CN107911939B - Flexible printed circuit board - Google Patents
Flexible printed circuit board Download PDFInfo
- Publication number
- CN107911939B CN107911939B CN201711195869.6A CN201711195869A CN107911939B CN 107911939 B CN107911939 B CN 107911939B CN 201711195869 A CN201711195869 A CN 201711195869A CN 107911939 B CN107911939 B CN 107911939B
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- China
- Prior art keywords
- layer
- circuit board
- printed circuit
- flexible printed
- protective layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000010410 layer Substances 0.000 claims abstract description 85
- 239000011241 protective layer Substances 0.000 claims abstract description 33
- 239000000084 colloidal system Substances 0.000 claims abstract description 32
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 29
- 229910052802 copper Inorganic materials 0.000 claims abstract description 25
- 239000010949 copper Substances 0.000 claims abstract description 25
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 238000004804 winding Methods 0.000 claims abstract description 16
- 239000004065 semiconductor Substances 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 19
- 238000005452 bending Methods 0.000 claims description 13
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 230000003014 reinforcing effect Effects 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 239000012212 insulator Substances 0.000 claims description 6
- 229920001187 thermosetting polymer Polymers 0.000 claims description 6
- 238000010023 transfer printing Methods 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 4
- 239000011159 matrix material Substances 0.000 claims description 3
- 238000005096 rolling process Methods 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 claims description 2
- 239000010959 steel Substances 0.000 claims description 2
- 108010025899 gelatin film Proteins 0.000 claims 2
- 238000010030 laminating Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 16
- 238000003466 welding Methods 0.000 abstract description 11
- 239000000463 material Substances 0.000 description 13
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002313 adhesive film Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000005553 drilling Methods 0.000 description 2
- 230000002427 irreversible effect Effects 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 230000008602 contraction Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052754 neon Inorganic materials 0.000 description 1
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 1
- 239000011087 paperboard Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a flexible printed circuit board, comprising: the semiconductor device comprises a copper substrate layer, a first insulating colloid layer, a first protective layer, a second insulating colloid layer and a second protective layer; the copper substrate layer has a curved winding structure; the copper substrate layer is provided with a first attaching surface and a second attaching surface respectively on two opposite side surfaces, the first insulating colloid layer is attached to the first attaching surface, and the first protective layer is attached to one side surface of the first insulating colloid layer far away from the first attaching surface; the second insulating colloid layer is attached to the second attaching surface, and the second protective layer is attached to one side surface, far away from the second attaching surface, of the second insulating colloid layer. The invention provides a flexible printed circuit board with infinite extension, which replaces the flexible printed circuit board structure of the traditional single-chip production process with a circuit board which is uninterrupted from reel to reel, does not need welding processing, saves resources, reduces the harm of harmful gas generated during welding to human body, and is environment-friendly and efficient.
Description
Technical Field
The invention relates to the field of printed circuit boards, in particular to a flexible printed circuit board.
Background
Currently, S-type flexible printed circuit boards are widely used, for example, in LED strip fabrication, billboard LED strip, low voltage LED strip, neon lights, and the like. The traditional process is widely used for producing a single flexible printed circuit board, a nonmetallic film is used as a base material, then a metal foil is adhered on one side to form a flexible printed circuit board with one side covered with metal, and then the flexible printed circuit board is manufactured by adopting the traditional circuit board process method.
However, when the length of the LED lamp to be mounted is long, the plate needs to be reworked and welded, and two or more plates are spliced together to reach the required length, and a large amount of working hours and welding materials are needed for completion. In addition, during welding of the finished product, harmful gas generated at high temperature is harmful to human body.
Disclosure of Invention
The invention aims to overcome the defects in the prior art, and provides a simpler flexible roll-coating transfer printing process circuit board with infinite extension, which replaces the flexible printed circuit substrate structure of the traditional single-chip production process with a roll-to-roll uninterrupted circuit board, does not need welding processing, saves resources, reduces the harm of harmful gas generated during welding to human bodies, and is environment-friendly and efficient.
The aim of the invention is realized by the following technical scheme:
a flexible printed circuit board, comprising: the semiconductor device comprises a copper substrate layer, a first insulating colloid layer, a first protective layer, a second insulating colloid layer and a second protective layer;
the copper substrate layer has a curved winding structure;
the copper substrate layer is provided with a first attaching surface and a second attaching surface on two opposite side surfaces respectively, the first insulating colloid layer is attached to the first attaching surface, and the first protective layer is attached to one side surface, far away from the first attaching surface, of the first insulating colloid layer;
The second insulating colloid layer is attached to the second attaching surface, and the second protective layer is attached to one side surface, far away from the second attaching surface, of the second insulating colloid layer;
the thickness of the first insulating colloid layer is the same as that of the first protective layer;
the thickness of the second insulating colloid layer is the same as that of the second protective layer.
As a further preferable embodiment, the thickness of the first insulating gel layer is 10 to 40 μm.
As a further preferable embodiment, the thickness of the first insulating gel layer is 15 to 35 μm.
As a further preferable embodiment, the thickness of the first protective layer is 10 to 40 μm.
As a further preferable embodiment, the thickness of the first protective layer is 15 to 35 μm.
As a further preferable scheme, the first insulating colloid layer is an adhesive or a thermosetting adhesive film.
As a further preferable scheme, the second insulating colloid layer is an adhesive or a thermosetting adhesive film.
As a further preferable embodiment, the first protective layer is a PI insulator.
As a further preferable embodiment, the second protective layer is a PI insulator.
As a further preferable scheme, the copper substrate layer is provided with a plurality of S-shaped copper foil conductors which are arranged in a matrix.
Compared with the prior art, the invention has the following advantages:
The invention relates to a flexible printed circuit board, which can be produced in a roll mode by arranging a copper base material layer with a bending winding structure, wherein the roll-to-roll uninterrupted circuit board replaces the structure of a flexible printed circuit board in the traditional single-chip production process, and the problem of process quality caused by poor welding as in the traditional circuit board can not occur any more when a circuit is manufactured, so that the quality of a product is improved. The finished product is not required to be processed and welded again, so that the welding cost is saved, the harm of harmful gas generated during welding to human bodies is reduced, the production cost of a circuit board is saved, and the production efficiency is improved.
Drawings
Fig. 1 is a schematic structural diagram of a flexible printed circuit board of the present invention;
fig. 2 is a structural view of the flexible printed circuit board of fig. 1 wound into a roll.
Detailed Description
In order that the invention may be readily understood, a more complete description of the invention will be rendered by reference to the appended drawings. The drawings illustrate preferred embodiments of the invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1, the present invention provides a flexible printed circuit board 10, comprising: the semiconductor device includes a copper substrate layer 100, a first insulating gel layer 200, a first protective layer 300, a second insulating gel layer 400, and a second protective layer 500. The copper substrate layer 100 is a metal layer on which the line is etched to form an uninterrupted seamless, infinitely extending S-type line layer. Referring to fig. 2, the copper substrate layer 100 is provided with a plurality of S-shaped copper foil conductors 130 arranged in a matrix, and the S-shaped copper foil conductors 130 extend continuously and infinitely.
Referring to fig. 1, the copper base material layer 100 has a curved winding structure, so that continuity of the flexible printed circuit board can be achieved, and storage and transportation are facilitated.
Referring to fig. 1, a first attaching surface 110 and a second attaching surface 120 are respectively disposed on opposite sides of a copper substrate layer 100, a first insulating gel layer 200 is attached to the first attaching surface 110, and a first protective layer 300 is attached to a side of the first insulating gel layer 200 away from the first attaching surface 110.
Referring to fig. 1, the second insulating gel layer 400 is attached to the second attaching surface 120, and the second protection layer 500 is attached to a side of the second insulating gel layer 400 away from the second attaching surface 120.
Referring to fig. 1, the thickness of the first insulating gel layer 200 is the same as that of the first protection layer 300. The thickness of the second insulation gel layer 400 is the same as that of the second protection layer 500.
The thickness of the first insulating gel layer 200 is 10 to 40 μm. Further, the thickness of the first insulating gel layer 200 is 15 to 35 μm. Preferably, in the present embodiment, the thickness of the first insulating gel layer 200 is 25 μm.
The thickness of the first protective layer 300 is 10 to 40 μm. Further, the thickness of the first protective layer 300 is 15 to 35 μm. Preferably, in the present embodiment, the thickness of the first protective layer 300 is 25 μm.
For example, the copper base material layer comprises the following components in parts by mass: 80-90 parts of copper and 10-20 parts of silver, so that the conductivity is better.
In this embodiment, the first insulating gel layer 200 is an adhesive or a thermosetting adhesive film. The second insulating gel layer 400 is an adhesive or a thermosetting adhesive film. The first protective layer 300 is a PI insulator. The second protection layer 500 is a PI insulator.
For example, the thickness of the copper base material layer 100 is 18 μm, 25 μm, 35 μm, 70 μm and 105 μm, and preferably, the thickness of the copper base material layer 100 is 35 μm, so that the thickness of the copper base material layer 100 can be made to conform to the national standard, which is advantageous for popularization and use of the flexible printed circuit board.
Furthermore, the novel process is adopted for production, and the roll coating transfer circuit process is adopted, so that the use amount of traditional equipment such as screen printing plates, screen frames, screen printers and the like and printing ink is reduced, the leftover materials are reduced, and the resources are saved.
Furthermore, the novel process is used for production, the full-automatic round steel die rolling hole automatic film coating is adopted, the waste generated by the rolling hole process is discharged by utilizing the low-viscosity transfer film, the productivity and the quality are improved, the pollution of dust generated by drilling to air in the traditional process is reduced, the consumption of auxiliary materials (paper board and wood board) required by drilling in the traditional process is reduced, the deviation phenomenon caused by manual alignment is reduced, the time and the electricity are saved, no pollution is caused, the green production is realized, and the energy conservation and the environment friendliness are realized.
The invention relates to an S-shaped flexible roll-coating transfer printing process printed circuit board produced continuously from roll to roll, wherein a main body is only a metal layer, and a circuit is etched on the metal layer to form a special-shaped (S-shaped) metal circuit layer. When the process is adopted to manufacture the circuit, the circuit is not manufactured after the material is cut like the traditional circuit board, and the circuit is welded to the required length when the circuit is manufactured to a finished product, so that a large amount of harmful gas to human bodies is avoided. The new technology is to use whole roll of base material, directly use new technology roll-to-roll coating transfer printing printed circuit and roll-to-roll coating PI solder mask layer, other flexible insulating material, etc. on the roll-to-roll circuit, so as to reduce the operation flow of the traditional technology production process and improve the production efficiency. The novel process is used for production, the traditional equipment such as screen plates, screen frames, screen printers and the like are reduced, and resources are saved. The adoption of the roll coating transfer printing process can completely avoid defective products caused by the expansion and contraction of the screen plate in the traditional silk screen printing production process, when the finished product has the required length, the finished product does not need to be welded again, and the finished product can be cut from the position with the required length. The energy consumption of the whole process is reduced, the production efficiency is improved, the quality problem caused by poor welding in the traditional production mode is also reduced, and the harm of harmful gas generated in the traditional welding mode to human bodies is reduced.
In order to enable the flexible printed circuit board to have a better bending-winding resistance; the first insulating colloid layer and the second insulating colloid layer can be torn off in the process of bonding with the electronic element; the bonding with the electronic element is more firm; the copper-based material layer comprises an outer frame, a plurality of connecting strips and a plurality of electronic element bonding sheets, wherein two ends of each connecting strip are respectively connected with the inner side wall of the outer frame, the connecting strips are mutually parallel, each electronic element bonding sheet is respectively connected with two adjacent electronic element bonding sheets, namely, each connecting strip is respectively connected with two adjacent electronic element bonding sheets; the outer frame is provided with a hollow cuboid structure, the outer side wall of the outer frame is provided with a bending-resistant winding structure reinforcing strip, and the side edge of the bending-resistant winding structure reinforcing strip is provided with a notch; a first arc-shaped groove and a second arc-shaped groove are formed in the electronic element bonding sheet, and an S-shaped bonding area is formed in the electronic element bonding sheet at the part between the first arc-shaped groove and the second arc-shaped groove; therefore, the outer frame is provided with the hollow cuboid structure, and when the flexible printed circuit board is bent and wound, the stress is more uniform due to the fact that the continuity of the side edges of the outer frame is more uniform, the problem of transitional bending or irreversible deformation in a local area is not easy to occur during bending and winding, the outer side wall of the outer frame is provided with the bending-resistant winding structure reinforcing strip, the cross section area of the side edge of the outer frame can be increased on the basis of uniform stress through the bending-resistant winding structure reinforcing strip, and the problem of transitional bending or irreversible deformation in the local area is not easy to occur during bending and winding; the side edge of the bending-resistant winding structure reinforcing strip is provided with a notch, and due to the existence of the notch, an operator's finger or a rubber tearing tool adopted better contacts the first insulating colloid layer and the second insulating colloid layer, so that the tearing operation of the first insulating colloid layer and the second insulating colloid layer, namely the rubber tearing operation, is completed; the electronic element bonding sheet is provided with a first arc-shaped groove and a second arc-shaped groove, and an S-shaped bonding area is formed at the part between the first arc-shaped groove and the second arc-shaped groove, and the two ends of the S-shaped bonding area can be bonded with pins of electronic elements better due to the curved structure of the S-shaped bonding area, so that the flexible printed circuit board can have better bending and winding resistance; the first insulating colloid layer and the second insulating colloid layer can be torn off in the process of bonding with the electronic element; the bonding with the electronic element is more firm; the overall structural strength can be improved.
In order to further enable the bonding between the flexible printed circuit board and the electronic element to be firmer, each S-shaped bonding area is provided with an electronic element pin bonding part, and the electronic element pin bonding parts are provided with a plurality of electronic element pin bonding grooves used for fixing electronic elements.
The above embodiments represent only a few embodiments of the present invention, which are described in more detail and are not to be construed as limiting the scope of the present invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (9)
1. A flexible printed circuit board, comprising: the semiconductor device comprises a copper substrate layer, a first insulating colloid layer, a first protective layer, a second insulating colloid layer and a second protective layer;
the copper substrate layer has a curved winding structure;
The copper substrate layer is provided with a first attaching surface and a second attaching surface on two opposite side surfaces respectively, the first insulating colloid layer is attached to the first attaching surface, and the first protective layer is attached to one side surface, far away from the first attaching surface, of the first insulating colloid layer; the copper substrate layer adopts a roll coating transfer printing circuit process;
The second insulating colloid layer is attached to the second attaching surface, and the second protective layer is attached to one side surface, far away from the second attaching surface, of the second insulating colloid layer;
the thickness of the first insulating colloid layer is the same as that of the first protective layer;
the thickness of the second insulating colloid layer is the same as that of the second protective layer;
the first protective layer and the second protective layer are all formed by automatically laminating full-automatic round steel die rolling holes;
The copper substrate layer is provided with a plurality of S-shaped copper foil conductors which are arranged in a matrix;
The copper substrate layer comprises an outer frame, a plurality of connecting strips and a plurality of electronic element bonding sheets, wherein two ends of each connecting strip are respectively connected with the inner side wall of the outer frame, the connecting strips are mutually arranged in parallel, each electronic element bonding sheet is respectively connected with two adjacent electronic element bonding sheets, the outer frame is provided with a hollow cuboid structure, the outer side wall of the outer frame is provided with a bending-resistant winding structure reinforcing strip, and the side edge of the bending-resistant winding structure reinforcing strip is provided with a notch; the electronic component bonding sheet is provided with a first arc-shaped groove and a second arc-shaped groove, and an S-shaped bonding area is formed on the electronic component bonding sheet at a part between the first arc-shaped groove and the second arc-shaped groove.
2. The flexible printed circuit board according to claim 1, wherein the thickness of the first insulating gel layer is 10 to 40 μm.
3. The flexible printed circuit board according to claim 2, wherein the thickness of the first insulating gel layer is 15 to 35 μm.
4. The flexible printed circuit board of claim 1, wherein the first protective layer has a thickness of 10 to 40 μm.
5. The flexible printed circuit board of claim 4, wherein the first protective layer has a thickness of 15 to 35 μm.
6. The flexible printed circuit board of claim 1, wherein the first insulating gel layer is an adhesive or a thermosetting gel film.
7. The flexible printed circuit board of claim 1, wherein the second insulating gel layer is an adhesive or a thermosetting gel film.
8. The flexible printed circuit board of claim 1, wherein the first protective layer is PI insulator.
9. The flexible printed circuit board of claim 1, wherein the second protective layer is a PI insulator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711195869.6A CN107911939B (en) | 2017-11-24 | 2017-11-24 | Flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711195869.6A CN107911939B (en) | 2017-11-24 | 2017-11-24 | Flexible printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107911939A CN107911939A (en) | 2018-04-13 |
| CN107911939B true CN107911939B (en) | 2024-05-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711195869.6A Active CN107911939B (en) | 2017-11-24 | 2017-11-24 | Flexible printed circuit board |
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| Country | Link |
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| CN (1) | CN107911939B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108650776B (en) * | 2018-05-15 | 2020-04-03 | 武汉华星光电半导体显示技术有限公司 | Flexible circuit board and display screen |
| CN109699126A (en) * | 2019-01-25 | 2019-04-30 | 昆山珀利铭新材料科技有限公司 | A kind of interior arrangement and manufacturing method applied to flexible circuit board |
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