FR2224293A1 - Multiple daylight pressing of resin impregnated mats - using stacks of both dry and preimpregnated glass mats - Google Patents

Multiple daylight pressing of resin impregnated mats - using stacks of both dry and preimpregnated glass mats

Info

Publication number
FR2224293A1
FR2224293A1 FR7312317A FR7312317A FR2224293A1 FR 2224293 A1 FR2224293 A1 FR 2224293A1 FR 7312317 A FR7312317 A FR 7312317A FR 7312317 A FR7312317 A FR 7312317A FR 2224293 A1 FR2224293 A1 FR 2224293A1
Authority
FR
France
Prior art keywords
dry
sheets
mats
moulding
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7312317A
Other languages
French (fr)
Other versions
FR2224293B1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DROUET DIAMOND
Original Assignee
DROUET DIAMOND
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DROUET DIAMOND filed Critical DROUET DIAMOND
Priority to FR7312317A priority Critical patent/FR2224293A1/en
Publication of FR2224293A1 publication Critical patent/FR2224293A1/en
Application granted granted Critical
Publication of FR2224293B1 publication Critical patent/FR2224293B1/fr
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2309/00—Use of inorganic materials not provided for in groups B29K2303/00 - B29K2307/00, as reinforcement
    • B29K2309/08—Glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2315/00—Other materials containing non-metallic inorganic compounds not provided for in groups B32B2311/00 - B32B2313/04
    • B32B2315/08—Glass
    • B32B2315/085—Glass fiber cloth or fabric
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

Composite mouldings for printed circuit boards, are mfd. by stacking dry glass mat (1) next to layers of heavily resin impregnated mat (2) and compression moulding to impregnate and bond the dry sheets by partial resin transfer from the other sheets. Multiple moulding by hot compression of several sets of mats in parallel in a multi-daylight tool. The moulding may be made from mixed stock sheets stacked between facing sheets of a different nature, esp. of copper or other metal. Combination of dry and loaded sheets produces a lower, cheaper, overall resin content than use of preimpregnated sheets only. Resin flow during consolidation is pref. coaxial into the interstices of the dry mat, radially as lateral flash to waste.
FR7312317A 1973-04-05 1973-04-05 Multiple daylight pressing of resin impregnated mats - using stacks of both dry and preimpregnated glass mats Granted FR2224293A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7312317A FR2224293A1 (en) 1973-04-05 1973-04-05 Multiple daylight pressing of resin impregnated mats - using stacks of both dry and preimpregnated glass mats

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7312317A FR2224293A1 (en) 1973-04-05 1973-04-05 Multiple daylight pressing of resin impregnated mats - using stacks of both dry and preimpregnated glass mats

Publications (2)

Publication Number Publication Date
FR2224293A1 true FR2224293A1 (en) 1974-10-31
FR2224293B1 FR2224293B1 (en) 1975-08-22

Family

ID=9117473

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7312317A Granted FR2224293A1 (en) 1973-04-05 1973-04-05 Multiple daylight pressing of resin impregnated mats - using stacks of both dry and preimpregnated glass mats

Country Status (1)

Country Link
FR (1) FR2224293A1 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0046978A2 (en) * 1980-09-02 1982-03-10 Robert Bürkle GmbH & Co. Method of making multilayer circuit boards, and apparatus therefor
EP0053367A2 (en) * 1980-11-29 1982-06-09 Sekisui Kagaku Kogyo Kabushiki Kaisha Method for producing plate heater
EP0792737A2 (en) * 1996-02-29 1997-09-03 Sumitomo Bakelite Company Limited Laminated board and process for production thereof
US6113730A (en) * 1994-11-30 2000-09-05 Mitsubishi Gas Chemical Company, Inc. Metal-foil-clad composite ceramic board and process for the production thereof
US6124220A (en) * 1995-03-28 2000-09-26 Sumitomo Bakelite Company Limited Laminated board and process for production thereof
US6136733A (en) * 1997-06-13 2000-10-24 International Business Machines Corporation Method for reducing coefficient of thermal expansion in chip attach packages
US6586352B1 (en) 1997-06-13 2003-07-01 International Business Machines Corporation Method for reducing coefficient of thermal expansion in chip attach packages

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0046978A2 (en) * 1980-09-02 1982-03-10 Robert Bürkle GmbH & Co. Method of making multilayer circuit boards, and apparatus therefor
EP0046978A3 (en) * 1980-09-02 1983-06-01 Robert Bürkle GmbH & Co. Method of making multilayer circuit boards, and apparatus therefor
EP0053367A2 (en) * 1980-11-29 1982-06-09 Sekisui Kagaku Kogyo Kabushiki Kaisha Method for producing plate heater
EP0053367A3 (en) * 1980-11-29 1985-08-14 Sekisui Kagaku Kogyo Kabushiki Kaisha Method for producing plate heater
US6113730A (en) * 1994-11-30 2000-09-05 Mitsubishi Gas Chemical Company, Inc. Metal-foil-clad composite ceramic board and process for the production thereof
US6124220A (en) * 1995-03-28 2000-09-26 Sumitomo Bakelite Company Limited Laminated board and process for production thereof
EP0792737A2 (en) * 1996-02-29 1997-09-03 Sumitomo Bakelite Company Limited Laminated board and process for production thereof
EP0792737A3 (en) * 1996-02-29 1998-07-22 Sumitomo Bakelite Company Limited Laminated board and process for production thereof
US6136733A (en) * 1997-06-13 2000-10-24 International Business Machines Corporation Method for reducing coefficient of thermal expansion in chip attach packages
US6387830B1 (en) * 1997-06-13 2002-05-14 International Business Machines Corporation Method for reducing coefficient of thermal expansion in chip attach packages
US6586352B1 (en) 1997-06-13 2003-07-01 International Business Machines Corporation Method for reducing coefficient of thermal expansion in chip attach packages
US6841026B2 (en) * 1997-06-13 2005-01-11 International Business Machines Corporation Method for reducing coefficient of thermal expansion in chip attach packages

Also Published As

Publication number Publication date
FR2224293B1 (en) 1975-08-22

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Legal Events

Date Code Title Description
ST Notification of lapse