CN201528030U - Microstrip antenna filter structure - Google Patents
Microstrip antenna filter structure Download PDFInfo
- Publication number
- CN201528030U CN201528030U CN2009202698525U CN200920269852U CN201528030U CN 201528030 U CN201528030 U CN 201528030U CN 2009202698525 U CN2009202698525 U CN 2009202698525U CN 200920269852 U CN200920269852 U CN 200920269852U CN 201528030 U CN201528030 U CN 201528030U
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- CN
- China
- Prior art keywords
- circuit board
- microstrip antenna
- filter structure
- sheet material
- fracture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model discloses a microstrip antenna filter structure which comprises a microstrip antenna arranged on a circuit board and a metal cavity arranged by surrounding the microstrip antenna. The circuit board comprises three layers of plates bonded through dielectric layers; a fracture is formed on the middle plate of the circuit board, and the metal cavity is electroplated on the surface of the fracture; an enclosed space is formed by the surface of the fracture and the lower layer plate of the circuit board; and the microstrip antenna is fixed on the lower layer plate and is positioned on the upper surface in the sealed space. The filter structure can greatly improve the shielding and processing effects of the circuit board to the microstrip antenna.
Description
Technical field
The utility model relates to wireless communication technique, relates in particular to a kind of micro-strip antenna filter structure.
Background technology
In the electronic wireless communications industry, micro-strip antenna filter is very important parts, and its quality directly influences the quality of communication quality.With reference to figure 1, existing micro-strip antenna filter structure is after being assemblied in microstrip antenna 2 on the circuit board 1, metallic cavity 3 of welding above microstrip antenna 2, and three faces of metallic cavity 3 all are metal covering, microstrip antenna 2 are played the effect of shielding and signal processing.The shortcoming of this structure need be on circuit board weld metal cavity in addition, the production technology trouble, production efficiency is low.
The utility model content
Technical problem to be solved in the utility model is: a kind of micro-strip antenna filter structure is provided, and this structure can realize mechanization, enhances productivity.
For solving the problems of the technologies described above, the utility model adopts following technical scheme:
A kind of micro-strip antenna filter structure, the metallic cavity that includes the microstrip antenna that is arranged on the circuit board and be provided with around described microstrip antenna, described circuit board includes the three ply board material, between every laminate material by the dielectric layer combination; Offer a fracture on the middle level sheet material of this circuit board, and described metallic cavity is electroplated the surface at this fracture, form enclosure space with the upper surface of this circuit board lower floor sheet material, described microstrip antenna then is fixed on the upper surface that described lower floor sheet material is positioned at this enclosure space.
The beneficial effects of the utility model are:
Embodiment of the present utility model is by imbedding metallic cavity circuit board inside, thereby realized mechanization production, improved production efficiency.
Below in conjunction with accompanying drawing the utility model is described in further detail.
Description of drawings
Fig. 1 is the micro-strip antenna filter structure generalized section of prior art.
Fig. 2 is the generalized section of the embodiment of micro-strip antenna filter structure that provides of the utility model.
Fig. 3 is the finished product schematic diagram of the manufacture method that provides among embodiment of micro-strip antenna filter structure of providing of the utility model.
Fig. 4 is the semi-finished product schematic diagram after the subsides dry film step of the manufacture method that provides among embodiment of micro-strip antenna filter structure of providing of utility model.
Fig. 5 is the semi-finished product schematic diagram after the metal plating step of the manufacture method that provides among embodiment of micro-strip antenna filter structure of providing of the utility model.
Fig. 6 is the semi-finished product schematic diagram behind the etching step of the manufacture method that provides among embodiment of micro-strip antenna filter structure of providing of the utility model.
Fig. 7 is the finished product schematic diagram after the pressing step of the manufacture method that provides among embodiment of micro-strip antenna filter structure of providing of the utility model.
Embodiment
Describe the micro-strip antenna filter structure that the utility model provides in detail below with reference to Fig. 1; As shown in the figure, present embodiment mainly includes microstrip antenna 2 that is arranged on the circuit board 1 and the metallic cavity 3 that is provided with around described microstrip antenna 2, circuit board 2 includes three ply board material (upper strata sheet material 11, middle level sheet material 12, lower floor's sheet material 13), passes through dielectric layer 14 combinations between every laminate material; And offer a fracture on the described middle level sheet material 12, and and described metallic cavity 3 electroplates on the surface of this fracture, forms enclosure space with the upper surface of lower floor sheet material 13, microstrip antenna 2 then is fixed on the upper surface that described lower floor sheet material 13 is positioned at this enclosure space.
Describe the manufacture method of the micro-strip antenna filter structure that the utility model provides below in detail, it is made a micro-strip antenna filter structure and mainly may further comprise the steps:
In the first pressing step, the middle level sheet material 12 that will be divided into two sections is respectively by after dielectric layer 14 and concordant combination the in upper strata sheet material 11 outsides, formation one fractures in the middle of described middle level sheet material 12, and the size of this fracture matches with the size of metallic cavity;
The metallic cavity making step carries out electroless copper plating and plating on the surface of described fracture, makes this fracture surface form metallic cavity 3;
The second pressing step will have been electroplated the circuit board semi-finished product of metallic cavity 3 by dielectric layer 14 and 13 pressings of lower floor's sheet material.
During specific implementation, with reference to figure 3, when the described second pressing step is implemented, exist and be difficult to realize all metallized problem of three faces of described metallic cavity, because need combine lower floor's sheet material of cavity and microstrip line by dielectric layer when being plated on the metallic cavity of fracture surface and sealing at last, cause this metallic cavity sealing back to stay the non-metallic zone of the about thickness of dielectric layers of thickness easily with the position 4 that described lower floor sheet material contacts with dielectric layer in its lower end, both sides.
In order to address this problem, the second pressing step of present embodiment can specifically adopt following steps:
In pasting the dry film step, with reference to figure 4, stick dry film 5 at the lower surface of middle level sheet material, the outside of described dry film is concordant with the outside of described middle level sheet material, and is inboard then the step 60 that indentation one is preset is distinguished in both sides described relatively fracture;
In the metal plating step,,, make that the surface of this metal level 61 is concordant with metallic cavity 3 inner surfaces at step 60 place's electroplated metal layers 61 with reference to figure 5;
In etching step,, dry film 5 is etched away with reference to figure 6;
In finished product pressing step, with reference to figure 7, to etch away lower floor's sheet material 13 that semi-finished product behind the dry film 5 and upper surface be provided with microstrip antenna 2 by dielectric layer 14 pressings, microstrip antenna 2 is positioned at the appropriate location of the enclosure space that lower floor's sheet material 13 and metallic cavity 3 form after the pressing.
Above-mentioned steps can realize effectively that circuit board buries all metallized requirement of cavity body structure three faces, improves circuit board microstrip line signal shielding and treatment effect.
The above is a preferred implementation of the present utility model; should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the utility model principle; can also make some improvements and modifications, these improvements and modifications also are considered as protection range of the present utility model.
Claims (1)
1. micro-strip antenna filter structure includes microstrip antenna that is arranged on the circuit board and the metallic cavity that is provided with around described microstrip antenna, and described circuit board includes the three ply board material, between every laminate material by the dielectric layer combination; It is characterized in that: offer a fracture on the middle level sheet material of this circuit board, and described metallic cavity is electroplated the surface at this fracture, form enclosure space with the upper surface of this circuit board lower floor sheet material, described microstrip antenna then is fixed on the upper surface that described lower floor sheet material is positioned at this enclosure space.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202698525U CN201528030U (en) | 2009-10-30 | 2009-10-30 | Microstrip antenna filter structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202698525U CN201528030U (en) | 2009-10-30 | 2009-10-30 | Microstrip antenna filter structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201528030U true CN201528030U (en) | 2010-07-14 |
Family
ID=42519312
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009202698525U Expired - Lifetime CN201528030U (en) | 2009-10-30 | 2009-10-30 | Microstrip antenna filter structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201528030U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101702457B (en) * | 2009-10-30 | 2013-05-08 | 深南电路有限公司 | Microstrip antenna filter structure and preparation method thereof |
| CN101714684B (en) * | 2009-12-01 | 2013-10-16 | 深南电路有限公司 | Manufacturing method of micro-strip antenna filter structure |
-
2009
- 2009-10-30 CN CN2009202698525U patent/CN201528030U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101702457B (en) * | 2009-10-30 | 2013-05-08 | 深南电路有限公司 | Microstrip antenna filter structure and preparation method thereof |
| CN101714684B (en) * | 2009-12-01 | 2013-10-16 | 深南电路有限公司 | Manufacturing method of micro-strip antenna filter structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20100714 Effective date of abandoning: 20091030 |
|
| RGAV | Abandon patent right to avoid regrant |