CN210274703U - Type-c material-saving design PCB easy to realize automatic processing - Google Patents
Type-c material-saving design PCB easy to realize automatic processing Download PDFInfo
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- CN210274703U CN210274703U CN201920738579.XU CN201920738579U CN210274703U CN 210274703 U CN210274703 U CN 210274703U CN 201920738579 U CN201920738579 U CN 201920738579U CN 210274703 U CN210274703 U CN 210274703U
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Abstract
The utility model discloses a type-c material-saving design PCB easy to realize automatic processing, in particular to the technical field of circuit boards, which comprises an insulating substrate, wherein the surface of the insulating substrate is provided with a placement mechanism; the placing mechanism comprises a plurality of placing clamping grooves, the placing clamping grooves are adjacent to each other, bonding clamping grooves are formed in the bottoms of the placing clamping grooves and communicated with each other, and type-c interface circuit boards are arranged in the placing clamping grooves. The utility model discloses a be provided with and place the mechanism, do not bond between two adjacent type-c interface circuit board sides, be favorable to save material, and because type-c interface circuit board cross sectional shape sets up to the convex, will form the gap originally between two adjacent interface districts, will bond the draw-in groove setting in the gap that forms between two adjacent interface districts, can its gap increase of effectual utilization glutinous even part, and do not additionally occupy effective area, improved the utilization ratio of circuit board, practice thrift the cost then.
Description
Technical Field
The utility model relates to a circuit board technical field, more specifically say, the utility model relates to a type-c province material design PCB board that easy automated processing realized.
Background
USB Type-C, Type-C for short, is a Universal Serial Bus (USB) hardware interface specification. The new version of the interface is highlighted by a slimmer design, faster transmission speeds (up to 10Gbps) and more aggressive power transmission (up to 100W). The Type-C double-sided pluggable interface has the greatest characteristic of supporting double-sided insertion of a USB interface, formally solves the worldwide problem of 'the USB can not be inserted correctly for ever', and is convenient to insert on the front side and the back side.
The existing type-c full-page circuit board needs to enable the orientation of a type-c interface circuit board to be consistent in order to realize die cutting or automation of processing, the bottoms and the side faces of a plurality of interface circuit boards are designed to be smooth, so that the bottoms and the side faces of two adjacent interface circuit boards are all bonded, and material waste can be caused.
SUMMERY OF THE UTILITY MODEL
In order to overcome the above-mentioned defect of prior art, the embodiment of the utility model provides a material design PCB board is economized to type-c that easy automated processing realized, through being provided with placement device, do not bond between two adjacent type-c interface circuit board sides, be favorable to save material, and because type-c interface circuit board cross sectional shape sets up to the convex, will form the gap originally between two adjacent interface districts, set up the bonding card groove in the gap that forms between two adjacent interface districts, can effectually utilize its gap increase to glue even part, and do not additionally occupy effective area, the utilization ratio of circuit board has been improved, then practice thrift the cost, in order to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a type-c material-saving design PCB easy to realize automatic processing comprises an insulating substrate, wherein a placing mechanism is arranged on the surface of the insulating substrate;
the placing mechanism comprises a plurality of placing clamping grooves, two adjacent placing clamping grooves are provided with bonding clamping grooves between the bottoms of the placing clamping grooves, the placing clamping grooves are communicated with the bonding clamping grooves, a type-c interface circuit board is arranged inside the placing clamping grooves and comprises an interface area and a circuit area, the interface area is arranged at the top of the circuit area, a gap is formed between the two adjacent type-c interface circuit boards, and a bonding agent is arranged inside the bonding clamping grooves.
In a preferred embodiment, fixing plates are arranged on two sides of the insulating substrate, the fixing plates and the insulating substrate are welded, and a plurality of fixing holes are uniformly formed in the surfaces of the fixing plates in a penetrating mode.
In a preferred embodiment, the cross-sectional shape of the type-c interface circuit board is a convex shape, a gap is formed between two adjacent interface regions, and the adhesive clamping groove is arranged in the gap formed between two adjacent interface regions.
In a preferred embodiment, the side of the two fixing plates facing the insulating substrate is provided with a plurality of fixing strips made of an insulating material.
In a preferred embodiment, the distance between two adjacent type-c interface circuit boards on the left and right and the distance between two adjacent type-c interface circuit boards on the upper and lower sides are both greater than 0.1 mm.
In a preferred embodiment, a plurality of the placing clamping grooves are arranged in parallel.
The utility model discloses a technological effect and advantage:
1. the placement mechanism is arranged, the side faces of two adjacent type-c interface circuit boards are not bonded, and the two adjacent type-c interface circuit boards are fixed through the adhesive in the bonding clamping grooves, so that the material saving and the cost saving are facilitated;
2. through being provided with the fixed plate, weld two fixed plates respectively in the both sides of insulating substrate, the fixed plate can be fixed the type-c interface circuit board of insulating substrate both sides, has improved the stability of device when removing.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention.
Fig. 2 is a schematic view of a partial structure at a in fig. 1 according to the present invention.
Fig. 3 is a schematic view of the insulating substrate structure of the present invention.
Fig. 4 is a schematic view of the fixing plate structure of the present invention.
Fig. 5 is a schematic structural view of the fixing strip of the present invention.
The reference signs are: 1 insulating substrate, 2 place the draw-in groove, 3 bonding draw-in grooves, 4type-c interface circuit boards, 401 interface region, 402 circuit region, 5 adhesives, 6 fixed plates, 7 fixed orifices, 8 fixed strips.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The type-c material-saving design PCB easy to realize automatic processing as shown in the figures 1, 2 and 3 comprises an insulating substrate 1, wherein a placing mechanism is arranged on the surface of the insulating substrate 1;
the placing mechanism comprises a plurality of placing clamping grooves 2, an adhesive clamping groove 3 is arranged between the bottoms of every two adjacent placing clamping grooves 2, the placing clamping grooves 2 are communicated with the adhesive clamping grooves 3, a type-c interface circuit board 4 is arranged in each placing clamping groove 2, each type-c interface circuit board 4 comprises an interface area 401 and a circuit area 402, each interface area 401 is arranged at the top of each circuit area 402, a gap is formed between every two adjacent type-c interface circuit boards 4, and an adhesive 5 is arranged in each adhesive clamping groove 3;
the section of the type-c interface circuit board 4 is convex, a gap is formed between every two adjacent interface regions 401, and the bonding clamping groove 3 is arranged in the gap formed between every two adjacent interface regions 401;
the distance between the two left and right adjacent type-c interface circuit boards 4 and the distance between the two upper and lower adjacent type-c interface circuit boards 4 are both larger than 0.1 mm;
a plurality of the placing clamping grooves 2 are arranged in parallel.
The implementation mode is specifically as follows: when the utility model is used, a plurality of type-c interface circuit boards 4 are placed in the corresponding placing clamping grooves 2, then the adhesive 5 is poured into the bonding clamping grooves 3, because the placing clamping groove 2 is communicated with the bonding clamping groove 3, the bonding agent 5 can be contacted with the two type-c interface circuit boards 4, after the bonding agent 5 is solidified, the adhesive 5 fixes the two adjacent type-c interface boards 4, the side surfaces of two adjacent type-c interface circuit boards 4 are not adhered, and are fixed by the adhesive 5 inside the adhesive clamping groove 3, the bonding clamping groove 3 is arranged in a gap formed between two adjacent interface areas 401, the distance between two left and right adjacent type-c interface circuit boards 4 and the distance between two upper and lower adjacent type-c interface circuit boards 4 are both larger than 0.1mm, and the size of a die cutting tool is 0.1mm at the minimum.
As shown in fig. 1, 3, 4 and 5, the type-c material-saving PCB easy to implement by automatic processing further comprises two fixing plates 6, the two fixing plates 6 are respectively disposed at two sides of the insulating substrate 1, the fixing plates 6 are welded to the insulating substrate 1, and a plurality of fixing holes 7 are uniformly formed on the surface of the fixing plates 6 in a penetrating manner;
one side of the two fixing plates 6 facing the insulating substrate 1 is provided with a plurality of fixing strips 8, and the fixing strips 8 are made of insulating materials.
The implementation mode is specifically as follows: the utility model discloses when using, weld two fixed plates 6 respectively in insulating substrate 1's both sides, fixed plate 6 can be fixed the type-c interface circuit board 4 of insulating substrate 1 both sides, has improved the stability of device when removing, and two fixed plates 6 are provided with a plurality of fixed strips 8 towards one side of insulating substrate 1, and two adjacent fixed strips 8 can carry out the secondary to type-c interface circuit board 4 and fix, have improved stability more.
The utility model discloses the theory of operation:
referring to the attached drawings 1-5 of the specification, when the utility model is used, a plurality of type-c interface circuit boards 4 are placed in corresponding placing clamping grooves 2, an adhesive 5 is poured into the bonding clamping grooves 3, the adhesive 5 can be contacted with the two type-c interface circuit boards 4 due to the communication between the placing clamping grooves 2 and the bonding clamping grooves 3, after the adhesive 5 is solidified, the adhesive 5 can fix the two adjacent type-c interface circuit boards 4, two fixing plates 6 are respectively welded at two sides of the insulating base plate 1 in advance, the fixing plates 6 can fix the type-c interface circuit boards 4 at two sides of the insulating base plate 1, the stability of the device during moving is improved, one side of the two fixing plates 6 facing the insulating base plate 1 is provided with a plurality of fixing strips 8, two adjacent fixing strips 8 can secondarily fix the type-c interface circuit boards 4, the stability is further improved.
The points to be finally explained are: first, in the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounted," "connected," and "connected" should be understood broadly, and may be a mechanical connection or an electrical connection, or a communication between two elements, and may be a direct connection, and "upper," "lower," "left," and "right" are only used to indicate a relative positional relationship, and when the absolute position of the object to be described is changed, the relative positional relationship may be changed;
secondly, the method comprises the following steps: in the drawings of the disclosed embodiments of the present invention, only the structures related to the disclosed embodiments are referred to, and other structures can refer to the common design, and under the condition of no conflict, the same embodiment and different embodiments of the present invention can be combined with each other;
and finally: the above description is only for the preferred embodiment of the present invention and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. The utility model provides a material design PCB board is economized to type-c that easy automated processing realized, includes insulating substrate (1), its characterized in that: the surface of the insulating substrate (1) is provided with a placing mechanism;
the placing mechanism comprises a plurality of placing clamping grooves (2), two adjacent placing clamping grooves (3) are formed between the bottoms of the placing clamping grooves (2), the placing clamping grooves (2) are communicated with the bonding clamping grooves (3), a type-c interface circuit board (4) is arranged inside the placing clamping grooves (2), the type-c interface circuit board (4) comprises an interface area (401) and a circuit area (402), the interface area (401) is arranged at the top of the circuit area (402), two adjacent type-c interface circuit boards (4) form a gap, and a bonding agent (5) is arranged inside the bonding clamping grooves (3).
2. The PCB easy to realize type-c material-saving design of the automatic processing machine as claimed in claim 1, wherein: the insulation substrate (1) both sides all are provided with fixed plate (6), weld between fixed plate (6) and insulation substrate (1), fixed plate (6) surface evenly runs through and is equipped with a plurality of fixed orificess (7).
3. The PCB easy to realize type-c material-saving design of the automatic processing machine as claimed in claim 1, wherein: the cross section of the type-c interface circuit board (4) is convex, a gap is formed between every two adjacent interface regions (401), and the bonding clamping groove (3) is arranged in the gap formed between every two adjacent interface regions (401).
4. The PCB easy to realize type-c material-saving design of the automatic processing of claim 2, wherein: one side, facing the insulating substrate (1), of each of the two fixing plates (6) is provided with a plurality of fixing strips (8), and the fixing strips (8) are made of insulating materials.
5. The PCB easy to realize type-c material-saving design of the automatic processing machine as claimed in claim 1, wherein: the distance between the two adjacent left and right type-c interface circuit boards (4) and the distance between the two adjacent up and down type-c interface circuit boards (4) are both larger than 0.1 mm.
6. The PCB easy to realize type-c material-saving design of the automatic processing machine as claimed in claim 1, wherein: a plurality of the placing clamping grooves (2) are arranged in parallel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920738579.XU CN210274703U (en) | 2019-05-22 | 2019-05-22 | Type-c material-saving design PCB easy to realize automatic processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920738579.XU CN210274703U (en) | 2019-05-22 | 2019-05-22 | Type-c material-saving design PCB easy to realize automatic processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210274703U true CN210274703U (en) | 2020-04-07 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920738579.XU Active CN210274703U (en) | 2019-05-22 | 2019-05-22 | Type-c material-saving design PCB easy to realize automatic processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210274703U (en) |
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2019
- 2019-05-22 CN CN201920738579.XU patent/CN210274703U/en active Active
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