JPS5610425A - Manufacture of laminated board - Google Patents

Manufacture of laminated board

Info

Publication number
JPS5610425A
JPS5610425A JP8615779A JP8615779A JPS5610425A JP S5610425 A JPS5610425 A JP S5610425A JP 8615779 A JP8615779 A JP 8615779A JP 8615779 A JP8615779 A JP 8615779A JP S5610425 A JPS5610425 A JP S5610425A
Authority
JP
Japan
Prior art keywords
resin
base material
external layer
internal layer
prepreg
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8615779A
Other languages
Japanese (ja)
Inventor
Toshiharu Mikawa
Yoshiharu Kasai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP8615779A priority Critical patent/JPS5610425A/en
Publication of JPS5610425A publication Critical patent/JPS5610425A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To improve the mold releasing property without deteriorating the characteristics inherent in the impregnating resin by a method wherein the base material for an external layer prepreg is formed larger than that of an internal layer prepreg and a specially modified substance is used as the impregnating resin for the external layer prepreg.
CONSTITUTION: First the internal layer prepreg 1 is formed by impregnating the base material such as a craft paper, glass fiber cloth, etc. with epoxy resin and dryed. On the other hand, the base material having a larger shape than that of the internal layer base material and a metal mold 3 for a multistage press is impregnated with the epoxy resin modified by an excellent mold releasing resin such as resol type phenol resin and dried to form the external layer prepreg 2. Then, the external layer prepregs 2 are laminated on both the upper and lower surfaces of a plurality of laminated internal layer prepregs 1 and sandwiched between the molds 3 of the multistage press, molded in heating and under pressure to obtain the laminated board.
EFFECT: The shape of the external layer base material is so large that resin does not attach to the mold through the resin flows out in heating and under pressure.
COPYRIGHT: (C)1981,JPO&Japio
JP8615779A 1979-07-06 1979-07-06 Manufacture of laminated board Pending JPS5610425A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8615779A JPS5610425A (en) 1979-07-06 1979-07-06 Manufacture of laminated board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8615779A JPS5610425A (en) 1979-07-06 1979-07-06 Manufacture of laminated board

Publications (1)

Publication Number Publication Date
JPS5610425A true JPS5610425A (en) 1981-02-02

Family

ID=13878896

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8615779A Pending JPS5610425A (en) 1979-07-06 1979-07-06 Manufacture of laminated board

Country Status (1)

Country Link
JP (1) JPS5610425A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58118243A (en) * 1982-01-07 1983-07-14 東芝ケミカル株式会社 Manufacture of copper lined laminated board
CN101961919A (en) * 2010-08-27 2011-02-02 上海晋飞复合材料科技有限公司 Prepreg mould-pressing composite material moulding process
CN105729969A (en) * 2014-12-11 2016-07-06 上海尖端工程材料有限公司 Method for manufacturing weight reduced flame retardation type automobile floor board

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58118243A (en) * 1982-01-07 1983-07-14 東芝ケミカル株式会社 Manufacture of copper lined laminated board
JPH028581B2 (en) * 1982-01-07 1990-02-26 Toshiba Chem Prod
CN101961919A (en) * 2010-08-27 2011-02-02 上海晋飞复合材料科技有限公司 Prepreg mould-pressing composite material moulding process
CN105729969A (en) * 2014-12-11 2016-07-06 上海尖端工程材料有限公司 Method for manufacturing weight reduced flame retardation type automobile floor board

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