

Links

Landscapes

  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulding By Coating Moulds (AREA)

Abstract

PURPOSE: To prepare the titled laminated plate having a smooth surface and being excellent in dimensional accuracy by method wherein plural epoxy resin impregnated sheet substrate materials converted to a semicured condition by the primary molding are laminated and this laminate is completely cured by the secondary molding.
CONSTITUTION: All or a part of plural epoxy resin impregnated sheet substrate materials 3 are entered into a pair of metal mold plates in such a condition that they are interposed between mold release papers 1 and heated and pressed under a mild condition to be subjected to the primary molding to obtain a sheet substrate material 3a impregnated with an epoxy resin in a semicured condition. Subsequently, a plurality of this substrate materials 3a are stacked or this substrate material 3a and the substrate material 3 are appropriately stacked and, moreover, the substrate materials 3a are stacked on an outer side thereof to make a laminated structure and this laminated structure is entered into a pair of the metal mold plates 2 and subjected to the secondary molding by heating and pressing to cure the substrate material 3, 3a completely.
COPYRIGHT: (C)1981,JPO&Japio
JP13556079A 1979-10-20 1979-10-20 Preparation of epoxy resin laminated plate Pending JPS5658827A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13556079A JPS5658827A (en) 1979-10-20 1979-10-20 Preparation of epoxy resin laminated plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13556079A JPS5658827A (en) 1979-10-20 1979-10-20 Preparation of epoxy resin laminated plate

Publications (1)

Publication Number Publication Date
JPS5658827A true JPS5658827A (en) 1981-05-22

Family

ID=15154657

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13556079A Pending JPS5658827A (en) 1979-10-20 1979-10-20 Preparation of epoxy resin laminated plate

Country Status (1)

Country Link
JP (1) JPS5658827A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6063118A (en) * 1983-09-17 1985-04-11 Nhk Spring Co Ltd Preparation of frp board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6063118A (en) * 1983-09-17 1985-04-11 Nhk Spring Co Ltd Preparation of frp board
JPH0411368B2 (en) * 1983-09-17 1992-02-28

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