CN101702457B - Microstrip antenna filter structure and preparation method thereof - Google Patents
Microstrip antenna filter structure and preparation method thereof Download PDFInfo
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- CN101702457B CN101702457B CN 200910208876 CN200910208876A CN101702457B CN 101702457 B CN101702457 B CN 101702457B CN 200910208876 CN200910208876 CN 200910208876 CN 200910208876 A CN200910208876 A CN 200910208876A CN 101702457 B CN101702457 B CN 101702457B
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Abstract
The invention discloses a microstrip antenna filter structure. The structure contains a microstrip antenna arranged on a circuit board and a metal cavity arranged around the microstrip antenna, wherein the circuit board comprises three layers of plates, the plates are combined together through medium layers; the middle-layer plate of the circuit board is provided with a fracture section, the metal cavity is electroplated on the surface of the fracture section to form an enclosed space with the upper surface of the bottom-layer plate of the circuit board, and the microstrip antenna is fixed on the bottom-layer plate and positioned on the upper surface of the enclosed space. The invention also discloses a preparation method of the microstrip antenna filter structure. By using the microstrip antenna filter structure and preparation method thereof of the invention, the shielding and processing effects of the circuit board on the microstrip line can be greatly improved.
Description
Technical field
The present invention relates to wireless communication technique, relate in particular to a kind of micro-strip antenna filter structure and preparation method thereof.
Background technology
In the electronic wireless communications industry, micro-strip antenna filter is very important parts, and its quality directly affects the quality of communication quality.With reference to figure 1, existing micro-strip antenna filter structure is after being assemblied in microstrip antenna 2 on circuit board 1, metallic cavity 3 of welding above microstrip antenna 2, and three faces of metallic cavity 3 are all metal covering, microstrip antenna 2 are played the effect of shielding and signal processing.The shortcoming of this structure need to be on circuit board weld metal cavity in addition, the production technology trouble, production efficiency is low.
Summary of the invention
Technical problem to be solved by this invention is: a kind of micro-strip antenna filter structure is provided, and this structure can realize mechanization, enhances productivity.
The further technical problem to be solved of the present invention is: a kind of micro-strip antenna filter structure manufacture method is provided, and the method can realize mechanization, enhances productivity.
For solving the problems of the technologies described above, the present invention adopts following technical scheme:
A kind of micro-strip antenna filter structure, the metallic cavity that includes the microstrip antenna that is arranged on circuit board and arrange around described microstrip antenna, described circuit board includes the three ply board material, between every laminate material by the dielectric layer combination; Offer a fracture on the middle level sheet material of this circuit board, and described metallic cavity is electroplated the surface at this fracture, form enclosure space with the upper surface of this circuit board lower floor sheet material, described microstrip antenna is fixed on the upper surface that described lower floor sheet material is positioned at this enclosure space.
Correspondingly, the present invention also provides a kind of micro-strip antenna filter structure manufacture method, and the method comprises the following steps:
The first pressing step will be divided into the middle level sheet material of two sections respectively by after the concordant combination in the outside of dielectric layer and upper strata sheet material, form a fracture in the middle of the sheet material of described middle level;
The metallic cavity making step carries out electroless copper plating and plating on the surface of described fracture, makes this fracture surface form metallic cavity;
The second pressing step, with the circuit board semi-finished product that are electroplate with described metallic cavity by dielectric layer and lower floor's sheet material pressing,
Described the second pressing step specifically comprises:
Paste the dry film step, stick dry film at the lower surface of described middle level sheet material, the outside of described dry film is concordant with the outside of described middle level sheet material, and is inboard the step that indentation one is preset is distinguished in both sides relatively described fracture;
The metal plating step at described step place electroplated metal layer, makes the surface of this metal level concordant with described metallic cavity inner surface;
Etching step etches away described dry film;
Finished product pressing step will etch away lower floor's sheet material that semi-finished product after dry film and upper surface be provided with microstrip antenna by the dielectric layer pressing, and after pressing, described microstrip antenna is positioned at the enclosure space of described lower floor sheet material and the formation of described metallic cavity.
The invention has the beneficial effects as follows:
Embodiments of the invention are by imbedding metallic cavity circuit board inside, thereby have realized mechanization production, have improved production efficiency.
The present invention is described in further detail below in conjunction with accompanying drawing.
Description of drawings
Fig. 1 is the micro-strip antenna filter structure generalized section of prior art.
Fig. 2 is the generalized section of an embodiment of micro-strip antenna filter structure provided by the invention.
Fig. 3 is the finished product schematic diagram of an embodiment of micro-strip antenna filter manufacture method provided by the invention.
Fig. 4 is the semi-finished product schematic diagram after subsides dry film step in embodiment of micro-strip antenna filter manufacture method provided by the invention.
Fig. 5 is the semi-finished product schematic diagram after the metal plating step in embodiment of micro-strip antenna filter manufacture method provided by the invention.
Fig. 6 is the semi-finished product schematic diagram after etching step in embodiment of micro-strip antenna filter manufacture method provided by the invention.
Fig. 7 is the finished product schematic diagram after the pressing step in embodiment of micro-strip antenna filter manufacture method provided by the invention.
Embodiment
Describe micro-strip antenna filter structure provided by the invention in detail below with reference to Fig. 1; As shown in the figure, the present embodiment mainly includes the microstrip antenna 2 that is arranged on circuit board 1 and the metallic cavity 3 that arranges around described microstrip antenna 2, circuit board 2 includes three ply board material (upper strata sheet material 11, middle level sheet material 12, lower floor's sheet material 13), passes through dielectric layer 14 combinations between every laminate material; And offer a fracture on described middle level sheet material 12, and and described metallic cavity 3 electroplates on the surface of this fracture, forms enclosure space with the upper surface of lower floor sheet material 13, microstrip antenna 2 is fixed on the upper surface that described lower floor sheet material 13 is positioned at this enclosure space.
The below describes an embodiment of micro-strip antenna filter structure manufacture method provided by the invention in detail; The present embodiment realizes that a micro-strip antenna filter structure making flow process mainly comprises the following steps:
In the first pressing step, will be divided into the middle level sheet material 12 of two sections respectively by after dielectric layer 14 and the 11 concordant combinations in the outside of upper strata sheet material, formation one fractures in the middle of described middle level sheet material 12, the size of this fracture matches with the size of metallic cavity;
The metallic cavity making step carries out electroless copper plating and plating on the surface of described fracture, makes this fracture surface form metallic cavity 3;
The second pressing step will have been electroplated the circuit board semi-finished product of metallic cavity 3 by dielectric layer 14 and 13 pressings of lower floor's sheet material.
During specific implementation, with reference to figure 3, when described the second pressing step is implemented, existence is difficult to realize all metallized problems of three faces of described metallic cavity, because need to combine lower floor's sheet material of cavity and microstrip line by dielectric layer when being plated on the metallic cavity of fracture surface and sealing at last, cause after this metallic cavity sealing easily staying with the position 4 that described lower floor sheet material contacts with dielectric layer in its lower end, both sides the non-metallic zone of the about thickness of dielectric layers of thickness.
In order to address this problem, the second pressing step of the present embodiment can specifically adopt following steps:
In pasting the dry film step, with reference to figure 4, stick dry film 5 at the lower surface of middle level sheet material, the outside of described dry film is concordant with the outside of described middle level sheet material, and is inboard the step 60 that indentation one is preset is distinguished in both sides relatively described fracture;
In the metal plating step, with reference to figure 5, at step 60 place's electroplated metal layers 61, make the surface of this metal level 61 concordant with metallic cavity 3 inner surfaces;
In etching step, with reference to figure 6, dry film 5 is etched away;
In finished product pressing step, with reference to figure 7, to etch away lower floor's sheet material 13 that semi-finished product after dry film 5 and upper surface be provided with microstrip antenna 2 by dielectric layer 14 pressings, after pressing, microstrip antenna 2 is positioned at the appropriate location of the enclosure space that lower floor's sheet material 13 and metallic cavity 3 form.
Above-mentioned steps can realize effectively that circuit board buries all metallized requirements of cavity body structure three faces, improves circuit board microstrip line signal shielding and treatment effect.
The above is the preferred embodiment of the present invention; should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the principle of the invention; can also make some improvements and modifications, these improvements and modifications also are considered as protection scope of the present invention.
Claims (2)
1. micro-strip antenna filter structure includes the microstrip antenna that is arranged on circuit board and the metallic cavity that arranges around described microstrip antenna, and described circuit board includes the three ply board material, between every laminate material by the dielectric layer combination; It is characterized in that: offer a fracture on the middle level sheet material of this circuit board, and described metallic cavity is electroplated the surface at this fracture, form enclosure space with the upper surface of this circuit board lower floor sheet material, described microstrip antenna is fixed on the upper surface that described lower floor sheet material is positioned at this enclosure space.
2. a micro-strip antenna filter structure manufacture method, is characterized in that, the method comprises the following steps:
The first pressing step will be divided into the middle level sheet material of two sections respectively by after the concordant combination in the outside of dielectric layer and upper strata sheet material, form a fracture in the middle of the sheet material of described middle level;
The metallic cavity making step carries out electroless copper plating and plating on the surface of described fracture, makes this fracture surface form metallic cavity;
The second pressing step, with the circuit board semi-finished product that are electroplate with described metallic cavity by dielectric layer and lower floor's sheet material pressing,
Described the second pressing step specifically comprises:
Paste the dry film step, stick dry film at the lower surface of described middle level sheet material, the outside of described dry film is concordant with the outside of described middle level sheet material, and is inboard the step that indentation one is preset is distinguished in both sides relatively described fracture;
The metal plating step at described step place electroplated metal layer, makes the surface of this metal level concordant with described metallic cavity inner surface;
Etching step etches away described dry film;
Finished product pressing step will etch away lower floor's sheet material that semi-finished product after dry film and upper surface be provided with microstrip antenna by the dielectric layer pressing, and after pressing, described microstrip antenna is positioned at the enclosure space of described lower floor sheet material and the formation of described metallic cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN 200910208876 CN101702457B (en) | 2009-10-30 | 2009-10-30 | Microstrip antenna filter structure and preparation method thereof |
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| CN 200910208876 CN101702457B (en) | 2009-10-30 | 2009-10-30 | Microstrip antenna filter structure and preparation method thereof |
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| Publication Number | Publication Date |
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| CN101702457A CN101702457A (en) | 2010-05-05 |
| CN101702457B true CN101702457B (en) | 2013-05-08 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101714684B (en) * | 2009-12-01 | 2013-10-16 | 深南电路有限公司 | Manufacturing method of micro-strip antenna filter structure |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2938452Y (en) * | 2006-05-18 | 2007-08-22 | 兰州大学 | Back cavity micro-band antenna |
| CN101436702A (en) * | 2008-12-12 | 2009-05-20 | 惠州市硕贝德通讯科技有限公司 | Waveguide-microstrip line transformation and power divider |
| CN201528030U (en) * | 2009-10-30 | 2010-07-14 | 深南电路有限公司 | Microstrip antenna filter structure |
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2009
- 2009-10-30 CN CN 200910208876 patent/CN101702457B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2938452Y (en) * | 2006-05-18 | 2007-08-22 | 兰州大学 | Back cavity micro-band antenna |
| CN101436702A (en) * | 2008-12-12 | 2009-05-20 | 惠州市硕贝德通讯科技有限公司 | Waveguide-microstrip line transformation and power divider |
| CN201528030U (en) * | 2009-10-30 | 2010-07-14 | 深南电路有限公司 | Microstrip antenna filter structure |
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| CN101702457A (en) | 2010-05-05 |
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Owner name: SHENNAN CIRCUIT CO., LTD. Free format text: FORMER NAME: SHENZHEN SHENNAN CIRCUITS CO., LTD. |
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Address after: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518000, Nanshan District, Guangdong, Shenzhen, China bridge, South Shahe City Industrial Zone Patentee before: Shenzhen Shennan Circuits Co., Ltd. |