CN207736773U - The compaction mold of PET film is pasted on pcb board - Google Patents
The compaction mold of PET film is pasted on pcb board Download PDFInfo
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- CN207736773U CN207736773U CN201721794147.8U CN201721794147U CN207736773U CN 207736773 U CN207736773 U CN 207736773U CN 201721794147 U CN201721794147 U CN 201721794147U CN 207736773 U CN207736773 U CN 207736773U
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- cope plate
- lower template
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- compaction mold
- void region
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Abstract
The utility model discloses a kind of compaction molds for pasting PET film on pcb board, including：Cope plate, the back side are machined with one or more first void regions with the first depth；One or more cope plate buffer layers, each cope plate buffer layer is that black foamed cotton layer is pasted with layers of two-sided, the second void region corresponding with the hollow out shape of the first void region is provided on black foamed cotton layer, layers of two-sided is used to each cope plate buffer layer correspondence being pasted onto each first void region；And lower template, multiple positioning cylinders are provided with, positioning cylinder is used to the pcb board for being pasted with PET film being fastened on lower template, and the front of lower template is machined with one or more third void regions and the 4th void region；Cope plate can be connected by guide post with lower template and be snapped together.The compaction mold of the utility model is simple in structure, light easy to operate, and each part of the PET film pasted on pcb board can be compacted, bubble-free, and the homogeneity of product is good, and qualification rate is high.
Description
Technical field
The utility model belongs to PCB circuit surface mounting techniques field, more particularly to a kind of for pasting PET on pcb board
The compaction mold of film.
Background technology
Currently, in PCB circuit board install metal dome can only using it is pure it is manual by the way of.Specially first glue-line is pasted onto
On pcb board face, metal dome is put in corresponding position by hand, then glue-line is pasted onto with one layer of PET film (high temperature resistance polyester film)
On, to play the role of fixed metal dome.It needs to compress this three layers of pcb board, glue-line and PET film at this time, due on pcb board having
Many electronic components such as LED light and resistance, since these electronic components are uneven, and many local glue-line width are only
Have less than 2mm, can only bit by bit be flattened by hand using swab stick or flat tool.Therefore, existing to paste PET film
That there are working efficiencies is extremely low for method, and pure craft is difficult to squeeze uniform, and there are bubble between PET film and pcb board, rejection rate is higher.
Therefore need that a kind of mold can disposably this three lamination be tight by pcb board, glue-line and PET film, to improve qualification rate,
And significantly improve working efficiency.
The information for being disclosed in the background technology part is merely intended to increase the understanding to the general background of the utility model, and
It is not construed as recognizing or implying in any form that information composition has been existing well known to persons skilled in the art
Technology.
Utility model content
It is existing to overcome the purpose of this utility model is to provide a kind of compaction mold for pasting PET film on pcb board
There is the mold work of the stickup PET film of technology extremely inefficient, it is difficult to squeeze uniform, bubble-free, the higher problem of rejection rate.
To achieve the above object, the utility model provides a kind of compaction mold for pasting PET film on pcb board, packet
It includes：Cope plate, the back side are machined with one or more first void regions with the first depth；One or more cope plates are slow
Layer is rushed, each cope plate buffer layer is that black foamed cotton layer is pasted with layers of two-sided, is provided on black foamed cotton layer and the first void region
Corresponding second void region of hollow out shape, layers of two-sided is used to each cope plate buffer layer correspondence being pasted onto each the
On one void region；And lower template, multiple positioning cylinders are provided with, positioning cylinder is used to be pasted with the PCB of PET film
Plate is fastened in lower template, and the front of lower template is machined with one or more third void regions and the 4th void region；
Cope plate can be connected by guide post with lower template and be snapped together.
Preferably, in above-mentioned technical proposal, the first depth is the thickness less than cope plate.
Preferably, in above-mentioned technical proposal, setting is there are two first positioning hole on cope plate, in lower template there are two settings
Second location hole, first positioning hole can be located by connecting with second location hole by guide post.
Preferably, in above-mentioned technical proposal, the thickness of lower template is more than the thickness of cope plate.
Preferably, in above-mentioned technical proposal, there is the second depth, the 4th void region to have third deep for third void region
Degree, the second depth are more than third depth.
Preferably, in above-mentioned technical proposal, the second depth is 3mm, and third depth is 0.8mm.
Preferably, in above-mentioned technical proposal, the thickness of black foamed cotton layer is 0.5-1mm.
Preferably, in above-mentioned technical proposal, the material of cope plate and lower template is bakelite.
Preferably, in above-mentioned technical proposal, the diameter of guide post is equal with the internal diameter of first positioning hole, second location hole.
Compared with prior art, the utility model has the advantages that：
The compaction mold for pasting PET film on pcb board of the utility model is simple in structure, light, easy to operate, greatly
It improves work efficiency.The each part of the PET film pasted on pcb board can be compacted, bubble-free, and the homogeneity of product is good, from
And product quality is significantly improved, and fraction defective can be reduced to 1% or less.
Description of the drawings
Fig. 1 is the front view of the cope plate of compaction mold according to the present utility model；
Fig. 2 is the vertical view of the cope plate of compaction mold according to the present utility model；
Fig. 3 is the schematic diagram of the cope plate buffer layer of compaction mold according to the present utility model；
Fig. 4 is the front view of the lower template of compaction mold according to the present utility model；
Fig. 5 is the vertical view of the lower template of compaction mold according to the present utility model.
Specific implementation mode
Below in conjunction with the accompanying drawings, specific embodiment of the present utility model is described in detail, it is to be understood that this practicality
Novel protection domain is not restricted by specific implementation.
Unless otherwise explicitly stated, otherwise in entire disclosure and claims, term " comprising " or its change
It changes such as "comprising" or " including " etc. and will be understood to comprise stated element or component, and do not exclude other members
Part or other component parts.
As shown in Figures 1 to 5, according to the compression for pasting PET film on pcb board of specific embodiment of the present invention
Mold, including：Cope plate 1, one or more cope plate buffer layers 2 and lower template 3.Wherein, there are one the processing of 1 back side of cope plate
Or multiple first void regions 4 with the first depth h1.Each cope plate buffer layer 2 is pasted with double faced adhesive tape for black foamed cotton layer
Layer, it is provided with the second void region 5 corresponding with the hollow out shape of the first void region on black foamed cotton layer, layers of two-sided is used for
Each cope plate buffer layer 2 correspondence is pasted onto on each first void region 4.Multiple positioning cylinders are provided in lower template 3
6, positioning cylinder 6 is used to the pcb board for being pasted with PET film being fastened on lower template 3, and the front of lower template 3 is machined with one
A or multiple thirds void region 7 and the 4th void region 8.Cope plate 1 can be connected by guide post with lower template 3 and be fastened on one
It rises.
In said program, setting is there are two first positioning hole 9 on cope plate, and there are two second location holes for setting in lower template
10, first positioning hole 9 can be located by connecting with second location hole 10 by guide post, and the diameter of guide post and first positioning hole 9, the
The internal diameter of two location holes 10 is equal.First depth h1 is the thickness less than cope plate 1.The thickness of lower template 3 is more than cope plate 1
Thickness.Third void region has the second depth h2, and there is third depth h3, the second depth h2 to be more than for the 4th void region
Three depth h3.The thickness of black foamed cotton layer is 0.5-1mm, and the thickness of layers of two-sided is about 0.1mm.Black foamed cotton layer can be squeezed flexibly
Pcb board can protect pcb board while compressing.Cope plate and the material of lower template are bakelite, and material pressure resistance, operation is gently
Just, it and is easy to preserve.Preferably, the first depth h1 is 3mm, and the second depth h2 is 3mm, and third depth h3 is 0.8mm, black foam
The thickness of layer is 0.5mm, can either ensure uniformly to compress pcb board, bubble-free in this way, and can protect pcb board and electronic component
It is not damaged.It should be understood, however, that the first void region 4 as shown in Figs. 1-5, the second void region 5, third vacancy section
The hollow out shape of domain 7 and the 4th void region 8 is exemplary only, and not restrictive, can be according to the electronics member device of pcb board
The different hollow out shape and depth of the concrete shape specifications design of part.
The specific work process of the compaction mold for pasting PET film on pcb board of the utility model is：
For the component on pcb board positive and negative, one or more first void regions are set in 1 corresponding position of cope plate
4,7 and the 4th void region 8 of one or more third void regions is provided in lower template 3, it in this way will not be in bonding processes
Middle damage PCB circuit board and relative electronic components.Pcb board to be compressed is positioned in lower template 3, and uses positioning cylinder
6 fix good position, and matching hole that at this time can be using the former fabrication hole on pcb board as the positioning cylinder 6 of compaction mold carries out
Stationary positioned.Cope plate 1 is snapped together by guide post and lower template 3 again, mold is then placed in forcing press working region,
Using 5S is compressed under forcing press 5T pressure, compaction mold is taken out after forcing press is molded, removes cope plate 1, takes out PCB
Plate completes a pcb board, glue-line and PET film and compresses.The each part of PET film pasted on pcb board can be compacted, without gas
Bubble, the homogeneity of product is good, to improve product quality, and fraction defective can be reduced to 1% or less.
The description of the aforementioned specific exemplary embodiment to the utility model is in order to illustrate and illustration purpose.These
Description is not wishing to for the utility model to be limited to disclosed precise forms, and it will be apparent that according to the above instruction, can carry out
Many change and variations.The purpose of selecting and describing the exemplary embodiment is that explaining the specific principle of the utility model
And its practical application, so that those skilled in the art can realize and utilize a variety of different examples of the utility model
Property embodiment and various chooses and changes.The scope of the utility model is intended to by claims and its waits similar shapes
Formula is limited.
Claims (9)
1. a kind of compaction mold for pasting PET film on pcb board, which is characterized in that including：
Cope plate, the back side are machined with one or more first void regions with the first depth；
One or more cope plate buffer layers, each cope plate buffer layer is that black foamed cotton layer is pasted with layers of two-sided, described
The second void region corresponding with the hollow out shape of the first void region is provided on black foamed cotton layer, the layers of two-sided is used for
Each cope plate buffer layer correspondence is pasted onto on each first void region；And
Lower template, is provided with multiple positioning cylinders, and the pcb board connection that the positioning cylinder is used to be pasted with PET film is solid
It is scheduled in the lower template, the front of the lower template is machined with one or more third void regions and the 4th void region；
The cope plate can be connected by guide post with the lower template and be snapped together.
2. compaction mold according to claim 1, which is characterized in that first depth is less than the thickness of the cope plate
Degree.
3. compaction mold according to claim 1, which is characterized in that there are two the first positioning for setting on the cope plate
Hole, there are two second location holes, the first positioning hole can pass through institute with the second location hole for setting in the lower template
Guide post is stated to be located by connecting.
4. compaction mold according to claim 1, which is characterized in that the thickness of the lower template is more than the cope plate
Thickness.
5. compaction mold according to claim 1, which is characterized in that the third void region has the second depth, institute
Stating the 4th void region, there is third depth, second depth to be more than the third depth.
6. compaction mold according to claim 5, which is characterized in that second depth is 3mm, and the third depth is
0.8mm。
7. compaction mold according to claim 1, which is characterized in that the thickness of the black foamed cotton layer is 0.5-1mm.
8. compaction mold according to claim 1, which is characterized in that the cope plate and the material of the lower template are electricity
Wood.
9. compaction mold according to claim 3, which is characterized in that the diameter of the guide post and the first positioning hole,
The internal diameter of second location hole is equal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721794147.8U CN207736773U (en) | 2017-12-20 | 2017-12-20 | The compaction mold of PET film is pasted on pcb board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721794147.8U CN207736773U (en) | 2017-12-20 | 2017-12-20 | The compaction mold of PET film is pasted on pcb board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207736773U true CN207736773U (en) | 2018-08-17 |
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ID=63118867
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721794147.8U Active CN207736773U (en) | 2017-12-20 | 2017-12-20 | The compaction mold of PET film is pasted on pcb board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207736773U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110065239A (en) * | 2019-04-01 | 2019-07-30 | 捷卡（厦门）工业科技有限公司 | A kind of processing jig of PET circuit board |
-
2017
- 2017-12-20 CN CN201721794147.8U patent/CN207736773U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110065239A (en) * | 2019-04-01 | 2019-07-30 | 捷卡（厦门）工业科技有限公司 | A kind of processing jig of PET circuit board |
| CN110065239B (en) * | 2019-04-01 | 2024-03-12 | 捷卡（厦门）工业科技有限公司 | Processing jig of PET circuit board |
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