CN214646478U - Prepreg for copper-clad plate - Google Patents

Prepreg for copper-clad plate Download PDF

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Publication number
CN214646478U
CN214646478U CN202120820490.5U CN202120820490U CN214646478U CN 214646478 U CN214646478 U CN 214646478U CN 202120820490 U CN202120820490 U CN 202120820490U CN 214646478 U CN214646478 U CN 214646478U
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China
Prior art keywords
glass fiber
fiber plate
glue
plate
prepreg
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CN202120820490.5U
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Chinese (zh)
Inventor
吴虹
聂国辉
曾昭峰
程凯
孙聪
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Junxuan New Material Hangzhou Co ltd
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Junxuan New Material Hangzhou Co ltd
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Abstract

The application relates to a prepreg for a copper-clad plate, which relates to the technical field of prepregs and comprises a first glass fiber plate, wherein a second glass fiber plate is arranged on one side wall of the first glass fiber plate, an adhesion cavity is arranged between the first glass fiber plate and the second glass fiber plate, and an adhesive is poured in the adhesion cavity; the first glass fiber plate is uniformly provided with a plurality of glue overflowing holes, the glue overflowing holes penetrate through the first glass fiber plate, one side wall, close to the first glass fiber plate relatively, of the second glass fiber plate is provided with a plurality of glue blocking blocks, and the glue blocking blocks are located at the glue overflowing holes of the second glass fiber plate relatively. The prepreg glue distribution device has the effect of improving the distribution uniformity of glue solution on prepregs.

Description

Prepreg for copper-clad plate
Technical Field
The application relates to the technical field of prepregs, in particular to a prepreg for a copper-clad plate.
Background
The prepreg is an indispensable semi-finished product of a copper-clad plate and a multilayer printed circuit board in the current industry, and is mainly prepared by soaking and drying a reinforcing material comprising glass fiber cloth, non-woven fabric or wood pulp paper and the like by curing mixed resin. Because the resin of the prepreg is in a semi-cured state, the resin can be melted and bonded again and completely cured at high temperature, so different types of prepreg substrates can be utilized for superposition, and a laminator is adopted for high-temperature hot pressing to form the copper-clad plate or the multilayer printed circuit laminated plate meeting the requirements.
When the existing prepreg is manufactured, the problems that the volatilization speed of a solvent is too high or too low, the leveling property of a glue solution is poor or a reinforcing material has defects and the like when the glue solution is baked easily cause the phenomena of colloidal particles, glue shortage or sagging and the like on the surface of the prepreg. With the development of electronic products towards light, thin, small and multifunctional directions, more and more copper clad laminates use copper foils with the thickness of 12 microns or less. If the surface of the prepreg has defects, the copper foil can be damaged during pressing, and the quality of the copper-clad plate is affected.
SUMMERY OF THE UTILITY MODEL
In order to improve the distribution uniformity of glue solution on the prepreg, the application provides a prepreg for a copper-clad plate.
The application provides a prepreg for copper-clad plate adopts following technical scheme:
a prepreg for a copper-clad plate comprises a first glass fiber plate, wherein a second glass fiber plate is arranged on one side wall of the first glass fiber plate, an adhesion cavity is formed between the first glass fiber plate and the second glass fiber plate, and an adhesive is poured into the adhesion cavity; the first glass fiber plate is uniformly provided with a plurality of glue overflowing holes, the glue overflowing holes penetrate through the first glass fiber plate, one side wall, close to the first glass fiber plate relatively, of the second glass fiber plate is provided with a plurality of glue blocking blocks, and the glue blocking blocks are located at the glue overflowing holes of the second glass fiber plate relatively.
By adopting the technical scheme, the first glass fiber board and the second glass fiber board are the composition structures of the prepreg; when the prepreg is prepared, the first glass fiber board and the second glass fiber board are mutually attached, so that a bonding cavity is formed between the first glass fiber board and the second glass fiber board, the first glass fiber board and the second glass fiber board are extruded after an adhesive is poured into the bonding cavity, the adhesive is pressed and flows at the bonding cavity, in the extrusion process, the excessive adhesive overflows from the glue overflow hole in the first glass fiber board out of the bonding cavity, and when the first glass fiber board is extruded to be abutted against the glue blocking block, the glue overflow hole is sealed, so that enough adhesive is ensured to be in the bonding cavity, the adhesive flows uniformly, no air bubbles are contained, and the first glass fiber board and the second glass fiber board are bonded more tightly; and after the glue solution overflows the glue overflow holes, the glue solution can uniformly overflow the surface of the first glass fiber plate due to the uniform arrangement of the glue overflow holes, so that the distribution uniformity of the adhesive on the prepreg is improved.
Optionally, the first glass fiber plate is relatively far away from the side wall of the second glass fiber plate, and a glue storage groove is formed at an opening of the glue overflow hole.
By adopting the technical scheme, after the adhesive overflows from the adhesive overflow holes, the adhesive flows into the adhesive storage groove, so that the distribution uniformity of the adhesive on the prepreg is further improved.
Optionally, the first glass fiber board is located at the glue overflow hole and provided with a glue overflow chamfer, and the glue overflow chamfer is located at a position where the first glass fiber board is relatively close to the second glass fiber board.
Through adopting above-mentioned technical scheme, the excessive gluey chamfer is convenient for the adhesive to flow to the excessive gluey downthehole from the bonding chamber, has improved the convenience of excessive gluey operation.
Optionally, be provided with the laminating chamfer on hindering gluey piece, the laminating chamfer is mutually supported with the excessive gluey chamfer.
Through adopting above-mentioned technical scheme, when the fine board of extrusion first glass and the second glass are fine for laminating chamfer and the chamfer of overflowing gluing each other, and then improved and hindered the sealing ability of gluey piece to overflowing gluey hole.
Optionally, a side wall of the second glass fiber plate relatively far from the first glass fiber plate is provided with a temperature-resistant layer.
Optionally, a protective layer is disposed on a side wall of the temperature-resistant layer relatively far from the second glass fiber plate.
In summary, the present application at least includes the following beneficial technical effects:
1. a second glass fiber board is arranged on one side wall of the first glass fiber board, a bonding cavity is formed between the first glass fiber board and the second glass fiber board, and an adhesive is poured into the bonding cavity; a plurality of glue overflowing holes are uniformly formed in the first glass fiber plate and penetrate through the first glass fiber plate, a plurality of glue blocking blocks are arranged on one side wall, close to the first glass fiber plate, of the second glass fiber plate, and the glue blocking blocks are located at the positions, opposite to the glue overflowing holes, of the second glass fiber plate; the first glass fiber board and the second glass fiber board are the composition structures of the prepreg; when the prepreg is prepared, the first glass fiber board and the second glass fiber board are mutually attached, so that a bonding cavity is formed between the first glass fiber board and the second glass fiber board, the first glass fiber board and the second glass fiber board are extruded after an adhesive is poured into the bonding cavity, the adhesive is pressed and flows at the bonding cavity, in the extrusion process, the excessive adhesive overflows from the glue overflow hole in the first glass fiber board out of the bonding cavity, and when the first glass fiber board is extruded to be abutted against the glue blocking block, the glue overflow hole is sealed, so that enough adhesive is ensured to be in the bonding cavity, the adhesive flows uniformly, no air bubbles are contained, and the first glass fiber board and the second glass fiber board are bonded more tightly; and after the glue solution overflows the glue overflow holes, the glue solution can uniformly overflow the surface of the first glass fiber plate due to the uniform arrangement of the glue overflow holes, so that the distribution uniformity of the adhesive on the prepreg is improved.
Drawings
Fig. 1 is a schematic cross-sectional view of a prepreg for a copper-clad plate in an embodiment of the present application.
Description of reference numerals: 1. a first glass fiber sheet; 2. a second glass fiber sheet; 3. a bonding chamber; 4. glue overflow holes; 5. a glue blocking block; 6. a binder; 7. a glue storage tank; 8. overflow glue chamfering; 9. fitting and chamfering; 10. a temperature resistant layer; 11. and a protective layer.
Detailed Description
The present application is described in further detail below with reference to fig. 1.
The embodiment of the application discloses a prepreg for a copper-clad plate.
Referring to fig. 1, the prepreg for the copper-clad plate comprises a rectangular first glass fiber plate 1, wherein a second glass fiber plate 2 is arranged on a side wall of the first glass fiber plate 1 with the largest area, and the second glass fiber plate 2 and the first glass fiber plate 1 have the same projection shape along the same direction. In the embodiment of the present application, the first glass fiber plate 1 and the second glass fiber plate 2 are made of glass fiber materials.
Referring to fig. 1, a bonding cavity 3 is formed between a first glass fiber plate 1 and a second glass fiber plate 2, a plurality of glue overflow holes 4 are uniformly formed in the first glass fiber plate 1, the glue overflow holes 4 which are circular penetrate through the first glass fiber plate 1 along a direction perpendicular to the second glass fiber plate 2, a plurality of glue blocking blocks 5 are arranged on a side wall of the second glass fiber plate 2 relatively close to the first glass fiber plate 1, and the glue blocking blocks 5 are located at the positions of the glue overflow holes 4 relatively. After an adhesive 6 is poured into a bonding cavity 3 between a first glass fiber plate 1 and a second glass fiber plate 2, the first glass fiber plate 1 and the second glass fiber plate 2 are extruded to enable the first glass fiber plate 1 and the second glass fiber plate 2 to approach each other, so that the adhesive 6 in the bonding cavity 3 flows under pressure, excessive adhesive 6 overflows from an overflow hole 4 to the surface side wall of the first glass fiber plate 1, and after the overflow hole 4 is sealed by an adhesive blocking block 5, the adhesive 6 does not overflow from the overflow hole 4 any more, namely, the adhesive 6 bonds and fixes the first glass fiber plate 1 and the second glass fiber plate 2 to each other.
Referring to fig. 1, a glue storage groove 7 is formed in the side wall, relatively far away from the second glass fiber plate 2, of the first glass fiber plate 1, the section of the glue storage groove 7 is rectangular, the glue storage groove 7 is located at the orifice of the glue overflow hole 4, and the glue storage groove 7 is communicated with the glue overflow groove; first glass fiber board 1 is located the drill way of excessive gluey hole 4, and is located the one side of being close to second glass fiber board 2 relatively and has seted up excessive gluey chamfer 8, and excessive gluey chamfer 8 orientation deposit gluey groove 7 slope setting, hinders and has seted up laminating chamfer 9 on the gluey piece 5, and laminating chamfer 9 and excessive gluey chamfer 8 setting of laminating each other.
Referring to fig. 1, a side wall of the second glass fiber plate 2 relatively far from the first glass fiber plate 1 is provided with a temperature-resistant layer 10, and a side wall of the temperature-resistant layer 10 relatively far from the second glass fiber plate 2 is provided with a protective layer 11.
The implementation principle of the prepreg for the copper-clad plate in the embodiment of the application is as follows: the first glass fiber board 1 and the second glass fiber board 2 are the composition structure of a prepreg; when a prepreg is prepared, a first glass fiber plate 1 and a second glass fiber plate 2 are mutually attached, so that a bonding cavity 3 is formed between the first glass fiber plate 1 and the second glass fiber plate 2, after an adhesive 6 is poured into the bonding cavity 3, the first glass fiber plate 1 and the second glass fiber plate 2 are extruded, the adhesive 6 is pressed and flows at the bonding cavity 3, in the extrusion process, the excessive adhesive 6 overflows the bonding cavity 3 from an adhesive overflow hole 4 on the first glass fiber plate 1, and when the first glass fiber plate 1 is extruded to be in contact with an adhesive block 5, the adhesive overflow hole 4 is sealed, so that enough adhesive 6 is ensured to be in the bonding cavity 3, the adhesive 6 flows uniformly and does not contain bubbles, and further, the first glass fiber plate 1 and the second glass fiber plate 2 are bonded more tightly; and after the glue solution overflows the glue overflow holes 4, the glue solution can uniformly overflow the surface of the first glass fiber plate 1 due to the uniform arrangement of the glue overflow holes 4, so that the distribution uniformity of the adhesive 6 on the prepreg is improved.
The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims (6)

1. The prepreg for the copper-clad plate is characterized in that: the glass fiber plate comprises a first glass fiber plate (1), wherein a second glass fiber plate (2) is arranged on one side wall of the first glass fiber plate (1), a bonding cavity (3) is formed between the first glass fiber plate (1) and the second glass fiber plate (2), and an adhesive (6) is poured into the bonding cavity (3); the glue leakage prevention structure is characterized in that a plurality of glue overflow holes (4) are uniformly formed in the first glass fiber plate (1), the glue overflow holes (4) penetrate through the first glass fiber plate (1), a plurality of glue blocking blocks (5) are arranged on one side wall, close to the first glass fiber plate (1), of the second glass fiber plate (2), and the glue blocking blocks (5) are located at the positions, opposite to the glue overflow holes (4), of the second glass fiber plate (2).
2. The prepreg according to claim 1, which is characterized in that: the first glass fiber plate (1) is relatively far away from the side wall of the second glass fiber plate (2), and a glue storage groove (7) is formed at the opening of the glue overflow hole (4).
3. The prepreg according to claim 1, which is characterized in that: the first glass fiber board (1) is provided with a glue overflow chamfer (8) at the glue overflow hole (4), and the glue overflow chamfer (8) is positioned at the position where the first glass fiber board (1) is relatively close to the second glass fiber board (2).
4. The prepreg according to claim 3, which is characterized in that: hinder and be provided with laminating chamfer (9) on gluey piece (5), laminating chamfer (9) and overflow gluey chamfer (8) and mutually support.
5. The prepreg according to claim 1, which is characterized in that: and a temperature-resistant layer (10) is arranged on one side wall of the second glass fiber plate (2) relatively far away from the first glass fiber plate (1).
6. The prepreg according to claim 5, which is characterized in that: and a protective layer (11) is arranged on one side wall of the temperature-resistant layer (10) relatively far away from the second glass fiber plate (2).
CN202120820490.5U 2021-04-21 2021-04-21 Prepreg for copper-clad plate Active CN214646478U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202120820490.5U CN214646478U (en) 2021-04-21 2021-04-21 Prepreg for copper-clad plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202120820490.5U CN214646478U (en) 2021-04-21 2021-04-21 Prepreg for copper-clad plate

Publications (1)

Publication Number Publication Date
CN214646478U true CN214646478U (en) 2021-11-09

Family

ID=78465128

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202120820490.5U Active CN214646478U (en) 2021-04-21 2021-04-21 Prepreg for copper-clad plate

Country Status (1)

Country Link
CN (1) CN214646478U (en)

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Date Code Title Description
GR01 Patent grant
GR01 Patent grant
PE01 Entry into force of the registration of the contract for pledge of patent right
PE01 Entry into force of the registration of the contract for pledge of patent right

Denomination of utility model: A semi cured sheet for copper-clad laminates

Effective date of registration: 20231208

Granted publication date: 20211109

Pledgee: Hangzhou branch of Bank of Nanjing Co.,Ltd.

Pledgor: Junxuan new material (Hangzhou) Co.,Ltd.

Registration number: Y2023330002973