CN208035423U - High-precision Multi-step forming board - Google Patents

High-precision Multi-step forming board Download PDF

Info

Publication number
CN208035423U
CN208035423U CN201820380737.4U CN201820380737U CN208035423U CN 208035423 U CN208035423 U CN 208035423U CN 201820380737 U CN201820380737 U CN 201820380737U CN 208035423 U CN208035423 U CN 208035423U
Authority
CN
China
Prior art keywords
die head
step forming
forming board
support plate
precision multi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201820380737.4U
Other languages
Chinese (zh)
Inventor
周继葆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangyin Kelida Electronic Co Ltd
Original Assignee
Jiangyin Kelida Electronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangyin Kelida Electronic Co Ltd filed Critical Jiangyin Kelida Electronic Co Ltd
Priority to CN201820380737.4U priority Critical patent/CN208035423U/en
Application granted granted Critical
Publication of CN208035423U publication Critical patent/CN208035423U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

A kind of high-precision Multi-step forming board of the utility model, the high-precision Multi-step forming board includes organism (1) and support plate (4), it is installed with die head (2) on the body (1), the die head (2) is located at the top of support plate (4), it is horizontally arranged with strip hole (2.1) on the die head (2), hole punching (2.2) is vertically provided on the die head (2), and strip hole (2.1) and hole punching (2.2) intersect vertically and penetrate through connection;The punching block (3) installed on body (1) punch is inserted into the hole punching (2.2) of die head (2), the front of the support plate (4) is provided with thermal conductive silicon rubber cushion (5), and the back side is provided with heating plate (6).Punching and heating adherency operation are incorporated into one, not only increase operating efficiency, also so that the consistency of product is preferable, increase the synthesized competitiveness of product by a kind of high-precision Multi-step forming board of the utility model.

Description

High-precision Multi-step forming board
Technical field
The utility model is related to a kind of punch table, reinforcing chip is punched out, it is adhered to one more particularly, to a kind of High-precision Multi-step forming board, belong to wiring board production equipment technology.
Background technology
Currently, with electronics miniaturization, lightening development trend, flexible circuit board is also because its is frivolous and can be complete It receives and is widely applied;But for the position that needs such as " golden fingers " repeatedly plug, flexible circuit board is excessively light because of material It is soft and be easy to be broken during assembly or use;For this reason, it may be necessary to adhere to reinforcing chip in these damageable zones to increase Its intensity;Conventional reinforcement mode is manual operations, the reinforcing chip of lower suitable size is cut in the way of aritificial cut-off, then It is placed in behind the position for needing reinforcement and heating adherency is carried out by heat gun;It finds in actual use, such manual type is made Industry inefficiency, and adhesiving effect is poor, and due to manual operation, there are certain operation errors by different operation personnel, therefore viscous The consistency of attached product is poor, to answer the presentation quality of first product, use that is serious or even influencing product.Because urgently A kind of mechanized manner is needed to substitute manual type to realize the production of high-efficiency high-accuracy.
Invention content
Purpose of the utility model is to overcome the above-mentioned shortcomings and provide a kind of high-precision Multi-step forming boards, will punching It is incorporated into one with heating adherency operation, operating efficiency is not only increased, also so that the consistency of product is preferable, increases product Synthesized competitiveness.
What the purpose of this utility model was realized in:
A kind of high-precision Multi-step forming board, the high-precision Multi-step forming board include organism and support plate, the load The material of plate is metal, is installed with die head on the body, and the die head is located at the top of support plate, transverse direction on the die head It is provided with strip hole, hole punching is vertically provided on the die head, and strip hole and hole punching intersect vertically and penetrate through connection; The punching block installed on the body punch is inserted into the hole punching of die head, and the front of the support plate is provided with thermal conductive silicon rubber cushion, The back side is provided with heating plate.
A kind of high-precision Multi-step forming board of the utility model is set with biscuit, biscuit on the emptying roller being arranged by body The reinforcement strip of interior winding is behind the strip hole of die head on wind-up roll.
A kind of high-precision Multi-step forming board of the utility model, between die head and emptying roller, between die head and wind-up roll It is provided with tensioning wheel.
A kind of high-precision Multi-step forming board of the utility model, the heating plate include PVC substrates, the PVC substrates Upper surface be attached at the back side of support plate, the lower surfaces of the PVC substrates is coated with fever ink layer, the two of the fever ink layer The power cord drawn by connecting terminal is held to be connected to the positive and negative anodes of DC power supply.
A kind of high-precision Multi-step forming board of the utility model, the heating plate include PVC substrates, the PVC substrates Upper surface be attached at the back side of support plate, the lower surface of the PVC substrates is pasted with more electric heating wires, more electric heating wire phases The both ends of power supply are mutually accessed after parallel connection.
Compared with prior art, the utility model has the beneficial effects that:
The utility model adds reinforcing chip to be pressed on the wiring board of heating while being punched reinforcing chip, to realize punching With adherency institutional operation, and it ensure that the dynamics of adherency will not occur compared to manual type using the pressure of press machine Offset, to improve adhesiving effect;Meanwhile ensure that by die head each punching press reinforcing chip it is in the same size, compared to Conventional aritificial cut-off mode, it is not only efficient, and also consistency is preferable, effectively raises the quality of product.
Description of the drawings
Fig. 1 is a kind of structural schematic diagram of high-precision Multi-step forming board of the utility model.
Fig. 2 is a kind of structure schematic diagram of the die head of high-precision Multi-step forming board of the utility model.
Fig. 3 is that a kind of wiring board of high-precision Multi-step forming board of the utility model adheres to the effect diagram after reinforcing chip (influence part in figure and be illustrated as the reinforcing chip adhered to).
Wherein:
Body 1, die head 2, punching block 3, support plate 4, thermal conductive silicon rubber cushion 5, heating plate 6, emptying roller 7, wind-up roll 8, tensioning wheel 9;
Strip hole 2.1, hole punching 2.2.
Specific implementation mode
Referring to Fig. 1~3, the utility model is related to a kind of high-precision Multi-step forming board, the high-precision Multi-step forming Board includes organism 1 and support plate 4, and the material of the support plate 4 is metal, it is characterised in that:It is installed on the body 1 Die head 2, the die head 2 are located at the top of support plate 4, are horizontally arranged with strip hole 2.1 on the die head 2, vertical on the die head 2 It is provided with hole punching 2.2, and strip hole 2.1 and hole punching 2.2 intersect vertically and penetrate through connection;It is installed on 1 punch of the body Punching block 3 be inserted into die head 2 hole punching 2.2 in, the front of the support plate 4 is provided with (the thermal conductive silicon rubber cushion 5 of thermal conductive silicon rubber cushion 5 Play a dual role of heat conduction and buffering), the back side is provided with heating plate 6 (for heating up);
Preferably, the heating plate 6 includes PVC substrates, and the upper surface of the PVC substrates is attached at the back side of support plate 4 On, the lower surfaces of the PVC substrates is coated with fever ink layer, the electricity that the both ends of the fever ink layer are drawn by connecting terminal Source line is connected to the positive and negative anodes of DC power supply;To which by the ink layer persistent fever that generates heat, fever ink layer has thermal conversion efficiency The high feature of rate has energy-efficient positive benefit;
Preferably, the heating plate 6 includes PVC substrates, and the upper surface of the PVC substrates is attached at the back side of support plate 4 On, the lower surface of the PVC substrates is pasted with more electric heating wires, the two of access power supply after more electric heating wires are parallel with one another End;It is simple in structure, easy to use by way of electric heating wire heating;
Concretely, it is set with biscuit on the emptying roller 7 that 1 side of body is arranged, the reinforcement strip wound in biscuit passes through mould Behind first 2 strip hole 2.1 on wind-up roll 8;
Further, it is both provided with tensioning wheel 9 between die head 2 and emptying roller 7, between die head 2 and wind-up roll 8, used respectively In to the reinforcement strip before punching and the reinforcement strip progress tensioning operation after punching;
In addition:It should be noted that above-mentioned specific implementation mode is only a prioritization scheme of this patent, the skill of this field Any change or improvement that art personnel are done according to above-mentioned design, within the protection domain of this patent..

Claims (5)

1. a kind of high-precision Multi-step forming board, the high-precision Multi-step forming board includes organism (1) and support plate (4), institute The material for stating support plate (4) is metal, it is characterised in that:Die head (2), die head (2) position are installed on the body (1) Top in support plate (4) is horizontally arranged with strip hole (2.1) on the die head (2), punching is vertically provided on the die head (2) Cut hole (2.2), and strip hole (2.1) and hole punching (2.2) intersect vertically and penetrate through connection;It is installed on body (1) punch Punching block (3) be inserted into die head (2) hole punching (2.2) in, the front of the support plate (4) is provided with thermal conductive silicon rubber cushion (5), the back of the body Face is provided with heating plate (6).
2. a kind of high-precision Multi-step forming board as described in claim 1, it is characterised in that:The emptying roller being arranged by body (1) (7) biscuit is set on, the reinforcement strip wound in biscuit is behind the strip hole (2.1) of die head (2) wound on wind-up roll (8) On.
3. a kind of high-precision Multi-step forming board as described in claim 1, it is characterised in that:Die head (2) and emptying roller (7) it Between, between die head (2) and wind-up roll (8) be both provided with tensioning wheel (9).
4. a kind of high-precision Multi-step forming board as described in claim 1, it is characterised in that:The heating plate (6) includes PVC The upper surface of substrate, the PVC substrates is attached at the back side of support plate (4), and the lower surface of the PVC substrates is coated with fever ink Layer, the both ends of the fever ink layer are connected to the positive and negative anodes of DC power supply by the power cord that connecting terminal is drawn.
5. a kind of high-precision Multi-step forming board as described in claim 1, it is characterised in that:The heating plate (6) includes PVC The upper surface of substrate, the PVC substrates is attached at the back side of support plate (4), and the lower surface of the PVC substrates is pasted with more electricity and adds Heated filament, the both ends of access power supply after more electric heating wires are parallel with one another.
CN201820380737.4U 2018-03-20 2018-03-20 High-precision Multi-step forming board Active CN208035423U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201820380737.4U CN208035423U (en) 2018-03-20 2018-03-20 High-precision Multi-step forming board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201820380737.4U CN208035423U (en) 2018-03-20 2018-03-20 High-precision Multi-step forming board

Publications (1)

Publication Number Publication Date
CN208035423U true CN208035423U (en) 2018-11-02

Family

ID=63948911

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201820380737.4U Active CN208035423U (en) 2018-03-20 2018-03-20 High-precision Multi-step forming board

Country Status (1)

Country Link
CN (1) CN208035423U (en)

Similar Documents

Publication Publication Date Title
CN208035423U (en) High-precision Multi-step forming board
CN205752240U (en) A kind of gold silver plate LED support
CN202197454U (en) Automatic attaching device for circuit board and thin attaching layer
CN207474599U (en) It is melted into the adjustable chemical conversion laminate of pcb board
CN204332701U (en) Negative nailing machine mold mechanism
CN207927005U (en) A kind of wiring board consent pressing structure
CN202053617U (en) Bonding sheet structure used for improving uniformity of thickness of copper-clad plate
CN210048202U (en) Multi-channel sucker
CN208835180U (en) Continuous remaining cream control device
CN207736773U (en) The compaction mold of PET film is pasted on pcb board
CN207057396U (en) A kind of device of copper foil material automatic chamfering
CN205086343U (en) Flexible packaging bag delivery port forming device that twists
CN205828566U (en) A kind of lithium ion battery multi-winding-core parallel connection battery core flattens tape sticking device
CN215921248U (en) Hot press
CN205871450U (en) Glass UV rendition equipment
CN204981738U (en) Double faced adhesive tape
CN212881171U (en) Vacuum defoaming device for circuit board
CN103857190A (en) Preparation method for FPC board
CN204810700U (en) A combination formula clamping device for $integrateing PCD board
CN216852547U (en) Ultra-thin conductive adhesive steel sheet reinforcement pressfitting structure
CN209545995U (en) The novel bit architecture that allows of the gold-plated product of FPC
CN205856800U (en) Electric blanket sewing die
CN203015294U (en) Dry film pressing device for one-side circuit board
CN207509986U (en) A kind of cold wave combined printing device
CN215096244U (en) Hot melt adhesive bonding machine with ironing function

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant